WO2006068156A1 - Kelvin probe - Google Patents

Abstract

There has been a problem that it is impossible to conduct high-accuracy inspection because of the measurement error of an electrical inspection or an emission inspection due to the contact resistance of the oxide film or the modified layer on the surface of the connection pad of an object to be measured. A Kevin probe having an end tapered by electrical discharge machining is fabricated by joining a conductive first substrate, a second substrate, and a filmy insulator by thermocompression bonding. Since the end of the Kelvin probe is tapered, the Kelvin probe can be used for inspection of a microfabricated device. By forming a probe or the Kelvin probe to have a polygonal cross-section, the shape of the end can be sharper and the oxide film or the modified layer on the surface of the connection pad of the object to be measured can be removed.. At least one side of the polygon may be curved, a sharp vertex of the polygon is brought into contact with the connection pad of the object.

Description

 Specification

 Kenolevin probe

 Technical field

 [0001] Light-emitting diode (LED) · relates to a Kelvin probe for electrical inspection and light-emission inspection of a semiconductor laser (LD) and a method for manufacturing the same.

 Background art

 In electrical inspection of semiconductor wafers and electronic components, or light emission inspection of light-emitting diodes, electrical connection is performed by pressing a probe against a connection pad of an object to be measured. In these examinations, Kelvin probes that can improve the measurement accuracy by using two measuring elements as a pair are also used. In electrical inspection and light emission inspection, the problem is contact resistance generated at the contact portion between the probe and the connection pad of the object to be measured. Causes of contact resistance include contact potential difference due to contact of dissimilar metals, resistance due to oxide film attached to the surface of the connection pad of the object to be measured, and minute uneven portions. Commonly used as connection pads include aluminum (A1), copper (Cu), and gold (Au). However, when aluminum and copper are oxidized and soon oxidized, a strong oxide film (A10, CuO, Cu0) is formed. In the case of gold, the surface is free of oxides and nitrides.

2 3 2

 A quality layer is formed. Therefore, in order to improve the electrical contact between the probe and the connection pad of the object to be measured, it is necessary to remove the oxide film or the deteriorated layer so that the probe does not contact the aluminum of the connection pad of the object to be measured. Don't be.

 [0003] In order to solve this problem, various methods have been considered so far. Patent Document 1 proposes a method in which the probe is brought into contact with the connection pad of the object to be measured obliquely to remove the oxide film on the surface. Further, Patent Document 2 proposes that the probe tip be made of a material different from the material of the probe body in order to prevent an oxide film from adhering to the probe tip. Patent Document 3 proposes a method of reducing the oxide film by having a semiconductor photocatalyst at the probe tip.

[0004] Further, a four-terminal method (Kelvin method) is known as a method for preventing an error caused by contact resistance between a connection pad of a device under test and a probe. According to the four-terminal method, the current application terminal and voltage Separating the measurement terminal eliminates the influence of contact resistance, and enables high-precision measurement even if there is an oxide film on the connection pad that is the object to be measured. The four probe method uses two probe as a pair, and the pair of probe is a Kelvin probe!

 Patent Document 1: JP-A-11 148947

 Patent Document 2: JP 2004-226204 A

 Patent Document 3: JP 2003-207522

 Disclosure of the invention

 Problems to be solved by the invention

 [0005] Since the tip shape of the conventional probe is flat or spherical, the oxide film on the surface of the connection pad of the object to be measured cannot be removed, and the contact resistance increases. The ability to measure optical or optical properties. In the methods of Patent Documents 2 and 3, it is necessary to attach another substance to the probe tip, and precise processing is difficult. As the element becomes finer, the probe also needs to be finely processed, and a probe suitable for such fine processing and capable of removing the surface acid film is required.

 [0006] Even in the inspection by the four-terminal method that enables high-accuracy measurement, there is a problem that it is difficult to connect two measuring elements to a connection pad that is an object to be measured of a miniaturized element. At present, with the miniaturization of devices, the connection pads, which are objects to be inspected, are also becoming finer, and the width of the connection pads is usually 30 to 100 m. If two measuring elements are connected to such a fine connection pad, accurate measurement may not be possible due to conduction. Moreover, even with a Kelvin probe in which two measuring elements and an insulating material that insulates them are integrated as in Patent Document 4, microfabrication is difficult and cannot be connected to a miniaturized connection pad. .

 [0007] When the probe is installed in the probe device, if the probe has a circular cross section, it is difficult to install the probe in the correct direction.

[0008] In addition, since it is difficult for the conventional Kelvin probe to set the tips of the two measuring elements to the same height, one of the two measuring elements contacts the connection pad, but the other Does not fully contact the connection pads, causing a measurement accuracy error. Patent Document 4: JP-A 63-175771 Means for solving the problem

 [0009] In order to solve the above problems, the present inventors provide the following Kelvin probe, a measuring device having a Kelvin probe, and a method for producing the Kelvin probe.

[0010] A first invention is a first stylus part, a second stylus part insulated from the first stylus part by an insulating layer, and a powerful Kelvin probe. Provided is a Kelvin probe having an elastic structure that can be elastically contacted with an object to be inspected when only one of the two probe parts is pinched. According to a second aspect of the present invention, the insulating layer partially secures the first probe part and the second probe part, and the vicinity of the tip part of the probe is not fixed, thereby forming the elastic structure. A Kelvin probe according to the first invention is provided. The third invention is

When the vicinity of the tip of either of the probe parts is not in contact with the test object, the vicinity of the tip of both probe parts is in contact, and when the vicinity of the tip of either probe part is in contact with the test object The Kelvin probe according to the first or second invention is provided in which the contacting probe part stagnate by the contact pressure, and the contact state is changed to the non-contact state. According to a fourth aspect of the present invention, the first probe part is an application needle having a smaller elasticity than the second probe part, and the second probe part is elastic compared to the first probe part. A first force which is a detection needle having a large structure. A Kelvin probe according to any one of the third invention is provided. The fifth invention is the Kelvin probe according to any one of the fourth invention, wherein the first probe part is a tungsten-based barta material force and the second probe part is a stainless steel wire-like material force. I will provide a. The sixth invention provides the Kelvin probe according to any one of the fifth invention, in which the first force in which the protruding amount of the first probe part and the second probe part differs depending on the object to be inspected. A seventh invention provides the Kelvin probe according to the sixth invention, wherein the second probe part protrudes more than the first probe part toward the test object. According to the eighth aspect of the invention, when both the first probe part and the second probe part come into contact with the inspection object by pressing against the object to be inspected, the inspection object is passed through the second probe part. The Kelvin probe according to the seventh invention, wherein the second probe portion has elasticity such that the load applied to the load is 10 g weight or less. A ninth invention provides the Kelvin probe according to any one of the first to eighth inventions, wherein the tip line of the second probe part is an acute angle with respect to the center line of the first probe part. In a tenth aspect of the present invention, the tip line having the acute angle of the second probe portion is connected to the second probe portion. The Kelvin probe according to the ninth invention is provided by providing a plurality of bent nodes. In the eleventh invention, the first probe part and the tip of the second probe part are on one axis with respect to the sliding direction of the probe. Provide the described Kelvin probe.

 A twelfth invention provides an inspection apparatus having the Kelvin probe according to any one of the first to eleventh inventions. A thirteenth invention has a test object mounting table for mounting a test object, and a Kelvin probe holding part for holding the Kelvin probe according to any one of the first power eleventh invention, The probe holding section provides the inspection apparatus according to the eleventh aspect, wherein the probe holding section lowers the tip of the measuring element section having an elastic structure substantially perpendicular to the inspection target mounting plane of the inspection target mounting base. A fourteenth aspect of the invention includes an inspection target mounting table for mounting an inspection target, and a Kelvin probe holding unit for holding the Kelvin probe according to any one of the first to eleventh aspects of the invention. The Kelvin probe holder is configured such that the tip of the measuring part having an elastic structure with respect to the inspection target mounting plane of the inspection target mounting table is viewed from the inspection target mounting plane on the measuring part side having no elastic structure. An inspection apparatus according to the tenth aspect of the present invention is provided that descends substantially vertically while maintaining an angle of less than degrees.

 [0012] A fifteenth aspect of the invention is an operation method of an inspection apparatus having the Kelvin probe according to any one of the sixth force of the eleventh aspect of the invention, and at the latest, the first probe part or the second probe part Provided is a method of operating an inspection apparatus having a shank side force application step of applying a force toward the shank side to the Kelvin probe after any one of the above contacts an inspection object.

[0013] The sixteenth invention includes a first substrate preparing step of preparing a first substrate, and a film in which a film-like insulating film is disposed on the first substrate surface prepared in the first substrate preparing step The step of arranging the second substrate so as to sandwich the film-like insulating film arranged in the film-like insulating film arranging step, and the step of arranging the second substrate. A block forming step in which the first substrate and the second substrate arranged with the film-like insulating film sandwiched between them are pressed while being heated to form a block integrally with the film-like insulating film; There is provided a method for manufacturing a Kelvin probe, comprising: an outer shape processing step for processing the block by wire electric discharge machining so that the first substrate and the second substrate are isolated from each other to form a measuring element. The seventeenth invention is the thickness of the film-like insulating film Provides a method for producing a Kelvin probe according to the sixteenth aspect of the invention, which is 5 microns or more and 50 microns or less. The eighteenth invention provides the method for producing a Kelvin probe according to the sixteenth or seventeenth invention, wherein a cut-out width cut out in the outer shape processing step is in a range of 5 microns to 2 mm.

The nineteenth invention provides a Kelvin probe having a polygonal cross section. A twenty-second invention provides the Kelvin probe according to the nineteenth invention, wherein the polygon is a polygon that is not a regular polygon. A twenty-first invention provides the Kelvin probe according to the nineteenth or twenty-first invention, wherein the polygon is an odd-sided polygon having an odd number of sides constituting the polygon. A twenty-second invention provides the Kelvin probe according to any one of the nineteenth force and the twenty-first invention, wherein the polygonal cross section is in a shank portion. In a twenty-third aspect of the invention, the polygonal cross section is at the tip, and when the tip is brought into contact with the connection pad of the object to be measured, the polygonal cross section is selected from any one of the vertices of the polygon. A Kelvin probe according to any one of the nineteenth to twenty-first inventions configured to contact a connection pad contact surface is provided. In the twenty-fourth aspect of the invention, the polygonal cross section is at the tip, and when the tip is brought into contact with the connection pad of the object to be measured, the apex force of the polygon is also in contact with the connection pad. A Kelvin probe according to any one of the nineteenth to twenty-first aspects of the invention configured to prevent contact with a surface is provided. According to a twenty-fifth aspect of the invention, from the nineteenth to the nineteenth aspect, the polygonal cross section has a curved surface as a surface to be contacted with the connection pad of the object to be measured at the tip of the Kelvin probe. A Kelvin probe according to any one of the twenty-first inventions is provided. A twenty-sixth aspect of the invention provides the Kelvin probe according to any one of the twenty-fifth aspect of the invention, wherein at least one side of the polygon is replaced with a straight line. The twenty-seventh aspect of the invention is arranged so as to be sandwiched between the first probe part and the second probe part, the first probe part, and the second probe part. And a Kelvin device according to any one of the nineteenth to twenty-sixth aspects, comprising: an insulating layer portion for integrating the first measuring portion and the second measuring portion. Provide a probe. A twenty-eighth aspect of the invention provides the Kelvin probe according to the twenty-seventh aspect of the invention, which is manufactured by the method for manufacturing a Kelvin probe according to any one of the sixteenth force and the eighteenth aspect of the invention. 20th A ninth invention provides the Kelvin probe according to the twenty-seventh or twenty-eighth invention, wherein the insulating layer portion is not arranged at the tip portion. A thirtieth aspect of the invention provides the Kelvin probe according to any one of the twenty-ninth aspect, wherein the nineteenth force having a bent tip portion. A thirty-first aspect of the invention provides the Kelvin probe according to the thirty-first aspect of the invention, wherein the bending is made on either side of the probe pair.

 The invention's effect

 [0015] With the Kelvin probe of the present invention, since both of the two measuring elements reliably contact the connection pad, it is possible to improve the accuracy of element inspection.

 [0016] Further, since the Kelvin probe tip can be finely applied by the Kelvin probe manufacturing method of the present invention, the use of the Kelvin probe obtained by the Kelvin probe manufacturing method of the present invention makes it possible to obtain a microelement. Inspection can be performed. Further, according to the Kelvin probe of the present invention, since the cross section is polygonal, the oxide film or the altered layer on the connection pad surface of the object to be measured can be easily removed. Therefore, the Kelvin probe can come into contact with the aluminum material portion of the connection pad of the object to be measured, and measurement errors due to contact resistance can be reduced. As another effect, the orientation of the probe can be easily performed when the probe is attached to the probe device.

 BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described in detail. The first embodiment will mainly describe claims 16 to 18. The second embodiment will mainly describe claims 19 to 26. The third embodiment will mainly describe claims 27 to 29. The fourth embodiment will mainly describe claims 30 and 31. The fifth embodiment will mainly describe claims 1, 2, 6, 7, and 8. Embodiment 6 will mainly describe claim 3. The seventh embodiment will mainly describe claims 4 and 5. The eighth embodiment will mainly describe claims 9 and 10. The ninth embodiment will mainly describe claim 11. The tenth embodiment will mainly describe claims 12 to 15.

 [0018] <Embodiment 1: Configuration>

 Embodiment 1>

Embodiment 1: Concept> The present embodiment relates to a method of manufacturing a Kelvin probe that can electrically insulate a pair of measuring elements by disposing an insulating layer between the pair of measuring elements. Fig. 13 shows a conceptual diagram of the manufacturing method of the Kelvin probe of this embodiment. First, a film-like insulating film is sandwiched between the first substrate and the second substrate and pressed while being heated using a roller (Next, the block is cut by a discharge cage (b). The resulting block is further finely added to form a Kelvin probe (c).

 <Embodiment 1: Manufacturing Process>

 FIG. 12 shows an example of the manufacturing process of the Kelvin probe of this embodiment. Hereinafter, the manufacturing process of this embodiment will be described for each process with reference to FIG.

 [0020] The first substrate preparation step (S1201) is a step of preparing the first substrate. The material of the first substrate is mainly composed of a conductive material. The conductive material is preferably as hard as possible in order to remove the oxide film. Specifically, tungsten, tungsten alloy, tungsten carbide, beryllium copper, or the like is preferable as the conductive material. The Kelvin probe may be composed of a plurality of types of materials other than a single type of material.

The film-like insulating film disposing step (S1202) is a step of disposing a film-like insulating film on the first substrate surface prepared in the first substrate preparing step. Since the film-like insulating film is the original material of the insulating layer constituting the Kelvin probe, the material can at least ultimately become the insulating layer. However, it is not always necessary to have an insulating property during the placement process work, and it is sufficient if the insulating property is obtained through a process such as heating in a later step. This arranging step can be performed by placing a film-like insulating film on the first substrate and pressurizing with a roller. Of course, you can simply place it without using a roller. The thickness of the film-like insulating film is preferably 5 microns or more and 50 microns or less. More preferably, it is 5 microns or more and 25 microns or less. If the film insulation film is 5 microns or less, the product characteristic strength of the film insulation film cannot accurately form a gap. If the film insulation film is 50 microns or more, the Kelvin probe becomes large and the microelements cannot be inspected. It is. Here, the fine element corresponds to a light emitting diode element, for example. However, the film insulation film in this film insulation film arrangement process Does not mean the thickness of the insulating layer of the Kelvin probe immediately after completion. That is, in the process leading to completion, the thickness of the film-like insulating film is usually reduced by heat curing. Therefore, it is necessary to determine the thickness of the film-like insulating film in this process after taking into consideration in advance how much the thickness will decrease in the subsequent process. An important reason for using this film-like insulating film is that a uniform thickness can be realized over a wide area. If a uniform thickness cannot be realized, the yield of products that satisfy the gap standard, which is the thickness of a predetermined insulating layer, will be deteriorated. Moreover, if a uniform gap cannot be realized, the mechanical strength of the insulating layer for integrating the two measuring elements will be insufficient.

 [0022] Here, the film-like insulating film is a film in which a resin (resist layer) hardened by light is sandwiched by a polyethylene and polyester film, but in the present invention, it reacts with light. Is not used. For example, products from Tokyo Ohka Kogyo Co., Ltd. and DuPont are known. In order to achieve a thickness of 5 microns or less with high accuracy, it is more effective to use a technique such as spin coating rather than a film-like insulating film. This is because the products with film-like insulating films have a large thickness variation rate because the absolute value of the difference in thickness does not change even if they are thin. However, if spin coating is used, a bulge is formed on the end face of the substrate, so the problem of gap accuracy degradation due to this bulge must be solved.

 [0023] The second substrate disposing step (S1203) is a step of disposing the second substrate so as to sandwich the film insulating film disposed in the film insulating film disposing step. The material of the second substrate is the same as the material of the first substrate.

[0024] In the block creation step (S1204), the first substrate placed with the film-like insulating film sandwiched in the second substrate placement step and the second substrate are pressed while heating. This is a process of forming a block integrally with a film-like insulating film. As shown in FIG. 13 (a), the pressing is performed by placing a film-like insulating film between the first substrate and the second substrate, and pressing the first substrate and the second substrate in the adhesion direction with a roller. . As the roller, a dry film laminator is used. Through this process, the first substrate and the film-like insulating film, and the second substrate and the film-like insulating film are firmly fixed together as a block. It becomes. As another pressing method, a method of compressing and integrating with a press machine, a method of vapor-depositing an insulating film layer by CVD, a first substrate, a film-like insulating film, and a second substrate placed on a jig and heating and screwing There is also a method of compressing with.

 [0025] The outer shape processing step (S1205) is a step of processing the block by wire electric discharge machining so that each of the first substrate and the second substrate becomes a measuring element while being insulated. The wire discharge force is a method in which a metal wire and a target object are used as electrodes to perform calorie by discharging between them. If the wire discharge force is used, even a hard metal such as tungsten can be processed into a complicated shape. Wire electrical discharge machining can be processed with a conductive material. Insulators cannot be processed. Therefore, it seems that the film-like insulating film cannot be processed, but the block is mainly made of a conductive material, and the film-like insulating film is sufficiently thin so that it is processed together with the conductive material. be able to. It is preferable that the cutting width to be cut out in the outer casing process is in the range of 5 microns to 2 mm. The cut-out width means the length in the direction perpendicular to the cut surface of the cut block. This is because it is technically difficult to cut the cutting width to 5 microns or less, and if the cutting width is 2 mm or more, the Kelvin probe becomes large and is not suitable for the measurement of fine elements. Since the Kelvin probe generally has a complicated shape having a pointed tip, it is difficult to achieve a desired shape by using only a cutting blade or only a polishing process. An important point of the present invention is that the wire discharge force is used in this outer shape caching process, and this makes it possible to realize a Kelvin probe having a complicated shape for the first time.

 [0026] <Embodiment 1: Effect>

 According to this embodiment, since the Kelvin probe can be finely processed, a Kelvin probe suitable for measurement of a miniaturized element can be manufactured.

 [0027] Embodiment 2>

 Embodiment 2: Concept>

FIG. 1 shows a state in which a semiconductor is inspected using the Kelvin probe of this embodiment. The Kelvin probe uses two gauges as a pair, and uses a pair of Kelvin probes on the current entrance and exit sides respectively, so use at least 4 gauges in total. The Kelvin probe is fixed, and the semiconductor support is Test by moving in the direction of the mark. FIG. 2 shows how the oxide film on the surface of the connection pad of the object to be measured is removed using the Kelvin probe of this embodiment. The connection pad of the DUT shown in Fig. 2 is made of aluminum (0203) as the base material, and the surface is an oxide film (A1 0)

 twenty three

Covered with (0202). In the state shown in Fig. 2 (a), the Kelvin probe (0201) is in contact only with the oxide film (0202), which is an insulator, so the contact resistance is large and accurate measurement cannot be performed. However, if the tip of the Kelvin probe is sharp, as shown in Fig. 2 (b), the Kelvin probe (0201) removes the hard oxide film (0202) on the surface and connects the object to be measured. Can contact with aluminum (0203) which is the pad body.

[0028] Embodiment 2: Configuration>

 3 and 4 show an example of the Kelvin probe of this embodiment. The Kelvin probe of this embodiment has a polygonal cross section. The cross section is a plane perpendicular to the longitudinal direction of the probe. In the example of Fig. 3, the cross section is rectangular, but not limited to this example, the polygon may be a plane figure surrounded by three or more line segments. Also, as in the example in Figure 4, at least one side of the polygon may be replaced with a straight line to form a curve. Further, it is not necessary for the entire cross section of the Kelvin probe to be a polygon, and a part of the cross section may be a polygon. Further, only the cross section of the measuring element constituting the Kelvin probe may be a polygon, even if the cross section of the entire Kelvin probe is a polygon. In other words, a “Kelvin probe having a polygonal cross section” means that the cross section of the entire Kelvin probe is polygonal, or only the cross section of the probe constituting the Kelvin probe is polygonal. It may be there.

 [0029] The Kelvin probe of the present embodiment uses two measuring elements as a pair. Therefore, there are two measuring elements as shown in FIG. 3 or FIG. 4, and the Kelvin probe of this embodiment is obtained. However, in this embodiment, the cross sections of both of the two probe elements need to be polygonal, and one of the two probe elements has the shape shown in FIG. 3 or FIG. If it is a circle)

[0030] The polygon is preferably a polygon that is not a regular polygon. Since the Kelvin probe having a regular n-square cross section has n-fold symmetry with respect to the central axis, it is difficult to visually align it. Since normal orientation is performed by image recognition, Direction alignment becomes easier when the cross section is not a regular polygon. The higher the anisotropy, the easier the orientation is. Therefore, it is preferable that the polygon is as different as possible from the regular polygon.

 [0031] Further, the polygon is more preferably an odd-sided polygon in which the number of sides constituting the polygon is an odd number. The odd-sided polygon is a triangle or a pentagon. This is because even-sided polygons (rectangles, hexagons, etc.) are more symmetrical, and odd-sided polygons are easier to align.

 [0032] The Kelvin probe of the present embodiment may have a polygonal cross section in the shank portion of the Kelvin probe. A shank part is an attachment part when attaching a Kelvin probe to a probe apparatus. This is because the cross section of the shank portion is polygonal, so that it is easy to align the direction when attaching the Kelvin probe.

 [0033] The material of the Kelvin probe is mainly composed of a conductive material. The conductive material is preferably as hard as possible in order to remove the oxide film. Specifically, tungsten, tungsten alloy, tungsten carbide, beryllium copper, and the like are preferable as the conductive material. The Kelvin probe may be composed of a plurality of kinds of materials other than a force composed of only one kind of material.

 [0034] Further, it is preferable that the surface of the portion of the Kelvin probe that contacts the connection pad of the object to be measured is covered with another material so that the surface is not easily oxidized. Examples of the material that covers the surface include gold and platinum. These materials can be attached as a thin film to the tip of the Kelvin probe by fitting or vapor deposition.

 [0035] In order to efficiently cut the oxide film, it is preferable that the radius of curvature of the apex angle of the tip is 1 μm or less. If the radius of curvature exceeds this value, the oxide film cannot be cut sufficiently, and the Kelvin probe cannot sufficiently contact the connection pad of the object to be measured.

[0036] The cross section of the polygon is at the tip of the Kelvin probe, and when the tip is brought into contact with the object to be measured, the connection pad contact surface of the object to be measured starts from any one of the polygonal vertices. It can be configured to touch. The tip refers to the part with a tip force of 20 to 1000 m. Even if the cross-section is polygonal, can the surface oxide film, etc. be sufficiently removed by simply contacting the flat part or one side of the tip with the connection pad of the object to be measured? That's it. In order for the sharp part (polygonal apex) at the tip of the Kelvin probe to scrape the oxide film, the Kelvin probe must be contacted at an angle. Preferably, the angle formed by the tip surface and the oxide film surface is 15 degrees or more.

[0037] The cross section of the polygon is at the tip of the Kelvin probe. When this tip is brought into contact with the connection pad of the object to be measured, the connection pad contact of the object to be measured is contacted from the apex of the polygon. It is configured so that it does not touch the touch surface. When the apex of the polygon comes into contact with the connection pad of the object to be measured, the oxide film can be removed as described above. However, not only the oxide film but also the connection pad body of the object to be measured may be damaged. If the connection pad body of the object to be measured is damaged, contact resistance increases due to surface irregularities, and accurate inspection cannot be performed. Therefore, in some cases, it is more preferable to bring the portion (side or flat portion) of the tip of the Kelvin probe into contact with the connection pad of the object to be measured. The ability to tolerate scratches to some extent should be selected according to the connection pad material and customer requirements.

 [0038] As shown in FIG. 11, the polygonal cross section is connected to the tip of the Kelvin probe and the surface to be contacted with the connection pad of the object to be measured may be a curved surface. This is because if the tip end is a curved surface, the connection pad body is hardly damaged. The curvature radius of the curved surface is 5 m or more so as not to damage the body of the connection pad of the object to be measured.

 [0039] The Kelvin probe of the present embodiment is preferably manufactured by a discharge cage. According to the discharge caloe, it is hard and suitable for microfabrication of materials!

 [0040] <Embodiment 2: Effect>

 Since the Kelvin probe of this embodiment has a sharp tip shape, the oxide film or the altered layer attached to the surface of the connection pad of the object to be measured can be removed, and the metal of the contact pad main body and the Kelvin probe can be removed. The tip can be in direct contact. Therefore, the contact resistance caused by the oxide film or the altered layer can be reduced, and the measurement accuracy can be improved. In addition, since the cross-sectional shape is polygonal, it is easy to align the direction when installing the Kelvin probe.

 [0041] Embodiment 3>

<Embodiment 3: Concept> The present embodiment relates to a Kelvin probe based on the second embodiment, in which an insulating layer is sandwiched between a pair of measuring elements, and the pair of measuring elements and the insulating layer are integrated.

[0042] <Embodiment 3: Configuration>

 FIG. 5 shows the Kelvin probe of this embodiment. The Kelvin probe (0500) of the present embodiment has a “first probe part” (0501), a “second probe part” (0502), and an “insulating layer part” (0503).

 [0043] The “first probe part” (0501) and “second probe part” (0502) are used to conduct electricity through the element to investigate the electrical characteristics of the element or the light emission characteristics of the LED. It is. These configurations are the same as those of the Kelvin probe of the second embodiment.

 [0044] The "insulating layer part" (0503) is disposed so as to be sandwiched between the first probe part (0501) and the second probe part (0502). In addition to insulating the first measuring element (0501) and the second measuring element (0502), the first measuring element (0501) and the second measuring element (0502) are integrated together. The insulating layer portion (0503) is made of an insulator that does not conduct electricity. The insulating layer portion (0503) may be configured not only with a single insulator but also with a plurality of insulator forces. The insulation layer part (0503) has a sufficient thickness to electrically insulate the first probe part (0501) and the second probe part (0502). However, it is not possible to make the insulating layer (0503) thicker than necessary because fine elements are inspected. The thickness of the insulating layer (0503) is preferably 5 μm or more and 20 μm or less. The width of the first and second probe parts is about 20 to 40 m. The width of the test connection pad normally used is usually about 80 μm, so the width of the Kelvin probe is determined according to the size of the connection pad as described above.

 [0045] The Kelvin probe of the present embodiment may be manufactured by the method for manufacturing a Kelvin probe described in the first embodiment. If the manufacturing method of Embodiment 1 is used, microfabrication is facilitated, and a Kelvin probe suitable for inspection of microelements can be manufactured.

As shown in FIG. 6, the Kelvin probe of the present embodiment may have a structure in which the insulating layer portion (0603) is not arranged at the tip portion. When the insulating layer part (0603) is arranged to the tip, only the insulating layer part comes into contact with the connection pad of the object to be measured, and the first measuring part (0601) and the second measuring part (06 02) of the object to be measured Insufficient contact with the connection pad, resulting in poor measurement results Because there are things. The range of the tip is the same as in the first embodiment.

[0047] Embodiment 3: Effect>

 According to the Kelvin probe of this embodiment, the presence of the insulating layer can prevent conduction due to contact between the probe elements, and can further improve the measurement accuracy. Also, by integrating the insulating layer with the measuring element, the distance between the pair of measuring elements can be narrowed, making it suitable for inspection of miniaturized elements.

[0048] <Embodiment 4: Concept>

 This embodiment is based on Embodiments 2 and 3, and the tip is bent, so that the probe has elasticity, and the tip of the probe wears out and the length of the probe pair is different. The present invention relates to a Kelvin probe that can accurately measure.

[0049] <Embodiment 4: Configuration>

 7 to 10 show an example of the Kelvin probe of this embodiment. The Kelvin probe of this embodiment is characterized in that the tip is bent. The probe is not elastic in the direction parallel to the longitudinal direction, but is elastic in the direction perpendicular to the longitudinal direction, so the tip of the probe is elastic in the direction perpendicular to the connection pad surface of the object to be measured. It becomes possible to move. In order for the probe to have sufficient elasticity, the bending angle is most preferably 90 degrees, but is not limited to this angle.

 FIG. 7 shows an example in which the Kelvin probe is bent in a direction perpendicular to the plane including the first probe portion (0701) and the second probe portion (0702). FIG. 8 shows an example in which the shape of the first probe part (0801) and the second probe part (0803) is the same as that of FIG. 7, and an insulating layer part (0802) is arranged between them. did.

 [0051] The bending of the tip of the Kelvin probe may be made on one side of the probe pair! In the example of FIG. 9, the Kelvin probe is bent toward the second probe part as viewed from the first probe part (0901). FIG. 10 shows an example in which the shape of the first probe part (1001) and the second probe part (1003) is the same as that of FIG. 9, and the insulating layer part (1002) is arranged between them. expressed.

 [0052] The range and the tip area of the tip are the same as in the second embodiment.

[0053] <Embodiment 4: Effect> According to the Kelvin probe of the present embodiment, the tip is bent, so that it is elastic in the direction perpendicular to the connection pad of the object to be measured, and the length of the pair of measuring elements is different. However, since the length can be adjusted by the elasticity, an accurate inspection can be performed.

 [0054] <Embodiment 5>

 Embodiment 5: Concept>

 The Kelvin probe of this embodiment is characterized in that one of the two measuring elements constituting the Kelvin probe can be held, so that both of the two measuring elements can reliably contact the inspection object. To do.

 [0055] <Embodiment 5: Configuration>

FIG. 14 shows an example of the appearance of the Kelvin probe of the present embodiment and the state when the Kelvin probe contacts the inspection object. The Kelvin probe includes a first probe part (1401), a second probe part (1402), and an insulating layer (1403). The first probe part (1401) and the second probe part are insulated by an insulating layer (1403). The Kelvin probe of the present embodiment has an elastic structure that can be elastically contacted with the object to be inspected (1404) when only one of the first probe portion ( ₁₄₀₁ ) or the second probe portion (1402) is pinched. Have In the example of FIG. 14, only the second probe portion (1402) is held.

 [0056] The insulating layer (1403) is configured such that the first probe part (1401) and the second probe part (1402) are partially fixed, and the vicinity of the tip part of the probe is not fixed. The elastic structure is formed. Therefore, the tip portion where the second probe portion (1402) is not fixed can be held away from the first probe portion and can be inertially pinched.

Furthermore, in the Kelvin probe of the present embodiment, the amount of protrusion of the first probe part (1401) and the second probe part (1402) differs toward the inspection object (1404). That is, the tip of the first probe part (1401) and the tip of the second probe part (1402) are arranged so that they are at different distances than the inspection target (1404) force is at the same distance. . In the example of FIG. 14 (a), the second probe portion (1402) protrudes more than the first probe portion (1401). By doing so, the second probe portion (1402) first comes into contact with the object to be inspected, and the first probe portion (1401) can also contact the object to be inspected by being elastically pinched (see FIG. 14 (b)). [0058] In addition, by pressing against the inspection object (1404), the second measurement part (1401) and the second measurement part (1402) are both in contact with the inspection object when the second measurement is performed. The second measuring element (1402) has elasticity so that the load applied to the object to be inspected (1404) through the element (1402) is 10 g weight or less. When the second probe (1402) comes into contact with the object to be inspected (1404), the second probe (1402) is bent by applying a load to the second probe (1402), The first probe portion (1401) is brought into contact with the inspection object (1404). At this time, the load gradually increases until the first probe portion (1401) contacts the inspection target (1404). Therefore, the load is highest at the moment when both the first probe part (1401) and the second probe part (1402) are in contact with the test object. By making the load at this time 10 g or less, it is possible to prevent the second probe part (1402) from being destroyed.

 [0059] <Embodiment 5: Effect>

 With the Kelvin probe of this embodiment, since both of the two measuring elements reliably contact the connection pad, it is possible to improve the accuracy of the element inspection.

 [0060] Embodiment 6>

 Embodiment 6: Concept>

 The Kelvin probe of this embodiment has a structure in which the vicinity of the tip of two measuring elements is in contact before the Kelvin probe contacts the inspection object, and the two measuring elements are separated after contacting the inspection object. Yes.

[0061] <Embodiment 6: Configuration>

FIG. 15 shows an example of the Kelvin probe of this embodiment. In the Kelvin probe of this embodiment, when the vicinity of the tip of either the V or the displacement probe part is not in contact with the object to be inspected, the vicinity of the tip of both probe parts is in contact, and the tip of one of the probe parts Due to the contact pressure when the vicinity is in contact with the object to be inspected, the contact portion that is in contact is stagnated, and the contact state is changed to a non-contact state. As shown in FIG. 15 (a), the contact state is a state in which the first probe part (1501) and the second probe part (1502) are in contact near the tip, that is, the first measurement part. This represents a state in which the slave part and the second probe part are conducting. When the second probe portion (1502) first contacts the object to be inspected (1533), it is stiffened by elasticity and the force of the first probe portion (1501) is also released (FIG. 15 (b)). By doing so, it is possible to further miniaturize the tip portion that does not need to be insulated. it can.

 [0062] When the second probe portion (1502) comes into contact with the object to be inspected (1503) first, the first probe portion (15 01) is separated from the force, so that the conductive state force becomes non-conductive and the resistance value increases. . When the first probe part (1501) also comes into contact with the inspection object (1503), the first measurement element part (1501) and the second measurement element part (1502) again conduct through the inspection object, so that the resistance value decreases. Therefore, by measuring the resistance value, it can be determined whether the first probe portion (1501) or the second probe portion (1502) is in contact, so that the descending speed of the Kelvin probe can be determined. Control becomes easy.

 [0063] <Embodiment 6: Effect>

 The Kelvin probe of this embodiment can be used for detecting fine elements by miniaturizing the tip. Also, the descending speed of the Kelvin probe can be controlled easily, so that the Kelvin probe and the inspection object are not damaged!

 [0064] <Embodiment 7>

 Embodiment 7: Concept>

 The Kelvin probe of the present embodiment has a structure in which one of the two measuring elements has a small elasticity and the other has a structure having a large elasticity, so that only one of the two measuring elements is included. It is characterized by being able to.

 [0065] <Embodiment 7: Configuration>

 FIG. 16 shows an example of the Kelvin probe of this embodiment. The Kelvin probe of this embodiment is composed of a first probe part (1601) and a second probe part (1602). The first probe part (1601) has a smaller elasticity than the second probe part (1602), and the second probe part (1602) has an elasticity less than that of the first probe part (1601). Compared with the size and structure. High elasticity means a property that tends to stagnate, and is achieved by making the shape thin or using a material having high elasticity.

 FIG. 17 shows another example of the Kelvin probe of this embodiment and the manufacturing process thereof.

In the example of FIG. 17, the first stylus part (1701) is also made of tungsten-based butter material force, and the second stylus part (1702) is made of stainless steel wire-like material. The tungsten barta-based material is a material whose main component is tungsten and is thicker than the second probe portion (1702). The The stainless steel wire-like material is made of stainless steel as a main component and is thinner than the first probe portion (1701). The wire-like material is not limited to a thin thread-like material, and may be an elastic thin, plate-like material as shown in FIG.

 As shown in FIG. 17, the first stylus part (1701) is manufactured by cutting the tip of a bar-shaped tungsten-based barter material and flattening one surface. On the other hand, the second probe portion (1702) is obtained by processing a stainless steel wire-like material as shown in FIG. 17 into a shape with a sharpened tip and bending the tip. An insulating layer is attached to the flat surface of the first probe portion (1701), and a second probe portion is attached thereon, thereby completing the Kelvin probe.

 [0068] <Embodiment 7: Effect>

 In the Kelvin probe of this embodiment, one of the two measuring elements has a property of being easily squeezed, and the other has a property of being hard, so that the Kelvin probe is not deformed and is in contact with the object to be inspected. can do.

 [0069] <Embodiment 8>

 Embodiment 8: Concept>

 In the Kelvin probe of this embodiment, two measuring elements are in contact at an acute angle near the tip.

[0070] <Embodiment 8: Configuration>

 18-20 show an example of the Kelvin probe of this embodiment. 18 is an overall view of the Kelvin probe, FIG. 19 is an enlarged view of the tip of the Kelvin probe, and FIG. 20 is a cross-sectional view of the Kelvin probe. In the Kelvin probe of this embodiment, the leading end line (1803) of the second probe part (1802) is acute with respect to the center line (1804) of the first probe part (1801). As shown in FIG. 18, the center line (1804) and the tip line (1803) are the central axes at the tip parts of the first probe part (1801) and the second probe part (1802), respectively.

 FIG. 21 shows another example of the Kelvin probe of the present embodiment. In the example of FIG. 21, the sharp tip of the second probe portion (2102) is formed by providing a plurality of bent nodes on the second probe portion.

 [0072] <Embodiment 8: Effect>

In the Kelvin probe of this embodiment, the contact angle between the two probe is an acute angle, The stress applied to the bent portion of the Kelvin probe can be reduced. In particular, if there are a plurality of bending nodes, the stress applied to the bending portion can be dispersed.

 [0073] <Embodiment 9>

 Embodiment 9: Concept>

 The Kelvin probe of this embodiment is characterized in that the tips of the two measuring elements are on different axes with respect to the sliding direction of the probe when contacting the inspection object.

[0074] <Embodiment 9: Configuration>

 FIG. 22 (a) is a top view of the state in which the Kelvin probe of this embodiment is in contact with the inspection object. The tip (2204, 2205) of the first probe part (2201) and the second probe part (2202) are not on one axis with respect to the sliding direction of the probe. The sliding direction of the probe is a direction in which the first probe portion (2201) and the second probe portion (2202) slide on the inspection object after the Kelvin probe is brought into contact with the inspection object (2203). In the example of Fig. 22 (a), the direction indicated by the arrow is the slip direction. On the other hand, FIG. 22 (b) shows the arrangement when the first probe part and the tips (2206, 2207) of the second probe part are on one axis with respect to the sliding direction of the probe.

[0075] <Embodiment 9: Effect>

 The Kelvin probe of this embodiment can effectively utilize the area to be inspected by arranging the two measuring elements obliquely with respect to the sliding direction. Therefore, it is suitable for the measurement of miniaturized elements.

[0076] <Embodiment 10>

 Embodiment 10: Concept>

 The present embodiment relates to an inspection apparatus having the Kelvin probe of Embodiments 5 to 9 and an operation method thereof.

[0077] <Embodiment 10: Configuration>

 FIG. 23 shows an overview of the inspection apparatus of this embodiment. The inspection apparatus according to the present embodiment includes an “inspection mounting table” (2301), a “Kelvin probe holding unit” (2302), and a “measurement unit” (2303).

The “inspection target mounting table” (2301) mounts the inspection target. On the inspection table (2301) There may be more than one test object to be placed. Moreover, since the inspection object mounting table (2301) is brought into contact with the Kelvin probe, it may be movable up and down.

The “Kelvin probe holding part” (2302) holds the Kelvin probe according to any one of Embodiments 5 to 9!

 The “measurement part” (2303) includes the first measurement part and the second measurement part described in the fifth to ninth embodiments.

 [0081] In addition to this, the inspection apparatus may be provided with a camera for observing whether or not the probe (2303) has contacted the inspection object!

 FIG. 24 shows an example of a state in which the Kelvin probe holding unit brings the measuring part into contact with the inspection object. In the example of FIG. 24, the Kelvin probe holding part lowers the tip of the measuring element part (2402) having an elastic structure substantially perpendicular to the inspection target mounting plane of the inspection target mounting table. The reason for descending substantially vertically is as follows. The camera for aligning the Kelvin probe is often installed directly above the inspection target (2403). If the Kelvin probe of the camera force gauge is used, it is easy to see whether the tip of the gauge is directly above the object to be inspected. Therefore, if the tip of the probe is installed directly above the object to be inspected, the probe tip is brought into vertical contact with the object to be inspected, so that the positioning of the Kelvin probe tip can be easily controlled. It becomes.

 FIG. 25 shows another example of the state in which the Kelvin probe holding unit brings the probe portion into contact with the inspection object. In the example of FIG. 25, the Kelvin probe holding unit has a measuring part (2501) having no elastic structure at the tip of a measuring part (2502) having an elastic structure with respect to the inspection target mounting plane of the inspection target mounting table. Observe the mounting plane force of the inspection side on the) side and move it down substantially vertically while maintaining an angle (Θ) of less than 90 degrees. This is because, when the tip end axis of the measuring part having an elastic structure is perpendicular to the plane to be inspected, it is confirmed by the camera whether the tip is in contact with the object to be inspected. This is because it is easy to confirm the tip with a camera by slightly shifting the tip axis from the vertical.

FIG. 26 shows an example of the operation method of the inspection apparatus of the present embodiment. When the Kelvin probe is lowered vertically (a), the second stylus part (2602) sticking out / spins toward the inspection object (2603) comes into contact with the inspection object first (b). Then the force to lower the Kelvin probe vertically If added, the tip of the second probe (2602) will move to the left in FIG. However, if the area of the test object (2603) is small, the movement of the tip of the second probe part (2602) may cause the second probe part (2602) to go out of the test object (2603). . To prevent this, at least, after either one of the first probe part (2601) or the second probe part (2602) comes into contact with the object to be inspected (2603), the directional force on the shank side with respect to the Kelvin probe It is good (c) when we apply the force. The shank side is the handle side of the Kelvin probe, which is the right side in Fig. 26. In the example of FIG. 26, in order to reduce the force toward the shank side, the second probe (2604) contacts the object to be inspected (2603), and then rotated around the rotation axis (2604), The force that forces the first probe part (2601) and the second probe part (2602) to the shank side is covered. Note that the method for measuring the force applied to the shank side is not limited to the method shown in FIG. For example, the Kelvin probe may be lowered by rotating around the rotation shaft (2604) before the second probe portion (2602) contacts the object to be inspected.

 [0085] <Embodiment 10: Effect>

 With the inspection device of this embodiment, the two measuring elements can be reliably brought into contact with the inspection object, and the measurement accuracy can be improved.

 Brief Description of Drawings

 FIG. 1 is a conceptual diagram when a semiconductor is inspected by the Kelvin probe of the first embodiment.

 FIG. 2 is a schematic diagram when the Kelvin probe of Embodiment 1 is brought into contact with the connection pad of the object to be measured.

 FIG. 3 is a diagram illustrating an example of a tip portion of the Kelvin probe according to the first embodiment.

 FIG. 4 is a diagram illustrating an example of a tip portion of the Kelvin probe according to the first embodiment.

 FIG. 5 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a second embodiment.

 FIG. 6 is a diagram illustrating an example of a tip portion of the Kelvin probe according to the second embodiment.

 FIG. 7 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a third embodiment.

 FIG. 8 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a third embodiment.

 FIG. 9 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a third embodiment.

FIG. 10 is a diagram illustrating an example of a tip portion of the Kelvin probe according to the third embodiment. FIG. 11 is a diagram illustrating an example of a Kelvin probe according to the first embodiment.

圆 12] A diagram illustrating the flow of processing in the first embodiment.

圆 13] A conceptual diagram for explaining the first embodiment.

 FIG. 14 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a fifth embodiment.

 FIG. 15 is a diagram illustrating an example of a tip portion of a Kelvin probe according to a sixth embodiment.

 FIG. 16 is a diagram illustrating an example of a tip portion of the Kelvin probe according to the seventh embodiment.

 FIG. 17 is a diagram illustrating an example of a Kelvin probe and a manufacturing method thereof according to Embodiment 7.

 FIG. 18 is a diagram illustrating an example of a Kelvin probe according to an eighth embodiment.

 FIG. 19 is a diagram illustrating an example of a tip portion of a Kelvin probe according to an eighth embodiment.

 FIG. 20 shows an example of a Kelvin probe of Embodiment 8.

 FIG. 21 is a diagram illustrating an example of a tip portion of a Kelvin probe according to an eighth embodiment.

圆 22] A diagram showing a state in which the Kelvin probe of Embodiment 9 is in contact with the inspection object.圆 23] A diagram showing an example of the inspection apparatus of the tenth embodiment.

 FIG. 24 is a diagram illustrating an example of an inspection apparatus according to a tenth embodiment.

25] A diagram showing an example of an inspection apparatus according to the tenth embodiment.

 FIG. 26 is a diagram illustrating an example of an operation method of the inspection apparatus according to the tenth embodiment.

Explanation of symbols

 0201 Kelvin probe

 0202 Oxide film (A1 0)

 twenty three

 0203 Anoleum

Claims

The scope of the claims  [1] First stylus part;  A second probe portion insulated from the first probe portion by an insulating layer;  A powerful Kelvin probe,  A Kelvin probe having an elastic structure capable of elastic contact with an object to be inspected when only one of the first probe part and the second probe part is pinched.  [2] The insulating layer partially secures the first probe part and the second probe part, and makes the elastic structure by making the vicinity of the tip part of the probe non-fixed.  The Kelvin probe according to claim 1. [3] When the vicinity of the tip of any probe part is not in contact with the object to be inspected, the vicinity of the tip of both probe parts is in contact, and the vicinity of the tip of either probe part is in contact with the object to be inspected The Kelvin probe according to claim 1 or 2, wherein the contacting probe part is squeezed by the contact pressure, and the contact state is changed to the non-contact state. [4] The first probe part is an application needle having a structure having a small elasticity compared to the second probe part, and the second probe part has a structure having a large elasticity compared to the first probe part. The Kelvin probe according to any one of claims 1 to 3, wherein the probe is a detection needle. [5] The Kelvin probe according to any one of [1] to [4], wherein the first probe portion also has a tungsten-based barter material force, and the second probe portion has a stainless steel wire-like material force. [6] From claim 1, wherein the amount of protrusion differs between the first probe part and the second probe part depending on the direction to be examined The Kelvin probe described in 5! [7] The Kelvin probe according to claim 6, wherein the second probe portion protrudes more than the first probe portion in a direction directed to the inspection object. [8] By pressing against the object to be inspected, both the first probe part and the second probe part both come into contact with the object to be inspected via the second probe part. Load is 1 The Kelvin probe according to claim 7, wherein the second probe portion has elasticity such that the Og weight or less. 9. The Kelvin probe according to any one of claims 1 to 8, wherein the tip line of the second probe part is an acute angle with respect to the center line of the first probe part. 10. The Kelvin probe according to claim 9, wherein the acute tip end line of the second probe portion is formed by providing a plurality of bent nodes on the second probe portion. [11] The Kelvin probe according to any one of [1] to [10], wherein the first probe part and the tip of the second probe part are not on one axis with respect to the sliding direction of the probe. [12] An inspection apparatus comprising the Kelvin probe according to any one of claims 1 to 11. [13] An inspection target mounting table on which the inspection target is mounted;  A Kelvin probe holding part for holding the Kelvin probe according to any one of claims 1 to 11,  13. The inspection apparatus according to claim 12, wherein the Kelvin probe holding part lowers the tip of the measuring part having an elastic structure substantially perpendicular to the inspection target mounting plane of the inspection target mounting table. [14] an inspection object mounting table for mounting the inspection object;  A Kelvin probe holding part for holding the Kelvin probe according to any one of claims 1 to 10,  The Kelvin probe holding part is 90 degrees when the tip of the measuring part having an elastic structure with respect to the inspection target mounting plane of the inspection target mounting table is viewed from the inspection target mounting plane on the measuring part side having no elastic structure. 13. The inspection apparatus according to claim 12, wherein the inspection apparatus is lowered substantially vertically while maintaining an angle of less than.  [15] An operation method of the inspection apparatus having the Kelvin probe according to any one of claims 6 to 11, wherein at least one of the first probe part and the second probe part is in contact with the object to be inspected. After that, the operation method of the inspection apparatus having a step of applying a force on the shank side that counters the force on the shank side with respect to the Kelvin probe. [16] a first substrate preparing step of preparing a first substrate, a film insulating film arranging step of arranging a film insulating film on the first substrate surface prepared in the first substrate preparing step, The second substrate placement step for placing the second substrate so as to sandwich the film-like insulation film placed in the film-like insulation film placement step, and the film-like insulation film is narrowed in the second substrate placement step. A block forming process in which the first substrate and the second substrate, which are held and pressed, are pressed while being heated and integrated into a block by a film-like insulating film, and the block is subjected to wire discharge. The first substrate and the second substrate are insulated while being processed. A method for manufacturing a Kelvin probe, which has an outer shape processing step for processing each of the probe elements.  17. The method for producing a Kelvin probe according to claim 16, wherein the thickness of the film-like insulating film is not less than 5 microns and not more than 50 microns. [18] The method of manufacturing a Kelvin probe according to claim 16 or 17, wherein a cut-out width cut out in the outer shape processing step is in a range of 5 microns to 2 mm. [19] A Kelvin probe having a polygonal cross section.  20. The Kelvin probe according to claim 19, wherein the polygon is not a regular polygon but a polygon.  21. The Kelvin probe according to claim 19 or 20, wherein the polygon is an odd-sided polygon having an odd number of sides constituting the polygon. [22] The Kelvin probe according to any one of [19] to [21], wherein a cross section of the polygon is in a shank portion.  [23] A cross section of the polygon is at a tip, and when the tip is brought into contact with a connection pad of an object to be measured, any one of the apexes of the polygon is used. The Kelvin probe according to any one of claims 19 to 21, wherein the Kelvin probe is configured to come into contact with the Kelvin probe.  [24] The cross section of the polygon is at the tip. When the tip is brought into contact with the connection pad of the object to be measured, the connection pad contact surface is not contacted from the vertex of the polygon. The Kelvin probe according to any one of claims 19 to 21 configured as described above.  [25] The cross section of the polygon as defined in any one of claims 19 to 21, wherein the surface of the tip of the polygonal cross section that contacts the connection pad of the object to be measured is a curved surface. The described Kelvin probe.  26. The Kelvin probe according to any one of claims 19 to 25, wherein at least one side of the polygon is a curved line instead of a straight line. [27] Arranged so as to be sandwiched between the first and second probe parts, the first and second probe parts, and insulate the probe parts from each other 27. In addition, the insulating layer portion for integrally connecting the first measuring portion and the second measuring portion, and also a force! The Kelvin probe according to any one of the above. [28] The Kelvin probe according to [27], which is produced by the method for producing a Kelvin probe according to any one of [16] to [18]. [29] The Kelvin probe according to [27] or [28], wherein the insulating layer portion is arranged at a tip portion!  [30] The Kelvin probe according to any one of claims 19 to 29, wherein the tip is bent. 31. The chenolevin probe according to claim 30, wherein the bending is performed on either side of the probe pair.