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WO2007148769A1 - Corps photoémetteur flexible et son substrat flexible - Google Patents

Corps photoémetteur flexible et son substrat flexible Download PDF

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Publication number
WO2007148769A1
WO2007148769A1 PCT/JP2007/062555 JP2007062555W WO2007148769A1 WO 2007148769 A1 WO2007148769 A1 WO 2007148769A1 JP 2007062555 W JP2007062555 W JP 2007062555W WO 2007148769 A1 WO2007148769 A1 WO 2007148769A1
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WO
WIPO (PCT)
Prior art keywords
light
light emitting
capsule
electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/062555
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English (en)
Japanese (ja)
Inventor
Hiroyuki Yanashima
Shinichi Morishima
Kyoko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of WO2007148769A1 publication Critical patent/WO2007148769A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/182—OLED comprising a fiber structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes

Definitions

  • the present invention relates to a flexural power! / Light emitter and a flexible substrate used therefor, and more particularly to a flexica light emitter that emits light when a current is applied or a voltage is applied thereto, and a flexible substrate used therefor.
  • Toru has been known as an emissive eaves such as an organic EL emissive that emits light when a current is applied to the emissive layer and an inorganic EL L3 ⁇ 4T that emits light when a voltage is applied to the emissive layer.
  • Light emitters placed on multiple substrates are applied to backlights for liquid crystal displays.
  • at least one layer of an organic material containing a carrier compound having carrier transportability is formed on at least a part of the outer peripheral surface of a linear book.
  • a linear light emission »1 formed by laminating a light emitting layer and a transparent electrode layer.
  • a ridge-like light emitting device comprising: a fiber core having one electrode; at least one light emitting layer disposed on the outer surface of the first electrode; and a transmissive second electrode disposed on the light emitting layer 4 is disclosed.
  • a semi-chip is mounted on a flexible chip, and the first main surface of the chip 3 ⁇ 4 f
  • a housing frame is formed, and a casing frame is provided, the casing frame being filled with a sample of a beam, in particular: filled with a semiconductor chip, comprising a semiconductor chip
  • a photoelectric component 5 is disclosed.
  • the encapsulation includes a sealing enclosure that encloses the area of the OLED device in order to:
  • the sealing enclosure is an eave 6 with a cap edge and an enclosure sealing area where adhesive is applied to seal the OLED device, and it is disclosed that a flexure substrate can be used as the substrate.
  • Japanese National Publication No. 002-503832 discloses a tiled display in which tiles ( ⁇ 7) formed by a plurality of pixel formations are arranged.
  • the substrate and the light emitter are integrated, an attempt is made to bend the substrate with a large curvature: ⁇ , the light emitting part and the substrate may be peeled off. It was not large enough for flexibility. Furthermore, the light emitting eave 7 is not yet sufficient in terms of flexibility because it is sealed with a tie formed by a plurality of pixel forming elements. Disclosure of the invention,
  • the present invention provides a flexural force optical body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs, and its flexibilities]
  • An object is to provide a flexible substrate that can be suitably used when a light emitter is difficult.
  • the present invention includes: 1) a flexible substrate; 2) a light emitting portion disposed at least on the flexible substrate and having at least a light emitting layer and constituting one pixel; and 3) a capsule shape for individually sealing the light emitting portions. 4) a plurality of capsule-shaped micro light-emitting devices each having a first electrode and a second electrode for applying a voltage to the light-emitting portion, and 5) a first electrode or a second electrode. Wiring for conducting electricity is provided, and a flexipreluminous body is provided.
  • FIG. 1 is a schematic view of a preferred embodiment of a capsule-like microphone-mouth light emitting eave.
  • FIG. 2 is a schematic diagram of a preferred embodiment of the capsule-like microphone-mouth light emitting device of the present invention shown in FIG.
  • FIG. 1 A first figure.
  • FIG. 3 is a cross-sectional view taken along the line IV-B ′ of a preferred embodiment of the force-pseed microphone opening light emitting device of the present invention shown in FIG.
  • FIG. 4 is a schematic diagram showing a state in which laser is irradiated on the outer periphery of the cylindrical laminate.
  • FIG. 5 is a schematic diagram showing a state where a laser beam is radiated to the cylindrical laminate on which the sealing layer is formed.
  • FIG. 6 is a cross-sectional view showing “ ⁇ ” of a preferred embodiment of the flexible substrate of the present invention.
  • FIG. 7 is a schematic diagram of the upper substrate of the flexure substrate shown in FIG. 2007/062555
  • FIG. 8 is a cross-sectional view of the lower substrate of the flexible substrate shown in FIG.
  • FIG. 9 shows a first view of a preferred embodiment of the flexure phosphor of the present invention.
  • FIG. 10 is a top view of each Uffl showing a part of another preferred embodiment of the flexible optical body of the present invention.
  • FIG. 11 is a schematic cross-sectional view showing a part of another preferred embodiment of the flexure phosphor of the present invention.
  • FIG. 12 is a schematic cross-sectional view showing a state in which a canon film is laminated on the flexural force V3 ⁇ 4 light body shown in FIGS.
  • FIG. 13 is a perspective view of a linear flexure light emitter suitable as the flexible bridle light emitter of the present invention. Explanation of symbols
  • a plurality of capsule-like microphone opening light emitting eaves are placed on a flexible substrate.
  • the capsule-shaped micro light-emitting element is small in size and covers the flexure substrate in the form of dots.
  • the light emitting layer is a cylindrical light emitting layer
  • the first electrode force is positioned in the inner periphery of the cylindrical light emitting layer
  • the second electrode is positioned on the outer periphery of the cylindrical light emitting layer. It is preferable. Since the capsule-shaped micro light-emitting eave has a substantially cylindrical shape, it can emit light radially on its outer peripheral surface. Flexibility gained! ⁇ Because the viewing angle of the light body is enlarged, the light emitting surface can be fully viewed in a bent state.
  • the force-pseed microphone-mouth light-emitting element has an average diameter of 1 to 100 mm, preferably 1 to 500 m, and length:! To 200 wm, preferably 1 to 50 It is preferably j «m and a substantially cylindrical capsule shape having a ratio of average diameter to length (average diameter: length) of 1: 1 to 1: 5. If the average diameter is lower than the lower sister, workability during dredging becomes difficult. On the other hand, if the upper limit is exceeded, heat generation from itself increases. Force-pseed microphone mouth If the length of the element is lower than my younger sister, workability during S is difficult. On the other hand, when the above upper limit is exceeded, unevenness due to the location of current flow increases, and the error from the element itself increases.
  • the layer is preferably made of an organic EL material or an inorganic EL material, particularly preferably an organic EL material.
  • organic EL materials and machine EL materials it becomes a powerful power to emit light more efficiently.
  • the capsule-shaped micro light-emitting eave When an organic EL material suitable for the light-emitting layer is used, the capsule-shaped micro light-emitting eave must have one of the first electrode and the second electrode as an eave, and the light-emitting part is disposed between the P sickle and the light-emitting layer. And an electron transport layer and a Z or electron injection layer.
  • the capsule-like microphone mouth light emission ⁇ ? Is one in which one of the first electrode and the second electrode is an anode, and the light emitting part is a hole transport layer disposed between the anode and the light emitting layer and z or It is preferable to provide a hole injection layer.
  • the capsule-shaped microphone-mouth light-emitting element emits light more efficiently. It becomes possible.
  • a concave portion for accommodating the capsule-shaped microphone opening light emitting eave is formed on the flexible substrate.
  • a flexica v3 ⁇ 4 light body including a flexible substrate having a concave portion has a configuration in which the capsule-shaped microphone-mouth light-emitting element is accommodated in the concave portion of the flexible substrate, and the capsule-shaped microphone-mouth light-emitting device is more stably fixed.
  • the flexure light emitter can be made thinner.
  • the flexible substrate is made by stacking the lower substrate and the upper substrate ⁇ r ⁇ , and the lower substrate is formed with a lower housing part to accommodate the bottom surface of the capsule-like microphone mouth light emitting 3 ⁇ 4 ⁇ , It is preferable that an upper housing portion for housing the upper surface of the capsule-shaped microphone-mouth light emitting element is formed on the upper substrate, and that the concave portion is formed of the upper housing portion and the upper housing portion.
  • a flexible luminous body having such a flexible substrate can form wiring on the lower substrate and cover the wiring, etc. with the upper substrate, and can sufficiently prevent the wiring from dropping off and being withstood.
  • a wiring accommodating portion for accommodating a wiring is formed on a flexible substrate, and that the wiring is accommodated in a movable state in the wire accommodating portion.
  • a flexible substrate having such a wiring accommodating portion is provided, and the wiring is accommodated in a movable state in the wiring accommodating portion, so that the wiring moves or extends within the movable range even when bent. It shrinks and the wiring itself is hardly loaded.
  • Such a flexible light emitter is sufficiently prevented from being broken by bending or the like.
  • the wiring length is given enough allowance (play) so that the wiring cable can move automatically, the wiring can be extended by the amount of play when the flexica light body is extended.
  • the flexible substrate of the present invention is formed with recesses for forming a plurality of capsule-like microphone-mouth light emitting elements.
  • the flexible board is composed of a T-side board and an upper board.
  • the lower housing part is formed on the lower substrate to accommodate the lower surface of the capsule microphone mouth light emitting element. It is preferable that an upper accommodating portion for accommodating the upper surface of the element is formed, and the concave portion is formed by the side accommodating portion and the upper accommodating portion.
  • the flexible substrate is preferably formed with a wiring accommodating portion for accommodating wiring on the flexible substrate.
  • the capsule-shaped micro light-emitting element includes a light-emitting portion having at least a light-emitting layer and constituting one pixel, a capsule-shaped sealing layer that individually seals the light-emitting portion, and a first for applying a voltage to the light-emitting portion.
  • An electrode and a second electrode are examples of a light-emitting portion having at least a light-emitting layer and constituting one pixel.
  • FIG. 1 shows a schematic diagram of a preferred embodiment of a force-pessel-like microphone-mouth light-emitting element.
  • the force-pseed microphone mouthpiece has a round-shaped turnip W shape.
  • “Capsule shape” refers to a shape in which the ratio of the length L to the diameter d of the cross section (d: L) is in the range of 1: 1 to 1: 5.
  • the ⁇ - ⁇ 'cross section is circular, but if the cross section is not circular, the diameter of the circumscribed circle of the cross section is defined as diameter d.
  • the length L is usually 2 0 00 m or less, preferably 1 0 0 0 0 m or less, and more preferably 5 0 0 0 m or less.
  • FIG. 2 and FIG. 3 are a schematic AA ′ cross-sectional view and a schematic BB ′ cross-sectional view, respectively, of a preferred embodiment of the capsule-shaped micro light emitting device shown in FIG.
  • the capsule-shaped micro light-emitting eave shown in Fig. 2 uses a thin organic EL material for the light-emitting layer, and is arranged on the outer periphery of mnm- (bus electrode) ⁇ ⁇ , its layer 11 and mmi ⁇
  • An electron transport layer 1 2 a light-emitting layer 1 3 disposed on the outer periphery of the electron transport layer 1 2, a hole transport layer 1 4 disposed on the outer periphery of the light-emitting layer 1 3, and a hole transport layer 1
  • the light emitting section includes a light emitting layer 13, an electron transport layer 12, and a hole transport layer 14.
  • 113 ⁇ 4 ⁇ ? 10 electrically connects the capsule-shaped micro light-emitting element and an external power source (not shown).
  • materials for forming 0 include conductive metals such as nickel, aluminum, and copper.
  • the & -i cross-sectional shape is preferably non-planar (for example, the cross-section is circular, polygonal, etc.).
  • l3 ⁇ 4g3 ⁇ 4? 10 may be hollow (cylindrical) or solid.
  • the cathode terminal 10 has a diameter of preferably about 1 to L00 0 am, and more preferably about 10 to 300 mm. If the diameter is lower than the above, the workability at that time becomes extremely difficult.
  • the diameter means the diameter of the circumscribed circle of the cross-sectional shape when the cross-section is not circular.
  • the iS layer 11 is arranged to emit electrons at a relatively low voltage.
  • 5 The material for forming the sealing layer 11 is preferably a material that has a relatively small work function and allows easy injection of electrons into the light emitting layer. .
  • Weaving layer materials are, for example, metals such as norium, force J-resium, gold, magnesium, magnesium Z silver alloy, their oxides, and multilayer structures in which aluminum, silver, chromium, etc. are further formed on these metals It is.
  • an inorganic EL material for the light-emitting layer! ⁇ , Eaves layer material is, for example, gold, silver, copper, chromium, aluminum.
  • the thickness of the 113 ⁇ 4 layer 11 depends on the intended design, but is preferably about 3 to 5 Onm. When the thickness is outside the above lower limit and upper limit, electrons are not sufficiently injected into the light emitting layer.
  • the electron transport layer 12 disposed on the outer periphery of the mM i 1 is disposed in the bag in order to improve the efficiency of the electron transport effect when the light emitting layer is an organic EL material.
  • Materials for forming the electron transport layer 1 2 may be any known material that example Bei electron transporting property, for example, polycyclic hydro mosquito one carbon-series derivatives, heterocyclic compounds, tris (8-quinolinolato) Aluminum. 2555
  • the light emitting layer 13 is a layer containing a material that emits light when a voltage is applied by the first electrode and the second electrode (by passing a current).
  • the light emitting layer material used for the light emitting layer 13 is a material that emits light when an electric current is applied or a voltage is applied, and an organic EL material or an inorganic EL material is preferable.
  • organic EL materials include distyryl biphenyl-based materials, dimesitylboryl-based materials, stilbene-based materials, dipyrryl-dicanobenzene materials, benzoxazole-based materials, distyryl-based materials, carbazole-based materials, dibenzochrysene-based materials, Examples include arylamine-based materials, pyrene-substituted oligothiophene-based materials, PPV oligomer-based materials, carbazole-based materials, and polyfluorene-based materials.
  • inorganic EL materials include GaN doped with Mg, ZnS doped with Mn, and SrS doped with Ce.
  • the thickness of the light emitting layer 13 can be reduced by about 1 to 3 according to the intended design, but is preferably about 10 to 200 nm. If the thickness is less than the above, recombination of electrons and holes does not occur sufficiently, luminance is not sufficient, or S becomes difficult. On the other hand, when the upper limit is exceeded, the applied voltage tends to increase.
  • the voltage applied to the light-emitting layer 13 may be determined according to the design. From the viewpoint of efficient light emission, about 2 to: L 00 Pol ⁇ is preferable.
  • the hole transport layer 14 is preferably disposed in order to improve the efficiency of the hole transport effect at an age when the light emitting layer is an organic EL material.
  • the hole transport layer material for forming the hole transport layer 14 include N, N'-diphenyl, ⁇ '-di (3-methylphenyl) 4, 4'- diaminobiphenyl (TPD), ⁇ ( 4, 4 '—bis [N— (1-naphthy 1) -N-pheny 1 ami no] bi pheny 1).
  • the thickness of the hole transport layer 14 can be changed according to the desired design.
  • the thickness is lower than ⁇ , the hole transport effect cannot be obtained sufficiently.
  • the upper limit is exceeded, the applied voltage increases.
  • the anode layer material for forming the anode layer 15 is, for example, indium tin oxide ( ⁇ ), tin oxide, nickel, or gold.
  • the thickness of the anode layer 15 is adjusted according to the intended design. However, about 5 to 30 nm is preferable. When the thickness exceeds the upper limit, the applied voltage increases.
  • the anode terminal 16 is arranged to electrically connect the light emitting element to an external power source (not shown) via the anode terminal 16.
  • an external power source not shown
  • the same materials as those described above can be used.
  • the sealing layer 17 is disposed to protect the light emitting part including the light emitting layer 13 from the outside air or the like.
  • the sealing material used for forming the sealing layer 17 include a transparent hatched epoxy resin, a photocurable epoxy resin, a silicon oxide film, and glass.
  • the thickness of the sealing layer 17 may be changed according to the target design, but is preferably about 10 to 300 nm. When the thickness is lower than the above, the sealing is not sufficiently performed or the strength of the sealing film is not sufficient. On the other hand, when the upper limit is exceeded, production becomes difficult, or emitted light is not sufficiently transmitted.
  • the shape is cylindrical and the B-B 'cross section is circular, but in the capsule micro light-emitting device, the shape is not particularly limited, and the cross-section May be an ellipse or a polygon.
  • the turnip-like microphone-mouth light-emitting element has an average diameter of 1 to: L 0 00 m, more preferably l to 500 m, more preferably 10 to 30 O im, and a length of 1 to 2 0 0 0 jt / m, more preferably 1 to 100 jum, more preferably 1 to 50 jum, and the ratio of mean diameter to length (mean diameter: length) is 1: :! ⁇ 1: It is preferable that it is the shape of a substantially liquor capsule which is 5.
  • the capsule micro light-emitting device of the above embodiment has ⁇ (bus electrode) 10 and ⁇ layer 1
  • the capsule micro light-emitting element at least a light-emitting layer and a light emitting element constituting one pixel are provided.
  • Capsule-shaped sealing layer for individually sealing the light emitting part, and a first electrode for applying a voltage to the light emitting part
  • the other configuration is not particularly limited as long as it includes the second electrode.
  • the light emitting portion is arranged on the outer periphery of the cathode layer 11 in order to improve the effect of electron injection. It may be provided.
  • the electron injection layer material for forming the electron 3 ⁇ 4 ⁇ layer is, for example, Ba, Ca, CaF, LiF, Li: NaF.
  • the thickness of the electron injection layer is preferably about 3 to 50 nm. When the upper limit is exceeded, the applied voltage increases.
  • the capsule-shaped micro light-emitting eave is arranged so that the light-emitting portion is in contact with the inner periphery of the anode layer 15.
  • a correct injection layer may also be provided.
  • the hole injection layer material for forming the hole injection layer is, for example, a phthalocyanine complex such as copper phthalocyanine, 4, 4 ', 4 "-tris (3-methylphenylphenylamino) Aromatic amine derivatives such as hydrazoles, force rubazole derivatives, triazole inducing, imidazole inducing, oxadiazole derivatives having amino groups, and polythiophene
  • the thickness of the hole injection layer is 5 to 300.
  • the first electrode is a ridge and the second electrode is an anode, but the capsule micro light-emitting element is: A preferred embodiment of the SSi method for the capsule-shaped microphone-mouth light emitting device will be described.
  • the method of manufacturing the force-pseed microphone-mouth light-emitting element includes a step (I) of applying a light-emitting layer material on the outer periphery of a linear first electrode material, and forming a cylindrical light-emitting layer by grass cutting; Supplying a second electrode material on the outer periphery of the layer to form a cylindrical second electrode layer to obtain a cylindrical laminate (II); and at predetermined intervals on the outer periphery of the cylindrical laminate.
  • a sealing layer by cutting the cylindrical laminate on which the sealing layer is formed at the exposed portion, and forming a light emitting layer having at least a light emitting layer and constituting one pixel; Seal individually And a step (V) of obtaining a capsule-like micro light-emitting device comprising: a capsule-shaped sealing layer; and a first electrode and a second electrode for applying a voltage to the light-emitting portion.
  • a light-emitting layer material is applied on the outer periphery of the linear first electrode material, and dried to form a cylindrical light-emitting layer (step (I)).
  • the first electrode material may be a material consisting only of a core wire made of a material or a material provided with a cylindrical negative electrode layer on the outer periphery of the spring, but preferably a cylindrical ridge layer on the outer periphery of the core wire It is a material with 3 ⁇ 4 What is necessary is just to use the same material and layer material as those described in the above-mentioned capsule-shaped microphone opening light emitting element as the
  • the method of supplying the IS layer material it is sufficient to use the method of, for example, vacuum deposition, chemical vapor deposition, etc., electric plating, electroless plating, electron impact method may be adopted. .
  • the light emitting layer material may be applied by the following coating method. For example, dipping, spraying, printing, printing, or hair may be used.
  • the light emitting layer material may be mixed with an appropriate solvent (water or organic solvent) and applied as a mixed solution.
  • the method of preparing the mixed solution is sufficient.
  • the IS, viscosity, etc. may be adjusted by preparing a desired mixed solution.
  • the cocoon can be made by the method of ⁇ ⁇ . For example, it can be done by natural grass drying, heat drying, or the like. During heating, it is preferable to heat and dry for about 5 minutes to 5 hours under conditions that do not damage the light emitting layer material below the glass transition of the light emitting layer material.
  • the electron injection layer When the electron injection layer is disposed in the capsule light emitting element, it is preferable to apply the electron injection layer material on the outer periphery of the linear first electrode material before applying the light emitting layer material. In addition, when the electron transport layer is disposed on the capsule light emitting eave, it is preferable that the electron transport layer material is applied and grassed before the light emitting layer material is applied.
  • the electron injection layer material and the electron transport layer material the electron injection layer material and the electron transport layer described in the above-described capsule-shaped micro light emitting device are used. The same material as the layer feeding material may be used.
  • a method for applying the electron injection layer material or the electron transport layer material and a method for applying the electron injection layer material a method similar to the method for applying the light emitting layer material and the method for drying may be provided.
  • a second electrode material is supplied onto the outer periphery of the cylindrical light emitting layer to form a cylindrical second electrode layer, thereby obtaining a cylindrical laminate (step (II)).
  • the second electrode material is an anode layer material for forming an anode layer.
  • the anode layer material the same anode layer material as described in the above-described capsule-shaped micro light-emitting element may be used.
  • a vapor deposition method such as vacuum vapor deposition and chemical vapor deposition, an electroplating method, an electroless plating method, an electron impact method, or a sol-gel method may be used.
  • the hole transport layer material when the hole transport layer is disposed on the capsule-shaped light emitting eave, the hole transport layer material is applied on the outer periphery of the linear first electrode material before supplying the second electrode material. Then, it is preferable to include a step of drying. In the case where the hole injection layer is disposed on the capsule light emitting eave, it is preferable to include a step of applying and injecting a hole injection layer material.
  • the hole transport layer material and the IE injection layer material the same materials as the electron injection layer material and the electron transport layer material described in the capsule micro light-emitting element described above may be used.
  • step (III) As a method for applying and transporting the hole transport layer material or the hole injection layer material, a method similar to the method for applying the light emitting layer material and the method for drying described above may be used. Next, an exposed portion where the first electrode material is exposed is formed at predetermined intervals on the outer periphery of the cylindrical laminated body at predetermined intervals (step (III)).
  • FIG. 4 is a schematic view showing a state in which an exposed portion 22 where the first electrode material is exposed is formed by irradiating the laser L from the laser light source 21 on the outer periphery of the cylindrical laminate 20.
  • arrow A indicates the direction of travel.
  • the laser light source 21 except for the first electrode material from the cylindrical laminate 20 Layer of! If it can be obtained, it is preferable to be able to irradiate a pulsed high-power laser L.
  • the laser L a pulse laser having an irradiation bow of 5 W / cm 2 to 100 WZ cm 2 is preferable.
  • Laser L is preferably a sheet of laser light from the viewpoint of improving production efficiency.
  • laser L is irradiated, only the layers other than the first electrode material in the cylindrical laminate 20 are irradiated by laser L! Adjust so that the laser beam is 1 L.
  • the interval at which the laser L is irradiated may be adjusted as appropriate according to the design of the target capsule microphone mouth light emitting element.
  • the exposed portion 22 where the first electrode material is exposed may be formed by irradiating the laser L on the outer periphery of the cylindrical laminate 20.
  • the spring made of the above-described material of the first electrode material may be exposed by laser L irradiation.
  • a sealing material is applied on the outer periphery of the cylindrical laminate on which the exposed portion is formed, and dried to form a sealing layer (step (IV)).
  • the same sealing material as that described in the above-described capsule-shaped microphone-mouth light-emitting element of the present invention may be used.
  • a method of applying the sealing material and a method of drying the same method as the method of applying the light-emitting layer material and the method of applying it may be reversed.
  • a method of forming the sealing layer a method of forming a sealing layer by evaporating a sealing material may be used.
  • step (V) the cylindrical laminated body on which the sealing layer is formed is cut at the exposed portion.
  • the method of cutting the cylindrical laminate at the exposed portion may be reversed from the method of cutting with a high-power laser, for example.
  • a light emitting part having at least a light emitting layer and constituting one pixel
  • a capsule-shaped sealing layer for individually sealing the light emitting part
  • a first electrode for applying a voltage to the light emitting part
  • the anode terminal may be formed so as to be in contact with the anode layer during use so that the anode layer is electrically connected to an external power source, and the sealing layer is formed.
  • the anode Before cutting the cylindrical laminate at the exposed portion, the anode is previously placed in contact with the anode layer on the cylindrical laminate. It may be formed.
  • a vapor deposition method such as vacuum vapor deposition or chemical vapor deposition, electroplating, non-electrostatic square plating, electronic collision, or the like may be employed.
  • the material for forming the anode may be the same as the material described in the above-mentioned capsule-like microphone-mouth light emitting device of the present invention.
  • FIG. 5 is a schematic view showing a state in which the exposed portion 22 is exposed again by irradiating the cylindrical laminate 20 on which the sealing layer 17 is formed with the laser L.
  • Any flexible substrate may be used as long as it can be used for arranging the light emitting elements, and a known flexible substrate can be used.
  • the shape of the flexible substrate may be linear or planar.
  • the above method may be reversed.
  • the flexible substrate is preferably a flexible substrate in which concave portions for forming a plurality of capsule-shaped micro light-emitting elements are formed, and is a flexible substrate formed by superposing a lower substrate and an upper substrate on the lower substrate.
  • a lower housing part is formed to accommodate the lower surface of the capsule-shaped micro light-emitting element, and an upper surface for accommodating the upper surface of the capsule-shaped micro light-emitting element on the upper substrate.
  • a flexure substrate in which a side accommodating portion is formed and a recess is formed from a lower accommodating portion and an upper accommodating portion is more preferable, and a flexible flexible substrate force in which a wiring accommodating portion for accommodating wiring is formed S is particularly preferred.
  • FIG. 6 is a cross-sectional view showing ⁇ of a preferred embodiment of the flexure substrate.
  • FIG. 7 is a schematic diagram of the upper substrate of the flexible substrate shown in FIG. 6, and
  • FIG. 8 is a schematic diagram of the lower substrate of the flexure substrate shown in FIG.
  • the flexible substrate shown in FIGS. 6 to 8 includes an upper substrate 30 and a lower substrate 31.
  • the flexible substrate including the upper substrate 30 and the lower substrate 31 has a recess 32 formed therein.
  • On the upper substrate 30, an upper housing part 40 is formed, and an anode wiring 42 is formed (see FIG. 7).
  • the lower substrate 3 1 is formed with a lower housing portion 4 1, an anode wiring 4 2, an ISS wiring groove (wiring housing portion) 4 3, and an anode wiring groove (wiring housing portion) 4 4. (See Figure 8).
  • the concave portion 32 of the flexible substrate is formed by the above-described upper accommodation portion 40 and lower accommodation portion 41.
  • the shape of the recess 32 may be any shape as long as it can accommodate the capsule-shaped micro light-emitting element, and may be designed in accordance with the shape of the force-pseed microphone-mouth light-emitting element.
  • the shapes of the upper housing part 40 and the lower housing part 41 may be formed in the shape of the intended concave part 32.
  • the shape of the recess may be reduced by a method that can form such a recess on the flexible substrate. For example, a method of forming the recess by etching can be given.
  • the anode wiring 42 is made to dissipate with either the first or second electrode of the capsule-like microphone mouth light emitting element when the capsule-like microphone mouth light emitting element is disposed, and to conduct electricity to the capsule-like micro light emitting element. Formed for.
  • a known wiring material used for wiring for example, a book such as aluminum or copper
  • a method of forming the anode wiring the method of ⁇ ⁇ may be adopted.
  • Sealed wiring grooves 4 3 and negative wiring grooves 4 4 are grooves for arranging wiring. For the shape of grooves 4 3 and 4 4, the method of
  • the polarity may be reversed as appropriate, or the groove for the selfish line may be positioned.
  • the flexif 1 / 3 ⁇ 4 light body of the present invention includes a flexible substrate, a plurality of capsule-shaped microphone-mouth light-emitting elements disposed on the flexure-shaped substrate, and electrical conduction to the first electrode or the second electrode of the capsule-shaped microphone-mouth light-emitting element. Wiring for carrying out.
  • FIG. 9 shows a perspective view of a preferred embodiment of the flexiflex / semiconductor of the present invention. The flexible light emitter shown in FIG.
  • the flexure substrate 50 is composed only of the lower substrate 31.
  • the flexi-powered light has a structure in which a plurality of force-pseudo microphone mouth light-emitting elements 51 are arranged on a flexible substrate 50. Therefore, when the light-emitting body has a defect, the defect has occurred.
  • the capsule micro light-emitting element 51 can be easily repaired by replacing it with a new one.
  • the size of the capsule-shaped micro light-emitting eave itself is small, and it exists in the form of dots on the flexible substrate. Therefore, even when the flexible light emitter is bent, the light emission itself is received. Since the force is small and it is hardly affected by the difference in flexibility between the light-emitting element and the substrate, it becomes a power ability to bend sufficiently. Therefore, the flexica phosphor can exhibit sufficiently excellent flexibility.
  • Wiring (anode wiring 4 2, I ® wiring 5 2 A, ⁇ wiring 5 2 B and I pole wiring 5 3) is a cuff.
  • Cell-shaped micro light-emitting element 51 1 1st electrode (in this embodiment! ⁇ ⁇ ⁇ ) or 2nd electrode (actual In the embodiment, any material capable of conducting electricity to the anode) may be used.
  • the wiring may be a wiring formed by fflf using a method such as vapor deposition, or a wiring in which this is arranged using a spring-like conductor.
  • Each wire and the age part of each wire and electrode may be connected by a method of ⁇ ⁇ such as spot welding.
  • the flexible J-ray illuminator may be used by laminating a cano film in order to protect the wiring and the like during use.
  • a film of polyethylene, polypropylene, polyethylene terephthalate or the like may be used as the cano film.
  • a method for fixing the capsule-shaped microphone-mouth light-emitting eave 51 to the flexible substrate 50 a method may be adopted in which the outer periphery of the force-push-shaped microphone-mouth light-emitting element is bonded to the lower substrate with a conductive adhesive or the like.
  • the cover film By using the cover film, the capsule-shaped micro light-emitting element and the substrate are not directly bonded, but the lower substrate and the cover film are bonded together with adhesive, etc., so that the first electrode and the second electrode are brought into contact with the wiring by crimping You may adopt the method of.
  • the flexiff light body is composed of only the flexible substrate 50 0 force R-law substrate 3 1, but such a flexica light body may be used as it is, and the lower substrate 3 1 may be connected to the upper substrate 30. May be used as another form.
  • FIG. 10 is a schematic top view showing a part of a flexible embodiment of the flexipower! / Trimming body
  • FIG. 11 is a schematic sectional view thereof. In the flexible pre-illuminator shown in FIGS.
  • a flexible substrate 50 including an upper substrate 30 and a lower substrate 31, a capsule micro light-emitting element 51, and a first It consists of a self-spring for conducting electricity to the electrode or the second electrode (anode wiring 4 3, iS wire 5 2 ⁇ , I® wire 5 2 ⁇ , anode wire 5 3).
  • the flexible substrate 50 is the same as the flexible substrate shown in FIGS.
  • the I® wirings 5 2 ⁇ and 5 2 ⁇ are arranged in the cathode wiring groove 43, and the anode wiring 53 is arranged in the anode wiring groove 44.
  • linear conductors are used for the wirings 5 2 A, 5 2 B and 5 3.
  • Cathode wiring 5 2 A and cathode wiring 5 2 B are spots Connected by welding. Anode wiring 4 3 and pole wiring 5 3 are also connected by spot welding.
  • the capsule-shaped micro light-emitting element 51 the capsule-shaped micro light-emitting element shown in FIG. 1 is used.
  • the anode wiring 43 is in contact with the anode 6 of the capsule-shaped micro light emitting eave 51.
  • the PtK ⁇ l 0 of the capsule-shaped micro light-emitting eave 5 1 and the Pt ⁇ wire 5 3 are connected by spot welding.
  • the US wiring 5 2 B has a margin in the length of the groove 4 3 for the vertical wiring.
  • the i ⁇ wiring 5 2 B is movable in the ⁇ wiring groove 4 3.
  • the wiring itself moves and wiring
  • the wire expands and contracts by the margin of the length, the wiring itself is hardly loaded, and it is sufficiently prevented that the wiring is disconnected due to bending or stretching.
  • the anode wiring 53 has a margin in the length of the anode wiring groove 44. Therefore, the anode wiring 53 is movable in the anode wiring groove 44.
  • Anode wiring groove (wiring housing part) 4 4 With positive wiring 5 3 accommodated in a movable state, the wiring itself can be moved even when the flexible luminous body is bent, so that the wiring has a margin of length. Because the wire is stretched and shrunk, there is almost no load on the wire itself, and the wire is sufficiently prevented from being disconnected by bending or stretching. Therefore, the flexible / light-emitting body can exhibit extremely excellent flexure properties.
  • a known method such as a method of bonding two substrates using a contact U or the like may be adopted.
  • a cover film may be laminated on the flexible 1 / 3 ⁇ 4 light body of other embodiments.
  • FIG. 1 An example of laminating canopy film 60 is shown in FIG.
  • the preferred embodiment of the flexible luminous body of the present invention has been described above, but the present invention is not limited to the above embodiment.
  • a cylindrical cabcell-shaped micro light-emitting eave is used.
  • capsule-shaped micro-emission eaves having various shapes may be used.
  • a sheet-like flexible substrate is used, but As the lexical substrate, a linear flexure substrate may be used.
  • Figure 13 (m) shows an example of a flexure light emitter when a linear flexible substrate is used.
  • a flexure light body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs. It is possible to provide a flexible substrate that can be used for the Mt of light bodies.
  • the flexible light emitter of the present invention is particularly useful as a light emitter used for various displays and the like because it is extremely excellent in life.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention porte: sur un corps photoémetteur très flexible et pouvant être réparé facilement au niveau de tout pixel défectueux; et sur un substrat flexible pouvant servir à la fabrication dudit corps photoémetteur. Ce dernier comporte: ledit substrat (50); une section photoémettrice disposée sur le substrat (50) et formant un pixel; une couche d'encapsulage scellant individuellement chacune des sections photoémettrices; plusieurs micro-éléments photoémetteurs encapsulés (51) munis d'une première électrode et d'une deuxième électrode d'application de tension aux sections photoémettrices; et des conducteurs alimentant les électrodes en courant.
PCT/JP2007/062555 2006-06-19 2007-06-15 Corps photoémetteur flexible et son substrat flexible Ceased WO2007148769A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-168582 2006-06-19
JP2006168582A JP5058521B2 (ja) 2006-06-19 2006-06-19 フレキシブル発光体及びそれに用いるフレキシブル基板

Publications (1)

Publication Number Publication Date
WO2007148769A1 true WO2007148769A1 (fr) 2007-12-27

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PCT/JP2007/062555 Ceased WO2007148769A1 (fr) 2006-06-19 2007-06-15 Corps photoémetteur flexible et son substrat flexible

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JP (1) JP5058521B2 (fr)
WO (1) WO2007148769A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258695B2 (en) 2006-06-19 2012-09-04 Sumitomo Chemical Company, Limited Capsular micro light-emitting device and method for manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296048B (zh) * 2013-05-22 2016-05-25 安徽唯象光电技术有限公司 一种基于电致发光原理的发光结构及显示器件

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Publication number Priority date Publication date Assignee Title
JPH02201396A (ja) * 1988-11-29 1990-08-09 Valeo Vision 発光ストリップ
JPH0472270U (fr) * 1990-11-06 1992-06-25
JPH0633181U (ja) * 1992-07-29 1994-04-28 エムケー精工株式会社 発光ダイオード表示装置
JPH06251876A (ja) * 1993-02-24 1994-09-09 Yazaki Corp 無機分散型発光素子
JPH11265785A (ja) * 1998-03-17 1999-09-28 Matsushita Electric Ind Co Ltd エレクトロルミネッセンス素子及びこれを用いた照光ユニット
JP2001307870A (ja) * 2000-04-11 2001-11-02 Elam Electroluminescent Industries Ltd 湿気から能動的な保護をする電界発光光源
WO2004100113A2 (fr) * 2003-04-29 2004-11-18 France Telecom Afficheur souple
JP2005108643A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 有機ｅｌ棒及びその製造方法
JP2006012760A (ja) * 2004-06-22 2006-01-12 Tobita Kosan:Kk 繊維状有機ｅｌ素子
JP2006023464A (ja) * 2004-07-07 2006-01-26 Komaden:Kk シート表示装置及び表示システム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02201396A (ja) * 1988-11-29 1990-08-09 Valeo Vision 発光ストリップ
JPH0472270U (fr) * 1990-11-06 1992-06-25
JPH0633181U (ja) * 1992-07-29 1994-04-28 エムケー精工株式会社 発光ダイオード表示装置
JPH06251876A (ja) * 1993-02-24 1994-09-09 Yazaki Corp 無機分散型発光素子
JPH11265785A (ja) * 1998-03-17 1999-09-28 Matsushita Electric Ind Co Ltd エレクトロルミネッセンス素子及びこれを用いた照光ユニット
JP2001307870A (ja) * 2000-04-11 2001-11-02 Elam Electroluminescent Industries Ltd 湿気から能動的な保護をする電界発光光源
WO2004100113A2 (fr) * 2003-04-29 2004-11-18 France Telecom Afficheur souple
JP2005108643A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 有機ｅｌ棒及びその製造方法
JP2006012760A (ja) * 2004-06-22 2006-01-12 Tobita Kosan:Kk 繊維状有機ｅｌ素子
JP2006023464A (ja) * 2004-07-07 2006-01-26 Komaden:Kk シート表示装置及び表示システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8258695B2 (en) 2006-06-19 2012-09-04 Sumitomo Chemical Company, Limited Capsular micro light-emitting device and method for manufacturing the same

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JP5058521B2 (ja) 2012-10-24
JP2007335358A (ja) 2007-12-27

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