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WO2008065093A3 - Device for determining and/or monitoring a process variable and method for contacting - Google Patents

Device for determining and/or monitoring a process variable and method for contacting Download PDF

Info

Publication number
WO2008065093A3
WO2008065093A3 PCT/EP2007/062842 EP2007062842W WO2008065093A3 WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3 EP 2007062842 W EP2007062842 W EP 2007062842W WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3
Authority
WO
WIPO (PCT)
Prior art keywords
contacting
monitoring
conductor structure
sensor unit
determining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/062842
Other languages
German (de)
French (fr)
Other versions
WO2008065093A2 (en
Inventor
Dirk Boghun
Alfred Umkehrer
Stephan Konrad
Gundolf Lippold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Wetzer GmbH and Co KG
Original Assignee
Endress and Hauser Wetzer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Wetzer GmbH and Co KG filed Critical Endress and Hauser Wetzer GmbH and Co KG
Publication of WO2008065093A2 publication Critical patent/WO2008065093A2/en
Publication of WO2008065093A3 publication Critical patent/WO2008065093A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a device for determining and/or monitoring at least one process variable. The invention is characterized in that at least one sensor unit (1) is provided, that the sensor unit (1) is applied with a lower side thereof to an upper side of a substrate (2), that the sensor unit (1) is connected to at least one contact pad (3) for electrical contact, that at least one contact plate (5) is provided, that a lower side of said contact plate (5) is provided with a conductor structure (6), said conductor structure (6) being designed so as to correspond to the arrangement of the contact pad (3). The invention is further characterized in that the conductor structure (6) and the contact pad (3) are contacted with each other in an electrically conducting manner, and that the contact plate (5) has at least one contacting unit (7) on an upper side, said contacting unit (7) and the conductor structure (6) being contacted with each other in an electrically conducting manner. The invention also relates to a method for contacting the sensor unit (1).
PCT/EP2007/062842 2006-11-27 2007-11-27 Device for determining and/or monitoring a process variable and method for contacting Ceased WO2008065093A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006056171.6 2006-11-27
DE102006056171A DE102006056171A1 (en) 2006-11-27 2006-11-27 Device for determining and / or monitoring a process variable and method for contacting

Publications (2)

Publication Number Publication Date
WO2008065093A2 WO2008065093A2 (en) 2008-06-05
WO2008065093A3 true WO2008065093A3 (en) 2009-01-22

Family

ID=39326434

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/062842 Ceased WO2008065093A2 (en) 2006-11-27 2007-11-27 Device for determining and/or monitoring a process variable and method for contacting

Country Status (2)

Country Link
DE (1) DE102006056171A1 (en)
WO (1) WO2008065093A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (en) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Measuring resistor for temperature measurements
DE19750123A1 (en) * 1997-11-13 1999-06-10 Heraeus Sensor Nite Gmbh Method for producing a sensor arrangement for temperature measurement
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS5974653A (en) * 1982-10-22 1984-04-27 Hitachi Ltd Semiconductor device
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
DE19812690C1 (en) * 1998-03-23 1999-11-18 Siemens Ag Support for a temperature-dependent resistor
JP4486289B2 (en) * 2001-03-30 2010-06-23 株式会社デンソー Flow sensor and manufacturing method thereof
JP2006010547A (en) * 2004-06-28 2006-01-12 Denso Corp Humidity sensor module and humidity sensor mounting structure
DE102005051672A1 (en) * 2005-10-28 2007-05-03 Hydac Electronic Gmbh Multidimensional fluid flow sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (en) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Measuring resistor for temperature measurements
DE19750123A1 (en) * 1997-11-13 1999-06-10 Heraeus Sensor Nite Gmbh Method for producing a sensor arrangement for temperature measurement
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)

Also Published As

Publication number Publication date
WO2008065093A2 (en) 2008-06-05
DE102006056171A1 (en) 2008-05-29

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