|
US7821023B2
(en)
|
2005-01-10 |
2010-10-26 |
Cree, Inc. |
Solid state lighting component
|
|
US9793247B2
(en)
|
2005-01-10 |
2017-10-17 |
Cree, Inc. |
Solid state lighting component
|
|
US9070850B2
(en)
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
|
US7355276B1
(en)
*
|
2005-03-11 |
2008-04-08 |
Maxtor Corporation |
Thermally-enhanced circuit assembly
|
|
JP5059739B2
(ja)
*
|
2005-03-11 |
2012-10-31 |
ソウル セミコンダクター カンパニー リミテッド |
直列接続された発光セルのアレイを有する発光ダイオードパッケージ
|
|
US9335006B2
(en)
|
2006-04-18 |
2016-05-10 |
Cree, Inc. |
Saturated yellow phosphor converted LED and blue converted red LED
|
|
JP4863203B2
(ja)
*
|
2006-04-28 |
2012-01-25 |
スタンレー電気株式会社 |
半導体発光装置
|
|
EP2034526B1
(en)
|
2006-06-02 |
2019-12-25 |
Hitachi Chemical Company, Ltd. |
Package for mounting optical semiconductor element and optical semiconductor device employing the same
|
|
US10295147B2
(en)
|
2006-11-09 |
2019-05-21 |
Cree, Inc. |
LED array and method for fabricating same
|
|
US20080205057A1
(en)
*
|
2007-02-23 |
2008-08-28 |
Frontend Analog And Digital Technology Corporation |
Light source device assembly
|
|
EP2434554B1
(en)
*
|
2007-08-03 |
2018-05-30 |
Panasonic Intellectual Property Management Co., Ltd. |
Wavelength-converted light-emitting device with uniform emission
|
|
KR100931927B1
(ko)
*
|
2007-12-26 |
2009-12-15 |
알티전자 주식회사 |
발광 다이오드 패키지 모듈
|
|
KR100969145B1
(ko)
*
|
2008-01-28 |
2010-07-08 |
알티전자 주식회사 |
발광 다이오드조명 모듈 및 그 제조방법
|
|
US8203167B2
(en)
*
|
2008-03-25 |
2012-06-19 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
|
|
US8525214B2
(en)
|
2008-03-25 |
2013-09-03 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader with thermal via
|
|
US20100181594A1
(en)
*
|
2008-03-25 |
2010-07-22 |
Lin Charles W C |
Semiconductor chip assembly with post/base heat spreader and cavity over post
|
|
US20090284932A1
(en)
*
|
2008-03-25 |
2009-11-19 |
Bridge Semiconductor Corporation |
Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
|
|
US20110278638A1
(en)
|
2008-03-25 |
2011-11-17 |
Lin Charles W C |
Semiconductor chip assembly with post/dielectric/post heat spreader
|
|
US8129742B2
(en)
*
|
2008-03-25 |
2012-03-06 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and plated through-hole
|
|
US8212279B2
(en)
*
|
2008-03-25 |
2012-07-03 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader, signal post and cavity
|
|
US20110163348A1
(en)
*
|
2008-03-25 |
2011-07-07 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump
|
|
US20110156090A1
(en)
*
|
2008-03-25 |
2011-06-30 |
Lin Charles W C |
Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
|
|
US8067784B2
(en)
*
|
2008-03-25 |
2011-11-29 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and substrate
|
|
US8354688B2
(en)
|
2008-03-25 |
2013-01-15 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
|
|
US20100052005A1
(en)
*
|
2008-03-25 |
2010-03-04 |
Lin Charles W C |
Semiconductor chip assembly with post/base heat spreader and conductive trace
|
|
US20100072511A1
(en)
*
|
2008-03-25 |
2010-03-25 |
Lin Charles W C |
Semiconductor chip assembly with copper/aluminum post/base heat spreader
|
|
US8232576B1
(en)
|
2008-03-25 |
2012-07-31 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and ceramic block in post
|
|
US8310043B2
(en)
*
|
2008-03-25 |
2012-11-13 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader with ESD protection layer
|
|
US8269336B2
(en)
*
|
2008-03-25 |
2012-09-18 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and signal post
|
|
US8415703B2
(en)
*
|
2008-03-25 |
2013-04-09 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
|
|
US8329510B2
(en)
*
|
2008-03-25 |
2012-12-11 |
Bridge Semiconductor Corporation |
Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
|
|
US8314438B2
(en)
*
|
2008-03-25 |
2012-11-20 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with bump/base heat spreader and cavity in bump
|
|
US8288792B2
(en)
*
|
2008-03-25 |
2012-10-16 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base/post heat spreader
|
|
US8193556B2
(en)
*
|
2008-03-25 |
2012-06-05 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and cavity in post
|
|
US8531024B2
(en)
*
|
2008-03-25 |
2013-09-10 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
|
|
US8378372B2
(en)
*
|
2008-03-25 |
2013-02-19 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
|
|
US8324723B2
(en)
*
|
2008-03-25 |
2012-12-04 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
|
|
US8207553B2
(en)
*
|
2008-03-25 |
2012-06-26 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with base heat spreader and cavity in base
|
|
US8148747B2
(en)
*
|
2008-03-25 |
2012-04-03 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with post/base/cap heat spreader
|
|
EP2273568B1
(en)
*
|
2008-04-30 |
2013-05-29 |
Zhejiang Manelux Lighting Co., Ltd. |
White light led and lamp of the white light led
|
|
JP5155890B2
(ja)
|
2008-06-12 |
2013-03-06 |
ルネサスエレクトロニクス株式会社 |
半導体装置およびその製造方法
|
|
WO2010007781A1
(ja)
*
|
2008-07-17 |
2010-01-21 |
株式会社 東芝 |
発光装置とそれを用いたバックライト、液晶表示装置および照明装置
|
|
JP5232555B2
(ja)
*
|
2008-07-23 |
2013-07-10 |
スタンレー電気株式会社 |
光半導体装置モジュール
|
|
TWI478370B
(zh)
|
2008-08-29 |
2015-03-21 |
晶元光電股份有限公司 |
一具有波長轉換結構之半導體發光裝置及其封裝結構
|
|
US9425172B2
(en)
|
2008-10-24 |
2016-08-23 |
Cree, Inc. |
Light emitter array
|
|
JP4780203B2
(ja)
*
|
2009-02-10 |
2011-09-28 |
日亜化学工業株式会社 |
半導体発光装置
|
|
KR101047603B1
(ko)
*
|
2009-03-10 |
2011-07-07 |
엘지이노텍 주식회사 |
발광 소자 패키지 및 그 제조방법
|
|
US8610156B2
(en)
|
2009-03-10 |
2013-12-17 |
Lg Innotek Co., Ltd. |
Light emitting device package
|
|
KR101037789B1
(ko)
*
|
2009-04-22 |
2011-05-27 |
주식회사 엠디티 |
도전부재가 도포되어 일체화된 절연재와 금속 하우징을 구비하는 발광다이오드 장착용 패키지
|
|
WO2010150824A1
(ja)
*
|
2009-06-24 |
2010-12-29 |
古河電気工業株式会社 |
光半導体装置用リードフレーム、光半導体装置用リードフレームの製造方法、および光半導体装置
|
|
US20110013403A1
(en)
*
|
2009-07-15 |
2011-01-20 |
Wen-Sung Hu |
Illumination-Improving Structure for LED or SMD LED lights
|
|
US8324653B1
(en)
|
2009-08-06 |
2012-12-04 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with ceramic/metal substrate
|
|
KR101168316B1
(ko)
*
|
2009-12-01 |
2012-07-25 |
삼성전자주식회사 |
발광다이오드 검사 장치
|
|
KR100986571B1
(ko)
*
|
2010-02-04 |
2010-10-07 |
엘지이노텍 주식회사 |
발광소자 패키지 및 그 제조방법
|
|
US20110225818A1
(en)
*
|
2010-03-19 |
2011-09-22 |
Shih-Bin Chiu |
Method of manufacturing an led illuminator device
|
|
TWI403663B
(zh)
*
|
2010-07-20 |
2013-08-01 |
Foxsemicon Integrated Tech Inc |
Led發光裝置
|
|
US8371715B2
(en)
*
|
2010-09-21 |
2013-02-12 |
Catcher Technology Co., Ltd. |
LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor
|
|
US9490235B2
(en)
|
2010-11-22 |
2016-11-08 |
Cree, Inc. |
Light emitting devices, systems, and methods
|
|
US9300062B2
(en)
|
2010-11-22 |
2016-03-29 |
Cree, Inc. |
Attachment devices and methods for light emitting devices
|
|
TW201228508A
(en)
*
|
2010-12-29 |
2012-07-01 |
Bridge Semiconductor Corp |
Mobile electronic device containing heat dissipative flexible circuit board structure and manufacturing method thereof
|
|
US9786811B2
(en)
|
2011-02-04 |
2017-10-10 |
Cree, Inc. |
Tilted emission LED array
|
|
US10842016B2
(en)
|
2011-07-06 |
2020-11-17 |
Cree, Inc. |
Compact optically efficient solid state light source with integrated thermal management
|
|
CN102800798B
(zh)
*
|
2011-10-26 |
2016-06-08 |
清华大学 |
一种led封装结构及其封装方法
|
|
CN104081112B
(zh)
|
2011-11-07 |
2016-03-16 |
克利公司 |
高电压阵列发光二极管(led)器件、设备和方法
|
|
US10043960B2
(en)
*
|
2011-11-15 |
2018-08-07 |
Cree, Inc. |
Light emitting diode (LED) packages and related methods
|
|
JP2013131744A
(ja)
*
|
2011-11-25 |
2013-07-04 |
Citizen Electronics Co Ltd |
発光素子の実装方法及び発光素子を有する発光装置
|
|
US9735198B2
(en)
|
2012-03-30 |
2017-08-15 |
Cree, Inc. |
Substrate based light emitter devices, components, and related methods
|
|
US10134961B2
(en)
|
2012-03-30 |
2018-11-20 |
Cree, Inc. |
Submount based surface mount device (SMD) light emitter components and methods
|
|
DE102012102847A1
(de)
|
2012-04-02 |
2013-10-02 |
Osram Opto Semiconductors Gmbh |
Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
|
|
CN102637804A
(zh)
*
|
2012-04-23 |
2012-08-15 |
木林森股份有限公司 |
一种无邦定led芯片倒装结构
|
|
KR101456921B1
(ko)
*
|
2012-06-01 |
2014-11-03 |
주식회사티티엘 |
세라믹 pcb를 이용한 led 광원모듈 및 그 제조방법
|
|
AT513780B1
(de)
*
|
2012-12-21 |
2015-02-15 |
Hella Fahrzeugteile Austria Gmbh |
Kühlvorrichtung für eine LED
|
|
KR102019830B1
(ko)
*
|
2013-01-30 |
2019-09-09 |
엘지이노텍 주식회사 |
발광소자 패키지
|
|
US9316382B2
(en)
*
|
2013-01-31 |
2016-04-19 |
Cree, Inc. |
Connector devices, systems, and related methods for connecting light emitting diode (LED) modules
|
|
KR102099439B1
(ko)
*
|
2013-10-08 |
2020-04-09 |
엘지이노텍 주식회사 |
발광 소자 및 이를 포함하는 발광 소자 패키지
|
|
KR102098594B1
(ko)
*
|
2014-03-14 |
2020-04-08 |
삼성전자주식회사 |
Led 패키지
|
|
JP6519311B2
(ja)
|
2014-06-27 |
2019-05-29 |
日亜化学工業株式会社 |
発光装置
|
|
JP6256700B2
(ja)
*
|
2014-11-11 |
2018-01-10 |
豊田合成株式会社 |
発光装置
|
|
JP6501606B2
(ja)
*
|
2015-05-19 |
2019-04-17 |
ルネサスエレクトロニクス株式会社 |
半導体装置
|
|
CN104900638B
(zh)
*
|
2015-05-27 |
2017-10-24 |
深圳市华星光电技术有限公司 |
发光元件组装结构
|
|
WO2017017885A1
(ja)
*
|
2015-07-24 |
2017-02-02 |
日本電気株式会社 |
実装構造体、実装構造体の製造方法、無線機
|
|
JP2017135253A
(ja)
*
|
2016-01-27 |
2017-08-03 |
オムロン株式会社 |
発光装置、および発光装置の製造方法
|
|
USD823492S1
(en)
|
2016-10-04 |
2018-07-17 |
Cree, Inc. |
Light emitting device
|
|
JP7444537B2
(ja)
*
|
2018-12-27 |
2024-03-06 |
デンカ株式会社 |
蛍光体基板の製造方法、発光基板の製造方法及び照明装置の製造方法
|
|
KR102762977B1
(ko)
*
|
2020-01-30 |
2025-02-10 |
삼성전자주식회사 |
금속 베이스 배선 기판 및 전자소자 모듈
|
|
KR102248022B1
(ko)
*
|
2020-07-13 |
2021-05-04 |
(주)포인트엔지니어링 |
광소자 패키지 기판 및 이를 포함하는 광소자 패키지
|
|
JP7631961B2
(ja)
*
|
2021-03-24 |
2025-02-19 |
富士フイルムビジネスイノベーション株式会社 |
光計測装置
|