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WO2006095516A1 - Composition de resine durcissable, preimpregne et materiau composite l’utilisant - Google Patents

Composition de resine durcissable, preimpregne et materiau composite l’utilisant Download PDF

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Publication number
WO2006095516A1
WO2006095516A1 PCT/JP2006/301835 JP2006301835W WO2006095516A1 WO 2006095516 A1 WO2006095516 A1 WO 2006095516A1 JP 2006301835 W JP2006301835 W JP 2006301835W WO 2006095516 A1 WO2006095516 A1 WO 2006095516A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin
dicyclopentagen
composition
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/301835
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English (en)
Japanese (ja)
Inventor
Kazuhiro Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Publication of WO2006095516A1 publication Critical patent/WO2006095516A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • the present invention relates to a curable resin composition, a pre-preda, and a composite material using the same.
  • Epoxy resin is used for adhesives, paints, electrical insulation materials, aircraft structural materials and the like because of its excellent mechanical, electrical, and chemical properties.
  • a pre-preda in which carbon fiber is impregnated with epoxy resin is known.
  • the greaves used in this prepreg are usually required to have high toughness and heat resistance.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2002-212320
  • an object of the present invention is to provide a curable resin composition from which a cured product having excellent heat resistance and toughness can be obtained.
  • the present invention provides the following (1) to (8).
  • Epoxy resin (B) which is liquid at room temperature
  • thermoplastic resin composition according to any one of the above (1) to (3), which is a polyether sulfone.
  • thermoplastic resin (D) is added to a total of 100 parts by mass of the dicyclopentagen type epoxy resin (A) and the epoxy resin resin (B) that is liquid at room temperature.
  • the curable resin composition according to any one of (1) to (4), wherein 70 parts by mass is contained.
  • the cured product obtained by heating at 180 ° C. for 2 hours has a glass transition temperature of 150 ° C. or higher, and a compressive strength after impact of 210 MPa or higher at the time of impact of 25 J. Composite material.
  • the curable resin composition of the present invention provides a cured product having excellent heat resistance and toughness.
  • the curable resin composition of the present invention includes a dicyclopentagen type epoxy resin (A), an epoxy resin (B) that is liquid at room temperature, and a diaminodiphenol- A curable resin composition containing lusulfone (C) and a thermoplastic resin (D) soluble in epoxy resin.
  • A dicyclopentagen type epoxy resin
  • B epoxy resin
  • D thermoplastic resin
  • the dicyclopentagen-type epoxy resin (A) used in the composition of the present invention is not particularly limited as long as it is a compound having at least two epoxy groups and a dicyclopentagen skeleton in one molecule. However, it is preferably a bicyclofunctional dicyclopentagen type epoxy resin. When the dicyclopentagen type epoxy resin (A) is bifunctional or higher, the cured product of the resulting composition is excellent in heat resistance and toughness. In particular, the dicyclopentagen type epoxy resin (A) is more preferably a bifunctional trifunctional one having a 2-functionality.
  • dicyclopentagen type epoxy resin (A) examples include compounds represented by any of the following formulas (1) to (3). These may be used alone or in combination of two or more.
  • the point power that the compound represented by the following formula (1) is excellent in heat resistance is also preferable.
  • n is an integer of 0 to 0, preferably 0 to 5 forces, and more preferably 1 to 3.
  • the epoxy equivalent of the dicyclopentagen-type epoxy resin (A) is preferably 100 to 500. When the epoxy equivalent force is within this range, the cured product of the resulting composition is excellent in toughness and heat resistance. In view of these characteristics, the epoxy equivalent is more preferably a force of 100 to 400, and more preferably a force of 200 to 300.
  • the content of the dicyclopentagen-type epoxy resin (A) is 100 parts by mass in total of the dicyclopentagen-type epoxy resin (A) and the epoxy resin resin (B) that is liquid at room temperature. The amount is preferably 5 to 50 parts by mass. Within this range, the viscosity of the resulting composition does not become too high, and the cured product has excellent heat resistance and toughness. From the point which is excellent by these characteristics, 20-30 mass parts which 10-40 mass parts are more preferable are still more preferable.
  • the dicyclopentagen-type epoxy resin (A) can improve toughness while maintaining heat resistance. This is presumably because the dicyclopentagen type epoxy resin (A) is excellent in heat resistance due to its rigid skeleton and increases the molecular weight between the cross-linking points of the cured product.
  • the epoxy resin (B) used in the composition of the present invention is not particularly limited as long as it is an epoxy resin that is liquid at room temperature.
  • compounds represented by the following formulas (4) to (7) bisphenol A, bisphenol F, bisphenol S, hexahydrobisphenol A, tetramethylbisphenol A, pyro Polyhydric phenols such as catechol, resorcinol, cresol mononovolak, tetrabromobisphenol A, trihydroxybiphenyl, bisresorenosol, bisphenolhexafluoroacetone, tetramethylbisphenol F, bixylenol, dihydroxynaphthalene, and epoxy Glycidyl ether type obtained by reaction with chlorohydrin; glycerin, neopentyl glycol, ethylene glycolol, propylene glycol, butylene glycol, hexylene glycol, polyethylene glycol, polypropylene glycol Polyglycidyl
  • the epoxy equivalent of the epoxy resin (soot) is preferably 100 to 500 force S. When the epoxy equivalent is within this range, the heat resistance is good. Because of these superior properties, the epoxy equivalent is more preferable than 100-300 power ⁇ , 100-200 power more preferable! / ,.
  • the power required for the matrix resin of the prepredder to have a low viscosity contains the above-described epoxy resin (foam), so that it can be suitably used as a matrix resin for the prepredder. Viscosity of
  • the diaminodiphenyl sulfone (C) used in the composition of the present invention is the above dicyclopente. Used as a curing agent for the tagen type epoxy resin (A) and the epoxy resin (B). Since the composition of the present invention uses diaminodiphenyl sulfone (C) as a curing agent, a cured product having excellent heat resistance and mechanical strength can be obtained.
  • the content of the diaminodiphenyl sulfone (C) is such that the molar ratio of all epoxy groups to amino groups (epoxy group Z amino group) in the composition is 1.0 / 0.5 to 1.0 / 1. An amount of 5 is preferred, and 1.0 / 0. 8 to 1.0 / 1.
  • thermoplastic resin (D) used in the composition of the present invention is not particularly limited as long as it is soluble in the epoxy resin contained in the composition of the present invention.
  • the thermoplastic resin is a resin having a soft low point because the fluidity of the resin increases when heated.
  • Specific examples of the thermoplastic resin (D) include polyethersulfone, polyamide resin, terpene phenol resin, terpene resin, and hydrogenated stone oil resin and rosin to which a hydroxyl group is bonded.
  • Resin, rosin ester-based resin and its alkyl-modified products, polyol-modified and alkylphenol-modified xylene resin, novolac-type phenol resin, coumarone resin, styrene resin, polyimide, polyetherimide, polyetherketone, Polyetheretherketone, nylon and the like can be mentioned. These may be used alone or in combination of two or more.
  • polyethersulfone strength, compatibility with epoxy resin, and high heat resistance are also preferable.
  • the weight average molecular weight of the thermoplastic rosin (D) is preferably 1,000-100,000. When the molecular weight is within this range, the cured product obtained has excellent toughness, and the viscosity of the composition does not become too high. In view of these characteristics, the weight average molecular weight is preferred to ⁇ 5,000 to 50,000 force ⁇ , 10,000 to 30,000 force ⁇ more preferred! / ,.
  • the content of the thermoplastic resin (D) is 100 parts by mass with respect to a total of 100 parts by mass of the dicyclopentagen-type epoxy resin ( ⁇ ) and the epoxy resin (liquid) that is liquid at room temperature.
  • the amount is preferably 5 to 70 parts by mass.
  • the cured product of the resulting composition has excellent toughness, and is excellent in heat resistance and water resistance. From the point which is excellent by these characteristics, 10-30 mass parts is more preferable, and 10-30 mass parts is still more preferable.
  • the thermoplastic resin (D) is considered to improve the toughness of the cured product of the composition of the present invention because the tensile elongation is usually several tens of times that of the cured epoxy product.
  • engineering plastics such as polyethersulfone, polyimide, polyetherimide, polyetherketone, polyetheretherketone, and nylon, the heat resistance can be further improved.
  • composition of the present invention may contain a curing catalyst, if necessary.
  • the curing catalyst include imidazoles such as BC13-amine complex, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, 2 , 4, 6-tris (dimethylaminomethyl) phenol, tertiary amines such as 1,8-diaza-bicyclo (5, 4, 0) undecene-7, phosphines such as triphenylphosphine, octyl Examples thereof include metal compounds such as tin oxide and quaternary phosphonium salts.
  • composition of the present invention is optionally filled with a filler, a reaction retarding agent, an anti-aging agent, an antioxidant, a pigment (dye), a plasticizer, as long as the object of the present invention is not impaired.
  • a filler a reaction retarding agent, an anti-aging agent, an antioxidant, a pigment (dye), a plasticizer, as long as the object of the present invention is not impaired.
  • a reaction retarding agent such as thixotropic agents, ultraviolet absorbers, flame retardants, solvents, surfactants (including leveling agents), dispersants, dehydrating agents, adhesion promoters, antistatic agents, etc. be able to.
  • Examples of the filler include organic or inorganic fillers of various shapes. Specifically, for example, fumed silica, calcined silica, precipitated silica, ground silica, fused silica; caustic earth; iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide; calcium carbonate, magnesium carbonate, zinc carbonate Waxy clay, kaolin clay, calcined clay; carbon black; these fatty acid treated products, oxalic acid treated products, urethane compound treated products, and fatty acid ester treated products.
  • reaction retarding agent examples include alcohol compounds.
  • antiaging agent examples include hindered phenol compounds.
  • antioxidant examples include butylhydroxytoluene (BHT), butyhydroxydiamine (BHA) and the like.
  • plasticizer examples include dioctyl phthalate (DOP) and dibutyl phthalate (DBP); dioctyl adipate, isodecyl succinate; diethylene glycol dibenzoate, pentaerythritol ester; butyl oleate, Examples include methyl acetyl ricinoleate; tricresyl phosphate, trioctyl phosphate; propylene glycol adipate polyester, butylene glycol adipate polyester, and the like. These may be used alone or as a mixture of two or more.
  • the wrinkle modification imparting agent examples include aerosil (manufactured by Nippon Aerosil Co., Ltd.), disparon (manufactured by Tsubakimoto Kosei Co., Ltd.), and the like.
  • adhesion-imparting agent examples include terpene resin, phenol resin, terpene resin, rosin resin, and xylene resin.
  • flame retardant examples include, for example, black mouth alkyl phosphate, dimethyl 'methyl phosphonate, bromine' phosphorus compound, ammonium polyphosphate, neopentyl bromide polyether, brominated polyether. Etc.
  • antistatic agent generally include quaternary ammonium salts; hydrophilic compounds such as polydalicol and ethylene oxide derivatives.
  • the method for producing the composition of the present invention is not particularly limited! However, for example, the above-mentioned essential components and optional components are placed in a reaction vessel, and the mixture is mixed in a mixing mixer or the like under reduced pressure. A method of sufficiently kneading using a machine can be used.
  • composition of the present invention can be used as a one-component curable resin composition containing the above-described essential components, a curing catalyst blended as necessary, and various additives.
  • the composition of the present invention has excellent heat resistance and toughness by containing dicyclopentagen type epoxy resin (A) and thermoplastic resin (D) soluble in epoxy resin. A cured product is obtained.
  • the epoxy resin (B) which is liquid at room temperature, each component contained in the composition of the present invention can be uniformly dispersed, the increase in viscosity can be suppressed, and the matrix resin for prepreg can be used. A suitably used low-viscosity composition is obtained.
  • composition of the present invention is used in a wide range of applications by taking advantage of the properties of the composition of the present invention. It is done. Examples thereof include adhesives, sealants, paints, coating agents, inks, toners, sealants, and pre-preda matrix grease. In particular, it is suitably used for matrix resin of prepredder.
  • the pre-preda of the present invention contains the above-described composition of the present invention and carbon fiber.
  • the carbon fiber is not particularly limited, and for example, a fiber woven fabric or a long fiber can be used.
  • the content of the carbon fibers preferably 30 to 70% by volume, based on the total volume Puripureda tool 50-65 volume 0/0 is more preferable.
  • the pre-preda of the present invention may contain, in addition to carbon fibers, aramid fibers such as Kepler, and reinforcing fibers such as glass fibers.
  • the pre-preda of the present invention can be produced by a conventionally known method. Specifically, it is produced by impregnating a carbon fiber with the composition of the present invention. When impregnating, a hot melt method or a wet method can be used. In the case of producing a pre-preda by a wet method, the composition of the present invention is dissolved in a solvent, a varnish is prepared, and carbon fiber is impregnated with the varnish.
  • ketone solvents such as methyl ethyl ketone (MEK) are preferred.
  • the amount of the solvent used is preferably 1 to 20 parts by mass with respect to 100 parts by mass of the composition of the present invention because the drying process can be shortened. Further, when the composition of the present invention has a relatively low viscosity, a pre-preda can be produced by impregnating the composition of the present invention into carbon fiber as it is.
  • the pre-preda of the present invention provides a composite material having excellent heat resistance and toughness.
  • the composite material of the present invention is a cured product of the above-described pre-preda of the present invention.
  • the composite material of the present invention can be obtained by heat curing the pre-preda of the present invention.
  • the composite material of the present invention can be obtained by heat-heating the prepredder of the present invention at about 150 to 200 ° C. for about 2 to 5 hours.
  • the composite material of the present invention has a glass transition temperature force S150 ° C or higher of a cured product obtained by heating at 180 ° C for 2 hours, and a compressive strength after impact of 210MPa or higher at the time of impact of 25J. Is preferred.
  • the compressive strength after impact is JIS K7089-1996. Means the value measured according to
  • the composite material of the present invention has excellent heat resistance and toughness. Therefore, the composite material of the present invention can be used for various molding materials by virtue of these excellent characteristics, and can be suitably used for structural materials such as sports equipment, aircraft and automobiles.
  • Example 1 The composite material of the present invention has excellent heat resistance and toughness. Therefore, the composite material of the present invention can be used for various molding materials by virtue of these excellent characteristics, and can be suitably used for structural materials such as sports equipment, aircraft and automobiles.
  • composition obtained was cured at 180 ° C. for 2 hours to obtain test pieces.
  • thermomechanical measurement device TMA4000S, manufactured by Bruker AEX Co., Ltd.
  • each test piece obtained was heated from room temperature to 250 ° C at a heating rate of 10 ° CZ under the condition of a load of 2g.
  • the transition temperature (° C) was measured. The results are shown in Table 1.
  • each composition obtained was applied onto release paper using a reverse roll coater to prepare a resin film.
  • two sheets of this resin film are stacked so as to sandwich both sides of carbon fiber (Torre force (registered trademark) T700SC, manufactured by Toray Industries, Inc., tensile elastic modulus 230GPa) arranged in one direction in a sheet shape. Combined.
  • the carbon fiber is impregnated with resin by heating and pressurizing at 110 ° C, 0.3 to 0.5 MPa, the basis weight of the carbon fiber is 196 ⁇ 5 gZcm 2 , and the weight fraction of the matrix resin is 34%.
  • a directional pre-preda was obtained.
  • the toughness was evaluated by the following method using the obtained prepredder.
  • Dicyclopentagen type epoxy resin (A) (compound represented by the following formula (1)): HP-7200, manufactured by Dainippon Ink & Chemicals, Inc.
  • Epoxy resin (B-1) (compound represented by the following formula (4)): HP-4032, manufactured by Dainippon Ink & Chemicals, Inc.
  • Epoxy resin (B-2) (compound represented by the following formula (5)): ELM-434, manufactured by Sumitomo Chemical Co., Ltd.
  • Epoxy resin (B-3) (compound represented by the following formula (6)): ELM-100, manufactured by Sumitomo Chemical Co., Ltd.
  • Epoxy resin (B-4) (compound represented by formula (7) below): MY-0500, manufactured by Huntsman Advanced Materials
  • Epoxy resin (B-5) (compound represented by the following formula (8)): EXA-4700, manufactured by Dainippon Ink & Chemicals, Inc.
  • Epoxy resin (B-6) (compound represented by the following formula (9)): YX-4000, manufactured by Japan Epoxy Resin Co., Ltd.
  • Thermoplastic resin (D) (compound represented by the following formula (10)): Polyethersulfone, manufactured by Sumitomo Chemical Co., Ltd.
  • C-1 (compound represented by the following formula (11)): 4, 4' — Diaminodiphenylsulfone, manufactured by Sumitomo Chemical Co., Ltd.
  • n is an integer of 0 to 10
  • R is an alkyl group having 1 to 5 carbon atoms such as a methyl group and an ethyl group.
  • M is an integer from 50 to 200.
  • Comparative Example 1 and Comparative Example 2 have excellent heat resistance, but their toughness was not sufficient.
  • Examples 1 and 2 have almost the same heat resistance as Comparative Examples 1 and 2, and the toughness is extremely high. It was very good.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

La présente invention décrit une composition de résine durcissable qui permet d’obtenir un produit durci ayant une résistance à la chaleur et une dureté excellentes. L’invention décrit en particulier une composition de résine durcissable contenant une résine époxydique de type dicyclopentadiène (A), une résine époxydique (B) qui est à l’état liquide à température ambiante, un diaminodiphénylsulfone (C) et une résine thermoplastique (D) qui est soluble dans une résine époxydique.
PCT/JP2006/301835 2005-03-09 2006-02-03 Composition de resine durcissable, preimpregne et materiau composite l’utilisant Ceased WO2006095516A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-065157 2005-03-09
JP2005065157A JP2006249171A (ja) 2005-03-09 2005-03-09 硬化性樹脂組成物およびプリプレグならびにこれを用いた複合材料

Publications (1)

Publication Number Publication Date
WO2006095516A1 true WO2006095516A1 (fr) 2006-09-14

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WO (1) WO2006095516A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013255A (ja) * 2007-07-03 2009-01-22 Mitsubishi Rayon Co Ltd 繊維強化複合材料用樹脂組成物およびその製造方法ならびに複合材料中間体
WO2012051045A2 (fr) 2010-10-12 2012-04-19 Hexcel Corporation Amélioration de la résistance aux solvants de résines époxy durcies avec une polyéthersulfone
WO2021131740A1 (fr) * 2019-12-26 2021-07-01 東レ株式会社 Préimprégné

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6060479B2 (ja) * 2011-11-24 2017-01-18 Jsr株式会社 基材の処理方法、半導体装置および仮固定用組成物
JP7307668B2 (ja) * 2019-12-10 2023-07-12 日本化薬株式会社 エポキシ樹脂、およびエポキシ樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236421A (ja) * 1985-08-12 1987-02-17 Toray Ind Inc プリプレグ用エポキシ樹脂組成物
JPH01135858A (ja) * 1987-11-20 1989-05-29 Sanyo Kokusaku Pulp Co Ltd 繊維強化用エポキシ樹脂組成物
WO1996017006A1 (fr) * 1994-12-02 1996-06-06 Toray Industries, Inc. Preimpregne et materiau composite renforces par des fibres
WO2003040206A1 (fr) * 2001-11-07 2003-05-15 Toray Industries, Inc. Compositions de resine epoxy pour materiaux composites a fibres, procede de production de ces materiaux, et materiaux composites a fibres
JP2004277481A (ja) * 2003-03-13 2004-10-07 Toho Tenax Co Ltd エポキシ樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236421A (ja) * 1985-08-12 1987-02-17 Toray Ind Inc プリプレグ用エポキシ樹脂組成物
JPH01135858A (ja) * 1987-11-20 1989-05-29 Sanyo Kokusaku Pulp Co Ltd 繊維強化用エポキシ樹脂組成物
WO1996017006A1 (fr) * 1994-12-02 1996-06-06 Toray Industries, Inc. Preimpregne et materiau composite renforces par des fibres
WO2003040206A1 (fr) * 2001-11-07 2003-05-15 Toray Industries, Inc. Compositions de resine epoxy pour materiaux composites a fibres, procede de production de ces materiaux, et materiaux composites a fibres
JP2004277481A (ja) * 2003-03-13 2004-10-07 Toho Tenax Co Ltd エポキシ樹脂組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013255A (ja) * 2007-07-03 2009-01-22 Mitsubishi Rayon Co Ltd 繊維強化複合材料用樹脂組成物およびその製造方法ならびに複合材料中間体
WO2012051045A2 (fr) 2010-10-12 2012-04-19 Hexcel Corporation Amélioration de la résistance aux solvants de résines époxy durcies avec une polyéthersulfone
EP2627710A2 (fr) 2010-10-12 2013-08-21 Hexcel Corporation Amélioration de la résistance aux solvants de résines époxy durcies avec une polyéthersulfone
JP2013538932A (ja) * 2010-10-12 2013-10-17 ヘクセル コーポレイション ポリエーテルスルホンで高靭化させたエポキシ樹脂の耐溶媒性の改善
US8686069B2 (en) 2010-10-12 2014-04-01 Hexcel Corporation Solvent resistance of epoxy resins toughened with polyethersulfone
WO2021131740A1 (fr) * 2019-12-26 2021-07-01 東レ株式会社 Préimprégné
JPWO2021131740A1 (fr) * 2019-12-26 2021-07-01
JP7596790B2 (ja) 2019-12-26 2024-12-10 東レ株式会社 プリプレグ

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