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WO2007081775A3 - Brasure sans plomb avec une faible dissolution du cuivre - Google Patents

Brasure sans plomb avec une faible dissolution du cuivre Download PDF

Info

Publication number
WO2007081775A3
WO2007081775A3 PCT/US2007/000226 US2007000226W WO2007081775A3 WO 2007081775 A3 WO2007081775 A3 WO 2007081775A3 US 2007000226 W US2007000226 W US 2007000226W WO 2007081775 A3 WO2007081775 A3 WO 2007081775A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead
free solder
low copper
printed wiring
copper dissolution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/000226
Other languages
English (en)
Other versions
WO2007081775A2 (fr
Inventor
Brian T Deram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/366,523 external-priority patent/US20070172381A1/en
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Priority to EP07716333A priority Critical patent/EP1971699A2/fr
Priority to CN2007800013531A priority patent/CN101356293B/zh
Publication of WO2007081775A2 publication Critical patent/WO2007081775A2/fr
Publication of WO2007081775A3 publication Critical patent/WO2007081775A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne des compositions de brasure sans plomb convenant pour joindre des dispositifs électroniques à des cartes de circuit imprimé, qui comprennent en poids 0,2 à 0,9 % de cuivre, 0,006 à 0,07 % de nickel, 0,03 à 0,08 % de bismuth, moins de 0,5 % d’argent, moins de 0,010 % de phosphore, le complément étant constitué d’étain et d’impuretés inévitables. La composition de brasure selon la présente invention trouve une application particulière dans les machines automatiques de brasure à la vague dans lesquelles la brasure sans plomb conventionnelle dissout le cuivre excédentaire des circuits imprimés et des bornes des composants.
PCT/US2007/000226 2006-01-10 2007-01-05 Brasure sans plomb avec une faible dissolution du cuivre Ceased WO2007081775A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07716333A EP1971699A2 (fr) 2006-01-10 2007-01-05 Brasure sans plomb avec une faible dissolution du cuivre
CN2007800013531A CN101356293B (zh) 2006-01-10 2007-01-05 低铜溶解的无铅焊料

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US75772106P 2006-01-10 2006-01-10
US60/757,721 2006-01-10
US76140006P 2006-01-23 2006-01-23
US60/761,400 2006-01-23
US11/366,523 2006-03-02
US11/366,523 US20070172381A1 (en) 2006-01-23 2006-03-02 Lead-free solder with low copper dissolution

Publications (2)

Publication Number Publication Date
WO2007081775A2 WO2007081775A2 (fr) 2007-07-19
WO2007081775A3 true WO2007081775A3 (fr) 2008-04-10

Family

ID=38164411

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/000226 Ceased WO2007081775A2 (fr) 2006-01-10 2007-01-05 Brasure sans plomb avec une faible dissolution du cuivre

Country Status (3)

Country Link
EP (1) EP1971699A2 (fr)
CN (1) CN101356293B (fr)
WO (1) WO2007081775A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2277657B1 (fr) * 2008-04-23 2012-07-11 Senju Metal Industry Co., Ltd Brasure sans plomb
WO2014002304A1 (fr) * 2012-06-29 2014-01-03 ハリマ化成株式会社 Alliage de soudure, pâte de soudure, et carte de circuits électroniques
CN104395035B (zh) * 2013-05-29 2017-10-20 新日铁住金高新材料株式会社 钎料球以及电子构件
CN105189027B (zh) * 2013-09-11 2018-06-29 千住金属工业株式会社 无铅软钎料、无铅焊料球、使用了该无铅软钎料的焊料接头和具有该焊料接头的半导体电路
EP3385027A1 (fr) 2013-10-31 2018-10-10 Alpha Metals, Inc. Alliages de brasure sans plomb et sans argent
HUE045443T2 (hu) * 2014-08-27 2019-12-30 Heraeus Deutschland Gmbh & Co Kg Forrasztópaszta és eljárás kohéziós kapcsolat kialakítására
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
US20180102464A1 (en) 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
CN107245602B (zh) * 2017-06-09 2019-03-22 升贸科技股份有限公司 无铅锡合金及使用其的镀锡铜线
CN108941969A (zh) * 2018-07-20 2018-12-07 广东中实金属有限公司 一种适用于压敏电阻的无铅焊料及其制备方法
KR102493931B1 (ko) * 2019-05-27 2023-02-06 센주긴조쿠고교 가부시키가이샤 납땜 합금, 솔더 페이스트, 납땜 볼, 솔더 프리폼, 납땜 조인트, 및 회로
CN112756729B (zh) * 2021-01-14 2022-02-18 深圳市兴鸿泰锡业有限公司 一种使用焊锡丝的电子元器件自动焊接方法
CN114464971A (zh) * 2022-02-28 2022-05-10 华为技术有限公司 介质滤波器和电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1088615A2 (fr) * 1999-09-29 2001-04-04 Nec Corporation Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (fr) * 2000-12-11 2002-06-12 Nec Corporation Soudure tendre, traitement de surface de circuits imprimés et procédé de montage d'un composant électronique
US20020134200A1 (en) * 2000-02-24 2002-09-26 Tetsuro Nishimura A control method for copper density in a solder dipping bath
EP1245328A1 (fr) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Pâte à braser sans plomb
EP1273384A1 (fr) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1570166A (zh) * 2004-05-09 2005-01-26 邓和升 无铅焊料合金及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1088615A2 (fr) * 1999-09-29 2001-04-04 Nec Corporation Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant
US20020134200A1 (en) * 2000-02-24 2002-09-26 Tetsuro Nishimura A control method for copper density in a solder dipping bath
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (fr) * 2000-12-11 2002-06-12 Nec Corporation Soudure tendre, traitement de surface de circuits imprimés et procédé de montage d'un composant électronique
EP1245328A1 (fr) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Pâte à braser sans plomb
EP1273384A1 (fr) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금

Also Published As

Publication number Publication date
EP1971699A2 (fr) 2008-09-24
WO2007081775A2 (fr) 2007-07-19
CN101356293A (zh) 2009-01-28
CN101356293B (zh) 2010-12-29

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