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WO2007101694A3 - Device comprising a gas cooler and evaporator for cooling, in particular, electronic components - Google Patents

Device comprising a gas cooler and evaporator for cooling, in particular, electronic components Download PDF

Info

Publication number
WO2007101694A3
WO2007101694A3 PCT/EP2007/002023 EP2007002023W WO2007101694A3 WO 2007101694 A3 WO2007101694 A3 WO 2007101694A3 EP 2007002023 W EP2007002023 W EP 2007002023W WO 2007101694 A3 WO2007101694 A3 WO 2007101694A3
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
cooling
gas cooler
electronic components
coolant conduit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/002023
Other languages
German (de)
French (fr)
Other versions
WO2007101694A2 (en
Inventor
Steffen Groezinger
Volker Velte
Henry Madsen
Henrik Olsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle Behr Industry GmbH and Co KG
Noise Limit ApS
Original Assignee
Behr Industrieanlagen GmbH and Co KG
Noise Limit ApS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr Industrieanlagen GmbH and Co KG, Noise Limit ApS filed Critical Behr Industrieanlagen GmbH and Co KG
Priority to US12/282,273 priority Critical patent/US20090301122A1/en
Priority to EP07723116A priority patent/EP1997139A2/en
Publication of WO2007101694A2 publication Critical patent/WO2007101694A2/en
Publication of WO2007101694A3 publication Critical patent/WO2007101694A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B45/00—Arrangements for charging or discharging refrigerant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Abstract

The invention relates to a device for cooling comprising an evaporator, a gas cooler, a first coolant conduit, a second coolant conduit and a filling device.
PCT/EP2007/002023 2006-03-09 2007-03-08 Device comprising a gas cooler and evaporator for cooling, in particular, electronic components Ceased WO2007101694A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/282,273 US20090301122A1 (en) 2006-03-09 2007-03-08 Device for cooling, in particular, electronic components, gas cooler and evaporator
EP07723116A EP1997139A2 (en) 2006-03-09 2007-03-08 Device for cooling, in particular, electronic components, gas cooler and evaporator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006011331A DE102006011331A1 (en) 2006-03-09 2006-03-09 Apparatus for cooling, in particular electronic components, gas coolers and evaporators
DE102006011331.4 2006-03-09

Publications (2)

Publication Number Publication Date
WO2007101694A2 WO2007101694A2 (en) 2007-09-13
WO2007101694A3 true WO2007101694A3 (en) 2007-11-15

Family

ID=38336084

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/002023 Ceased WO2007101694A2 (en) 2006-03-09 2007-03-08 Device comprising a gas cooler and evaporator for cooling, in particular, electronic components

Country Status (4)

Country Link
US (1) US20090301122A1 (en)
EP (1) EP1997139A2 (en)
DE (1) DE102006011331A1 (en)
WO (1) WO2007101694A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD723674S1 (en) * 2014-02-21 2015-03-03 Cool-It Hi Way Services Inc. Evaporator cover
US12449181B2 (en) 2021-04-08 2025-10-21 Lorenzo Badie, JR. Portable beach cooler

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903709A (en) * 1974-01-02 1975-09-09 Heil Quaker Corp Refrigerant charging apparatus
US4539817A (en) * 1983-12-23 1985-09-10 Staggs Michael J Refrigerant recovery and charging device
US4554792A (en) * 1981-07-08 1985-11-26 Margulefsky Allen L Method and apparatus for rehabilitating refrigerant
DE9402680U1 (en) * 1994-02-18 1994-04-21 Behr Gmbh & Co, 70469 Stuttgart Connection adapter for filling or removing refrigerant in a refrigerant system
DE10201557A1 (en) * 2002-01-17 2003-07-31 Modine Mfg Co Container with liquid for evaporation cooling of electronics/electrics has bearer plate with opening to which evacuation/filling port is connected as hydraulic connection to container interior
DE20314532U1 (en) * 2003-09-16 2004-02-19 Pries, Wulf H. Device for dissipating heat from electronic and electrical components
US20040070941A1 (en) * 2002-10-15 2004-04-15 Debashis Ghosh Compact thermosiphon with enhanced condenser for electronics cooling

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010743A (en) * 1989-12-15 1991-04-30 Richard E. Glaser Test fitting adapter for refrigerant lines
JP2859927B2 (en) * 1990-05-16 1999-02-24 株式会社東芝 Cooling device and temperature control device
US5159972A (en) * 1991-03-21 1992-11-03 Florida Power Corporation Controllable heat pipes for thermal energy transfer
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
JP3216770B2 (en) * 1995-03-20 2001-10-09 カルソニックカンセイ株式会社 Cooling device for electronic components
KR19980019402A (en) * 1998-03-16 1998-06-05 천기완 CPU COOLING DEVICE OF PC
US6125644A (en) * 1998-04-03 2000-10-03 United Microelectronics, Corp. Container of coolant
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
DE10027617A1 (en) * 2000-06-02 2001-12-06 Mannesmann Vdo Ag Device for driving an air conditioning compressor
JP2002168547A (en) * 2000-11-20 2002-06-14 Global Cooling Bv CPU cooling device with thermosiphon
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
US6704200B2 (en) * 2002-02-12 2004-03-09 Hewlett-Packard Development Company, L.P. Loop thermosyphon using microchannel etched semiconductor die as evaporator
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
CA2561769C (en) * 2004-03-31 2009-12-22 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7404433B1 (en) * 2007-01-31 2008-07-29 Man Zai Industrial Co., Ltd. Liquid cooled heat sink

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903709A (en) * 1974-01-02 1975-09-09 Heil Quaker Corp Refrigerant charging apparatus
US4554792A (en) * 1981-07-08 1985-11-26 Margulefsky Allen L Method and apparatus for rehabilitating refrigerant
US4539817A (en) * 1983-12-23 1985-09-10 Staggs Michael J Refrigerant recovery and charging device
DE9402680U1 (en) * 1994-02-18 1994-04-21 Behr Gmbh & Co, 70469 Stuttgart Connection adapter for filling or removing refrigerant in a refrigerant system
DE10201557A1 (en) * 2002-01-17 2003-07-31 Modine Mfg Co Container with liquid for evaporation cooling of electronics/electrics has bearer plate with opening to which evacuation/filling port is connected as hydraulic connection to container interior
US20040070941A1 (en) * 2002-10-15 2004-04-15 Debashis Ghosh Compact thermosiphon with enhanced condenser for electronics cooling
DE20314532U1 (en) * 2003-09-16 2004-02-19 Pries, Wulf H. Device for dissipating heat from electronic and electrical components

Also Published As

Publication number Publication date
US20090301122A1 (en) 2009-12-10
DE102006011331A1 (en) 2007-09-13
WO2007101694A2 (en) 2007-09-13
EP1997139A2 (en) 2008-12-03

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