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WO2007081775A3 - Lead-free solder with low copper dissolution - Google Patents

Lead-free solder with low copper dissolution Download PDF

Info

Publication number
WO2007081775A3
WO2007081775A3 PCT/US2007/000226 US2007000226W WO2007081775A3 WO 2007081775 A3 WO2007081775 A3 WO 2007081775A3 US 2007000226 W US2007000226 W US 2007000226W WO 2007081775 A3 WO2007081775 A3 WO 2007081775A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead
free solder
low copper
printed wiring
copper dissolution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/000226
Other languages
French (fr)
Other versions
WO2007081775A2 (en
Inventor
Brian T Deram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/366,523 external-priority patent/US20070172381A1/en
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Priority to EP07716333A priority Critical patent/EP1971699A2/en
Priority to CN2007800013531A priority patent/CN101356293B/en
Publication of WO2007081775A2 publication Critical patent/WO2007081775A2/en
Publication of WO2007081775A3 publication Critical patent/WO2007081775A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Lead-free solder compositions suitable for joining electronic devices to printed wiring boards, which comprises by weight 0.2 to 0.9 % copper, 0.006 to 0.07 % nickel, 0.03 to 0.08 % bismuth, less than 0.5 % silver, less than 0.010 % phosphorus, and a balance of tin and inevitable impurities. A solder composition embodying this invention finds particular application in automated wave-soldering machines where conventional lead-free solders dissolve excessive copper from printed wiring circuitry and component terminations.
PCT/US2007/000226 2006-01-10 2007-01-05 Lead-free solder with low copper dissolution Ceased WO2007081775A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07716333A EP1971699A2 (en) 2006-01-10 2007-01-05 Lead-free solder with low copper dissolution
CN2007800013531A CN101356293B (en) 2006-01-10 2007-01-05 Low copper soluble lead-free solder

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US75772106P 2006-01-10 2006-01-10
US60/757,721 2006-01-10
US76140006P 2006-01-23 2006-01-23
US60/761,400 2006-01-23
US11/366,523 US20070172381A1 (en) 2006-01-23 2006-03-02 Lead-free solder with low copper dissolution
US11/366,523 2006-03-02

Publications (2)

Publication Number Publication Date
WO2007081775A2 WO2007081775A2 (en) 2007-07-19
WO2007081775A3 true WO2007081775A3 (en) 2008-04-10

Family

ID=38164411

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/000226 Ceased WO2007081775A2 (en) 2006-01-10 2007-01-05 Lead-free solder with low copper dissolution

Country Status (3)

Country Link
EP (1) EP1971699A2 (en)
CN (1) CN101356293B (en)
WO (1) WO2007081775A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2277657B1 (en) * 2008-04-23 2012-07-11 Senju Metal Industry Co., Ltd Lead-free solder
WO2014002304A1 (en) * 2012-06-29 2014-01-03 ハリマ化成株式会社 Solder alloy, solder paste, and electronic circuit board
US9320152B2 (en) * 2013-05-29 2016-04-19 Nippon Steel & Sumikin Materials Co., Ltd. Solder ball and electronic member
US10434608B2 (en) * 2013-09-11 2019-10-08 Senju Metal Indsutry Co., Ltd. Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint
MX387156B (en) 2013-10-31 2025-03-18 Alpha Metals SILVER-FREE, LEAD-FREE SOLDERING ALLOYS.
HUE045443T2 (en) * 2014-08-27 2019-12-30 Heraeus Deutschland Gmbh & Co Kg Soldering paste and process of cohesive connection
JP6011709B1 (en) * 2015-11-30 2016-10-19 千住金属工業株式会社 Solder alloy
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
CN107245602B (en) * 2017-06-09 2019-03-22 升贸科技股份有限公司 Lead-free tin alloy and tinned copper wire using the same
CN108941969A (en) * 2018-07-20 2018-12-07 广东中实金属有限公司 A kind of lead-free solder and preparation method thereof suitable for varistor
US11377715B2 (en) * 2019-05-27 2022-07-05 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit
CN112756729B (en) * 2021-01-14 2022-02-18 深圳市兴鸿泰锡业有限公司 Automatic welding method for electronic component by using solder wire
CN114464971A (en) * 2022-02-28 2022-05-10 华为技术有限公司 Dielectric filter and electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1088615A2 (en) * 1999-09-29 2001-04-04 Nec Corporation Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (en) * 2000-12-11 2002-06-12 Nec Corporation Solder, method for processing surface of printed wiring board, and method for mounting electronic part
US20020134200A1 (en) * 2000-02-24 2002-09-26 Tetsuro Nishimura A control method for copper density in a solder dipping bath
EP1245328A1 (en) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Lead-free solder paste
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
KR20050030237A (en) * 2004-11-13 2005-03-29 삼성전자주식회사 Pb free solder alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1570166A (en) * 2004-05-09 2005-01-26 邓和升 Lead free solder alloy and its preparation method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1088615A2 (en) * 1999-09-29 2001-04-04 Nec Corporation Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
US20020134200A1 (en) * 2000-02-24 2002-09-26 Tetsuro Nishimura A control method for copper density in a solder dipping bath
US20020051728A1 (en) * 2000-03-14 2002-05-02 Koji Sato Solder ball and method for producing same
EP1213089A1 (en) * 2000-12-11 2002-06-12 Nec Corporation Solder, method for processing surface of printed wiring board, and method for mounting electronic part
EP1245328A1 (en) * 2001-03-01 2002-10-02 Senju Metal Industry Co., Ltd. Lead-free solder paste
EP1273384A1 (en) * 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Lead-free solder alloy
KR20050030237A (en) * 2004-11-13 2005-03-29 삼성전자주식회사 Pb free solder alloy

Also Published As

Publication number Publication date
EP1971699A2 (en) 2008-09-24
CN101356293B (en) 2010-12-29
CN101356293A (en) 2009-01-28
WO2007081775A2 (en) 2007-07-19

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