WO2008030227A1 - Faible coefficient de résistivité thermique de résistors polymères à base de carbures et nitrures de métal - Google Patents
Faible coefficient de résistivité thermique de résistors polymères à base de carbures et nitrures de métal Download PDFInfo
- Publication number
- WO2008030227A1 WO2008030227A1 PCT/US2006/034516 US2006034516W WO2008030227A1 WO 2008030227 A1 WO2008030227 A1 WO 2008030227A1 US 2006034516 W US2006034516 W US 2006034516W WO 2008030227 A1 WO2008030227 A1 WO 2008030227A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- volume
- polymer
- carbon
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/0652—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component containing carbon or carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
Definitions
- Embedded passives comprise a type of Printed Circuit Board (PCB) design that combines better performance in smaller boards with increased functionality by burying resistors or capacitors, i.e. passive devices, in the substrate material itself.
- PCB Printed Circuit Board
- resistors or capacitors i.e. passive devices
- important performance requirements for making PCBs having embedded resistors operating in the 100 Ohms to 1 mega-Ohm range include a balanced Temperature Coefficient of Resistance ["TCR”] and resistive stability.
- new materials are required since current materials satisfy neither the performance nor fabrication requirements for0 routine manufacture of embedded passives in PCBs.
- a group IV metal carbide or nitride is defined as a compound with the chemical formula A x B y where A pertains to any group IV metal and/or their mixtures, and B is C or N.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
La présente invention concerne des compositions contenant de 20 à 50 % en volume d'un nitrure ou carbure d'un métal du groupe IV, un polymère et de 1 à 9 % en volume d'une forme allotropique de carbone. Les compositions sont utiles dans la fabrication de résistors avec de faibles coefficients de résistivité thermique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2006/034516 WO2008030227A1 (fr) | 2006-09-07 | 2006-09-07 | Faible coefficient de résistivité thermique de résistors polymères à base de carbures et nitrures de métal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2006/034516 WO2008030227A1 (fr) | 2006-09-07 | 2006-09-07 | Faible coefficient de résistivité thermique de résistors polymères à base de carbures et nitrures de métal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008030227A1 true WO2008030227A1 (fr) | 2008-03-13 |
Family
ID=37969951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2006/034516 Ceased WO2008030227A1 (fr) | 2006-09-07 | 2006-09-07 | Faible coefficient de résistivité thermique de résistors polymères à base de carbures et nitrures de métal |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008030227A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019002029A1 (fr) * | 2017-06-27 | 2019-01-03 | Tdk Electronics Ag | Résistance en feuille, capteur à feuille mince et utilisation de particules d'un deuxième matériau conducteur |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6063463A (en) * | 1998-01-08 | 2000-05-16 | Xerox Corporation | Mixed carbon black fuser member coatings |
| WO2001009905A2 (fr) * | 1999-07-30 | 2001-02-08 | Tyco Electronics Corporation | Composition polymere electriquement conductrice |
| US20030111648A1 (en) * | 2001-09-26 | 2003-06-19 | Chu Edward Fu-Hua | Conductive composition exhibiting PTC behavior |
-
2006
- 2006-09-07 WO PCT/US2006/034516 patent/WO2008030227A1/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6063463A (en) * | 1998-01-08 | 2000-05-16 | Xerox Corporation | Mixed carbon black fuser member coatings |
| WO2001009905A2 (fr) * | 1999-07-30 | 2001-02-08 | Tyco Electronics Corporation | Composition polymere electriquement conductrice |
| US20030111648A1 (en) * | 2001-09-26 | 2003-06-19 | Chu Edward Fu-Hua | Conductive composition exhibiting PTC behavior |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019002029A1 (fr) * | 2017-06-27 | 2019-01-03 | Tdk Electronics Ag | Résistance en feuille, capteur à feuille mince et utilisation de particules d'un deuxième matériau conducteur |
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