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WO2007148769A1 - Flexible light emitting body and flexible substrate used for same - Google Patents

Flexible light emitting body and flexible substrate used for same Download PDF

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Publication number
WO2007148769A1
WO2007148769A1 PCT/JP2007/062555 JP2007062555W WO2007148769A1 WO 2007148769 A1 WO2007148769 A1 WO 2007148769A1 JP 2007062555 W JP2007062555 W JP 2007062555W WO 2007148769 A1 WO2007148769 A1 WO 2007148769A1
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WO
WIPO (PCT)
Prior art keywords
light
light emitting
capsule
electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/062555
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French (fr)
Japanese (ja)
Inventor
Hiroyuki Yanashima
Shinichi Morishima
Kyoko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Publication of WO2007148769A1 publication Critical patent/WO2007148769A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/182OLED comprising a fiber structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • H10K59/179Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes

Definitions

  • the present invention relates to a flexural power! / Light emitter and a flexible substrate used therefor, and more particularly to a flexica light emitter that emits light when a current is applied or a voltage is applied thereto, and a flexible substrate used therefor.
  • Toru has been known as an emissive eaves such as an organic EL emissive that emits light when a current is applied to the emissive layer and an inorganic EL L3 ⁇ 4T that emits light when a voltage is applied to the emissive layer.
  • Light emitters placed on multiple substrates are applied to backlights for liquid crystal displays.
  • at least one layer of an organic material containing a carrier compound having carrier transportability is formed on at least a part of the outer peripheral surface of a linear book.
  • a linear light emission »1 formed by laminating a light emitting layer and a transparent electrode layer.
  • a ridge-like light emitting device comprising: a fiber core having one electrode; at least one light emitting layer disposed on the outer surface of the first electrode; and a transmissive second electrode disposed on the light emitting layer 4 is disclosed.
  • a semi-chip is mounted on a flexible chip, and the first main surface of the chip 3 ⁇ 4 f
  • a housing frame is formed, and a casing frame is provided, the casing frame being filled with a sample of a beam, in particular: filled with a semiconductor chip, comprising a semiconductor chip
  • a photoelectric component 5 is disclosed.
  • the encapsulation includes a sealing enclosure that encloses the area of the OLED device in order to:
  • the sealing enclosure is an eave 6 with a cap edge and an enclosure sealing area where adhesive is applied to seal the OLED device, and it is disclosed that a flexure substrate can be used as the substrate.
  • Japanese National Publication No. 002-503832 discloses a tiled display in which tiles ( ⁇ 7) formed by a plurality of pixel formations are arranged.
  • the substrate and the light emitter are integrated, an attempt is made to bend the substrate with a large curvature: ⁇ , the light emitting part and the substrate may be peeled off. It was not large enough for flexibility. Furthermore, the light emitting eave 7 is not yet sufficient in terms of flexibility because it is sealed with a tie formed by a plurality of pixel forming elements. Disclosure of the invention,
  • the present invention provides a flexural force optical body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs, and its flexibilities]
  • An object is to provide a flexible substrate that can be suitably used when a light emitter is difficult.
  • the present invention includes: 1) a flexible substrate; 2) a light emitting portion disposed at least on the flexible substrate and having at least a light emitting layer and constituting one pixel; and 3) a capsule shape for individually sealing the light emitting portions. 4) a plurality of capsule-shaped micro light-emitting devices each having a first electrode and a second electrode for applying a voltage to the light-emitting portion, and 5) a first electrode or a second electrode. Wiring for conducting electricity is provided, and a flexipreluminous body is provided.
  • FIG. 1 is a schematic view of a preferred embodiment of a capsule-like microphone-mouth light emitting eave.
  • FIG. 2 is a schematic diagram of a preferred embodiment of the capsule-like microphone-mouth light emitting device of the present invention shown in FIG.
  • FIG. 1 A first figure.
  • FIG. 3 is a cross-sectional view taken along the line IV-B ′ of a preferred embodiment of the force-pseed microphone opening light emitting device of the present invention shown in FIG.
  • FIG. 4 is a schematic diagram showing a state in which laser is irradiated on the outer periphery of the cylindrical laminate.
  • FIG. 5 is a schematic diagram showing a state where a laser beam is radiated to the cylindrical laminate on which the sealing layer is formed.
  • FIG. 6 is a cross-sectional view showing “ ⁇ ” of a preferred embodiment of the flexible substrate of the present invention.
  • FIG. 7 is a schematic diagram of the upper substrate of the flexure substrate shown in FIG. 2007/062555
  • FIG. 8 is a cross-sectional view of the lower substrate of the flexible substrate shown in FIG.
  • FIG. 9 shows a first view of a preferred embodiment of the flexure phosphor of the present invention.
  • FIG. 10 is a top view of each Uffl showing a part of another preferred embodiment of the flexible optical body of the present invention.
  • FIG. 11 is a schematic cross-sectional view showing a part of another preferred embodiment of the flexure phosphor of the present invention.
  • FIG. 12 is a schematic cross-sectional view showing a state in which a canon film is laminated on the flexural force V3 ⁇ 4 light body shown in FIGS.
  • FIG. 13 is a perspective view of a linear flexure light emitter suitable as the flexible bridle light emitter of the present invention. Explanation of symbols
  • a plurality of capsule-like microphone opening light emitting eaves are placed on a flexible substrate.
  • the capsule-shaped micro light-emitting element is small in size and covers the flexure substrate in the form of dots.
  • the light emitting layer is a cylindrical light emitting layer
  • the first electrode force is positioned in the inner periphery of the cylindrical light emitting layer
  • the second electrode is positioned on the outer periphery of the cylindrical light emitting layer. It is preferable. Since the capsule-shaped micro light-emitting eave has a substantially cylindrical shape, it can emit light radially on its outer peripheral surface. Flexibility gained! ⁇ Because the viewing angle of the light body is enlarged, the light emitting surface can be fully viewed in a bent state.
  • the force-pseed microphone-mouth light-emitting element has an average diameter of 1 to 100 mm, preferably 1 to 500 m, and length:! To 200 wm, preferably 1 to 50 It is preferably j «m and a substantially cylindrical capsule shape having a ratio of average diameter to length (average diameter: length) of 1: 1 to 1: 5. If the average diameter is lower than the lower sister, workability during dredging becomes difficult. On the other hand, if the upper limit is exceeded, heat generation from itself increases. Force-pseed microphone mouth If the length of the element is lower than my younger sister, workability during S is difficult. On the other hand, when the above upper limit is exceeded, unevenness due to the location of current flow increases, and the error from the element itself increases.
  • the layer is preferably made of an organic EL material or an inorganic EL material, particularly preferably an organic EL material.
  • organic EL materials and machine EL materials it becomes a powerful power to emit light more efficiently.
  • the capsule-shaped micro light-emitting eave When an organic EL material suitable for the light-emitting layer is used, the capsule-shaped micro light-emitting eave must have one of the first electrode and the second electrode as an eave, and the light-emitting part is disposed between the P sickle and the light-emitting layer. And an electron transport layer and a Z or electron injection layer.
  • the capsule-like microphone mouth light emission ⁇ ? Is one in which one of the first electrode and the second electrode is an anode, and the light emitting part is a hole transport layer disposed between the anode and the light emitting layer and z or It is preferable to provide a hole injection layer.
  • the capsule-shaped microphone-mouth light-emitting element emits light more efficiently. It becomes possible.
  • a concave portion for accommodating the capsule-shaped microphone opening light emitting eave is formed on the flexible substrate.
  • a flexica v3 ⁇ 4 light body including a flexible substrate having a concave portion has a configuration in which the capsule-shaped microphone-mouth light-emitting element is accommodated in the concave portion of the flexible substrate, and the capsule-shaped microphone-mouth light-emitting device is more stably fixed.
  • the flexure light emitter can be made thinner.
  • the flexible substrate is made by stacking the lower substrate and the upper substrate ⁇ r ⁇ , and the lower substrate is formed with a lower housing part to accommodate the bottom surface of the capsule-like microphone mouth light emitting 3 ⁇ 4 ⁇ , It is preferable that an upper housing portion for housing the upper surface of the capsule-shaped microphone-mouth light emitting element is formed on the upper substrate, and that the concave portion is formed of the upper housing portion and the upper housing portion.
  • a flexible luminous body having such a flexible substrate can form wiring on the lower substrate and cover the wiring, etc. with the upper substrate, and can sufficiently prevent the wiring from dropping off and being withstood.
  • a wiring accommodating portion for accommodating a wiring is formed on a flexible substrate, and that the wiring is accommodated in a movable state in the wire accommodating portion.
  • a flexible substrate having such a wiring accommodating portion is provided, and the wiring is accommodated in a movable state in the wiring accommodating portion, so that the wiring moves or extends within the movable range even when bent. It shrinks and the wiring itself is hardly loaded.
  • Such a flexible light emitter is sufficiently prevented from being broken by bending or the like.
  • the wiring length is given enough allowance (play) so that the wiring cable can move automatically, the wiring can be extended by the amount of play when the flexica light body is extended.
  • the flexible substrate of the present invention is formed with recesses for forming a plurality of capsule-like microphone-mouth light emitting elements.
  • the flexible board is composed of a T-side board and an upper board.
  • the lower housing part is formed on the lower substrate to accommodate the lower surface of the capsule microphone mouth light emitting element. It is preferable that an upper accommodating portion for accommodating the upper surface of the element is formed, and the concave portion is formed by the side accommodating portion and the upper accommodating portion.
  • the flexible substrate is preferably formed with a wiring accommodating portion for accommodating wiring on the flexible substrate.
  • the capsule-shaped micro light-emitting element includes a light-emitting portion having at least a light-emitting layer and constituting one pixel, a capsule-shaped sealing layer that individually seals the light-emitting portion, and a first for applying a voltage to the light-emitting portion.
  • An electrode and a second electrode are examples of a light-emitting portion having at least a light-emitting layer and constituting one pixel.
  • FIG. 1 shows a schematic diagram of a preferred embodiment of a force-pessel-like microphone-mouth light-emitting element.
  • the force-pseed microphone mouthpiece has a round-shaped turnip W shape.
  • “Capsule shape” refers to a shape in which the ratio of the length L to the diameter d of the cross section (d: L) is in the range of 1: 1 to 1: 5.
  • the ⁇ - ⁇ 'cross section is circular, but if the cross section is not circular, the diameter of the circumscribed circle of the cross section is defined as diameter d.
  • the length L is usually 2 0 00 m or less, preferably 1 0 0 0 0 m or less, and more preferably 5 0 0 0 m or less.
  • FIG. 2 and FIG. 3 are a schematic AA ′ cross-sectional view and a schematic BB ′ cross-sectional view, respectively, of a preferred embodiment of the capsule-shaped micro light emitting device shown in FIG.
  • the capsule-shaped micro light-emitting eave shown in Fig. 2 uses a thin organic EL material for the light-emitting layer, and is arranged on the outer periphery of mnm- (bus electrode) ⁇ ⁇ , its layer 11 and mmi ⁇
  • An electron transport layer 1 2 a light-emitting layer 1 3 disposed on the outer periphery of the electron transport layer 1 2, a hole transport layer 1 4 disposed on the outer periphery of the light-emitting layer 1 3, and a hole transport layer 1
  • the light emitting section includes a light emitting layer 13, an electron transport layer 12, and a hole transport layer 14.
  • 113 ⁇ 4 ⁇ ? 10 electrically connects the capsule-shaped micro light-emitting element and an external power source (not shown).
  • materials for forming 0 include conductive metals such as nickel, aluminum, and copper.
  • the & -i cross-sectional shape is preferably non-planar (for example, the cross-section is circular, polygonal, etc.).
  • l3 ⁇ 4g3 ⁇ 4? 10 may be hollow (cylindrical) or solid.
  • the cathode terminal 10 has a diameter of preferably about 1 to L00 0 am, and more preferably about 10 to 300 mm. If the diameter is lower than the above, the workability at that time becomes extremely difficult.
  • the diameter means the diameter of the circumscribed circle of the cross-sectional shape when the cross-section is not circular.
  • the iS layer 11 is arranged to emit electrons at a relatively low voltage.
  • 5 The material for forming the sealing layer 11 is preferably a material that has a relatively small work function and allows easy injection of electrons into the light emitting layer. .
  • Weaving layer materials are, for example, metals such as norium, force J-resium, gold, magnesium, magnesium Z silver alloy, their oxides, and multilayer structures in which aluminum, silver, chromium, etc. are further formed on these metals It is.
  • an inorganic EL material for the light-emitting layer! ⁇ , Eaves layer material is, for example, gold, silver, copper, chromium, aluminum.
  • the thickness of the 113 ⁇ 4 layer 11 depends on the intended design, but is preferably about 3 to 5 Onm. When the thickness is outside the above lower limit and upper limit, electrons are not sufficiently injected into the light emitting layer.
  • the electron transport layer 12 disposed on the outer periphery of the mM i 1 is disposed in the bag in order to improve the efficiency of the electron transport effect when the light emitting layer is an organic EL material.
  • Materials for forming the electron transport layer 1 2 may be any known material that example Bei electron transporting property, for example, polycyclic hydro mosquito one carbon-series derivatives, heterocyclic compounds, tris (8-quinolinolato) Aluminum. 2555
  • the light emitting layer 13 is a layer containing a material that emits light when a voltage is applied by the first electrode and the second electrode (by passing a current).
  • the light emitting layer material used for the light emitting layer 13 is a material that emits light when an electric current is applied or a voltage is applied, and an organic EL material or an inorganic EL material is preferable.
  • organic EL materials include distyryl biphenyl-based materials, dimesitylboryl-based materials, stilbene-based materials, dipyrryl-dicanobenzene materials, benzoxazole-based materials, distyryl-based materials, carbazole-based materials, dibenzochrysene-based materials, Examples include arylamine-based materials, pyrene-substituted oligothiophene-based materials, PPV oligomer-based materials, carbazole-based materials, and polyfluorene-based materials.
  • inorganic EL materials include GaN doped with Mg, ZnS doped with Mn, and SrS doped with Ce.
  • the thickness of the light emitting layer 13 can be reduced by about 1 to 3 according to the intended design, but is preferably about 10 to 200 nm. If the thickness is less than the above, recombination of electrons and holes does not occur sufficiently, luminance is not sufficient, or S becomes difficult. On the other hand, when the upper limit is exceeded, the applied voltage tends to increase.
  • the voltage applied to the light-emitting layer 13 may be determined according to the design. From the viewpoint of efficient light emission, about 2 to: L 00 Pol ⁇ is preferable.
  • the hole transport layer 14 is preferably disposed in order to improve the efficiency of the hole transport effect at an age when the light emitting layer is an organic EL material.
  • the hole transport layer material for forming the hole transport layer 14 include N, N'-diphenyl, ⁇ '-di (3-methylphenyl) 4, 4'- diaminobiphenyl (TPD), ⁇ ( 4, 4 '—bis [N— (1-naphthy 1) -N-pheny 1 ami no] bi pheny 1).
  • the thickness of the hole transport layer 14 can be changed according to the desired design.
  • the thickness is lower than ⁇ , the hole transport effect cannot be obtained sufficiently.
  • the upper limit is exceeded, the applied voltage increases.
  • the anode layer material for forming the anode layer 15 is, for example, indium tin oxide ( ⁇ ), tin oxide, nickel, or gold.
  • the thickness of the anode layer 15 is adjusted according to the intended design. However, about 5 to 30 nm is preferable. When the thickness exceeds the upper limit, the applied voltage increases.
  • the anode terminal 16 is arranged to electrically connect the light emitting element to an external power source (not shown) via the anode terminal 16.
  • an external power source not shown
  • the same materials as those described above can be used.
  • the sealing layer 17 is disposed to protect the light emitting part including the light emitting layer 13 from the outside air or the like.
  • the sealing material used for forming the sealing layer 17 include a transparent hatched epoxy resin, a photocurable epoxy resin, a silicon oxide film, and glass.
  • the thickness of the sealing layer 17 may be changed according to the target design, but is preferably about 10 to 300 nm. When the thickness is lower than the above, the sealing is not sufficiently performed or the strength of the sealing film is not sufficient. On the other hand, when the upper limit is exceeded, production becomes difficult, or emitted light is not sufficiently transmitted.
  • the shape is cylindrical and the B-B 'cross section is circular, but in the capsule micro light-emitting device, the shape is not particularly limited, and the cross-section May be an ellipse or a polygon.
  • the turnip-like microphone-mouth light-emitting element has an average diameter of 1 to: L 0 00 m, more preferably l to 500 m, more preferably 10 to 30 O im, and a length of 1 to 2 0 0 0 jt / m, more preferably 1 to 100 jum, more preferably 1 to 50 jum, and the ratio of mean diameter to length (mean diameter: length) is 1: :! ⁇ 1: It is preferable that it is the shape of a substantially liquor capsule which is 5.
  • the capsule micro light-emitting device of the above embodiment has ⁇ (bus electrode) 10 and ⁇ layer 1
  • the capsule micro light-emitting element at least a light-emitting layer and a light emitting element constituting one pixel are provided.
  • Capsule-shaped sealing layer for individually sealing the light emitting part, and a first electrode for applying a voltage to the light emitting part
  • the other configuration is not particularly limited as long as it includes the second electrode.
  • the light emitting portion is arranged on the outer periphery of the cathode layer 11 in order to improve the effect of electron injection. It may be provided.
  • the electron injection layer material for forming the electron 3 ⁇ 4 ⁇ layer is, for example, Ba, Ca, CaF, LiF, Li: NaF.
  • the thickness of the electron injection layer is preferably about 3 to 50 nm. When the upper limit is exceeded, the applied voltage increases.
  • the capsule-shaped micro light-emitting eave is arranged so that the light-emitting portion is in contact with the inner periphery of the anode layer 15.
  • a correct injection layer may also be provided.
  • the hole injection layer material for forming the hole injection layer is, for example, a phthalocyanine complex such as copper phthalocyanine, 4, 4 ', 4 "-tris (3-methylphenylphenylamino) Aromatic amine derivatives such as hydrazoles, force rubazole derivatives, triazole inducing, imidazole inducing, oxadiazole derivatives having amino groups, and polythiophene
  • the thickness of the hole injection layer is 5 to 300.
  • the first electrode is a ridge and the second electrode is an anode, but the capsule micro light-emitting element is: A preferred embodiment of the SSi method for the capsule-shaped microphone-mouth light emitting device will be described.
  • the method of manufacturing the force-pseed microphone-mouth light-emitting element includes a step (I) of applying a light-emitting layer material on the outer periphery of a linear first electrode material, and forming a cylindrical light-emitting layer by grass cutting; Supplying a second electrode material on the outer periphery of the layer to form a cylindrical second electrode layer to obtain a cylindrical laminate (II); and at predetermined intervals on the outer periphery of the cylindrical laminate.
  • a sealing layer by cutting the cylindrical laminate on which the sealing layer is formed at the exposed portion, and forming a light emitting layer having at least a light emitting layer and constituting one pixel; Seal individually And a step (V) of obtaining a capsule-like micro light-emitting device comprising: a capsule-shaped sealing layer; and a first electrode and a second electrode for applying a voltage to the light-emitting portion.
  • a light-emitting layer material is applied on the outer periphery of the linear first electrode material, and dried to form a cylindrical light-emitting layer (step (I)).
  • the first electrode material may be a material consisting only of a core wire made of a material or a material provided with a cylindrical negative electrode layer on the outer periphery of the spring, but preferably a cylindrical ridge layer on the outer periphery of the core wire It is a material with 3 ⁇ 4 What is necessary is just to use the same material and layer material as those described in the above-mentioned capsule-shaped microphone opening light emitting element as the
  • the method of supplying the IS layer material it is sufficient to use the method of, for example, vacuum deposition, chemical vapor deposition, etc., electric plating, electroless plating, electron impact method may be adopted. .
  • the light emitting layer material may be applied by the following coating method. For example, dipping, spraying, printing, printing, or hair may be used.
  • the light emitting layer material may be mixed with an appropriate solvent (water or organic solvent) and applied as a mixed solution.
  • the method of preparing the mixed solution is sufficient.
  • the IS, viscosity, etc. may be adjusted by preparing a desired mixed solution.
  • the cocoon can be made by the method of ⁇ ⁇ . For example, it can be done by natural grass drying, heat drying, or the like. During heating, it is preferable to heat and dry for about 5 minutes to 5 hours under conditions that do not damage the light emitting layer material below the glass transition of the light emitting layer material.
  • the electron injection layer When the electron injection layer is disposed in the capsule light emitting element, it is preferable to apply the electron injection layer material on the outer periphery of the linear first electrode material before applying the light emitting layer material. In addition, when the electron transport layer is disposed on the capsule light emitting eave, it is preferable that the electron transport layer material is applied and grassed before the light emitting layer material is applied.
  • the electron injection layer material and the electron transport layer material the electron injection layer material and the electron transport layer described in the above-described capsule-shaped micro light emitting device are used. The same material as the layer feeding material may be used.
  • a method for applying the electron injection layer material or the electron transport layer material and a method for applying the electron injection layer material a method similar to the method for applying the light emitting layer material and the method for drying may be provided.
  • a second electrode material is supplied onto the outer periphery of the cylindrical light emitting layer to form a cylindrical second electrode layer, thereby obtaining a cylindrical laminate (step (II)).
  • the second electrode material is an anode layer material for forming an anode layer.
  • the anode layer material the same anode layer material as described in the above-described capsule-shaped micro light-emitting element may be used.
  • a vapor deposition method such as vacuum vapor deposition and chemical vapor deposition, an electroplating method, an electroless plating method, an electron impact method, or a sol-gel method may be used.
  • the hole transport layer material when the hole transport layer is disposed on the capsule-shaped light emitting eave, the hole transport layer material is applied on the outer periphery of the linear first electrode material before supplying the second electrode material. Then, it is preferable to include a step of drying. In the case where the hole injection layer is disposed on the capsule light emitting eave, it is preferable to include a step of applying and injecting a hole injection layer material.
  • the hole transport layer material and the IE injection layer material the same materials as the electron injection layer material and the electron transport layer material described in the capsule micro light-emitting element described above may be used.
  • step (III) As a method for applying and transporting the hole transport layer material or the hole injection layer material, a method similar to the method for applying the light emitting layer material and the method for drying described above may be used. Next, an exposed portion where the first electrode material is exposed is formed at predetermined intervals on the outer periphery of the cylindrical laminated body at predetermined intervals (step (III)).
  • FIG. 4 is a schematic view showing a state in which an exposed portion 22 where the first electrode material is exposed is formed by irradiating the laser L from the laser light source 21 on the outer periphery of the cylindrical laminate 20.
  • arrow A indicates the direction of travel.
  • the laser light source 21 except for the first electrode material from the cylindrical laminate 20 Layer of! If it can be obtained, it is preferable to be able to irradiate a pulsed high-power laser L.
  • the laser L a pulse laser having an irradiation bow of 5 W / cm 2 to 100 WZ cm 2 is preferable.
  • Laser L is preferably a sheet of laser light from the viewpoint of improving production efficiency.
  • laser L is irradiated, only the layers other than the first electrode material in the cylindrical laminate 20 are irradiated by laser L! Adjust so that the laser beam is 1 L.
  • the interval at which the laser L is irradiated may be adjusted as appropriate according to the design of the target capsule microphone mouth light emitting element.
  • the exposed portion 22 where the first electrode material is exposed may be formed by irradiating the laser L on the outer periphery of the cylindrical laminate 20.
  • the spring made of the above-described material of the first electrode material may be exposed by laser L irradiation.
  • a sealing material is applied on the outer periphery of the cylindrical laminate on which the exposed portion is formed, and dried to form a sealing layer (step (IV)).
  • the same sealing material as that described in the above-described capsule-shaped microphone-mouth light-emitting element of the present invention may be used.
  • a method of applying the sealing material and a method of drying the same method as the method of applying the light-emitting layer material and the method of applying it may be reversed.
  • a method of forming the sealing layer a method of forming a sealing layer by evaporating a sealing material may be used.
  • step (V) the cylindrical laminated body on which the sealing layer is formed is cut at the exposed portion.
  • the method of cutting the cylindrical laminate at the exposed portion may be reversed from the method of cutting with a high-power laser, for example.
  • a light emitting part having at least a light emitting layer and constituting one pixel
  • a capsule-shaped sealing layer for individually sealing the light emitting part
  • a first electrode for applying a voltage to the light emitting part
  • the anode terminal may be formed so as to be in contact with the anode layer during use so that the anode layer is electrically connected to an external power source, and the sealing layer is formed.
  • the anode Before cutting the cylindrical laminate at the exposed portion, the anode is previously placed in contact with the anode layer on the cylindrical laminate. It may be formed.
  • a vapor deposition method such as vacuum vapor deposition or chemical vapor deposition, electroplating, non-electrostatic square plating, electronic collision, or the like may be employed.
  • the material for forming the anode may be the same as the material described in the above-mentioned capsule-like microphone-mouth light emitting device of the present invention.
  • FIG. 5 is a schematic view showing a state in which the exposed portion 22 is exposed again by irradiating the cylindrical laminate 20 on which the sealing layer 17 is formed with the laser L.
  • Any flexible substrate may be used as long as it can be used for arranging the light emitting elements, and a known flexible substrate can be used.
  • the shape of the flexible substrate may be linear or planar.
  • the above method may be reversed.
  • the flexible substrate is preferably a flexible substrate in which concave portions for forming a plurality of capsule-shaped micro light-emitting elements are formed, and is a flexible substrate formed by superposing a lower substrate and an upper substrate on the lower substrate.
  • a lower housing part is formed to accommodate the lower surface of the capsule-shaped micro light-emitting element, and an upper surface for accommodating the upper surface of the capsule-shaped micro light-emitting element on the upper substrate.
  • a flexure substrate in which a side accommodating portion is formed and a recess is formed from a lower accommodating portion and an upper accommodating portion is more preferable, and a flexible flexible substrate force in which a wiring accommodating portion for accommodating wiring is formed S is particularly preferred.
  • FIG. 6 is a cross-sectional view showing ⁇ of a preferred embodiment of the flexure substrate.
  • FIG. 7 is a schematic diagram of the upper substrate of the flexible substrate shown in FIG. 6, and
  • FIG. 8 is a schematic diagram of the lower substrate of the flexure substrate shown in FIG.
  • the flexible substrate shown in FIGS. 6 to 8 includes an upper substrate 30 and a lower substrate 31.
  • the flexible substrate including the upper substrate 30 and the lower substrate 31 has a recess 32 formed therein.
  • On the upper substrate 30, an upper housing part 40 is formed, and an anode wiring 42 is formed (see FIG. 7).
  • the lower substrate 3 1 is formed with a lower housing portion 4 1, an anode wiring 4 2, an ISS wiring groove (wiring housing portion) 4 3, and an anode wiring groove (wiring housing portion) 4 4. (See Figure 8).
  • the concave portion 32 of the flexible substrate is formed by the above-described upper accommodation portion 40 and lower accommodation portion 41.
  • the shape of the recess 32 may be any shape as long as it can accommodate the capsule-shaped micro light-emitting element, and may be designed in accordance with the shape of the force-pseed microphone-mouth light-emitting element.
  • the shapes of the upper housing part 40 and the lower housing part 41 may be formed in the shape of the intended concave part 32.
  • the shape of the recess may be reduced by a method that can form such a recess on the flexible substrate. For example, a method of forming the recess by etching can be given.
  • the anode wiring 42 is made to dissipate with either the first or second electrode of the capsule-like microphone mouth light emitting element when the capsule-like microphone mouth light emitting element is disposed, and to conduct electricity to the capsule-like micro light emitting element. Formed for.
  • a known wiring material used for wiring for example, a book such as aluminum or copper
  • a method of forming the anode wiring the method of ⁇ ⁇ may be adopted.
  • Sealed wiring grooves 4 3 and negative wiring grooves 4 4 are grooves for arranging wiring. For the shape of grooves 4 3 and 4 4, the method of
  • the polarity may be reversed as appropriate, or the groove for the selfish line may be positioned.
  • the flexif 1 / 3 ⁇ 4 light body of the present invention includes a flexible substrate, a plurality of capsule-shaped microphone-mouth light-emitting elements disposed on the flexure-shaped substrate, and electrical conduction to the first electrode or the second electrode of the capsule-shaped microphone-mouth light-emitting element. Wiring for carrying out.
  • FIG. 9 shows a perspective view of a preferred embodiment of the flexiflex / semiconductor of the present invention. The flexible light emitter shown in FIG.
  • the flexure substrate 50 is composed only of the lower substrate 31.
  • the flexi-powered light has a structure in which a plurality of force-pseudo microphone mouth light-emitting elements 51 are arranged on a flexible substrate 50. Therefore, when the light-emitting body has a defect, the defect has occurred.
  • the capsule micro light-emitting element 51 can be easily repaired by replacing it with a new one.
  • the size of the capsule-shaped micro light-emitting eave itself is small, and it exists in the form of dots on the flexible substrate. Therefore, even when the flexible light emitter is bent, the light emission itself is received. Since the force is small and it is hardly affected by the difference in flexibility between the light-emitting element and the substrate, it becomes a power ability to bend sufficiently. Therefore, the flexica phosphor can exhibit sufficiently excellent flexibility.
  • Wiring (anode wiring 4 2, I ® wiring 5 2 A, ⁇ wiring 5 2 B and I pole wiring 5 3) is a cuff.
  • Cell-shaped micro light-emitting element 51 1 1st electrode (in this embodiment! ⁇ ⁇ ⁇ ) or 2nd electrode (actual In the embodiment, any material capable of conducting electricity to the anode) may be used.
  • the wiring may be a wiring formed by fflf using a method such as vapor deposition, or a wiring in which this is arranged using a spring-like conductor.
  • Each wire and the age part of each wire and electrode may be connected by a method of ⁇ ⁇ such as spot welding.
  • the flexible J-ray illuminator may be used by laminating a cano film in order to protect the wiring and the like during use.
  • a film of polyethylene, polypropylene, polyethylene terephthalate or the like may be used as the cano film.
  • a method for fixing the capsule-shaped microphone-mouth light-emitting eave 51 to the flexible substrate 50 a method may be adopted in which the outer periphery of the force-push-shaped microphone-mouth light-emitting element is bonded to the lower substrate with a conductive adhesive or the like.
  • the cover film By using the cover film, the capsule-shaped micro light-emitting element and the substrate are not directly bonded, but the lower substrate and the cover film are bonded together with adhesive, etc., so that the first electrode and the second electrode are brought into contact with the wiring by crimping You may adopt the method of.
  • the flexiff light body is composed of only the flexible substrate 50 0 force R-law substrate 3 1, but such a flexica light body may be used as it is, and the lower substrate 3 1 may be connected to the upper substrate 30. May be used as another form.
  • FIG. 10 is a schematic top view showing a part of a flexible embodiment of the flexipower! / Trimming body
  • FIG. 11 is a schematic sectional view thereof. In the flexible pre-illuminator shown in FIGS.
  • a flexible substrate 50 including an upper substrate 30 and a lower substrate 31, a capsule micro light-emitting element 51, and a first It consists of a self-spring for conducting electricity to the electrode or the second electrode (anode wiring 4 3, iS wire 5 2 ⁇ , I® wire 5 2 ⁇ , anode wire 5 3).
  • the flexible substrate 50 is the same as the flexible substrate shown in FIGS.
  • the I® wirings 5 2 ⁇ and 5 2 ⁇ are arranged in the cathode wiring groove 43, and the anode wiring 53 is arranged in the anode wiring groove 44.
  • linear conductors are used for the wirings 5 2 A, 5 2 B and 5 3.
  • Cathode wiring 5 2 A and cathode wiring 5 2 B are spots Connected by welding. Anode wiring 4 3 and pole wiring 5 3 are also connected by spot welding.
  • the capsule-shaped micro light-emitting element 51 the capsule-shaped micro light-emitting element shown in FIG. 1 is used.
  • the anode wiring 43 is in contact with the anode 6 of the capsule-shaped micro light emitting eave 51.
  • the PtK ⁇ l 0 of the capsule-shaped micro light-emitting eave 5 1 and the Pt ⁇ wire 5 3 are connected by spot welding.
  • the US wiring 5 2 B has a margin in the length of the groove 4 3 for the vertical wiring.
  • the i ⁇ wiring 5 2 B is movable in the ⁇ wiring groove 4 3.
  • the wiring itself moves and wiring
  • the wire expands and contracts by the margin of the length, the wiring itself is hardly loaded, and it is sufficiently prevented that the wiring is disconnected due to bending or stretching.
  • the anode wiring 53 has a margin in the length of the anode wiring groove 44. Therefore, the anode wiring 53 is movable in the anode wiring groove 44.
  • Anode wiring groove (wiring housing part) 4 4 With positive wiring 5 3 accommodated in a movable state, the wiring itself can be moved even when the flexible luminous body is bent, so that the wiring has a margin of length. Because the wire is stretched and shrunk, there is almost no load on the wire itself, and the wire is sufficiently prevented from being disconnected by bending or stretching. Therefore, the flexible / light-emitting body can exhibit extremely excellent flexure properties.
  • a known method such as a method of bonding two substrates using a contact U or the like may be adopted.
  • a cover film may be laminated on the flexible 1 / 3 ⁇ 4 light body of other embodiments.
  • FIG. 1 An example of laminating canopy film 60 is shown in FIG.
  • the preferred embodiment of the flexible luminous body of the present invention has been described above, but the present invention is not limited to the above embodiment.
  • a cylindrical cabcell-shaped micro light-emitting eave is used.
  • capsule-shaped micro-emission eaves having various shapes may be used.
  • a sheet-like flexible substrate is used, but As the lexical substrate, a linear flexure substrate may be used.
  • Figure 13 (m) shows an example of a flexure light emitter when a linear flexible substrate is used.
  • a flexure light body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs. It is possible to provide a flexible substrate that can be used for the Mt of light bodies.
  • the flexible light emitter of the present invention is particularly useful as a light emitter used for various displays and the like because it is extremely excellent in life.

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Abstract

Provided is a flexible light emitting body which has extremely excellent flexibility and can be easily repaired by each defective pixel even when a defect is generated. A flexible substrate which can be suitably used for manufacturing the flexible light emitting body is also provided. The flexible light emitting body is provided with a flexible substrate (50); a light emitting section, which is arranged on the flexible substrate (50), has at least a light emitting layer and configures one pixel; a capsule-like sealing layer for individually sealing the light emitting sections; a plurality of capsule-like micro light emitting elements (51) provided with a first electrode and a second electrode, respectively, for applying a voltage to the light emitting sections; and a wiring for carrying electricity to the first electrode or the second electrode.

Description

555  555

明 細 書 フレキシフ 1/¾光体及びそれに用いるフレキシブル基板 嫌分野 Description Flexix 1 / ¾ light body and flexible substrate used for it

本発明は、 フレキシ力!/ ¾光体並びにそれに用いるフレキシブル基板に関し、 より詳し くは、 電流を流す、 または電圧を印加することで発光するフレキシカ P¾光体並びにそれ に用いるフレキシブル基板に関する。 龍漏  The present invention relates to a flexural power! / Light emitter and a flexible substrate used therefor, and more particularly to a flexica light emitter that emits light when a current is applied or a voltage is applied thereto, and a flexible substrate used therefor. Dragon leakage

徹から、 発光軒として、 発光層に電流を流すことにより発光する有機 E L軒や発 光層に電圧を印加することにより発光する無機 E L¾T等が知られており、 このような発 光軒を複数基板に配置した発光体は、 液晶ディスプレイのバックライト等に応用されて いる。 素子として、 例えば、 特開平 1 0— 6 4 6 7 8号公報においては、 線状 本の 外周面の少なくとも一部に、 キヤリャ輸送性を有する有樹匕合物を含有する少なくとも 1 層の有機の発光層と、 透明電極層とをこの腦こ積層してなる線状の発光 » 1が開示され ている。 特表 2 0 0 2— 5 3 8 5 0 2号公報においては、 フアイノー上に複数の発光 を含み、 その各々は二つの電極を備え、 その間に電気信号を供給して発光^?を発光させ る発光素子 2が開示されている。 特開 2 0 0 2— 3 5 2 9 4 9号公報においては、 有機繊 維の外周面の少なくとも一部に、 電極層と、 キヤリャ輸送性を有する有機化合物を含有す る少なくとも 1層の有機の発光層と、 透明電極層とをこの順に積層してなる線状の発光素 子 3が開示されている。 更に、 特開 2 0 0 2— 1 8 4 5 8 0号公報においては、 外側に第 Toru has been known as an emissive eaves such as an organic EL emissive that emits light when a current is applied to the emissive layer and an inorganic EL L¾T that emits light when a voltage is applied to the emissive layer. Light emitters placed on multiple substrates are applied to backlights for liquid crystal displays. As an element, for example, in Japanese Patent Application Laid-Open No. 10-6 6 6 78, at least one layer of an organic material containing a carrier compound having carrier transportability is formed on at least a part of the outer peripheral surface of a linear book. There is disclosed a linear light emission »1 formed by laminating a light emitting layer and a transparent electrode layer. In the special table 2 0 0 2— 5 3 8 5 0 2 publication, a plurality of light emission is included on the Fino, each of which has two electrodes, and an electric signal is supplied between them to emit light ^? A light emitting device 2 is disclosed. In Japanese Patent Laid-Open No. 2000-0 3 5 2 9 4 9, at least one layer of an organic layer containing an electrode layer and an organic compound having a carrier transporting property is provided on at least a part of the outer peripheral surface of the organic fiber. A linear light-emitting element 3 is disclosed in which a light-emitting layer and a transparent electrode layer are laminated in this order. Furthermore, in Japanese Patent Laid-Open No. 2 00 2-1 8 4 5 8 0,

1の電極を有する繊維コァと、 第 1の電極の外面上に配置された少なくとも 1つの発光層 と、 発光層上に配置された透過性の第 2の電極とを含む纖隹状の発光素子 4が開示されて レ る。 これらの線状の発光素子 1〜4を複数本用いて、 これを基板上に配置することでシ ート状発光体として利用することカ坷能である。 特表 2004-5071 14号公報にお いては、 半 本チップがフレキシブルなチップ 本上に取付けられ チッフ ¾ f本にお ける第一の主要面には半 #ί本チップの電気的な接続のための難路が形成され、 さらにケ 一シングフレームが ¾置され、 該ケ一シングフレームはビ一ム¾1体の謝本、 特に充: t謝 · 料で充填されている、 半導体チップを備えた光電的な構成軒 5が開示されている。 特表 2004-508679号公報においては、 有難光ダイオード (OLED) デバイスの カプセル化に関して、 該カプセル化は、 キャップを:^するために OLEDデバイスのセ 頁域を包囲するシ一リング囲い枠を含み、 シーリング囲い枠は、 接着剤が OLEDデバ イスをシールするために施される、 キャップ縁部と囲い枠のシーリング領域を持つ軒 6 であり、 基板にはフレキシカレ基板を用いることができることが開示されている。 特表 2 002-503832号公報においては、 複数のピクセリ 成舒によって形成されたタ ィル (魏舒 7) が 列されたタイル張りディスプレイが開示されている。 A ridge-like light emitting device comprising: a fiber core having one electrode; at least one light emitting layer disposed on the outer surface of the first electrode; and a transmissive second electrode disposed on the light emitting layer 4 is disclosed. By using a plurality of these linear light emitting elements 1 to 4 and arranging them on the substrate, It is the ability to use as a light emitter. In JP 2004-5071 No.14, a semi-chip is mounted on a flexible chip, and the first main surface of the chip ¾ f A housing frame is formed, and a casing frame is provided, the casing frame being filled with a sample of a beam, in particular: filled with a semiconductor chip, comprising a semiconductor chip A photoelectric component 5 is disclosed. In JP 2004-508679 Gazette, regarding encapsulation of a compulsory optical diode (OLED) device, the encapsulation includes a sealing enclosure that encloses the area of the OLED device in order to: The sealing enclosure is an eave 6 with a cap edge and an enclosure sealing area where adhesive is applied to seal the OLED device, and it is disclosed that a flexure substrate can be used as the substrate. ing. Japanese National Publication No. 002-503832 discloses a tiled display in which tiles (魏舒 7) formed by a plurality of pixel formations are arranged.

しかしながら、 線状の発光素子 1〜4を利用してシ一ト状発光体を S¾tした場合には、 得られるシート状発光体はフレキシカレ性の点で未だ十分なものではなかった。 さらに、 有機 EL材料を用いてシート状発光体を Miする際には、 発光層を酸素および水分から遮 断すること力 s発光体の長赫化の観点から非常に重要であるが、 は発光面全体を ^(本 で封止する^:がとられており、 実用的なフレキシブルシ一卜状発光体を得るためには、 十分なフレキシフレ f生をもち、 かつガスバリァ性の非常に高いフィルム等で封止する必要 があった。 そして、 現状では、 封止のためのフィルムとしてはガスバリア性とフレキシブ ル性で未だ十分な特性を持つものは得られていない。  However, when the sheet-like illuminant was subjected to S¾t using the linear light-emitting elements 1 to 4, the obtained sheet-like illuminant was still not sufficient in terms of flexure. Furthermore, when mimicking a sheet-like light emitter using an organic EL material, it is very important to shield the light-emitting layer from oxygen and moisture from the viewpoint of lengthening the light emitter. The entire surface is sealed with ^ (book ^ :), and in order to obtain a practical flexible light-emitting illuminant, the film has sufficient flexibility and has a very high gas barrier property. It is necessary to seal with, etc. At present, as a film for sealing, there has not yet been obtained a gas barrier property and a flexible property with sufficient characteristics.

また、 素子 5及び 6では、 基板と発光体が一体となっているため、 基板を大きな曲率で 屈曲させようとする:^、 発光部と基板が剥寫 I るなどの不具合が生じる可能性が大きぐ フレキシブル性において十分な特性を持つものではなかった。 さらに、 発光軒 7は、 複 数のピクセル形成素子によって形成されたタイジレがー括で封止されているため、 フレキシ ブル ['生の点で未だ十分なものではなかつた。 発明の開示 , In elements 5 and 6, since the substrate and the light emitter are integrated, an attempt is made to bend the substrate with a large curvature: ^, the light emitting part and the substrate may be peeled off. It was not large enough for flexibility. Furthermore, the light emitting eave 7 is not yet sufficient in terms of flexibility because it is sealed with a tie formed by a plurality of pixel forming elements. Disclosure of the invention,

本発明は、 極めて優れたフレキシブル性を有し、 且つ欠陥が発生しても欠陥の発生した 画素ごとに容易に修理することができるフレキシ力 光体を提供すること、 並びに、 そ のフレキシ力]/ ¾光体を難する際に好適に用いることが 能なフレキシブル基板を提供 することを目的とする。  The present invention provides a flexural force optical body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs, and its flexibilities] An object is to provide a flexible substrate that can be suitably used when a light emitter is difficult.

本発明者らは、 上記目的を達成すべく鋭意職を重ねた結果、 本発明を するに至つ た。  As a result of intensive efforts to achieve the above object, the present inventors have come up with the present invention.

すなわち本発明は、 1 ) フレキシブル基板と、 2) フレキシブル基板に配置された、 発 光層を少なくとも有し且つ一画素を構成する発光部と、 3) 発光部を個別に封止するカブ セル状の封止層と、 4) 発光部に電圧を印加するための第一電極及び第二電極とをそれぞ れ備える複数個のカプセル状マイクロ発光^?と、 5 ) 第一電極又は第二電極に電気を導 通するための配線と、 を備えたフレキシプリ 光体を提供する。 酾の簡単な説明  That is, the present invention includes: 1) a flexible substrate; 2) a light emitting portion disposed at least on the flexible substrate and having at least a light emitting layer and constituting one pixel; and 3) a capsule shape for individually sealing the light emitting portions. 4) a plurality of capsule-shaped micro light-emitting devices each having a first electrode and a second electrode for applying a voltage to the light-emitting portion, and 5) a first electrode or a second electrode. Wiring for conducting electricity is provided, and a flexipreluminous body is provided. A brief description of 酾

図 1は、 カプセル状マイク口発光軒の好適な一実施形態の模式図である。 FIG. 1 is a schematic view of a preferred embodiment of a capsule-like microphone-mouth light emitting eave.

図 2は、 図 1に示す本発明のカプセル状マイク口発光素子の好適な一実施形態の概略 Α—FIG. 2 is a schematic diagram of a preferred embodiment of the capsule-like microphone-mouth light emitting device of the present invention shown in FIG.

Α' 断面図である。 FIG.

図 3は、 図 1に示す本発明の力プセレ状マイク口発光素子の好適な一実施形態の »Β― B' 断面図である。 FIG. 3 is a cross-sectional view taken along the line IV-B ′ of a preferred embodiment of the force-pseed microphone opening light emitting device of the present invention shown in FIG.

図 4は、 筒状積層体の外周上にレーザーを照射している状態を示す模式図である。 FIG. 4 is a schematic diagram showing a state in which laser is irradiated on the outer periphery of the cylindrical laminate.

図 5は、 封止層が形成された筒状積層体にレーザ一を照射している状態を示す模式図であ る。 FIG. 5 is a schematic diagram showing a state where a laser beam is radiated to the cylindrical laminate on which the sealing layer is formed.

図 6は、 本発明のフレキシブル基板の好適な一実施形態の" ^を示 «薩断面図である。 図 7は、 図 6に示すフレキシカレ基板の上側基板の模式図である。 2007/062555 FIG. 6 is a cross-sectional view showing “^” of a preferred embodiment of the flexible substrate of the present invention. FIG. 7 is a schematic diagram of the upper substrate of the flexure substrate shown in FIG. 2007/062555

図 8は、 図 6に示すフレキシブル基板の下側基板の獻図である。 FIG. 8 is a cross-sectional view of the lower substrate of the flexible substrate shown in FIG.

図 9は、 本発明のフレキシカ ¾光体の好適な一実施形態の 1見図を示す。 FIG. 9 shows a first view of a preferred embodiment of the flexure phosphor of the present invention.

図 10は、 本発明のフレキシプリ 光体の好適な他の実施形態の一部を示 Uffl各上面図で ある。 FIG. 10 is a top view of each Uffl showing a part of another preferred embodiment of the flexible optical body of the present invention.

図 11は、 本発明のフレキシ力 光体の好適な他の実施形態の一部を示 ¾略断面図で あ 。 FIG. 11 is a schematic cross-sectional view showing a part of another preferred embodiment of the flexure phosphor of the present invention.

図 12は、 図 10〜: 11に示すフレキシ力 V¾光体にカノ—フィルムを積層させた状態を 示す概略断面図である。 FIG. 12 is a schematic cross-sectional view showing a state in which a canon film is laminated on the flexural force V¾ light body shown in FIGS.

図 13は、 本発明のフレキシブリレ発光体として好適な線状のフレキシカレ発光体の斜視図 である。 符号の説明 FIG. 13 is a perspective view of a linear flexure light emitter suitable as the flexible bridle light emitter of the present invention. Explanation of symbols

10 &m-ひス電極)  (10 & m-His electrode)

11 P封亟層  11 P sealing layer

12 電子輸送層  12 Electron transport layer

13 発光層  13 Light emitting layer

14 正孔輸送層  14 Hole transport layer

15 陽極層  15 Anode layer

16 陽極 (バス電極)  16 Anode (Bath electrode)

17 封止層  17 Sealing layer

20 筒状積層体  20 Cylindrical laminate

21 レーザー光源  21 Laser light source

22 露出部  22 Exposed area

30 上側基板  30 Upper board

31 下側基板 3 2 凹部 31 Lower board 3 2 Recess

4 0 上側収容部  4 0 Upper housing

4 1 下側収容部  4 1 Lower housing

4 2 配線  4 2 Wiring

4 3 溝 (配線収容部)  4 3 Groove (Wiring receiving part)

4 4 溝 (配線収容部)  4 4 Groove (Wiring receiving part)

5 0 フレキシブル基板  5 0 Flexible substrate

5 1 力プセル状マイク口発光軒  5 1 Power Psell-shaped microphone mouth emitting eaves

5 2 A 配線  5 2 A wiring

5 2 B 配線  5 2 B Wiring

5 3 配線  5 3 Wiring

6 0 カバーフィルム  6 0 Cover film

L…レ一ザ一  L ... Laser 1

A 進行方向 発明を るための最良の形態  A Direction of travel Best mode for invention

本発明のフレキシカ 光体においては、 フレキシブル基板に、 複数個のカプセル状マ イク口発光軒が ¾置されている。 カプセル状マイクロ発光素子は、 それ自体の大きさが 小さく、 フレキシカレ基板にドット状に被する。 フレキシカ 光体を曲げた場合、 発 光^?自体が受ける力は非常に小さくなり、 フレキシヵ V¾光体は、 発光素子と基板との 間の屈曲性の差による影響をほとんど受けない。 そのため、 フレキシフ !/¾光体は、 十分 に曲げることが可能となり、 十分に優れたフレキシカレ性を発 if "る。  In the flexure optical body of the present invention, a plurality of capsule-like microphone opening light emitting eaves are placed on a flexible substrate. The capsule-shaped micro light-emitting element is small in size and covers the flexure substrate in the form of dots. When the flexica light body is bent, the force applied to the light emitting element itself becomes very small, and the flexica V¾ light body is hardly affected by the difference in flexibility between the light emitting element and the substrate. Therefore, the flexif! / ¾ illuminant can be bent sufficiently and exhibits sufficiently excellent flexure performance.

発光面の全体が一括で封止されておらず、 個々の力プセル状マイク口発光^?がそれぞ れ個別に封止されているため、 のフレキシフ 光体とは異なり、 一部に欠陥が生じ た場合に欠陥が生じた画素の力プセル状マイク口発光素子を新たなカプセル状マイク口発 光 と容易に交換することができる。 フレキシブリ ¾光体は、 容易に修理することがで 含る。 Unlike the flexiflex illuminant, some defects are present because the entire light-emitting surface is not encapsulated in a lump, and each force-pseudo microphone mouth light emission ^? Is individually encapsulated. If a defect occurs, the force-pseudo microphone mouth light emitting element of the pixel in which a defect has occurred is It can be easily exchanged for light. The flexible luminescent material can be easily repaired.

カプセル状マイクロ発光素子は、 発光層が筒状発光層であり、 筒状発光層の内周内に第 一電極力観置され 且つ筒状発光層の外周上に第二電極が 置されていることが好ましい。 カプセル状マイクロ発光軒は、 その形状が略円柱状の形状であるため、 その外周面上 において放射状に発光できる。 得られるフレキシ力!^光体の視野角が拡大するため、 屈 曲した状態で発光面を十分に視認することができる。  In the capsule micro light emitting device, the light emitting layer is a cylindrical light emitting layer, the first electrode force is positioned in the inner periphery of the cylindrical light emitting layer, and the second electrode is positioned on the outer periphery of the cylindrical light emitting layer. It is preferable. Since the capsule-shaped micro light-emitting eave has a substantially cylindrical shape, it can emit light radially on its outer peripheral surface. Flexibility gained! ^ Because the viewing angle of the light body is enlarged, the light emitting surface can be fully viewed in a bent state.

力プセル状マイク口発光素子は、 平均直径が l〜1 0 0 0〃m、 好ましくは 1〜 5 0 0 mであり、 長さが:!〜 2 0 0 0 wm、 好ましくは 1〜5 0 0 j«mであり、 且つ平均直径 と長さとの比 (平均直径:長さ) が 1 : 1〜1 : 5である略円柱型カプセ 状であるこ とが好ましい。 平均直径が前記の下妹満では、 纖時の作業性が困難となる。 他方、 前 記上限を超えると 自体からの発熱が大きくなる。 力プセル状マイク口 素子の長さ が嫌己の下妹満では、 S 時の作業性が困難となる。 他方、 前記上限を超えると電流の 流れ方の場所によるムラが大きくなることや、 素子自体からの が大きくなる。  The force-pseed microphone-mouth light-emitting element has an average diameter of 1 to 100 mm, preferably 1 to 500 m, and length:! To 200 wm, preferably 1 to 50 It is preferably j «m and a substantially cylindrical capsule shape having a ratio of average diameter to length (average diameter: length) of 1: 1 to 1: 5. If the average diameter is lower than the lower sister, workability during dredging becomes difficult. On the other hand, if the upper limit is exceeded, heat generation from itself increases. Force-pseed microphone mouth If the length of the element is lower than my younger sister, workability during S is difficult. On the other hand, when the above upper limit is exceeded, unevenness due to the location of current flow increases, and the error from the element itself increases.

カプセル状マイクロ 軒は、 層が、 有機 E L材料又は無機 E L材料からなるこ とが好ましく、 有機 EL材料からなることが、特に好ましい。 有機 ELネ才料及ぴ 機 EL材 料を用いることで、 より効率よく発光させること力河能となる。  In the capsule micro eaves, the layer is preferably made of an organic EL material or an inorganic EL material, particularly preferably an organic EL material. By using organic EL materials and machine EL materials, it becomes a powerful power to emit light more efficiently.

発光層に好適な有機 EL材料を用いる場合、 カプセル状マイクロ発光軒は、 第一電極 又は第二電極のうちの一方が謹であること、 発光部が、 P鎌と発光層との間に配置され た電子輸送層及び Z又は電子注入層とを備えることが好ましい。 また、 カプセル状マイク 口発光^?は、 第一電極又は第二電極のうちの一方が陽極であること、 発光部が、 陽極と 発光層との間に配置された正孔輸送層及び z又は正孔注入層を備えることが好ましい。 電 子輸送層、 電子 ¾λ層、 正孔輸送層又は正孔注入層を備えることで、 電子輸送性や正孔輸 送性等が向上し、 カプセル状マイク口発光素子をより効率的に発光させることが可能とな る。 フレキシ力 光体においては、 フレキシブル基板にカプセル状マイク口発光軒を収 容するための凹部が形成されていることが好ましい。 凹部が形成されたフレキシブル基板 を備えるフレキシカ v¾光体は、 フレキシブル基板の凹部にカプセル状マイク口発光素子 が収容された構成のものとなり、 カプセル状マイク口発光素子をより安定的に固定するこ とが可能となり、 フレキシカレ発光体は薄型化することができる。 When an organic EL material suitable for the light-emitting layer is used, the capsule-shaped micro light-emitting eave must have one of the first electrode and the second electrode as an eave, and the light-emitting part is disposed between the P sickle and the light-emitting layer. And an electron transport layer and a Z or electron injection layer. In addition, the capsule-like microphone mouth light emission ^? Is one in which one of the first electrode and the second electrode is an anode, and the light emitting part is a hole transport layer disposed between the anode and the light emitting layer and z or It is preferable to provide a hole injection layer. By providing an electron transport layer, an electron ¾λ layer, a hole transport layer, or a hole injection layer, the electron transport property, the hole transport property, etc. are improved, and the capsule-shaped microphone-mouth light-emitting element emits light more efficiently. It becomes possible. In the flexi-powered light body, it is preferable that a concave portion for accommodating the capsule-shaped microphone opening light emitting eave is formed on the flexible substrate. A flexica v¾ light body including a flexible substrate having a concave portion has a configuration in which the capsule-shaped microphone-mouth light-emitting element is accommodated in the concave portion of the flexible substrate, and the capsule-shaped microphone-mouth light-emitting device is more stably fixed. The flexure light emitter can be made thinner.

フレキシブル基板は下側基板と上側基板とを重ね ^r ±てなるものであること、 下側基板 にカプセル状マイク口発光 ¾ΐの下面を収容するための下側収容部が形成されていること、 上側基板にカプセル状マイク口発光素子の上面を収容するための上側収容部が形成さ 'れて いること、 また、 凹部が Ύ側収容部と上側収容部とから形成されていることが好ましい。 このようなフレキシブル基板を備えるフレキシブル発光体は、 下側基板において配線を形 成し、 上側基板でその配線等を覆うことが 能となり、 配線の脱落や耐員を十分に防止で さる。  The flexible substrate is made by stacking the lower substrate and the upper substrate ^ r ±, and the lower substrate is formed with a lower housing part to accommodate the bottom surface of the capsule-like microphone mouth light emitting ¾ΐ, It is preferable that an upper housing portion for housing the upper surface of the capsule-shaped microphone-mouth light emitting element is formed on the upper substrate, and that the concave portion is formed of the upper housing portion and the upper housing portion. A flexible luminous body having such a flexible substrate can form wiring on the lower substrate and cover the wiring, etc. with the upper substrate, and can sufficiently prevent the wiring from dropping off and being withstood.

フレキシフレ発光体においては、 フレキシブル基板に配線を収容するための配線収容部 が形成されており、 且つ配線が 線収容部内において可動状態で収容されていることが好 ましい。 このような配線収容部が形成されたフレキシカレ基板を備え、 且つ、 その配線収 容部に配線を可動状態で収容することで、 曲げたときにも配線がその可動域の範囲 動 し、 または伸び縮みし、 配線自体に負荷がほとんどかからない。 このようなフレキシブル 発光体は、 曲げ等により断線することが十分に防止される。 また、 配線カ坷動するように 配線の長さに余裕 (遊び) を持たせた場合には、 フレキシカ 光体を伸長させた齢に 配線をその遊びの分だけ伸長させられる。 このような構成をとることで、 得られるフレキ シブル発光体を伸長させることも可能となり、 フレキシブレ 体により優れたフレキシ プリレ1'生を発揮させることカ^ J倉となる。 本発明のフレキシブル基板は、 複数のカプセル状マイク口発光素子を するための凹 部が形成されている。 フレキシブル基板は、 そのフレキシカレ基板が T側基板と上側基板 とを重ね合せてなるものであり、 下側基板にカプセル状マイク口発光素子の下面を収容す るための下側収容部が形成されており、 上彻 j基板に力プセリ W犬マイク口発光素子の上面を 収容するための上側収容部が形成されており、 凹部が 側収容部と上側収容部とから形成 されていることが好ましい。 In the flexible light emitter, it is preferable that a wiring accommodating portion for accommodating a wiring is formed on a flexible substrate, and that the wiring is accommodated in a movable state in the wire accommodating portion. A flexible substrate having such a wiring accommodating portion is provided, and the wiring is accommodated in a movable state in the wiring accommodating portion, so that the wiring moves or extends within the movable range even when bent. It shrinks and the wiring itself is hardly loaded. Such a flexible light emitter is sufficiently prevented from being broken by bending or the like. In addition, when the wiring length is given enough allowance (play) so that the wiring cable can move automatically, the wiring can be extended by the amount of play when the flexica light body is extended. By adopting such a configuration, it is possible to extend the resulting flexible illuminant, and it is possible to exhibit excellent flexiprere 1 'life with the flexible body. The flexible substrate of the present invention is formed with recesses for forming a plurality of capsule-like microphone-mouth light emitting elements. The flexible board is composed of a T-side board and an upper board. The lower housing part is formed on the lower substrate to accommodate the lower surface of the capsule microphone mouth light emitting element. It is preferable that an upper accommodating portion for accommodating the upper surface of the element is formed, and the concave portion is formed by the side accommodating portion and the upper accommodating portion.

フレキシブル基板は、 そのフレキシブル基板に配線を収容するための配線収容部が形成 されていることが好ましい。 以下、 図面を参照しながら本発明の赚な実施形態について詳細に説明する。 以下の説 明及び図面中、 同一又は相当する要素には同一の符号を付し、 重複する説明は省略する。 (カプセル状マイクロ発光^?)  The flexible substrate is preferably formed with a wiring accommodating portion for accommodating wiring on the flexible substrate. Hereinafter, detailed embodiments of the present invention will be described in detail with reference to the drawings. In the following description and drawings, the same or corresponding elements are denoted by the same reference numerals, and duplicate descriptions are omitted. (Capsule-like micro light emission ^?)

カプセル状マイクロ発光素子は、 発光層を少なくとも有し且つ一画素を構成する発光部 と、 発光部を個別に封止するカプセル状の封止層と、 発光部に電圧を印加するための第一 電極及び第二電極とを備える。  The capsule-shaped micro light-emitting element includes a light-emitting portion having at least a light-emitting layer and constituting one pixel, a capsule-shaped sealing layer that individually seals the light-emitting portion, and a first for applying a voltage to the light-emitting portion. An electrode and a second electrode.

図 1に力プセル状マイク口発光素子の好適な一実施形態の模式図を示す。 力プセル状マ イク口 軒は円麵のカブ W 状を有する。 「カプセル形状」 とは、 断面の直径 d に対する長さ Lの比 (d: L) が 1 : 1〜1 : 5の範囲にある形状をいう。 図 1において は、 Β - Β' 断面が円形であるが、 断面が円形でない場合には、 断面形状の外接円の駄 直径を直径 dとする。 長さ Lは、 通常 2 0 0 0 m以下、 好ましくは 1 0 0 0 m以下、 更に好ましく〖ま 5 0 0〃m以下である。  FIG. 1 shows a schematic diagram of a preferred embodiment of a force-pessel-like microphone-mouth light-emitting element. The force-pseed microphone mouthpiece has a round-shaped turnip W shape. “Capsule shape” refers to a shape in which the ratio of the length L to the diameter d of the cross section (d: L) is in the range of 1: 1 to 1: 5. In Fig. 1, the Β-Β 'cross section is circular, but if the cross section is not circular, the diameter of the circumscribed circle of the cross section is defined as diameter d. The length L is usually 2 0 00 m or less, preferably 1 0 0 0 0 m or less, and more preferably 5 0 0 0 m or less.

図 2、 図 3は、 それぞれ、 図 1に示すカプセル状マイクロ発光素子の好適な一実施形態 の概略 A—A' 断面図、 概略 B— B' 断面図である。  FIG. 2 and FIG. 3 are a schematic AA ′ cross-sectional view and a schematic BB ′ cross-sectional view, respectively, of a preferred embodiment of the capsule-shaped micro light emitting device shown in FIG.

図 2に示すカプセル状マイクロ発光軒は、 発光層に醜な有機 E L材料を用いるもの であり、 mnm- (バス電極) ι οと、 its層 1 1と、 m m i ιの外周上に配置された 電子輸送層 1 2と、 電子輸送層 1 2の外周上に配置された発光層 1 3と、 発光層 1 3の外 周上に配置された正孔輸送層 1 4と、 正孔輸送層 1 4の外周上に配置された陽極層 1 5と、 陽極 バス電極) 16と、 これらの部材を覆うようにして配置されたカプセル状の封 止層 17とを備える。 図 1に示す実施形態においては、 発光部は、 発光層 13と電子輸送 層 12と正孔輸送層 14とを備える。 The capsule-shaped micro light-emitting eave shown in Fig. 2 uses a thin organic EL material for the light-emitting layer, and is arranged on the outer periphery of mnm- (bus electrode) ι ο, its layer 11 and mmi ι An electron transport layer 1 2, a light-emitting layer 1 3 disposed on the outer periphery of the electron transport layer 1 2, a hole transport layer 1 4 disposed on the outer periphery of the light-emitting layer 1 3, and a hole transport layer 1 An anode layer 15 disposed on the outer periphery of 4, and An anode bus electrode) 16 and a capsule-like sealing layer 17 disposed so as to cover these members. In the embodiment shown in FIG. 1, the light emitting section includes a light emitting layer 13, an electron transport layer 12, and a hole transport layer 14.

11¾^?10は、 カプセル状マイクロ発光素子と外部電源 (図 ず) を電気的に接続 する。 0を形成するための^?材料としては、 例えば、 ニッケル、 アルミニゥ ム、 銅のような導電性金属が挙げられる。 また、 & -i 断面形状が非平面状 (例えば、 断面が円形、 多角形等) であることが好ましい。 l¾g¾?10は、 中空 (円筒 状のもの) 、 中実いずれであってもよい。 陰極端子 10は、 直径が好ましくは 1〜: L 00 0 a m程度、 より好ましくは 10〜 300〃 m程度である。 直径が前記の下 P妹満では、 it時の作業性が著しく困難となる。 他方、 前記上限を超えると電流の流れ方や電圧の印 加の仕方のムラが大きくなることや、 素子自体からの発熱が大きくなる。 ここで、 直径は、 断面が円形でない場合には、 断面形状の外接円の 直径をいう。 11¾ ^? 10 electrically connects the capsule-shaped micro light-emitting element and an external power source (not shown). Examples of materials for forming 0 include conductive metals such as nickel, aluminum, and copper. Further, the & -i cross-sectional shape is preferably non-planar (for example, the cross-section is circular, polygonal, etc.). l¾g¾? 10 may be hollow (cylindrical) or solid. The cathode terminal 10 has a diameter of preferably about 1 to L00 0 am, and more preferably about 10 to 300 mm. If the diameter is lower than the above, the workability at that time becomes extremely difficult. On the other hand, if the upper limit is exceeded, unevenness in the way the current flows and how the voltage is applied increases, and heat generation from the element itself increases. Here, the diameter means the diameter of the circumscribed circle of the cross-sectional shape when the cross-section is not circular.

iS層 11は、 比較的低い電圧で電子を放出されるために配置される。 発光層に麵な 有機 EL材料を用いる ^、 |5封亟層11を形成するための隱亟層材料としては、 比較的仕 事関数が小さく発光層への電子の注入が容易な材料が好ましい。 織層材料は、 例えば、 ノ リウム、 力 Jレシゥム、 金、 マグネシウム、 マグネシウム Z銀合金のような金属、 それら の酸化物、 それらの金属にさらにアルミニウム、 銀、 クロム等を形成した多層構造のもの である。 また、 発光層に無機 EL材料を用いる:!^、 斷亟層材料は、 例えば、 金、 銀、 銅、 クロム、 アルミニウムである。 11¾層 11の厚みは、 目的の設計に応じて される が、 3〜5 Onm程度が好ましい。 厚みが前記の下限および上限を外れる場合には、 発光 層への電子の注入が十分に起こらなくなる。 mM i 1の外周上に配置されている電子輸 送層 12は、 発光層が赚な有機 EL材料である場合に、 電子輸慰果の効率を向上させ るために赚に配置される。 電子輸送層 12を形成させるための材料は、 電子輸送性を備 えた公知の材料であればよく、 例えば、 ポリサイクリックハイドロカ一ボン系列誘導体、 ヘテロサイクリック化合物、 トリス (8—キノリノライト) アルミニウムである。 2555 The iS layer 11 is arranged to emit electrons at a relatively low voltage. Use a thin organic EL material for the light emitting layer ^, | 5 The material for forming the sealing layer 11 is preferably a material that has a relatively small work function and allows easy injection of electrons into the light emitting layer. . Weaving layer materials are, for example, metals such as norium, force J-resium, gold, magnesium, magnesium Z silver alloy, their oxides, and multilayer structures in which aluminum, silver, chromium, etc. are further formed on these metals It is. Also, use an inorganic EL material for the light-emitting layer! ^, Eaves layer material is, for example, gold, silver, copper, chromium, aluminum. The thickness of the 11¾ layer 11 depends on the intended design, but is preferably about 3 to 5 Onm. When the thickness is outside the above lower limit and upper limit, electrons are not sufficiently injected into the light emitting layer. The electron transport layer 12 disposed on the outer periphery of the mM i 1 is disposed in the bag in order to improve the efficiency of the electron transport effect when the light emitting layer is an organic EL material. Materials for forming the electron transport layer 1 2, may be any known material that example Bei electron transporting property, for example, polycyclic hydro mosquito one carbon-series derivatives, heterocyclic compounds, tris (8-quinolinolato) Aluminum. 2555

発光層 13は、 第一電極及び第二電極により電圧を印加することで (電流を流すこと で) 発光する材料を含有する層である。 発光層 13に用いられる発光層材料は、 電流を流 す、 または電圧を印加することによって発光する材料であり、 有機 EL材料又は無機 EL 材料が好ましい。 有機 EL材料としては、 例えば、 ジスチリルビフエニル系材料、 ジメシ チルボリル系材料、 スチルベン系材料、 ジピリリルジシァノベンゼン材料、 ベンズォキサ ゾール系材料、 ジスチリル系材料、 カルバゾール系材料、 ジベンゾクリセン系材料、 ァリ ールァミン系材料、 ピレン置換オリゴチォフェン系材料、 PPVオリゴマー系材料、 カル バゾ一ル系材料、 ポリフルオレン系材料が挙げられる。 また、 無機 EL材料としては、 例 えば、 M gをドープした G a N、 Mnをド一プした Z n S、 C eをド一プした S r Sが挙 げられる。 発光層 13の厚みは、 目的の設計に応じて ¾1¾¾することができるが、 10 〜200nm程度が、好ましい。 厚みが前記の下 満では、 電子と正孔の再結合が十分に 起こらない、 または輝度が十分に取れない、 または S が困難になる等の傾向にある。 他 方、 前記上限を超えると印加する電圧が高くなる傾向にある。 発光層 13に印加する電圧 は、 その設計に応じて すればよぐ 効率よく発光させる観点からは約 2〜: L 00 ポル卜が好ましい。 The light emitting layer 13 is a layer containing a material that emits light when a voltage is applied by the first electrode and the second electrode (by passing a current). The light emitting layer material used for the light emitting layer 13 is a material that emits light when an electric current is applied or a voltage is applied, and an organic EL material or an inorganic EL material is preferable. Examples of organic EL materials include distyryl biphenyl-based materials, dimesitylboryl-based materials, stilbene-based materials, dipyrryl-dicanobenzene materials, benzoxazole-based materials, distyryl-based materials, carbazole-based materials, dibenzochrysene-based materials, Examples include arylamine-based materials, pyrene-substituted oligothiophene-based materials, PPV oligomer-based materials, carbazole-based materials, and polyfluorene-based materials. Examples of inorganic EL materials include GaN doped with Mg, ZnS doped with Mn, and SrS doped with Ce. The thickness of the light emitting layer 13 can be reduced by about 1 to 3 according to the intended design, but is preferably about 10 to 200 nm. If the thickness is less than the above, recombination of electrons and holes does not occur sufficiently, luminance is not sufficient, or S becomes difficult. On the other hand, when the upper limit is exceeded, the applied voltage tends to increase. The voltage applied to the light-emitting layer 13 may be determined according to the design. From the viewpoint of efficient light emission, about 2 to: L 00 Pol 卜 is preferable.

正孔輸送層 14は、 発光層が有機 EL材料である齢に正孔の輸送効果の効率を向上さ せるために好適に配置される。 正孔輸送層 14を形成させるための正孔輸送層材料として は、 例えば N, N' ージフエニル一Ν, Ν' ージ (3—メチルフエニル) 4, 4' —ジァ ミノビフエニレ (TPD) 、 ΝΡΒ (4, 4' —b i s [N— (1-naph t hy 1) -N-pheny 1 ami no] b i pheny 1) のような芳 アミン 本が挙げ られる。 正孔輸送層 14の厚みは、 目的の設計に応じて ¾¾更することができるが、 5 The hole transport layer 14 is preferably disposed in order to improve the efficiency of the hole transport effect at an age when the light emitting layer is an organic EL material. Examples of the hole transport layer material for forming the hole transport layer 14 include N, N'-diphenyl, Ν'-di (3-methylphenyl) 4, 4'- diaminobiphenyl (TPD), ΝΡΒ ( 4, 4 '—bis [N— (1-naphthy 1) -N-pheny 1 ami no] bi pheny 1). The thickness of the hole transport layer 14 can be changed according to the desired design.

〜10 Onm程度であることが好ましい。 厚みが前記の下 β妹満では、 正孔輸送の効果が 十分に得られない。 他方、 前記上限を超えると印加される電圧が大きくなる。 It is preferably about ˜10 Onm. When the thickness is lower than β, the hole transport effect cannot be obtained sufficiently. On the other hand, when the upper limit is exceeded, the applied voltage increases.

陽極層 15を形成させるための陽極層材料は、 例えば、 酸化インジウムスズ (ΙΤΟ) 、 酸化スズ、 ニッケル、 金である。 陽極層 15の厚みは目的の設計に応じて適 ^¾更するこ とができるが、 5〜3 0 O nm程度が好ましい。 厚みが前記上限を超えると印加される電 圧が大きくなる。 The anode layer material for forming the anode layer 15 is, for example, indium tin oxide (ΙΤΟ), tin oxide, nickel, or gold. The thickness of the anode layer 15 is adjusted according to the intended design. However, about 5 to 30 nm is preferable. When the thickness exceeds the upper limit, the applied voltage increases.

陽極端子 1 6は、 陽極端子 1 6を介して発光素子を外部の電源 (図示せず) に電気的に 接 るために配置される。 陽極 6.を形成させるための材料としては、 上述の 材料と同様のものを用いることができる。  The anode terminal 16 is arranged to electrically connect the light emitting element to an external power source (not shown) via the anode terminal 16. As the material for forming the anode 6, the same materials as those described above can be used.

封止層 1 7は、 発光層 1 3を含む発光部を外気等から保護するために配置される。 封止 層 1 7を形成するために用いる封止材料としては、 例えば、 透明な讀化型エポキシ樹脂、 光硬化型エポキシ樹脂、 シリコン酸化膜、 ガラスが挙げられる。 封止層 1 7の厚みは、 目 的の設計に応じて ¾1¾更すればよいが、 1 0〜3 0 0 nm程度が好ましい。 厚みが前記 の下 P妹満では、 封止が十分に行われない、 または封止膜の強度が十分でなくなる。 他方、 前記上限を超えると製造が困難になる、 または発光した光が十分に透過しなくなる。 力プセル状マイク口発光素子の好適な実施形態について説明したが、 本発明は上記実施 形態に限定されるものではない。 例えば、 上記実施形態のカプセル状マイクロ発光素子に おいては、 その形状が円柱形状で B— B' 断面が円形であるが、 カプセル状マイクロ発光 素子においては、 その形状は特に制限されず、 断面が楕円や多角形であってもよい。 カブ セレ状マイク口発光素子は、 平均直径が 1〜: L 0 0 0 m、 より好ましくは l〜5 0 0 m、 更に好ましくは 1 0〜3 0 O i mであり、 長さが 1〜2 0 0 0 jt/ m、 より好ましくは l〜1 0 0 0 ju m、 更に好ましくは 1〜5 0 O ju mであり、 且つ平均直径と長さとの比 (平均直径:長さ) が 1 : :!〜 1 : 5である略円酒カプセル形状であることが好ましい。 上記実施形態のカプセル状マイクロ発光素子は、 隱亟 (バス電極) 1 0と、 隨層 1 The sealing layer 17 is disposed to protect the light emitting part including the light emitting layer 13 from the outside air or the like. Examples of the sealing material used for forming the sealing layer 17 include a transparent hatched epoxy resin, a photocurable epoxy resin, a silicon oxide film, and glass. The thickness of the sealing layer 17 may be changed according to the target design, but is preferably about 10 to 300 nm. When the thickness is lower than the above, the sealing is not sufficiently performed or the strength of the sealing film is not sufficient. On the other hand, when the upper limit is exceeded, production becomes difficult, or emitted light is not sufficiently transmitted. Although the preferred embodiment of the force-pseed microphone-mouth light emitting element has been described, the present invention is not limited to the above embodiment. For example, in the capsule micro light-emitting device of the above embodiment, the shape is cylindrical and the B-B 'cross section is circular, but in the capsule micro light-emitting device, the shape is not particularly limited, and the cross-section May be an ellipse or a polygon. The turnip-like microphone-mouth light-emitting element has an average diameter of 1 to: L 0 00 m, more preferably l to 500 m, more preferably 10 to 30 O im, and a length of 1 to 2 0 0 0 jt / m, more preferably 1 to 100 jum, more preferably 1 to 50 jum, and the ratio of mean diameter to length (mean diameter: length) is 1: :! ~ 1: It is preferable that it is the shape of a substantially liquor capsule which is 5. The capsule micro light-emitting device of the above embodiment has は (bus electrode) 10 and 隨 layer 1

1と、 l ¾層 1 1と、 電子輸送層 1 2と、 発光層 1 3と、 正孔輸送層 1 4と、 陽極層 1 41, l ¾ layer 1 1, electron transport layer 1 2, light emitting layer 1 3, hole transport layer 1 4, anode layer 1 4

Aと、 陽極 ¾ΐ ひス電極) 1 4 Bと、 封止層 1 7とを備えるものであるが、 カプセル状 マイクロ発光素子においては、 発光層を少なくとも有し且つ一画素を構成する発 と、 発光部を個別に封止するカプセル状の封止層と、 発光部に電圧を印加するための第一電極 及び第二電極とを備えていればよぐ 他の構成は特に制限されない。 例えば、 カプセル状 マイクロ発光軒においては、 発光層が好適な有機 E L材料からなる場合に、 発光部が、 電子注入の効果を向上させるために陰極層 1 1の外周上に配置された電子注入層を備える ものであってもよい。 電子 ¾λ層を形成するための電子注入層材料は、 例えば、 B a、 C a、 C a F、 L i F、 : L i、 N a Fである。 電子注入層の厚みは 3〜5 0 nm程度である ことが好ましい。 前記上限を超えると印加される電圧が大きくなる。 A, an anode, a cathode electrode) 14 B, and a sealing layer 17. In the capsule micro light-emitting element, at least a light-emitting layer and a light emitting element constituting one pixel are provided. Capsule-shaped sealing layer for individually sealing the light emitting part, and a first electrode for applying a voltage to the light emitting part The other configuration is not particularly limited as long as it includes the second electrode. For example, in a capsule micro light emitting eave, when the light emitting layer is made of a suitable organic EL material, the light emitting portion is arranged on the outer periphery of the cathode layer 11 in order to improve the effect of electron injection. It may be provided. The electron injection layer material for forming the electron ¾λ layer is, for example, Ba, Ca, CaF, LiF, Li: NaF. The thickness of the electron injection layer is preferably about 3 to 50 nm. When the upper limit is exceeded, the applied voltage increases.

カプセル状マイクロ発光軒は、 発光層が好適な有機 E L材料からなる場合に、 正孔注 入の効果を向上させるため、 発光部が、 陽極層 1 5の内周内に接するようにして配置させ た正?し注入層を備えるものであってもよい。 正孔注入層を形成するための正孔注入層材料 は、 例えば、 銅フタロシアニン等のフタロシアニン錯体、 4, 4' , 4" —トリス ( 3— メチルフエニルフエニルァミノ) 卜リフエ二 Jレアミン等の芳香 アミン誘導体、 ヒドラゾ ン纏体、 力ルバゾール誘導体、 トリァゾ一ル誘難、 イミダゾ一ル誘 本、 アミノ基を 有するォキサジァゾール誘導体、 ポリチォフェンである。 正孔注入層の厚みは 5〜3 0 0 nm程度が好ましい。 前記上限を超えると印加される電圧が大きくなる。 上記実施形態に おいては、 第一電極が隨であり且つ第二電極が陽極であるが、 カプセル状マイクロ発光 素子は、 その極性が逆であってもよい。 カプセル状マイク口発光素子の SSi方法の好適な一実施形態について説明する。  In order to improve the effect of hole injection when the light-emitting layer is made of a suitable organic EL material, the capsule-shaped micro light-emitting eave is arranged so that the light-emitting portion is in contact with the inner periphery of the anode layer 15. A correct injection layer may also be provided. The hole injection layer material for forming the hole injection layer is, for example, a phthalocyanine complex such as copper phthalocyanine, 4, 4 ', 4 "-tris (3-methylphenylphenylamino) Aromatic amine derivatives such as hydrazoles, force rubazole derivatives, triazole inducing, imidazole inducing, oxadiazole derivatives having amino groups, and polythiophene The thickness of the hole injection layer is 5 to 300. In the above embodiment, the first electrode is a ridge and the second electrode is an anode, but the capsule micro light-emitting element is: A preferred embodiment of the SSi method for the capsule-shaped microphone-mouth light emitting device will be described.

力プセレ状マイク口発光素子の製造方法は、 線状の第一電極材料の外周上に発光層材料を 塗布し、 草纖して筒状発光層を形成する工程 (I) と、 筒状発光層の外周上に第二電極材 料を供給して筒状第二電極層を形成し、 筒状積層体を得る工程 (II) と、 筒状積層体の外 周上に所定の間隔ごとにレーザーを照射して第一電極材料が露出した露出部を所定の間隔 毎に形成する工程 (III) と、 露出部が形成された筒状積層体の外周上に封止材料を塗布 し、 乾燥して封止層を形成する工程 (IV) と、 封止層が形成された筒状積層体を露出部で 切断し、 発光層を少なくとも有し且つ一画素を構成する発 と、 発光部を個別に封止す るカプセル状の封止層と、 発光部に電圧を印加するための第一電極及び第二電極とを備え るカプセル状マイクロ発光素子を得る工程 (V) と、 を含む。 The method of manufacturing the force-pseed microphone-mouth light-emitting element includes a step (I) of applying a light-emitting layer material on the outer periphery of a linear first electrode material, and forming a cylindrical light-emitting layer by grass cutting; Supplying a second electrode material on the outer periphery of the layer to form a cylindrical second electrode layer to obtain a cylindrical laminate (II); and at predetermined intervals on the outer periphery of the cylindrical laminate. A step (III) of forming exposed portions where the first electrode material is exposed by laser irradiation at predetermined intervals, and applying a sealing material on the outer periphery of the cylindrical laminate on which the exposed portions are formed, followed by drying. Forming a sealing layer by cutting the cylindrical laminate on which the sealing layer is formed at the exposed portion, and forming a light emitting layer having at least a light emitting layer and constituting one pixel; Seal individually And a step (V) of obtaining a capsule-like micro light-emitting device comprising: a capsule-shaped sealing layer; and a first electrode and a second electrode for applying a voltage to the light-emitting portion.

次に、 カプセル状マイク口発光軒の第一電極が 111亟で且つ第二電極が陽極であるカブ セル状マイク口発光素子の製造方法を説明する。  Next, a manufacturing method of a capsule-shaped microphone opening light emitting element in which the first electrode of the capsule microphone opening light emitting eave is 111 mm and the second electrode is an anode will be described.

カプセル状マイクロ発光軒の $¾i方法においては、 先ず、 線状の第一電極材料の外周 上に発光層材料を塗布し、 韋燥して筒状発光層を形成する (工程 (I) )。  In the $ ¾i method of the capsule-shaped micro light-emitting eave, first, a light-emitting layer material is applied on the outer periphery of the linear first electrode material, and dried to form a cylindrical light-emitting layer (step (I)).

第一電極材料は、 材料からなる芯線のみからなる材料又は 泉の外周上に筒状の陰 極層を備えている材料であればよいが、 好ましくは、 芯線の外周上に筒状の 亟層を備え ている材料である。 ¾?材料及ぴ 亟層を形成するための |5封亟層材料には、 上述のカプセ ル状マイク口発光素子において説明した^?材料及ぴ 層材料と同様のものを用いれば よい。 材料に! IS層材料を供給する方法には、 の方法を 翻すればよぐ 例 えば、 真空蒸着及 匕学蒸着等の蒸着方法、 電気めつき、 無電解めつき、 電子衝撃法を採 用すればよい。  The first electrode material may be a material consisting only of a core wire made of a material or a material provided with a cylindrical negative electrode layer on the outer periphery of the spring, but preferably a cylindrical ridge layer on the outer periphery of the core wire It is a material with ¾ What is necessary is just to use the same material and layer material as those described in the above-mentioned capsule-shaped microphone opening light emitting element as the | 5 sealing layer material for forming the material and the layer. To material! For the method of supplying the IS layer material, it is sufficient to use the method of, for example, vacuum deposition, chemical vapor deposition, etc., electric plating, electroless plating, electron impact method may be adopted. .

発光層材料を塗布は、 の塗工方法で行えばよぐ 例えば、 浸漬 (デイツピング) や スプレー、 コ一夕一、 印刷機、 或い « ^毛を用いて行えばよい。 発光層材料の塗布に際し ては、 適当な溶剤 (水又は有機溶剤等) に発光層材料を贿混合して混合液として塗布し てもよい。 混合液の調 ¾ ^法は の方法で行えばよぐ その? IS、 粘度等は所望の混合 液を 調製して調節すればよい。 謹は^ πの方法で行えばよぐ 例えば、 自然草燥、 加熱乾燥等で行えばよい。加熱纖に際しては、 発光層材料のガラス転移 以下の発光 層材料に損傷を与えなレ 条件で 5分〜 5時間程度加熱、 草燥させることが好ましい。 カプセル状発光素子に電子注入層を配置する場合には、 発光層材料を塗 «る前に、 線 状の第一電極材料の外周上に電子注入層材料を塗布して,させることが好ましい。 また、 カプセル状発光軒に電子輸送層を配置する場合には、 発光層材料を塗;? る前に、 電子 輸送層材料を塗布して草纖させることが好ましい。 電子注入層材料及び電子輸送層材料と 'しては、 上述のカプセル状マイクロ発光素子において説明した電子注入層材料及び電子輸 送層材料と同様のものが用いればよい。 また、 電子注入層材料又は電子輸送層材料を塗布 する方法及び させる方法としては、 上述の発光層材料を塗布する方法及び乾燥させる 方法と同様の方法を棚すればよい。 The light emitting layer material may be applied by the following coating method. For example, dipping, spraying, printing, printing, or hair may be used. In applying the light emitting layer material, the light emitting layer material may be mixed with an appropriate solvent (water or organic solvent) and applied as a mixed solution. The method of preparing the mixed solution is sufficient. The IS, viscosity, etc. may be adjusted by preparing a desired mixed solution. The cocoon can be made by the method of ^ π. For example, it can be done by natural grass drying, heat drying, or the like. During heating, it is preferable to heat and dry for about 5 minutes to 5 hours under conditions that do not damage the light emitting layer material below the glass transition of the light emitting layer material. When the electron injection layer is disposed in the capsule light emitting element, it is preferable to apply the electron injection layer material on the outer periphery of the linear first electrode material before applying the light emitting layer material. In addition, when the electron transport layer is disposed on the capsule light emitting eave, it is preferable that the electron transport layer material is applied and grassed before the light emitting layer material is applied. As the electron injection layer material and the electron transport layer material, the electron injection layer material and the electron transport layer described in the above-described capsule-shaped micro light emitting device are used. The same material as the layer feeding material may be used. In addition, as a method for applying the electron injection layer material or the electron transport layer material and a method for applying the electron injection layer material, a method similar to the method for applying the light emitting layer material and the method for drying may be provided.

筒状発光層の外周上に第二電極材料を供給して筒状第二電極層を形成し、 筒状積層体を 得る (工程 (II) ) 。  A second electrode material is supplied onto the outer periphery of the cylindrical light emitting layer to form a cylindrical second electrode layer, thereby obtaining a cylindrical laminate (step (II)).

本実施形態においては第二電極が陽極であるため、 第二電極材料は、 陽極層を形成する ための陽極層材料である。 陽極層材料としては、 上述のカプセル状マイクロ発光素子にお いて説明した陽極層材料と同様のものが用いればよい。 陽極層材料を供給する方法は、 例 えば、 真空蒸着及 匕学蒸着等の蒸着方法、 電気めつき、 無電解めつき、 電子衝撃法、 ゾ ル—ゲル法を湖すればよい。  In the present embodiment, since the second electrode is an anode, the second electrode material is an anode layer material for forming an anode layer. As the anode layer material, the same anode layer material as described in the above-described capsule-shaped micro light-emitting element may be used. As the method for supplying the anode layer material, for example, a vapor deposition method such as vacuum vapor deposition and chemical vapor deposition, an electroplating method, an electroless plating method, an electron impact method, or a sol-gel method may be used.

本発明においては、 カプセル状発光軒に正孔輸送層を配置する場合には、 第二電極材 料を供給する前に、 線状の第一電極材料の外周上に正孔輸送層材料を塗布して乾燥させる 工程を含むことが好ましい。 カプセル状発光軒に正孔注入層を配置する場合には、 正孔 注入層材料を塗布して,させる工程を含むことが好ましい。 正孔輸送層材料及び IE?し注 入層材料としては、 上述のカプセル状マイクロ発光素子において説明した電子注入層材料 及び電子輸送層材料と同様のものを用いらればよい。 正孔輸送層材料又は正孔注入層材料 を塗 る方法及ぴ ¾ ^させる方法としては、 上述の発光層材料を塗 »る方法及び燥 させる方法と同様の方法を すればよい。 次いで、 筒状積層体の外周上に所定の間隔ごとにレーザ一を照射して第一電極材料が露 出した露出部を所定の間隔毎に形成する (工程 (III) ) 。  In the present invention, when the hole transport layer is disposed on the capsule-shaped light emitting eave, the hole transport layer material is applied on the outer periphery of the linear first electrode material before supplying the second electrode material. Then, it is preferable to include a step of drying. In the case where the hole injection layer is disposed on the capsule light emitting eave, it is preferable to include a step of applying and injecting a hole injection layer material. As the hole transport layer material and the IE injection layer material, the same materials as the electron injection layer material and the electron transport layer material described in the capsule micro light-emitting element described above may be used. As a method for applying and transporting the hole transport layer material or the hole injection layer material, a method similar to the method for applying the light emitting layer material and the method for drying described above may be used. Next, an exposed portion where the first electrode material is exposed is formed at predetermined intervals on the outer periphery of the cylindrical laminated body at predetermined intervals (step (III)).

レーザーを照射する工程 (Ι Π) の好適な例について図 4を参照しながら説明する。 図 4は、 筒状積層体 2 0の外周上にレーザー光源 2 1からレーザー Lを照射して第一電極材 料が露出した露出部 2 2を形成している状態を示す模式図である。 図 4中において矢印 A は、 進行方向を表す。 レーザー光源 2 1としては、 筒状積層体 2 0から第一電極材料以外 の層を!^ ¾できるものであればよレが、 パルス状の高出力のレーザー Lを照射できるもの が好ましい。 レーザ一 Lとしては、 照射弓艘が 5W/ c m2〜 1 0 0 WZ c m2であるパ ルスレーザーが好ましい。 レ一ザ一 Lは、 生産効率の向上の観点から、 シート状のレーザ 一光が好ましい。 レ一ザ一 Lの照射に際しては、 レーザ一 Lの照射により筒状積層体 2 0 中の第一電極材料以外の層のみを! ^するように調整してレーザ一 Lを照射する。 レ一ザ 一 Lを照射する間隔は、 目的とするカプセル状マイク口発光素子の設計に応じて適宜調整 すればよい。 筒状積層体 2 0の外周上にレーザー Lを照射することで第一電極材料が露出 した露出部 2 2を形成すればよい。 レーザ一の照射によって第一電極材料を露出させるが、 レーザー Lの照射によつて第一電»才料のうちの前述の 材料からなる 泉を露出させ てもよい。 A preferred example of the laser irradiation step ( Ι Π ) will be described with reference to FIG. FIG. 4 is a schematic view showing a state in which an exposed portion 22 where the first electrode material is exposed is formed by irradiating the laser L from the laser light source 21 on the outer periphery of the cylindrical laminate 20. In Fig. 4, arrow A indicates the direction of travel. As the laser light source 21, except for the first electrode material from the cylindrical laminate 20 Layer of! If it can be obtained, it is preferable to be able to irradiate a pulsed high-power laser L. As the laser L, a pulse laser having an irradiation bow of 5 W / cm 2 to 100 WZ cm 2 is preferable. Laser L is preferably a sheet of laser light from the viewpoint of improving production efficiency. When laser L is irradiated, only the layers other than the first electrode material in the cylindrical laminate 20 are irradiated by laser L! Adjust so that the laser beam is 1 L. The interval at which the laser L is irradiated may be adjusted as appropriate according to the design of the target capsule microphone mouth light emitting element. The exposed portion 22 where the first electrode material is exposed may be formed by irradiating the laser L on the outer periphery of the cylindrical laminate 20. Although the first electrode material is exposed by laser irradiation, the spring made of the above-described material of the first electrode material may be exposed by laser L irradiation.

次いで、 露出部が形成された筒状積層体の外周上に封止材料を塗布し、 乾燥して封止層 を形成する (工程 (IV) )。  Next, a sealing material is applied on the outer periphery of the cylindrical laminate on which the exposed portion is formed, and dried to form a sealing layer (step (IV)).

封止材料としては、 上述の本発明のカプセル状マイク口発光素子において説明した封止 材料と同様のものを用いればよい。 封止材料を塗布する方法及び乾躁させる方法としては、 上述の発光層材料を塗 Wる方法及ぴ觀させる方法と同様の方法を翻すればよい。 封 止層を形成する方法としては、 封止材料を蒸着して封止層を形成する方法を すればよ い。  As the sealing material, the same sealing material as that described in the above-described capsule-shaped microphone-mouth light-emitting element of the present invention may be used. As a method of applying the sealing material and a method of drying, the same method as the method of applying the light-emitting layer material and the method of applying it may be reversed. As a method of forming the sealing layer, a method of forming a sealing layer by evaporating a sealing material may be used.

次に、 封止層が形成された筒状積層体を露出部で切断する (工程 (V) )。  Next, the cylindrical laminated body on which the sealing layer is formed is cut at the exposed portion (step (V)).

筒状積層体を露出部で切断する方法は、 例えば、 大出力のレーザ一により切断する方法 を翻すればよい。 切断することで、 発光層を少なくとも有し且つ一画素を構成する発光 部と、 発光部を個別に封止するカプセル状の封止層と、 発光部に電圧を印加するための第 一電極及び第二電極とを備えるカプセル状マイク口発光 ¾ΐを得ることができる。  The method of cutting the cylindrical laminate at the exposed portion may be reversed from the method of cutting with a high-power laser, for example. By cutting, a light emitting part having at least a light emitting layer and constituting one pixel, a capsule-shaped sealing layer for individually sealing the light emitting part, a first electrode for applying a voltage to the light emitting part, and It is possible to obtain a capsule-shaped microphone-mouth light emitting device including the second electrode.

カプセル状マイクロ発光^?においては、 陽極層が外部電源と電気的に接続されるよう に、 使用の際に陽極層に接するように陽極端子を形成してもよく、 封止層が形成された筒 状積層体を露出部で切断する前に、 予め、 筒状積層体に陽極層に接するように陽極 を 形成してもよい。 陽極 を形成する方法としては、 例えば、 真空蒸着及 匕学蒸着等の 蒸着方法、 電気めつき、 無電角军めっき、 電子衝,法を採用すればよい。 陽極 を形成す るための ^材料は、 上述の本発明のカプセル状マイク口発光素子において説明した^ 材料と同様のものを用いればよい。 工程 (V) において封止層が形成された筒状積層体を 露出部で切断する前に、 封止層が形成された筒状積層体にレーザ一を照射して露出部を再 度露出させる工程を含むことが好ましい。 In the capsule micro light-emitting device, the anode terminal may be formed so as to be in contact with the anode layer during use so that the anode layer is electrically connected to an external power source, and the sealing layer is formed. Before cutting the cylindrical laminate at the exposed portion, the anode is previously placed in contact with the anode layer on the cylindrical laminate. It may be formed. As a method for forming the anode, for example, a vapor deposition method such as vacuum vapor deposition or chemical vapor deposition, electroplating, non-electrostatic square plating, electronic collision, or the like may be employed. The material for forming the anode may be the same as the material described in the above-mentioned capsule-like microphone-mouth light emitting device of the present invention. Before cutting the cylindrical laminate with the sealing layer formed in step (V) at the exposed portion, the cylindrical laminate with the sealing layer formed is irradiated with a laser to expose the exposed portion again. It is preferable to include a process.

レーザーを照射して露出部を再度露出させる工程の好適な例について図 5を参照しなが ら説明する。 図 5は、 封止層 1 7が形成された筒状積層体 2 0にレーザー Lを照射して露 出部 2 2を再度露出させている状態を示す模式図である。 図 5中において矢印 Αは、 進行 方向を表す。 レーザ一 Lを照射して露出部 2 2を再度露出させることで、 第一電極材料の みが露出し、 他の部位が封止された筒状積層体を得ることができ、 その筒状積層体に対し て工程 (V) を施すことで、 第一電極材料の が露出されたカプセル状マイクロ発光素 子を効率よく得ることができる。 レーザ一 Lを照射するためのレーザ一光源 2 1及びレ一 ザ一 Lの な条件は、 前述のものと同様である。  A preferred example of the step of exposing the exposed portion again by irradiating with laser will be described with reference to FIG. FIG. 5 is a schematic view showing a state in which the exposed portion 22 is exposed again by irradiating the cylindrical laminate 20 on which the sealing layer 17 is formed with the laser L. FIG. In FIG. 5, the arrow Α indicates the direction of travel. By irradiating the laser 1 L and exposing the exposed portion 22 again, it is possible to obtain a cylindrical laminate in which only the first electrode material is exposed and the other parts are sealed. By applying the step (V) to the body, it is possible to efficiently obtain a capsule-like micro light-emitting device in which the first electrode material is exposed. The conditions for the laser beam source 21 and the laser beam L for irradiating the laser beam L are the same as those described above.

(フレキシブル基 (Flexible base

フレキシブル基板としては、 発光素子を配置するために用いること力河能なものであれ ばよく、 公知のフレキシブル基板を iig用いることができる。 フレキシブル基板の形状は、 線状のものであっても面状のものであってもよい。 フレキシブル基板の 法は、 の方法を ¾¾翻すればよい。  Any flexible substrate may be used as long as it can be used for arranging the light emitting elements, and a known flexible substrate can be used. The shape of the flexible substrate may be linear or planar. For the method of the flexible substrate, the above method may be reversed.

フレキシブル基板の構造としては、 前述のフレキシブル基板を に用いられる。 フレ キシブル基板としては、 複数のカプセル状マイクロ発光素子を^するための凹部が形成 されたフレキシブル基板が好ましく、 下側基板と上側基板とを重ね合せてなるフレキシブ ル基板であって下側基板にカプセル状マイクロ発光素子の下面を収容するための下側収容 部が形成されており、 上側基板にカプセル状マイクロ発光^?の上面を収^ るための上 側収容部が形成されており、 凹部が下側収容部と上側収容部とから形成されているフレキ シカレ基板がより好ましく、 配線を収容するた の配線収容部が形成されているフレキシ フレ基板力 S特に好ましい。 As the structure of the flexible substrate, the aforementioned flexible substrate can be used. The flexible substrate is preferably a flexible substrate in which concave portions for forming a plurality of capsule-shaped micro light-emitting elements are formed, and is a flexible substrate formed by superposing a lower substrate and an upper substrate on the lower substrate. A lower housing part is formed to accommodate the lower surface of the capsule-shaped micro light-emitting element, and an upper surface for accommodating the upper surface of the capsule-shaped micro light-emitting element on the upper substrate. A flexure substrate in which a side accommodating portion is formed and a recess is formed from a lower accommodating portion and an upper accommodating portion is more preferable, and a flexible flexible substrate force in which a wiring accommodating portion for accommodating wiring is formed S is particularly preferred.

図 6は、 フレキシカレ基板の好適な一実施形態の^^を示 従断面図である。 また、 図 7は、 図 6に示すフレキシブル基板の上側基板の模式図であり、 図 8は、 図 6に示すフ レキシカレ基板の下側基板の模式図である。 図 6〜 8に示すフレキシブル基板は、 上側基 板 3 0と下側基板 3 1を含む。 上側基板 3 0と下側基板 3 1とからなるフレキシブル基板 には凹部 3 2が形成されている。 上側基板 3 0には、 上側収容部 4 0が形成され、 陽極配 線 4 2が形成されている (図 7参照) 。 下側基板 3 1には、 下側収容部 4 1と、 陽極配線 4 2と、 ISS配線用溝 (配線収容部) 4 3と、 陽極配線用溝 (配線収容部) 4 4とが形成 されている (図 8参照) 。  FIG. 6 is a cross-sectional view showing ^^ of a preferred embodiment of the flexure substrate. FIG. 7 is a schematic diagram of the upper substrate of the flexible substrate shown in FIG. 6, and FIG. 8 is a schematic diagram of the lower substrate of the flexure substrate shown in FIG. The flexible substrate shown in FIGS. 6 to 8 includes an upper substrate 30 and a lower substrate 31. The flexible substrate including the upper substrate 30 and the lower substrate 31 has a recess 32 formed therein. On the upper substrate 30, an upper housing part 40 is formed, and an anode wiring 42 is formed (see FIG. 7). The lower substrate 3 1 is formed with a lower housing portion 4 1, an anode wiring 4 2, an ISS wiring groove (wiring housing portion) 4 3, and an anode wiring groove (wiring housing portion) 4 4. (See Figure 8).

本実施形態においては、 フレキシブル基板の凹部 3 2は、 上述の上側収容部 4 0と下側 収容部 4 1とにより形成される。 凹部 3 2の形状としては、 カプセル状マイクロ発光素子 を収容できる形状であればよく、 力プセル状マイク口発光素子の形状に合せて ¾ϋその形 状の設計を麵してもよい。 上側収容部 4 0及び下側収容部 4 1の形状は、 目的とする凹 部 3 2の形状に^ &て形成すればよい。 凹部の形 法は、 フレキシブル基板にこのよう な凹部を形成させることが可能な^ Πの方法を 細すればよく、 例えば、 エッチング により凹部を形成する方法を挙げることができる。  In the present embodiment, the concave portion 32 of the flexible substrate is formed by the above-described upper accommodation portion 40 and lower accommodation portion 41. The shape of the recess 32 may be any shape as long as it can accommodate the capsule-shaped micro light-emitting element, and may be designed in accordance with the shape of the force-pseed microphone-mouth light-emitting element. The shapes of the upper housing part 40 and the lower housing part 41 may be formed in the shape of the intended concave part 32. The shape of the recess may be reduced by a method that can form such a recess on the flexible substrate. For example, a method of forming the recess by etching can be given.

陽極配線 4 2は、 カプセル状マイク口発光素子を配置した際にカプセル状マイク口発光 鮮の第一電極又は第二電極のいずれかと嫌虫させて、 カプセル状マイクロ発光素子に電 気を導通させるために形成される。 陽極配線 4 2の材料としては、 配線に用いちれる公知 の配線材料 (例えば、 アルミニウム、 銅等の 本) を ¾t¾いればよい。 陽極配線を形成 する方法は、 么^の方法を採用して形成させればよぐ 例えば、 蒸着法により形成する方 法を採用すればよい。 封亟配線用溝 4 3及ぴ慯極配線用溝 4 4は、 配線を配置させるための溝である。 溝 4 3 及び 4 4の形 法は、 の方法を 細すればよい。 The anode wiring 42 is made to dissipate with either the first or second electrode of the capsule-like microphone mouth light emitting element when the capsule-like microphone mouth light emitting element is disposed, and to conduct electricity to the capsule-like micro light emitting element. Formed for. As a material of the anode wiring 42, a known wiring material used for wiring (for example, a book such as aluminum or copper) may be used. As a method of forming the anode wiring, the method of 么 ^ may be adopted. For example, a method of forming by an evaporation method may be adopted. Sealed wiring grooves 4 3 and negative wiring grooves 4 4 are grooves for arranging wiring. For the shape of grooves 4 3 and 4 4, the method of

フレキシカレ基板においては、 用いるカプセル状マイクロ発光素子の設計に応じて、 適 宜極性を逆に したり、 酉己線用の溝の位置を してもよい。  In the flexure substrate, depending on the design of the capsule micro light-emitting element to be used, the polarity may be reversed as appropriate, or the groove for the selfish line may be positioned.

(フレキシブル発光体) (Flexible light emitter)

本発明のフレキシフ 1/¾光体は、 フレキシブル基板と、 フレキシカレ基板に配置された 複数個のカプセル状マイク口発光素子と、 カプセル状マイク口発光素子の第一電極又は第 二電極に電気を導通するための配線とを備える。 以下、 図面に基づいてフレキシフ V¾光 体の好適な難形態について説明する。 図 9に、 本発明のフレキシフ !/¾光体の好適な一 形態の斜視図を示す。 図 9に示すフレキシフレ発光体は、 フレキシブル基板 5 0と、 複数個の力プセリ W犬マイク口発光素子 5 1と、 力プセ 1犬マイク口発光素子 5 1の第一電 極又は第二電極に電気を導通するための配線 (陽極配線 4 2、 陰極酉己泉 5 2 A、 陰極配線 5 2 B及び揚極配線 5 3 ) とを備える。 フレキシカレ基板 5 0は下側基板 3 1のみからな る。  The flexif 1 / ¾ light body of the present invention includes a flexible substrate, a plurality of capsule-shaped microphone-mouth light-emitting elements disposed on the flexure-shaped substrate, and electrical conduction to the first electrode or the second electrode of the capsule-shaped microphone-mouth light-emitting element. Wiring for carrying out. In the following, a preferred difficult form of the flexiff V light beam will be described with reference to the drawings. FIG. 9 shows a perspective view of a preferred embodiment of the flexiflex / semiconductor of the present invention. The flexible light emitter shown in FIG. 9 includes a flexible substrate 50, a plurality of force-pseed W dog microphone mouth light-emitting elements 51, and a force electrode 1 dog microphone mouth light-emitting element 51 first electrode or second electrode. And a wiring for conducting electricity (anode wiring 4 2, cathode cathode self spring 5 2 A, cathode wiring 5 2 B and lifting wire 5 3). The flexure substrate 50 is composed only of the lower substrate 31.

フレキシ力 光体は、 フレキシブル基板 5 0に、 複数個の力プセル状マイク口発光素 子 5 1を配置した構成となることから、 その発光体に欠陥が生じた場合には、 欠陥が生じ たカプセル状マイクロ発光素子 5 1を新たなものと交換することで容易に修理することが できる。 フレキシブ 光体においては、 カプセル状マイクロ発光軒自体の大きさが小 さく、 それがフレキシブル基板にドット状に存^るものとなることから、 フレキシブル 発光体を曲げた場合においても発光 »自体が受ける力は小さく発光^?と基板との間の 屈曲性の差による影響をほとんど受けないため、 十分に曲げること力河能となる。 そのた め、 フレキシカ ¾光体は、 十分に優れたフレキシブル性を発揮できる。  The flexi-powered light has a structure in which a plurality of force-pseudo microphone mouth light-emitting elements 51 are arranged on a flexible substrate 50. Therefore, when the light-emitting body has a defect, the defect has occurred. The capsule micro light-emitting element 51 can be easily repaired by replacing it with a new one. In the flexible light emitter, the size of the capsule-shaped micro light-emitting eave itself is small, and it exists in the form of dots on the flexible substrate. Therefore, even when the flexible light emitter is bent, the light emission itself is received. Since the force is small and it is hardly affected by the difference in flexibility between the light-emitting element and the substrate, it becomes a power ability to bend sufficiently. Therefore, the flexica phosphor can exhibit sufficiently excellent flexibility.

配線 (陽極配線 4 2、 I ®配線 5 2 A、 麵配線 5 2 B及ぴ I 極配線 5 3) は、 カフ。セ ル状マイクロ発光素子 5 1の第一電極 (本実施形態においては!^亟) 又は第二電極 (本実 施形態においては陽極) に電気を導通することカ坷能なものであればよい。 配線としては、 蒸着等、 の方法を fflf用して形成させた配線であっても、 泉状の導体を用いてこれ を配置した配線であってもよい。 各配線同士、 及び各配線と電極との齢部は、 スポット 溶接等の^ πの方法を して 接続させれば い。 Wiring (anode wiring 4 2, I ® wiring 5 2 A, 麵 wiring 5 2 B and I pole wiring 5 3) is a cuff. Cell-shaped micro light-emitting element 51 1 1st electrode (in this embodiment! ^ 又 は) or 2nd electrode (actual In the embodiment, any material capable of conducting electricity to the anode) may be used. The wiring may be a wiring formed by fflf using a method such as vapor deposition, or a wiring in which this is arranged using a spring-like conductor. Each wire and the age part of each wire and electrode may be connected by a method of ^ π such as spot welding.

フレキシブ Jレ発光体は、 使用の際に、 配線等を保護するためにカノ一フィルムを積層さ せて用いてもよい。 カノ一フィルムとしては、 例えば、 ポリエチレン、 ポリプロピレン、 ポリエチレンテレフタレ一ト等のフィルムを使用すればよい。  The flexible J-ray illuminator may be used by laminating a cano film in order to protect the wiring and the like during use. For example, a film of polyethylene, polypropylene, polyethylene terephthalate or the like may be used as the cano film.

フレキシブル基板 5 0にカプセル状マイク口発光軒 5 1を固定する方法は、 導電性の 接着剤等により力プセル状マイク口発光素子の外周と下側基板とを貼合わせる方法を採用 すればよい。 カバーフィルムを用いることによりカプセル状マイクロ発光素子と基板とを 直接接着せず、 下側基板とカバーフィルムを接糊等で貼合わせることにより第一電極お よび第二電極を圧着により配線と接触させ、 する方法を採用してもよい。  As a method for fixing the capsule-shaped microphone-mouth light-emitting eave 51 to the flexible substrate 50, a method may be adopted in which the outer periphery of the force-push-shaped microphone-mouth light-emitting element is bonded to the lower substrate with a conductive adhesive or the like. By using the cover film, the capsule-shaped micro light-emitting element and the substrate are not directly bonded, but the lower substrate and the cover film are bonded together with adhesive, etc., so that the first electrode and the second electrode are brought into contact with the wiring by crimping You may adopt the method of.

フレキシフ 光体は、 フレキシブル基板 5 0力 R則基板 3 1のみからなるものである が、 このようなフレキシカ 光体はこれをそのまま用いてもよく、 また、 下側基板 3 1 に上側基板 3 0を重ね合せて他の形態として用いてもよい。 以下、 フレキシブル基板 5 0 がード側基板 3 1に上側基板 3 0を重ね合せたものであるフレキシフ k¾光体の好適な他の 実施形態について説明する。 図 1 0は、 フレキシ力!/ ¾光体の赚な実施形態の一部を示 «略上面図であり、 図 1 1は、 その概略断面図である。 図 1 0及び 1 1に示すフレキシ プリ ¾光体においては、 上側基板 3 0と、 下側基板 3 1とを重ね^ てなるフレキシブル 基板 5 0と、 カプセル状マイクロ発光素子 5 1と、 第一電極又は第二電極に電気を導通す るための酉己糸泉 (陽極配線 4 3、 iS配 ϋ 5 2 Α、 I ®酉己 ϋ 5 2 Β、 陽極配線 5 3 ) とから なる。 フレキシブル基板 5 0は図 6〜 8に示すフレキシブル基板と同様のものである。 本 実施形態においては、 I ®配線 5 2 Α及び 5 2 Βは、 陰極配線用溝 4 3に配置されており、 陽極配線 5 3は、 陽極配線用溝 4 4に配置されている。 配線 5 2 A、 5 2 B及び 5 3とし ては、 それぞれ線状の導体を用いている。 陰極配線 5 2 A及び陰極配線 5 2 Bはスポット 溶接により接続されている。 陽極配線 4 3及ぴ 極配線 5 3もスポット溶接により接続さ れている。 カプセル状マイクロ発光素子 5 1として、 図 1に示すカプセル状マイクロ発光 軒が用いられている。 フレキシブル基板 5 0は、 陽極配線 4 3がカプセル状マイクロ発 光軒 5 1の陽極 6と接している。 カプセル状マイクロ発光軒 5 1の PtK^ l 0と Pt亟配線 5 3とがスポット溶接により接続されている。 US配線 5 2 Bは麵配線用 溝 4 3内において、 その長さに余裕を持たせている。 そのため、 i亟配線 5 2 Bは麵配 線用溝 4 3において可動状態となっている。 隨配線用溝 (配線収容部) 4 3に |5細配線 5 2 Bを可動状態で収^ Tることで、 フレキシ力 I ^光体を曲げたときにも配線自体カ坷 動して配線が長さの余裕の分だけ伸び縮みするため配線自体に負荷がほとんどかからず、 曲げや伸長等によって配線が断線することが十分に防止される。 同様に陽極配線 5 3は陽 極配線用溝 4 4内において、 その長さに余裕を持たせている。 そのため、 陽極配線 5 3は 陽極配線用溝 4 4において可動状態となっている。 陽極配線用溝 (配線収容部) 4 4に陽 極配線 5 3を可動状態で収容することで、 フレキシブル発光体を曲げたときにも配線自体 が可動して配線が長さの余裕の分だけ伸び縮みするため配線自体に負荷がほとんどかから ず、 曲げや伸長等によって配線が断線することが十分に防止される。 従って、 フレキシブ ]/ ¾光体は極めて優れたフレキシカレ性を発揮できる。 上側基板 3 0と下側基板 3 1とを 重ね合せる方法は、 例えば、 接豁 U等を用いて 2枚の基板を接着する方法等の公知の方法 を蒙採用すればよい。 他の実施形態のフレキシブ 1/¾光体には、 上述のように、 カバー フィルムを積層させて用いてもよい。 カノ一フィルム 6 0を積層させた例を図 1 2に示す。 以上、 本発明のフレキシブル発光体の好適な実施形態について説明したが、 本発明は上 記実施形態に限定されるものではない。 例えば、 上記実施形態においては、 円柱状のカブ セル状マイクロ発光軒を用いているが、 本発明においては、 様々な形状のカプセル状マ イク口発光軒を用いてもよい。 また、 シート状のフレキシブル基板を用いているが、 フ レキシカレ基板として、 線状のフレキシカレ基板を用いてもよい。 線状のフレキシブル基 板を用いる場合のフレキシカレ発光体の例を図 1 3 ( m) に示す。 The flexiff light body is composed of only the flexible substrate 50 0 force R-law substrate 3 1, but such a flexica light body may be used as it is, and the lower substrate 3 1 may be connected to the upper substrate 30. May be used as another form. In the following, another preferred embodiment of the flexiflex k example optical body in which the flexible substrate 50 is obtained by superposing the upper substrate 30 on the card side substrate 31 will be described. FIG. 10 is a schematic top view showing a part of a flexible embodiment of the flexipower! / Trimming body, and FIG. 11 is a schematic sectional view thereof. In the flexible pre-illuminator shown in FIGS. 10 and 11, a flexible substrate 50 including an upper substrate 30 and a lower substrate 31, a capsule micro light-emitting element 51, and a first It consists of a self-spring for conducting electricity to the electrode or the second electrode (anode wiring 4 3, iS wire 5 2 Α, I® wire 5 2 Β, anode wire 5 3). The flexible substrate 50 is the same as the flexible substrate shown in FIGS. In the present embodiment, the I® wirings 5 2 Α and 5 2 Β are arranged in the cathode wiring groove 43, and the anode wiring 53 is arranged in the anode wiring groove 44. For the wirings 5 2 A, 5 2 B and 5 3, linear conductors are used. Cathode wiring 5 2 A and cathode wiring 5 2 B are spots Connected by welding. Anode wiring 4 3 and pole wiring 5 3 are also connected by spot welding. As the capsule-shaped micro light-emitting element 51, the capsule-shaped micro light-emitting element shown in FIG. 1 is used. In the flexible substrate 50, the anode wiring 43 is in contact with the anode 6 of the capsule-shaped micro light emitting eave 51. The PtK ^ l 0 of the capsule-shaped micro light-emitting eave 5 1 and the Pt 亟 wire 5 3 are connected by spot welding. The US wiring 5 2 B has a margin in the length of the groove 4 3 for the vertical wiring. Therefore, the i 亟 wiring 5 2 B is movable in the 溝 wiring groove 4 3.隨 Wiring groove (wiring accommodating part) 4 3 in | 5 thin wiring 5 2 B in a movable state, flexi force I ^ When the light body is bent, the wiring itself moves and wiring However, since the wire expands and contracts by the margin of the length, the wiring itself is hardly loaded, and it is sufficiently prevented that the wiring is disconnected due to bending or stretching. Similarly, the anode wiring 53 has a margin in the length of the anode wiring groove 44. Therefore, the anode wiring 53 is movable in the anode wiring groove 44. Anode wiring groove (wiring housing part) 4 4 With positive wiring 5 3 accommodated in a movable state, the wiring itself can be moved even when the flexible luminous body is bent, so that the wiring has a margin of length. Because the wire is stretched and shrunk, there is almost no load on the wire itself, and the wire is sufficiently prevented from being disconnected by bending or stretching. Therefore, the flexible / light-emitting body can exhibit extremely excellent flexure properties. As a method of overlapping the upper substrate 30 and the lower substrate 31, for example, a known method such as a method of bonding two substrates using a contact U or the like may be adopted. As described above, a cover film may be laminated on the flexible 1 / ¾ light body of other embodiments. An example of laminating canopy film 60 is shown in FIG. The preferred embodiment of the flexible luminous body of the present invention has been described above, but the present invention is not limited to the above embodiment. For example, in the above-described embodiment, a cylindrical cabcell-shaped micro light-emitting eave is used. However, in the present invention, capsule-shaped micro-emission eaves having various shapes may be used. In addition, a sheet-like flexible substrate is used, but As the lexical substrate, a linear flexure substrate may be used. Figure 13 (m) shows an example of a flexure light emitter when a linear flexible substrate is used.

^±の利用可纖 ^ ± available

本発明によれば、 極めて優れたフレキシブル性を有し、 且つ欠陥が発生しても欠陥の発 生した画素ごとに容易に修理することができるフレキシカ 光体を提供すること、 並び に、 そのフレキシ力!/ ¾光体を Mtする際に赚に用いることカ坷能なフレキシブル基板 を提供することが^ となる。  According to the present invention, it is possible to provide a flexure light body that has extremely excellent flexibility and can be easily repaired for each pixel in which a defect has occurred even if a defect occurs. It is possible to provide a flexible substrate that can be used for the Mt of light bodies.

したがって、 本発明のフレキシフレ発光体は、 フレキシブル 1生に極めて優れるため、 各 種ディスプレイ等に用いる発光体として特に有用である。  Therefore, the flexible light emitter of the present invention is particularly useful as a light emitter used for various displays and the like because it is extremely excellent in life.

Claims

請求の範囲 The scope of the claims 1 . フレキシブル基板と、 1. Flexible substrate, フレキシカレ基板に配置された、 発光層を少なくとも有し且つ一画素を構成する発 光部と、  A light emitting portion disposed on the flexure substrate and having at least a light emitting layer and constituting one pixel; 部を個別に封止するカプセル状の封止層と、  A capsule-shaped sealing layer that individually seals the parts; 発光部に電圧を印加するための第一電極及び第二電極とをそれぞれ備える複数個の カプセル状マイク口発光^?と、  A plurality of capsule-shaped microphone-mouth light emitters each having a first electrode and a second electrode for applying a voltage to the light emitting section; 第一電極又は第二電極に電気を導通するための配線と、  Wiring for conducting electricity to the first electrode or the second electrode; を備えたフレキシブリレ発光体。  A flexible brilliant light emitter. 2. 力プセル状マイク口発光素子は、  2. The force-pseed microphone mouth light emitting element 発光層が筒状発光層であり、  The light emitting layer is a cylindrical light emitting layer, 筒状発光層の内周内に第一癒が 3置され 且つ  Three first healings are placed in the inner periphery of the cylindrical light emitting layer, and 筒状発光層の外周上に第二電極が 置されている請求項 1記載の発光体。  2. The light emitting body according to claim 1, wherein a second electrode is disposed on the outer periphery of the cylindrical light emitting layer. 3 . カプセル状マイクロ発光軒は、 3. Capsule-shaped micro light eaves 平均直径が 1〜1 0 0 0 mであり、 長さが:!〜 2 0 0 O /^ mであり、 且つ 平均直径と長さとの比 (平均直径:長さ) が 1 : 1〜1 : 5である  The average diameter is 1 ~ 100 000 m, the length is:! ~ 2 000 O / ^ m, and the ratio of the average diameter to the length (average diameter: length) is 1: 1 ~ 1 : 5 略円柱型力プセリ 状を有する請求項 1又は 2に記載の発光体。  The light-emitting body according to claim 1, wherein the light-emitting body has a substantially cylindrical force shape. 4. カプセル状マイク口発光^?は、  4. Capsule microphone mouth light emission? 発光層が有機 E L材料又は無機 E L材料からなる  The light emitting layer is made of organic EL material or inorganic EL material 請求項 1〜 3いずれか記載の発光体。  The light emitter according to any one of claims 1 to 3. 5. カプセル状マイク口発光 は、  5. Capsule-like microphone mouth light emission 第一電極又は第二電極のうちの一方がi®であり、  One of the first electrode or the second electrode is i®, 発光部が、 陰極と発光層との間に配置された電子輸送層及び/又は電子注入層を 備える請求項 1〜 4いずれか記載のフレキシフレ発光体。 The flexible light emitter according to any one of claims 1 to 4, wherein the light emitting section comprises an electron transport layer and / or an electron injection layer disposed between the cathode and the light emitting layer. 6. 力プセル状マイク口発光素子は、 6. The force-pseed microphone mouth light emitting element 第一電極又は第二電極のうちの一方が陽極であり、  One of the first electrode or the second electrode is an anode, 発光部が、 陽極と発光層との間に配置された正孔輸送層及び Z又《IE L注入層を 備える請求項 1〜 5のいずれか記載の発光体。  The light-emitting body according to claim 1, wherein the light-emitting portion includes a hole transport layer and a Z or << IE L injection layer disposed between the anode and the light-emitting layer. 7. フレキシカレ基板にカプセル状マイク口発光素子を収容するための凹部が形成され ている請求項 1〜 6のいずれか記載の発光体。 7. The light emitter according to any one of claims 1 to 6, wherein a recess for accommodating the capsule-like microphone-mouth light-emitting element is formed on the flexure substrate. 8. フレキシブル基板が、 下側基板と上側基板とを重ね^:てなるものであり、  8. The flexible board is made up of the lower board and the upper board. 下側基板にカプセル状マイク口発光素子の下面を収 するための下側収容部が形成 されており、  A lower housing part is formed on the lower substrate to accommodate the lower surface of the capsule-like microphone mouth light emitting element. 上側基板にカプセル状マイク口発光素子の上面を収容するための上側収容部が形成 されており、  An upper housing portion for housing the upper surface of the capsule-shaped microphone-mouth light emitting element is formed on the upper substrate, 凹部が下側収容部と上側収容部とから形成されている請求項 1〜 7のいずれか記載 の発光体。  The light emitter according to any one of claims 1 to 7, wherein the concave portion is formed of a lower housing portion and an upper housing portion. 9. フレキシブル基板に配線を収容するための配線収容部が形成されており、 且つ配線 が Ϊ己線収容部内において可動状態で収容されている請求項 1〜 8のいずれか記載の 発光体。  9. The light emitter according to any one of claims 1 to 8, wherein a wiring accommodating portion for accommodating wiring is formed on the flexible substrate, and the wiring is accommodated in a movable state in the self-insulating wire accommodating portion. 1 0. 複数のカプセル状マイクロ発光素子を支持するための凹部が形成されたフレキシブ ル基板。  1 0. A flexible substrate having recesses for supporting a plurality of capsule-shaped micro light-emitting elements. 1 1. フレキシブル基板が、 下側基板と上側基板とを重ね合せてなるものであり、  1 1. The flexible board is a combination of the lower board and the upper board. 下側基板にカプセル状マイク口発光素子の下面を収容するための下側収容部が形成 されており、  A lower housing portion is formed on the lower substrate for housing the lower surface of the capsule-like microphone-mouth light emitting element, 上側基板にカプセル状マイク口発光素子の上面を収容するための上側収容部が形成 されており、  An upper housing portion for housing the upper surface of the capsule-shaped microphone-mouth light emitting element is formed on the upper substrate, 凹部が 側収容部と上側収容部とから形成されている請求項 1 0記載の基板。 The substrate according to claim 10, wherein the concave portion is formed of a side accommodating portion and an upper accommodating portion. 2. フレキシブル基板に配線を収容するための配線収容部が形成されている請求項 i 0 又は 1 1記載の基板。 2. The substrate according to claim i 0 or 11, wherein a wiring accommodating portion for accommodating wiring is formed in the flexible substrate.
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