WO2008028625A3 - Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung - Google Patents
Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung Download PDFInfo
- Publication number
- WO2008028625A3 WO2008028625A3 PCT/EP2007/007703 EP2007007703W WO2008028625A3 WO 2008028625 A3 WO2008028625 A3 WO 2008028625A3 EP 2007007703 W EP2007007703 W EP 2007007703W WO 2008028625 A3 WO2008028625 A3 WO 2008028625A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor substrates
- simultaneously doping
- oxidizing semiconductor
- oxidizing
- doping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/128—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009525991A JP2010503190A (ja) | 2006-09-04 | 2007-09-04 | 半導体基板に対して同時にドーピングおよび酸化を実行する方法および当該方法の利用 |
| US12/439,964 US20100136768A1 (en) | 2006-09-04 | 2007-09-04 | Method for simultaneous doping and oxidizing semiconductor substrates and the use thereof |
| EP07802115A EP2064750A2 (de) | 2006-09-04 | 2007-09-04 | Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006041424.1 | 2006-09-04 | ||
| DE102006041424A DE102006041424A1 (de) | 2006-09-04 | 2006-09-04 | Verfahren zur simultanen Dotierung und Oxidation von Halbleitersubstraten und dessen Verwendung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008028625A2 WO2008028625A2 (de) | 2008-03-13 |
| WO2008028625A3 true WO2008028625A3 (de) | 2008-05-08 |
Family
ID=39078879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2007/007703 Ceased WO2008028625A2 (de) | 2006-09-04 | 2007-09-04 | Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100136768A1 (de) |
| EP (1) | EP2064750A2 (de) |
| JP (1) | JP2010503190A (de) |
| DE (1) | DE102006041424A1 (de) |
| WO (1) | WO2008028625A2 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008033169A1 (de) * | 2008-05-07 | 2009-11-12 | Ersol Solar Energy Ag | Verfahren zur Herstellung einer monokristallinen Solarzelle |
| US8569100B2 (en) * | 2008-06-26 | 2013-10-29 | Mitsubishi Electric Corporation | Solar cell and manufacturing method thereof |
| DE102008030725B4 (de) | 2008-07-01 | 2013-10-17 | Deutsche Cell Gmbh | Verfahren zur Herstellung einer Kontakt-Struktur mittels einer Galvanikmaske |
| DE102008049281A1 (de) * | 2008-09-26 | 2010-04-08 | Centrotherm Photovoltaics Technology Gmbh | Diffusionseinrichtung für die Solarzellenfertigung und Verfahren zur Herstellung von Solarzellen |
| US8124502B2 (en) * | 2008-10-23 | 2012-02-28 | Applied Materials, Inc. | Semiconductor device manufacturing method, semiconductor device and semiconductor device manufacturing installation |
| EP2180531A1 (de) * | 2008-10-23 | 2010-04-28 | Applied Materials, Inc. | Halbleitervorrichtungsherstellungsverfahren, Halbleitervorrichtung und Halbleitervorrichtungsherstellungsanlage |
| KR20110086833A (ko) * | 2008-10-23 | 2011-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 소자 제조 방법, 반도체 소자 및 반도체 소자 제조 설비 |
| DE102009005168A1 (de) * | 2009-01-14 | 2010-07-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Solarzelle und Verfahren zur Herstellung einer Solarzelle aus einem Siliziumsubstrat |
| DE102009003393A1 (de) * | 2009-01-27 | 2010-07-29 | Schott Solar Ag | Verfahren zur Temperaturbehandlung von Halbleiterbauelementen |
| CA2759708C (en) * | 2009-04-21 | 2019-06-18 | Tetrasun, Inc. | High-efficiency solar cell structures and methods of manufacture |
| EP2422377A4 (de) * | 2009-04-22 | 2013-12-04 | Tetrasun Inc | Lokalisierte metallkontakte mit lokalisierter laserunterstützter umwandlung von funktionalen folien in solarzellen |
| US8450141B2 (en) * | 2009-06-17 | 2013-05-28 | University Of Delaware | Processes for fabricating all-back-contact heterojunction photovoltaic cells |
| DE102010004498A1 (de) * | 2010-01-12 | 2011-07-14 | centrotherm photovoltaics AG, 89143 | Verfahren zur Ausbildung einer zweistufigen Dotierung in einem Halbleitersubstrat |
| WO2011119910A2 (en) | 2010-03-26 | 2011-09-29 | Tetrasun, Inc. | Shielded electrical contact and doping through a passivating dielectric layer in a high-efficiency crystalline solar cell, including structure and methods of manufacture |
| WO2011145731A1 (ja) * | 2010-05-20 | 2011-11-24 | 京セラ株式会社 | 太陽電池素子およびその製造方法ならびに太陽電池モジュール |
| KR101150686B1 (ko) | 2010-12-17 | 2012-05-25 | 현대중공업 주식회사 | 태양전지 및 그 제조방법 |
| DE102011103538A1 (de) * | 2011-06-07 | 2012-12-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Dotierung von Halbleitersubstraten sowie dotiertes Halbleitersubstrat und Verwendung |
| CN102751379A (zh) * | 2012-06-20 | 2012-10-24 | 常州天合光能有限公司 | 一种在n型硅衬底上快速形成p-n结的方法 |
| US10014425B2 (en) * | 2012-09-28 | 2018-07-03 | Sunpower Corporation | Spacer formation in a solar cell using oxygen ion implantation |
| US9093598B2 (en) * | 2013-04-12 | 2015-07-28 | Btu International, Inc. | Method of in-line diffusion for solar cells |
| US20140361407A1 (en) * | 2013-06-05 | 2014-12-11 | SCHMID Group | Silicon material substrate doping method, structure and applications |
| JP6456279B2 (ja) * | 2015-01-29 | 2019-01-23 | 三菱電機株式会社 | 太陽電池の製造方法 |
| FR3035741B1 (fr) * | 2015-04-28 | 2018-03-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'une cellule photovoltaique. |
| US9673341B2 (en) | 2015-05-08 | 2017-06-06 | Tetrasun, Inc. | Photovoltaic devices with fine-line metallization and methods for manufacture |
| CN107293604A (zh) * | 2017-07-27 | 2017-10-24 | 浙江晶科能源有限公司 | 一种p型面低反射率晶硅电池的制备方法 |
| CN114566568A (zh) * | 2022-02-28 | 2022-05-31 | 安徽华晟新能源科技有限公司 | 半导体衬底层的处理方法和太阳能电池的制备方法 |
| CN118186578B (zh) * | 2024-02-07 | 2025-06-03 | 北京怀柔实验室 | 硅单晶表面无损的铝选区扩散方法及其应用 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4210472A (en) * | 1977-12-10 | 1980-07-01 | Itt Industries, Incorporated | Manufacturing process of semiconductor devices |
| US5665175A (en) * | 1990-05-30 | 1997-09-09 | Safir; Yakov | Bifacial solar cell |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3690969A (en) * | 1971-05-03 | 1972-09-12 | Motorola Inc | Method of doping semiconductor substrates |
| GB1536545A (en) * | 1975-03-26 | 1978-12-20 | Mullard Ltd | Semiconductor device manufacture |
| US4295266A (en) * | 1980-06-30 | 1981-10-20 | Rca Corporation | Method of manufacturing bulk CMOS integrated circuits |
| JP2989373B2 (ja) * | 1992-05-08 | 1999-12-13 | シャープ株式会社 | 光電変換装置の製造方法 |
| US5591681A (en) * | 1994-06-03 | 1997-01-07 | Advanced Micro Devices, Inc. | Method for achieving a highly reliable oxide film |
| US6180869B1 (en) * | 1997-05-06 | 2001-01-30 | Ebara Solar, Inc. | Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices |
| US6274429B1 (en) * | 1997-10-29 | 2001-08-14 | Texas Instruments Incorporated | Use of Si-rich oxide film as a chemical potential barrier for controlled oxidation |
| JPH11354516A (ja) * | 1998-06-08 | 1999-12-24 | Sony Corp | シリコン酸化膜形成装置及びシリコン酸化膜形成方法 |
| US6221789B1 (en) * | 1998-07-29 | 2001-04-24 | Intel Corporation | Thin oxides of silicon |
| US6784121B1 (en) * | 1998-10-23 | 2004-08-31 | Texas Instruments Incorporated | Integrated circuit dielectric and method |
| US6204198B1 (en) * | 1998-11-24 | 2001-03-20 | Texas Instruments Incorporated | Rapid thermal annealing of doped polycrystalline silicon structures formed in a single-wafer cluster tool |
| JP2002076400A (ja) * | 2000-08-30 | 2002-03-15 | Shin Etsu Handotai Co Ltd | 太陽電池セルおよび太陽電池セルの製造方法 |
| US7217883B2 (en) * | 2001-11-26 | 2007-05-15 | Shell Solar Gmbh | Manufacturing a solar cell with backside contacts |
| JP2004221149A (ja) * | 2003-01-10 | 2004-08-05 | Hitachi Ltd | 太陽電池の製造方法 |
| JP2005056875A (ja) * | 2003-08-01 | 2005-03-03 | Sharp Corp | 太陽電池およびその製造方法 |
| JP4761706B2 (ja) * | 2003-12-25 | 2011-08-31 | 京セラ株式会社 | 光電変換装置の製造方法 |
| JP4632672B2 (ja) * | 2004-02-04 | 2011-02-16 | シャープ株式会社 | 太陽電池の製造方法 |
-
2006
- 2006-09-04 DE DE102006041424A patent/DE102006041424A1/de not_active Withdrawn
-
2007
- 2007-09-04 EP EP07802115A patent/EP2064750A2/de not_active Withdrawn
- 2007-09-04 JP JP2009525991A patent/JP2010503190A/ja active Pending
- 2007-09-04 US US12/439,964 patent/US20100136768A1/en not_active Abandoned
- 2007-09-04 WO PCT/EP2007/007703 patent/WO2008028625A2/de not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4210472A (en) * | 1977-12-10 | 1980-07-01 | Itt Industries, Incorporated | Manufacturing process of semiconductor devices |
| US5665175A (en) * | 1990-05-30 | 1997-09-09 | Safir; Yakov | Bifacial solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100136768A1 (en) | 2010-06-03 |
| WO2008028625A2 (de) | 2008-03-13 |
| EP2064750A2 (de) | 2009-06-03 |
| DE102006041424A1 (de) | 2008-03-20 |
| JP2010503190A (ja) | 2010-01-28 |
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