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WO2008065093A3 - Vorrichtung zur bestimmung und/oder überwachung einer prozessgrösse und verfahren zur kontaktierung - Google Patents

Vorrichtung zur bestimmung und/oder überwachung einer prozessgrösse und verfahren zur kontaktierung Download PDF

Info

Publication number
WO2008065093A3
WO2008065093A3 PCT/EP2007/062842 EP2007062842W WO2008065093A3 WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3 EP 2007062842 W EP2007062842 W EP 2007062842W WO 2008065093 A3 WO2008065093 A3 WO 2008065093A3
Authority
WO
WIPO (PCT)
Prior art keywords
contacting
monitoring
conductor structure
sensor unit
determining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/062842
Other languages
English (en)
French (fr)
Other versions
WO2008065093A2 (de
Inventor
Dirk Boghun
Alfred Umkehrer
Stephan Konrad
Gundolf Lippold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Wetzer GmbH and Co KG
Original Assignee
Endress and Hauser Wetzer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Wetzer GmbH and Co KG filed Critical Endress and Hauser Wetzer GmbH and Co KG
Publication of WO2008065093A2 publication Critical patent/WO2008065093A2/de
Publication of WO2008065093A3 publication Critical patent/WO2008065093A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Die Erfindung bezieht sich auf eine Vorrichtung zur Bestimmung und/oder Überwachung mindestens einer Prozessgröße. Die Erfindung beinhaltet, dass mindestens eine Sensoreinheit (1) vorgesehen ist, dass die Sensoreinheit (1) mit einer Unterseite auf einer Oberseite eines Substrats (2) aufgebracht ist, dass die Sensoreinheit (1) zur elektrischen Kontaktierung mit mindestens einem Kontaktpad (3) verbunden ist, dass mindestens eine Kontaktplatine (5) vorgesehen ist, dass die Kontaktplatine (5) auf einer Unterseite mit einer Leiterstruktur (6) versehen ist, wobei die Leiterstruktur (6) korrespondierend zur Anordnung des Kontaktpads (3) ausgestaltet ist, dass die Leiterstruktur (6) und der Kontaktpad (3) elektrisch leitend miteinander kontaktiert sind, und dass die Kontaktplatine (5) auf einer Oberseite mindestens eine Kontaktierungseinheit (7) aufweist, wobei die Kontaktierungseinheit (7) und die Leiterstruktur (6) elektrisch leitend miteinander kontaktiert sind. Weiterhin bezieht sich die Erfindung auf ein Verfahren zur Kontaktierung einer Sensoreinheit (1).
PCT/EP2007/062842 2006-11-27 2007-11-27 Vorrichtung zur bestimmung und/oder überwachung einer prozessgrösse und verfahren zur kontaktierung Ceased WO2008065093A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006056171A DE102006056171A1 (de) 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung
DE102006056171.6 2006-11-27

Publications (2)

Publication Number Publication Date
WO2008065093A2 WO2008065093A2 (de) 2008-06-05
WO2008065093A3 true WO2008065093A3 (de) 2009-01-22

Family

ID=39326434

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/062842 Ceased WO2008065093A2 (de) 2006-11-27 2007-11-27 Vorrichtung zur bestimmung und/oder überwachung einer prozessgrösse und verfahren zur kontaktierung

Country Status (2)

Country Link
DE (1) DE102006056171A1 (de)
WO (1) WO2008065093A2 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (de) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
DE19750123A1 (de) * 1997-11-13 1999-06-10 Heraeus Sensor Nite Gmbh Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS5974653A (ja) * 1982-10-22 1984-04-27 Hitachi Ltd 半導体装置
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
DE19812690C1 (de) * 1998-03-23 1999-11-18 Siemens Ag Träger für einen temperaturabhängigen Widerstand
JP4486289B2 (ja) * 2001-03-30 2010-06-23 株式会社デンソー フローセンサ及びその製造方法
JP2006010547A (ja) * 2004-06-28 2006-01-12 Denso Corp 湿度センサモジュールおよび湿度センサの実装構造
DE102005051672A1 (de) * 2005-10-28 2007-05-03 Hydac Electronic Gmbh Mehrdimensionaler Fluidströmungssensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (de) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
DE19750123A1 (de) * 1997-11-13 1999-06-10 Heraeus Sensor Nite Gmbh Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)

Also Published As

Publication number Publication date
DE102006056171A1 (de) 2008-05-29
WO2008065093A2 (de) 2008-06-05

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