[go: up one dir, main page]

WO2005020650A3 - Printed circuit board - Google Patents

Printed circuit board Download PDF

Info

Publication number
WO2005020650A3
WO2005020650A3 PCT/AT2004/000271 AT2004000271W WO2005020650A3 WO 2005020650 A3 WO2005020650 A3 WO 2005020650A3 AT 2004000271 W AT2004000271 W AT 2004000271W WO 2005020650 A3 WO2005020650 A3 WO 2005020650A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
loss
supporting material
comprised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2004/000271
Other languages
German (de)
French (fr)
Other versions
WO2005020650A2 (en
Inventor
Dietrich Juran
Gerald Eckl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG Oesterreich
Original Assignee
Siemens AG Oesterreich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG Oesterreich filed Critical Siemens AG Oesterreich
Publication of WO2005020650A2 publication Critical patent/WO2005020650A2/en
Publication of WO2005020650A3 publication Critical patent/WO2005020650A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/024Dielectric details, e.g. changing the dielectric material around a transmission line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0187Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention relates to a printed circuit board (1), comprised of a nonconducting supporting material (2) and of conductive structures (3a, , 3h) on the free surfaces and/or in the interior of the supporting material, to and/or into which structured loss layers (4a, , 4c) made of a material subject to loss are applied/inserted.
PCT/AT2004/000271 2003-08-20 2004-07-26 Printed circuit board Ceased WO2005020650A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA1311/2003 2003-08-20
AT13112003 2003-08-20

Publications (2)

Publication Number Publication Date
WO2005020650A2 WO2005020650A2 (en) 2005-03-03
WO2005020650A3 true WO2005020650A3 (en) 2005-06-09

Family

ID=34200459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2004/000271 Ceased WO2005020650A2 (en) 2003-08-20 2004-07-26 Printed circuit board

Country Status (1)

Country Link
WO (1) WO2005020650A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966294A (en) * 1996-12-20 1999-10-12 Nec Corporation Printed circuit board for prevention of unintentional electromagnetic interference
US20030062965A1 (en) * 2001-09-27 2003-04-03 Stephen Jensen Circuit board having ferrite containing layer
US20040018658A1 (en) * 2002-07-27 2004-01-29 Yasuhiko Mano Noise shield type multi-layered substrate and munufacturing method thereof
US20040121652A1 (en) * 2002-12-20 2004-06-24 Gailus Mark W. Interconnection system with improved high frequency performance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966294A (en) * 1996-12-20 1999-10-12 Nec Corporation Printed circuit board for prevention of unintentional electromagnetic interference
US20030062965A1 (en) * 2001-09-27 2003-04-03 Stephen Jensen Circuit board having ferrite containing layer
US20040018658A1 (en) * 2002-07-27 2004-01-29 Yasuhiko Mano Noise shield type multi-layered substrate and munufacturing method thereof
US20040121652A1 (en) * 2002-12-20 2004-06-24 Gailus Mark W. Interconnection system with improved high frequency performance

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"ELECTROMAGNETIC NOISE SUPPRESSION FOR ELECTRONICS CARDS AND BOARDS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 33, no. 7, 1 December 1990 (1990-12-01), pages 243 - 246, XP000108425, ISSN: 0018-8689 *
WAFFENSCHMIDT E ET AL: "Embedded passives integrated circuits for power converters", 33RD.ANNUAL IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE. PESC 2002. CONFERENCE PROCEEDINGS. CAIRNS, QUEENSLAND, AUSTRALIA, JUNE 23 - 27, 2002, ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, NEW YORK, NY : IEEE, US, vol. VOL. 2 OF 4. CONF. 33, 23 June 2002 (2002-06-23), pages 12 - 17, XP010596058, ISBN: 0-7803-7262-X *

Also Published As

Publication number Publication date
WO2005020650A2 (en) 2005-03-03

Similar Documents

Publication Publication Date Title
EP1164823A3 (en) Printed circuit board and method of manufacturing the same
SG116443A1 (en) Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same.
AU2003235219A1 (en) Flexible printed circuit board and process for producing the same
AU2001284499A1 (en) Photosensitive composition, cured article thereof, and printed circuit board using the same
AU6483199A (en) Electronic circuit board
SG115480A1 (en) Printed circuit board and its manufacturing method
EP1089334B8 (en) Ceramic circuit board
AU2003303968A1 (en) An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
EP1307075A3 (en) Prepreg and circuit board and method for manufacturing the same
AU6731400A (en) Wiring-connecting material and process for producing circuit board with the same
AU2001271381A1 (en) Vialess printed circuit board
AU2001240090A1 (en) Process for the manufacture of printed circuit boards with plated resistors
GB2375655B (en) Circuit board assembly
AU2001229588A1 (en) Printed circuit board assembly
GB2363257B (en) Printed circuit board
AU2003286422A1 (en) Photonic circuit board
AU2002308354A1 (en) Multilayer printed circuit board
SG91855A1 (en) Circuit board assembly
GB0001573D0 (en) Printed circuit board with fuse
DE69917083D1 (en) Printing process, circuit board and manufacturing process
GB2371411B (en) Circuit board mount
AU2003277566A1 (en) Printed wiring board and process for producing the same
WO2007078924A3 (en) Printed circuit board waveguide
WO2005020650A3 (en) Printed circuit board
IL148041A0 (en) Printed circuit board arrangement

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WA Withdrawal of international application