WO2005080485A1 - メッキ樹脂成形体 - Google Patents
メッキ樹脂成形体 Download PDFInfo
- Publication number
- WO2005080485A1 WO2005080485A1 PCT/JP2005/002834 JP2005002834W WO2005080485A1 WO 2005080485 A1 WO2005080485 A1 WO 2005080485A1 JP 2005002834 W JP2005002834 W JP 2005002834W WO 2005080485 A1 WO2005080485 A1 WO 2005080485A1
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- WO
- WIPO (PCT)
- Prior art keywords
- resin
- resin molded
- acid
- plating
- molded article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
Definitions
- the present invention relates to a plating resin molded product having a high plating strength and a method for producing a plating resin molded product which does not require an etching step.
- resin moldings such as ABS resin and polyamide resin are used as automobile parts.
- ABS resin and polyamide resin are used as automobile parts.
- copper, nickel, etc. It has been subjected.
- an etching step of roughening the resin molded article after the degreasing step is indispensable in order to increase the adhesion strength between the resin molded article and the plating layer.
- a chromic acid bath a mixture of chromium trioxide and sulfuric acid
- the wastewater contains toxic hexavalent chromate ions.
- Japanese Patent Application Laid-Open No. 2003-82218 solves such a problem of the prior art, and achieves high adhesion strength despite the fact that etching using a chromium bath is not required. Thus, a plating resin molded article having a metal plating layer is obtained.
- Japanese Patent Application Laid-Open No. 2003-81821 the surface of a resin molded product made of a polyamide and a styrene-based resin such as an ABS resin or a resin molded product made of a polypropylene is A metal resin molded body is disclosed. Disclosure of the invention
- the present invention provides a method for producing a resin mold, which has a high adhesion strength between the resin molded article and the plating layer and has a beautiful appearance, and an etching process using chromic acid or the like which is unnecessary.
- the task is to provide.
- the present inventors By mixing a chelating agent and the like into a thermoplastic resin to form a resin molded article, the present inventors have made it possible to form a resin molded article and a metal layer without etching treatment with an acid containing a heavy metal such as chromic acid. The present inventors have found that the adhesion strength of the steel can be dramatically improved, and completed the present invention.
- the present invention provides, as a means for solving the above problems, a mold resin molded article having a metal mold layer on a surface of a resin molded article containing a thermoplastic resin and a chelating agent, wherein the resin molded article is subjected to an etching treatment with an acid containing a heavy metal.
- the present invention provides a molded resin body which has not been subjected to any treatment.
- Another object of the present invention is to provide a method for producing a molded resin article as described above, comprising: a step of degreasing a resin molded article containing a thermoplastic resin and at least a chelating agent; and an electroless plating step. And a method for producing a plated resin molded article that does not include an etching step using an acid containing a heavy metal.
- the plating resin molded article of the present invention does not undergo etching treatment with an acid containing a heavy metal such as chromic acid and potassium permanganate, but has a plating layer with high adhesion strength.
- a heavy metal such as chromic acid and potassium permanganate
- wastewater treatment is easy and environmental pollution by heavy metals is eliminated.
- thermoplastic resin can be appropriately selected from well-known ones according to the intended use.
- a polyamide resin, a styrene resin, an olefin resin, a polyphenylene ether resin (PPE), Polyphenylene sulfone resin (PPS) and polysulfone resin are preferred.
- These thermoplastic resins have a water absorption (under water at 23 ° C, It is preferable that the water absorption after 24 hours and the ISO62) be 0.6% or more, more preferably 0.6 to 5%, and even more preferably 0.6 to 2%.
- the polyamide resin is a polyamide resin formed from diamine and dicarboxylic acid and a copolymer thereof, and may be crystalline, amorphous, or a mixture thereof. When both crystalline and non-crystalline materials are present, the degree of crystallinity is preferably 60% or less, more preferably 40% or less.
- Polyamide resins include nylon 66, polyhexamethylene sebacamide (nylon 6.10), polyhexamethylene dodecanamide (nylon 6-12), polydodemethylene dodecanamide (nylon 12 2), polymethaxylylene dipamide (nylon MXD6), polytetramethylene adipamide (nylon 46), and mixtures and copolymers of these; / 0 or less is nylon 66/6 T (6 T: poly hexamethylene terephthalate Tarami de), 6 I component is 50 mole 0/0 less nylon 66Z6 I (6 1: Poly to Kisamechire N'isofutarami de), nylon ⁇ ⁇ ⁇ Copolymers such as nylon 6 ⁇ / 6 1/6 10; polyhexamethylene terephthalamide (nylon 6 ⁇ ), polyhexamethylene isophthalamide (nylon 6I), poly (2-methyl) Copolymers such as pentamethylene) terephthalamide (nylon ⁇ 5 ⁇ ), poly (2-methylpentam
- nylon 6 poly- ⁇ -indene force amide
- nylon 12 poly- — ⁇ —aliphatic polyamide resins
- copolymers with polyamides consisting of diamines and dicarboxylic acids specifically nylon 6 ⁇ / 6, nylon 6 TZ11 1, nylon 6 ⁇ / 12, nylon ⁇ nylon 6T / 6 IZ61 / 10/12 and mixtures thereof.
- PA (nylon) 6, PA (nylon) 66, and PA (nylon) 6/66 are preferable as the polyamide resin.
- styrene-based resin examples include polymers of styrene and styrene derivatives such as ⁇ -substituted and nucleated styrene. Also, a copolymer mainly composed of these monomers and a monomer of a vinyl compound such as acrylonitrile, acrylic acid and methacrylic acid and / or a conjugated diene compound such as butadiene and isoprene is used. Is also included.
- polystyrene, high-impact polystyrene (HIPS) resin, acrylonitrile-butadiene-styrene copolymer (ABS) resin, atarilonitrile-styrene copolymer (AS resin), styrene-methacrylate copolymer (MS resin), styrene Monobutadiene copolymer (SBS resin) and the like can be mentioned.
- the polystyrene-based resin may include a styrene-based copolymer obtained by copolymerizing a carboxyl group-containing unsaturated compound for improving compatibility with the polyamide-based resin.
- the styrenic copolymer in which the carboxyl group-containing unsaturated compound is copolymerized, the carboxyl group-containing unsaturated compound and, if necessary, other monomers copolymerizable therewith in the presence of the rubbery polymer. Is a copolymer obtained by polymerizing Specific examples of the components
- styrene is preferable as the aromatic biel, and acrylonitrile is preferable as the monomer copolymerized with the aromatic vinyl.
- the content of the unsaturated compound having a carboxyl group is preferably 0.1 to 8% by mass, more preferably 0.2 to 7% by mass in the styrene resin.
- Olefin-based resin is a polymer whose main monomer component is monoolefin having 2 to 8 carbon atoms.Low-density polyethylene, high-density polyethylene, linear low-density polyethylene, polypropylene, ethylene-propylene random copolymer And at least one selected from ethylene-propylene block copolymer, polymethylpentene, polybutene_1, and modified products thereof. Of these, polypropylene and acid-modified polypropylene are preferable.
- the chelating agent is a component that acts so that the metal contained in the plating bath easily adheres to the surface of the resin molded product.
- those selected from the following groups can be used.
- Aliphatic diamines such as methylenediamine, ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, o_, m- and p-phenylenediamine, benzidine, diaminostilbene Aromatic diamines such as
- Ethane-1,1,1-diphosphonic acid ethane-1,1,2-triphosphonic acid, ethane-1-hydroxy-1,1,1-diphosphonic acid and derivatives thereof, ethanehydroxy-1,1,2-triphosphonic acid, ethane-1 Phosphonic acids such as 1,2-dicarboxy-1,2-diphosphonic acid and methanehydroxyphosphonic acid, or metal salts or alkanolamines thereof;
- Phosphonocarboxylic acids such as 2-phosphonobutane-1,2-dicarboxylic acid, 1,1-phosphonobutane-1,2,3,4-tricarboxylic acid, ⁇ -methylphosphonosuccinic acid, etc. or their metal salts or salts Monolamine salt;
- Amino acids such as aspartic acid, glutamic acid, and glycine or their alkalis Metal salts or alkanolamine salts;
- Aminopolyacetic acids such as triacetate triacetic acid, imino diacetic acid, ethylene diamine tetraacetic acid, diethylene triamine pentaacetic acid, glycol ether diamine tetraacetic acid, hydroxyethyl imino diacetic acid, triethylene tetramine hexaacetic acid, and jencoric acid or these
- Glyconoleic acid diglyconicoleic acid, oxydisuccinic acid, carboxymethinoleoxysuccinic acid, citric acid, malonic acid, lactic acid, tartaric acid, oxalic acid, malic acid, oxydisuccinic acid, dalconic acid, carboxymethylsuccinic acid, carboxymethyltartaric acid, ⁇ - Organic acids such as hydroxypropionic acid and ⁇ -hydroxyisobutyric acid, or their metal salts or salts;
- the content ratio of the thermoplastic resin and the chelating agent in the resin molded product is preferably from 0.1 to 20 parts by mass, more preferably from 0.1 to 20 parts by mass, based on 100 parts by mass of the thermoplastic resin. 5 parts by mass is more preferable, and 0.1 to 10 parts by mass is further preferable.
- a water-soluble substance refers to a substance that is soluble in water, regardless of its solubility.
- Polyhydric alcohols such as antaerythritol and glycerin; polyvinylinole alcohol, polyatarylic acid, polymaleic acid, polyacrylamide, polyvinylpyrrolidone, polyethyleneoxide, acrylic acid monoanhydride Maleic anhydride, diisobutylene maleic anhydride copolymer, maleic anhydride monoacetate copolymer, naph Tallen sulfonate formalin condensate and salts thereof can be mentioned.
- those which are soluble in water but have low solubility are preferred.
- those having 0 g / 100 g or less are more preferred, and those having 10 g / 100 g or less are still more preferred.
- Examples of such a substance include pentaerythritol (7.2 g / 100 g), dipentaerythritol (0.1 g / 100 g or less), and the like.
- the content ratio of the thermoplastic resin and the water-soluble substance in the resin molded product is preferably 0.01 to 50 parts by mass, more preferably 0.01 to 50 parts by mass, with respect to 100 parts by mass of the thermoplastic resin. To 30 parts by mass, more preferably 0.01 to 15 parts by mass.
- the resin molding of the present invention contains a surfactant and Z or a coagulant in the resin molding.
- surfactants and / or coagulants may be those in which the surfactant (emulsifier) used when emulsion polymerization is applied during the production of the thermoplastic resin remains in the resin, or may be used for bulk polymerization or the like.
- a production method that does not use an emulsifier it may be added separately to a thermoplastic resin.
- the surfactant and Z or the coagulant may be those used in the emulsion polymerization of the resin, or may be other than those used in the emulsion polymerization, and the surfactant may be an anionic surfactant, a cation surfactant, or a nonionic surfactant.
- An ionic surfactant and a non-ionic surfactant are preferred.
- surfactants include fatty acid salts, rosinates, alkyl sulfates, alkyl benzene sulfonates, alkyl diphenyl ether sulfonates, polyoxyethylene alkyl ether sulfates, sulfosuccinic acid diester salts, ⁇ - ⁇ Anionic surfactants such as olefin sulfates and ⁇ -olefin sulfonates; cationic surfactants such as mono- or dialkylamines or polyoxyethylene adducts thereof, and mono- or di-long-chain alkyl quaternary ammonium salts; Agents: alkyl darcoside, polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sucrose fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene fatty acid ester, polyoxy Nonionic surfactants such as ethylene prop
- the content of the surfactant and / or coagulant in the resin molded body is preferably from 0.01 to 10 parts by mass of the surfactant and / or coagulant with respect to 100 parts by mass of the thermoplastic resin. 0.01 to 5 parts by mass is more preferable, and 0.01 to 2 parts by mass is even more preferable.
- the adhesive resin molded article of the present invention preferably has a maximum value of 10 kPa or more, more preferably a maximum value of 5 kPa, of the adhesion strength (JISH 8630) between the luster molded article and the metal plated layer. 0 kPa or more, more preferably the highest value is 100 kPa or more, particularly preferably the highest value is 150 kPa or more.
- the shape, the type and the thickness of the plating layer of the plating resin molded article of the present invention can be appropriately selected according to the application, and can be applied to various applications.
- bumpers, emblems, wheel caps, and interior parts It is suitable for automotive parts such as exterior parts.
- the production method of the present invention includes a degreasing step and an electroless plating step, and preferably includes at least a step of treating with a catalyst-providing liquid between the two steps. Normal processing steps performed by a trader can be added as appropriate.
- a resin molded body containing a thermoplastic resin, a chelating agent, a water-soluble substance, a surfactant, and the like is degreased.
- the resin molded body is obtained by molding into a desired shape suitable for the application by a known method such as injection molding.
- the degreasing treatment is performed with an aqueous solution of a surfactant containing an acid such as sodium hydroxide or sodium carbonate or an acid such as sulfuric acid or carbonic acid.
- a surfactant containing an acid such as sodium hydroxide or sodium carbonate or an acid such as sulfuric acid or carbonic acid.
- an electroless plating step or another step it is possible to shift to an electroless plating step or another step, and to use a chromic acid, potassium permanganate, or the like, which is a roughening treatment for increasing the adhesion strength of the plating layer.
- An etching step using an acid containing heavy metals chromium, manganese, etc. in the present invention
- a step of treating with a chemical solution (an activation step) and a washing step can be performed.
- the step of treating with the catalyst imparting liquid and the step of treating with the activating liquid can be performed simultaneously.
- the treatment with the catalyst-imparting solution is carried out, for example, by immersing tin chloride (20 to 40 g I- 1 ) in a 35% hydrochloric acid solution (10 to 20 mgl) at room temperature for about 1 to 5 minutes. treatment with liquid are palladium chloride (0:.!.! ⁇ 0 3 gl- Li of 35% hydrochloric acid solution (3 ⁇ 5 mg 1 - 1) in, at room temperature: immersed to 2 minutes.
- plating bath a bath containing nickel, copper, konokoleto, nickel-cobalt alloy, gold and the like, and a reducing agent such as formalin and hypophosphite can be used.
- the pH and temperature of the plating bath are selected according to the type of plating bath used.
- an electric plating step using copper or the like may be added after the activation treatment using an acid or an alkaline metal.
- the surface layer of the thermoplastic resin molded article having a good water absorption swells to form a swelled layer.
- the catalyst component penetrates into the swelling layer, and the plating metal adheres to the nucleus with the catalyst component as a nucleus.
- the metal plating layer having high adhesion strength is formed on the surface of the molded body as a result of the growth of the plating from inside the swelling layer in this manner.
- the chelating agent contained in the resin molded body acts to promote the capture of the plating metal.
- the adhesion strength (maximum value) between the resin molded body and the metal plating layer was measured by the adhesion test method described in JIS H8630 Annex 6 using the molded resin bodies obtained in the Examples and Comparative Examples. .
- A-2) Polyamide 66, UBE Nylon 66 2020B manufactured by Ube Industries, Ltd., Water absorption 1.3%
- ABS resin styrene content 45 mass 0/0, Accession Rironitoriru 15 mass 0 /, rubber of 40 mass 0 /..
- A- 5 acid-modified ABS resin (styrene content 42 mass 0/0, Atari Roni preparative Rinore 1 6 mass 0/0, rubber of 40 mass 0/0, methacrylic acid 2 wt 0/0)
- A- 6 acid-modified AB S resin (styrene content 40 mass 0/0, Akuriro two Torinore 1 4 mass 0/0, rubber of 40 mass 0/0, methacrylic acid 6 weight 0/0).
- B chelating agent (B-1): EDTA 2Na 2H20 (Quartlet N, manufactured by Nagase Chemtech) (B-2): EDTA Fe Na 2H20 (Quartet Fe, manufactured by Nagase Chemtech) (B-3): TTHA 6Na (Quartet TH, manufactured by Nagase Chemtech)
- thermoplastic resin is indicated by mass%, other components are indicated by mass parts with respect to 100 parts by mass of the thermoplastic resin.
- a composition with the combination and ratio shown in Tables 1 and 2 [Thermoplastic resin is indicated by mass%, other components are indicated by mass parts with respect to 100 parts by mass of the thermoplastic resin].
- V-type tumbler twin screw extrusion
- the mixture was melted and kneaded on a machine (made by Nippon Steel, ⁇ 30, cylinder temperature 230 ° C) to obtain a pellet.
- a 100 x 50 x 3 mm compact was obtained using an injection molding machine (cylinder temperature 240 ° C, mold temperature 60 ° C), and this compact was used as a test piece in the following process order.
- the plating was performed to obtain a molded resin molded product. Table 1 shows the test results.
- Degreasing step The test piece was immersed in a 5 ° gZL aqueous solution (liquid temperature 40 ° C) of Aceculin A-220 (manufactured by Okuno Pharmaceutical Co., Ltd.) for 20 minutes.
- Catalyst application step A test solution was prepared by mixing a test piece with 35 mass% hydrochloric acid (15 Om1 L) and Cyarist C (Okuno Pharmaceutical Co., Ltd.) 4 Om1 ZL aqueous solution (liquid temperature: 25 ° C) Immersed for 3 minutes. ⁇
- First activation step The test piece is treated with a 98% by mass sulfuric acid 100 ml ZL aqueous solution (liquid temperature (40 ° C) for 3 minutes.
- Second activation step The test piece was immersed in an aqueous solution of sodium hydroxide (15 g, L) (liquid temperature: 40 ° C) for 2 minutes.
- Nickel electroless plating process A test piece was prepared using chemical nickel HR-TA (manufactured by Okuno Seiyaku Kogyo Co., Ltd.) 150 ml ZL and chemical nickel HR-TB (manufactured by Okuno Pharmaceutical Co., Ltd.) 1 50 m 1 _ L for 5 minutes in a mixed aqueous solution (liquid temperature 40 ° C).
- Acid activating step The test piece was immersed in Topsun (manufactured by Okuno Pharmaceutical Co., Ltd.) 100 g / L aqueous solution (liquid temperature 25 ° C) for 1 minute.
- Chloride ion (C 1 _) 5m 1 / L Chloride ion (C 1 _) 5m 1 / L
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemically Coating (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-043926 | 2004-02-20 | ||
| JP2004043926A JP2005232338A (ja) | 2004-02-20 | 2004-02-20 | メッキ樹脂成形体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005080485A1 true WO2005080485A1 (ja) | 2005-09-01 |
Family
ID=34879325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/002834 Ceased WO2005080485A1 (ja) | 2004-02-20 | 2005-02-16 | メッキ樹脂成形体 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005232338A (ja) |
| TW (1) | TW200602396A (ja) |
| WO (1) | WO2005080485A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4468295B2 (ja) * | 2005-12-15 | 2010-05-26 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
| JP4275157B2 (ja) * | 2006-07-27 | 2009-06-10 | 荏原ユージライト株式会社 | プラスチック表面の金属化方法 |
| JP5080117B2 (ja) * | 2006-08-04 | 2012-11-21 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
| JP5364237B2 (ja) * | 2006-08-28 | 2013-12-11 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
| JP5138394B2 (ja) * | 2008-01-21 | 2013-02-06 | 日立マクセル株式会社 | ポリマー部材 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001031788A (ja) * | 1999-07-22 | 2001-02-06 | Teijin Meton Kk | メッキされた架橋重合体成形物 |
| US20030059621A1 (en) * | 2001-09-11 | 2003-03-27 | Toshihiro Tai | Plating resin molded article and process for producing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07111385A (ja) * | 1993-10-12 | 1995-04-25 | Hitachi Chem Co Ltd | 導電性ポリマーを用いるスルーホールのめっき前処理液 |
| JP3150590B2 (ja) * | 1995-11-29 | 2001-03-26 | 株式会社日立製作所 | 無電解めっきの下地処理方法 |
| JP2003193247A (ja) * | 2001-12-25 | 2003-07-09 | Toyota Motor Corp | 無電解めっき素材の前処理方法 |
-
2004
- 2004-02-20 JP JP2004043926A patent/JP2005232338A/ja active Pending
-
2005
- 2005-02-16 WO PCT/JP2005/002834 patent/WO2005080485A1/ja not_active Ceased
- 2005-02-18 TW TW094104745A patent/TW200602396A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001031788A (ja) * | 1999-07-22 | 2001-02-06 | Teijin Meton Kk | メッキされた架橋重合体成形物 |
| US20030059621A1 (en) * | 2001-09-11 | 2003-03-27 | Toshihiro Tai | Plating resin molded article and process for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200602396A (en) | 2006-01-16 |
| JP2005232338A (ja) | 2005-09-02 |
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