[go: up one dir, main page]

WO2004096679A1 - Dispositif de levitation de substrat - Google Patents

Dispositif de levitation de substrat Download PDF

Info

Publication number
WO2004096679A1
WO2004096679A1 PCT/JP2004/006000 JP2004006000W WO2004096679A1 WO 2004096679 A1 WO2004096679 A1 WO 2004096679A1 JP 2004006000 W JP2004006000 W JP 2004006000W WO 2004096679 A1 WO2004096679 A1 WO 2004096679A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
glass substrate
contact
floating
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/006000
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Okahira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to CN2004800004365A priority Critical patent/CN1697768B/zh
Priority to JP2005504478A priority patent/JP4418428B2/ja
Priority to KR1020047020899A priority patent/KR101053770B1/ko
Publication of WO2004096679A1 publication Critical patent/WO2004096679A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a substrate floating method for floating a glass substrate used for a front panel display (FPD) such as a liquid crystal display (LCD), for example.
  • FPD front panel display
  • LCD liquid crystal display
  • Publication 8-3 1 3 8 1 5 discloses a positioning device for glass substrates.
  • a holding stage for holding the glass substrate by suction is placed on the XY stage via the pole caster, and this holding stage is moved by the urging of the pressing cylinder. Press the edge of the glass substrate directly against each reference pin to align.
  • the size of the holding stage and the X-Y stage that hold the glass substrate by suction also increase.
  • the XY stage requires four times the installation space of the glass substrate to move the glass substrate in the XY direction and observe the entire surface of the glass substrate with a microscope, and the entire apparatus is large.
  • the weight of the weight holding stage increases due to the increase in size of the holding stage, the holding stage is moved and when the side edge of the glass substrate is pressed directly against each reference pin, the glass is impacted by the impact. The substrate may be damaged.
  • the operation of the cylinder is performed with the glass substrate placed on a large number of rollers of the filtration conveyance unit.
  • a technique is disclosed in which a glass substrate is pressed against a positioning pin and aligned. In such an alignment, as the size of the glass substrate is increased, the frictional resistance between the glass substrate and the large number of rollers is increased, and the glass substrate is used as a positioning pin by means of a cylinder. It becomes difficult to press o Also, when the glass substrate is pressed in the direction perpendicular to the direction of rotation of the many rollers, the glass substrate slides on the many rollers and moves. For this reason, there is a possibility that a trace of friction may occur on the back surface of the glass substrate.
  • the force is large, and the glass substrate may be damaged o Also, by floating the glass substrate by electrostatic force etc., the distance between the surface of the floating stage and the surface of the glass substrate Because the friction force is extremely small, there is a problem that the glass substrate is transferred by small external force or its own inertial force during delivery of the glass substrate or glass substrate.
  • a floating means for floating a substrate, a contact member capable of contacting the back surface of the substrate, and a tip member A substrate floating apparatus comprising: a support member provided on the substrate; and an elevating mechanism which raises the support member and brings the contact member into contact with the back surface of the substrate floating by the floating means to restrict the movement of the substrate.
  • FIG. 1 is a block diagram showing a first embodiment of a first substrate floating apparatus according to the present invention.
  • FIG. 2 is a block diagram of a second substrate floating apparatus according to the present invention.
  • FIG. 3 is a block diagram showing the substrate levitation system of the LCD production line to which the same system is applied.
  • Fig. 4 shows the configuration of each transport unit in the LCD manufacturing line.
  • Figure 5 shows the same device regulating the movement of the glass substrate.
  • Figure 6 shows the appearance of the floating stage used in the board inspection system to which the same system is applied.
  • FIG. 7 is a block diagram showing a second embodiment of a substrate floating apparatus according to the present invention.
  • FIG. 8 shows another holding mechanism of the contact film in the same device.
  • Fig. 1 shows the entire configuration of the first substrate floating apparatus.
  • the surface 1 a of the floating stage 1 is regularly provided with a plurality of air blowout holes 1 h for blowing out air at a constant pressure of air.
  • This levitation stage 1 has a glass substrate 2 on the surface 1 a. 0
  • the floatation stage 1 floats the glass substrate 2 such as electrostatic levitation or ultrasonic levitation from the stage surface, not limited to air levitation, and floats the glass substrate 1 on the surface of the levitation stage 1. As long as it
  • the floating stage 1 is provided with a first substrate holding mechanism 3A.
  • the first substrate holding mechanism 3 A is HX-embedded in a cylindrical hole 4 vertically penetrating the floating stage 1.
  • a U-shaped supporting member 5 is disposed below the U-shaped bottom plate 5 a to form a gru
  • an air pressure cylinder 6 is provided which can be attached by an actuator o
  • the telescopic port 7 of the pneumatic cylinder 6 projects from the telescopic rod 7 of the pneumatic cylinder 6 which protrudes above the U-shaped base plate 5 a through the hole provided in the u-shaped base plate 5 a At the tip, the screw
  • the substrate holding member 10 is connected via a connecting portion consisting of 8 and 9.
  • the substrate holding member 10 is provided with a support base 1 1 and a support rod 1 2 coaxially with the telescopic rod 7.
  • the support base 1 1 is formed in a cylindrical shape, and is connected to the tip of the telescopic rod 7 via a screw 8 and a nut 9.
  • the support rod 1 2 is provided on the support base 1 1 and formed in a cylindrical shape having an outer diameter smaller than the outer diameter of the support base 1 1.
  • a cylindrical contact member 1 3 made of a wear resistant resin is attached to the tip of the support rod 1 2. This contact point 04 00600
  • the material 13 is provided with a hole 13a in the lower surface 15 of the rod 13 slightly larger than the outer diameter of the support rod 12.
  • a support rod 12 is inserted into the hollow portion of the contact member 13 through the hole 13a.
  • a contact member 1 3 is rotatably provided on the support rod 1 2 in the direction of arrow A via a cylindrical ball support 1 6 and a pole bearing 1 7.
  • An elastic member such as, for example, a spring 8 is provided on the outer periphery of the support rod 12 between the lower surface 15 of the contact member 13 and the upper surface 1 1 a of the support base 1.
  • the biasing force of the coil spring 1 8 squeezing the material 1 3 upward (the elastic force> represents the contact force of the contact member 1 3 against the back surface of the glass substrate 2 that floats and draws). That is, the inertia is caused by the external force or the weight which is smaller than the contact pressure to the glass substrate 2 when the floating glass substrate 2 is pressed or the contact pressure to the glass substrate 2 when the transfer portions 32 to 35 are not attracted.
  • the contact member 1 3 is set to contact the back surface of the glass substrate 2 with a small contact force that does not move or with a slight application force that does not affect the glass substrate 2 with friction marks and deformation.
  • This contact member 1 3 is supported via coil spring 1 8 It is supported for vertical movement in the direction of arrow B 1 2 of the tip.
  • the expansion stroke of the expansion lock K 7 by the pneumatic cylinder 6 is the upper surface 14 of the contact member 1 3 when the expansion port 7 is compressed, and the glass substrate floated on the floating stage 1
  • the contact member 13 is brought into contact with the lower surface of the glass substrate 2 which floats up to the lower surface of the contact member, and the contact resistance is generated to such an extent that the glass substrate 2 is not moved. It is preset to the total length of the minute distance of.
  • FIG. 2 is an overall block diagram of a second substrate floating apparatus.
  • the floating stage 1 is provided with a second substrate holding mechanism 3B.
  • a support housing 20 is connected to a tip end of the expansion / contraction opening 7 of the pneumatic cylinder 6 of the second substrate holding mechanism 3 B via a reinforcement PP 8 and a nut 9 and is drawn.
  • the support case 20 is formed, for example, in a cylindrical shape, and a suction pad mounting hole 21 is provided in the inside. Inside the suction pad mounting hole 21 is formed an annular lateral groove portion 2 3 that restricts the vertical movement of the suction pad 2 2.
  • the lateral groove portion 2 3 has an inner diameter larger than the inner diameter of the suction pad mounting hole 2 1.
  • the suction pad 2 2 is P via the bellows 25 which is a suction pad supporting member made of an elastic member such as rubber, resin or metal which expands and contracts in the vertical direction. I'm sorry.
  • the suction pad 2 2 doubles as a contact member formed of a friction-resistant resin, for example, in a disk shape.
  • the suction pad 22 is formed with, for example, a circular patch groove 26 at the upper portion, and a locking ring 27 ⁇ that restricts vertical movement at the lower portion.
  • the locking ring 27 is mounted in the lateral groove 23.
  • Air flow passages 2 8 a to 2 8 c are provided in communication between the suction pads 2 2, the bellows 2 5, and the support housing 2 0.
  • the air flow passage 2 8 c is bent in the support housing 20 to reach the outer wall surface of the support housing 20, and the air suction port 2 9 is formed in the outer wall surface.
  • a suction pump is connected to the air suction port 2 9 via a suction tube 2 4 or the like.
  • the back surface of the glass substrate 2 is adsorbed and fixed to the suction pad 2 2 by suctioning the suction pump with a suction pump through each of the first-class passages 2 8 a to 2 8 c. .
  • the suction pressure by the suction pump is the suction pad to the back of the glass substrate 2 that is rising, 2 2
  • suction pressure it is also possible to set the suction pressure to such an extent that the friction force between (contact member) and the glass substrate 2 does not move due to a small external force or self weight.
  • the biasing force (elastic force) of the base 2 5 is the optimum value of the contact pressure of the suction pad 2 2 against the back surface of the glass substrate 2 which is floating, that is, the pressing pin for which the glass substrate 2 which is floating is described later Four
  • the expansion / shrinkage of expansion / shrink port 7 by pneumatic cylinder 6 is the lower surface of glass substrate 2 floating on the upper surface of floating stage 1 from the upper surface of suction pad 2 2 when expansion / contraction 7 is shrunk.
  • the distance is set in advance to such a length that a minute distance that causes contact resistance to move the glass substrate 2 in contact with the lower surface of the glass substrate 2 on which the suction pad 2 2 floats is generated. .
  • Figure 3 applies the first and second substrate holding mechanisms 3A and 3B.
  • FIG. 6 is a block diagram showing a substrate floating device of a line made of L C D.
  • a plurality of air blowing holes 1 h are regularly provided in the vertical and horizontal directions on the surface 1 a of the floating stage 1 for transfer.
  • Guide rails 3 0 and 3 1 in linear form are provided on both sides of the floating stage 1. These guide rails 3
  • each of 0 and 3 for example, two sets of transport units 3 2 3 3 and 3 4 3 5 5 driven by a re-air motor are provided movably.
  • Each of the transport units 32 and 33 in one set reciprocates on each guide rail 30 and 31 in the direction of arrow C in synchronization with each other, and each transport unit 34 and 35 in the other set also Each guide rail 3 0, synchronized with each other
  • FIG. 4 is a block diagram of each of the transport sections 3 2 to 3 5. Since the transport units 32 to 35 have the same configuration, only the configuration of the transport unit 3 2 will be described.
  • a suction table 3 8 is provided on the transfer section 32 via the raising and lowering support members 3 6 and 3 7. Each raising and lowering support member 3 6, 3 7 synchronizes the suction mounting table 3 8 in the vertical direction
  • a plurality of, for example, five substrate suction devices 3 9 are provided on the suction mounting table 38 in the same direction as the transport direction E of the glass substrate 2.
  • the number of installed substrate suction devices 3 9 is not limited to five, and any number may be provided.
  • Each substrate suction device 3 9 sucks and holds the back of the glass substrate 2 by suction of air.
  • a substrate delivery part S for delivering the glass substrate 2 conveyed from the upstream side to the downstream detection part S 2 and the substrate delivery part And an inspection unit S 2 provided downstream of the sensor.
  • a plurality of cylindrical holes 4 are provided in the floating stage 1 at the substrate delivery portion S, and a first substrate holding mechanism 3A shown in FIG. 1 is provided in each of the holes 4 as a substrate holding mechanism. It is These first substrate holding mechanisms 3A are provided, for example, at four positions corresponding to the respective corner positions of a rectangle having a longitudinal direction in the L CD manufacturing line direction.
  • the first substrate holding mechanism 3 A can raise the glass substrate 2 almost horizontally by the air on the floating stage 1, so for example, at one place corresponding to the approximate center position of the glass substrate 2. It is also possible to provide it.
  • the inspection section S 2 is provided with reference pins 4 2 fixedly provided and pressing pins 4 3 movable in the direction of pressing the edge of the glass substrate 2 (arrow G direction).
  • a portal arm 4 4 is provided across the floating stage 1 in the inspection section S 2 .
  • the portal arm 4 4 is movable in the same direction (arrow F direction) as the transport direction E of the glass substrate 2.
  • a microscope head 4 5 is provided on the portal arm 4 4 so as to be movable in a direction perpendicular to the transport direction E (direction of arrow J>)
  • the portal arm 4 4 floats the glass substrate 2. It may be fixedly installed if it is moved at a predetermined pitch in the direction of arrow E by the transport sections 34 and 35 in a state of being floated on the stage 1.
  • An air layer is formed between 1 a and the glass substrate 2, and the glass substrate 2 floats on the surface 1 a of the floating stage 1.
  • the respective substrate suction devices 3 9 of the transport sections 32 3 and 3 3 adsorb and hold the leading edge of the glass substrate 2 on which the air is floated in the transport direction E.
  • These transport units 32 and 33 move on the respective guide rails 30 and 31 in synchronization in the transport direction E of the LCD manufacturing line while holding the glass substrate 2 by suction. ⁇ . As a result, the glass substrate 2 floated by air is transferred to each
  • each first substrate holding mechanism 3 A is synchronized with each other and each expansion / contraction port of each pneumatic cylinder 6, 7 is a predetermined expansion / contraction opening Extend upwards.
  • the contact members 13 are raised along the support rods 12 along with the extension of the extension arms 7.
  • the extension heights of the extension arms 7 are predetermined. When the height is reached, each pneumatic cylinder 6 stops the expansion of each telescopic port 7 respectively.
  • each contact member 13 of each pneumatic cylinder 6 comes in contact with the back surface of the glass substrate 2 that is air-floated as shown in FIG.
  • the contact of the upper surface 14 of each contact member 1 3 with the back surface of the glass substrate 2 is determined by the biasing force of each coil spring 1 8.
  • Each contact member 1 3 is made of resin, is rotatable with respect to each support rod 1 2 via the Bonoring 1 7, and is biased by the biasing force of each of the Coinole Springs 1 8. Since it is provided so as to be movable in the direction, it can rotate or move up and down according to the posture of the glass substrate 2 and the contact members 1 3 when it contacts the back surface of the glass substrate 2. Contact the back side of the glass substrate 2.
  • each contact member 1 3 is stopped at the same height position by the extension of each expansion / contraction V to the pre-set height of each pneumatic cylinder 6. By this, the glass substrate 2 is transferred in the horizontal state. It is held without movement.
  • each of the transport units 32 3 stops the adsorption holding on the glass substrate 2 and returns to the loading side (upstream side) of the glass substrate 2.
  • the transport units 34 and 35 move to the top side of the transport direction E of the glass substrate 2 in the substrate delivery unit S, and these transport units 34 , 35 each substrate suction device 3 9 starts the suction operation.
  • the first substrate holding mechanisms 3 A synchronize each other with the expansion and contraction rods 7 of the pneumatic cylinders 6. Shrink.
  • Each first substrate holding mechanism 3 A is separated from the back surface of the glass substrate 2, and the glass substrate 2 floats on the floating stage 1.
  • the transfer units 34 and 35 move on the respective guide rails 30 and 31 in synchronization with the downstream side of the LCD manufacturing line in a state where the glass substrate 2 is adsorbed and held, and the glass substrate 2 is moved. fast transport up inspection unit S 2.
  • each second substrate holding mechanism 3B shown in FIG. 2 in the inspection section S 2 synchronizes each other with the expansion and contraction ports 7 of each pneumatic cylinder 6 in synchronization with each other.
  • Stretch upward by a preset stretch stroke Along with the expansion of the expansion rod 7, the suction pad 2 2 provided on the support housing 20 rises.
  • the pneumatic cylinder 6 stops stretching the stretch rod 7. By this, each suction pad 2 2 is in contact with the back surface of the glass substrate 2 that is air-floating.
  • each suction pad 2 2 is determined by the pressing force of the pressing pin 4 3 or the dead weight of the glass substrate 2 air-floating by the biasing force of the bellows 25. It contacts the back of the glass substrate 2 with a small frictional force that does not move further, and regulates the movement of the glass substrate 2 floating on the air. That is, each suction pad 2 2 temporarily moves the glass substrate 2 by the frictional force that acts on the back surface of the glass substrate 2 so that the glass substrate 2 can move following the movement of each pressing pin 43. Stop.
  • each pressing pin 4 3 when each pressing pin 4 3 is pressed against the edge of the glass substrate 2, the glass substrate 2 follows the pressing pin 4 3 (a state in which the glass substrate 2 does not separate from each pressing pin 4 3 The two adjacent sides of the glass substrate 2 abut each reference pin 4 2 and are aligned to the reference position. Before this alignment is started, each of the transport units 3 4 and 3 5 stops adsorption and holding of the glass substrate 2 and moves to the substrate delivery unit S side.
  • Suction pad 2 2 descends.
  • the suction pad 2 2 has its lower end in the annular lateral groove portion 2 3 abutted with the locking ring 2 7 of the suction pad 2 2 so that the descent is restricted.
  • the portal arm 4 2 is in the same direction as the transport direction E of the glass substrate 2 (arrow As the microscope head 4 3 moves on the portal arm 4 2 in the direction perpendicular to the transport direction E (in the direction of the arrow J) while moving in the direction F), the inspection on the glass substrate 2 is performed. It takes place.
  • the glass substrate 2 in the good power sale to the substrate transfer portion S of LCD production line for air transport is provided a first substrate holding mechanism 3 A, it provided the second substrate holding mechanism 3 B to the inspection unit S 2.
  • the substrate delivery unit S i each transport unit 3 2 to the glass substrate 2,
  • the glass substrate 2 is temporarily held by the first substrate holding mechanism 3 A and can be stopped without moving. In the case of a flat state only by air floating, the glass substrate 2 is moved by an external force such as slight inclination or downflow, for example. However, the first substrate holding mechanism 3 A and the glass substrate The movement of the glass substrate 2 can be regulated by the friction force with 2.
  • the biasing force of the coil spring 18 is set to the optimum value even when the first substrate holding mechanism 3 A contacts the back surface of the glass substrate 2 that is air-floating at the substrate delivery portion S.
  • the sliding movement of the glass substrate 2 on the first substrate holding mechanism 3 A does not affect the back surface of the glass substrate 2.
  • the first substrate holding mechanism 3 A is configured to raise and lower the substrate holding member 10 supporting the contact member 13 by the pneumatic cylinder 6, and the second substrate holding mechanism 3 B is a suction pad 2. Since 2 configurations for elevating Ri by the air pressure silica Sunda 6, can the first and second substrate holding Organization 3 a, 3 B both miniaturization, passed City section S 1 test each receiving substrate of the LCD production line there is easy and this incorporated into part S 2.
  • the glass substrate 2 air-conveyed to the LCD manufacturing line is With the glass substrate 2 air-floating at the plate delivery section S, the delivery is performed between the transport sections 32, 3 3 and 34, 35 so that air can be transported at high speed.
  • the time required for the inspection process can be shortened, and the inspection time can be shortened.
  • Fig. 6 is an external view of the floating stage used in the substrate inspection apparatus.
  • the first substrate holding mechanism 3A shown in Fig. 1 is provided at four places on the rectangular floating stage 100, for example.
  • the first substrate holding mechanism 3A is provided at four places corresponding to the respective corner positions of, for example, a rectangle at places where the floating glass substrate 2 can be supported from the back side.
  • Each reference pin 50 constituting the positioning mechanism is fixedly provided on each side of XY on the outer periphery of floating stage 1, and each pressing pin 5 1 is arranged on the side opposite to these sides. It is provided to be movable.
  • each contact member 1 3 of each pneumatic cylinder 6 contacts the back surface of the force substrate 2.
  • Contact members 1 3 are each coil spring
  • a biasing force of 1 8 prevents the air floating glass substrate 2 from moving with a smaller external force than the pressing force of the pressing pin 5 1, and has a small contact force that does not affect the back surface of the glass substrate 2.
  • the back surface of the glass substrate 2 that is floating on the air contacts the Hold the raised glass substrate 2 horizontally without moving it. In such a state, when the glass substrate 2 is pressed against each reference pin 50 by pressing each pressing pin 51, the glass substrate 2 is aligned in the reference position with good stability.
  • each pneumatic cylinder 6 contracts the expansion rod 1 4.
  • the glass substrate 2 floats on the floating stage 100 while maintaining the alignment state.
  • the portal arm 4 4 mounted with the microscope head 45 etc. shown in FIG. 3 moves in the X direction
  • the microscope head 4 5 moves in the Y direction to inspect the glass substrate 2 Is done.
  • the movement of the air-floating glass substrate 2 is restricted by the frictional resistance due to the contact of each contact member 13, and each pressing pin 5 1 Since it can be pressed against each reference pin 50 following the operation, the glass substrate 2 can be positioned to the reference position with stability, etc., and it is applied to the substrate inspection process of the LCD manufacturing line. You can achieve the same effect as when you
  • Fig. 7 is a block diagram of the substrate holding mechanism.
  • a ring-shaped support member 60 is provided at the opening of the cylindrical hole 4 provided in the floating stage 1.
  • the ring-like support member 60 has a pair of ring-like holding pieces 60 a and 6 O b in the vertical direction. This The contact film 6 1 is held in a stretched state by the holding pieces 6 0 a 6 0 b on the ring-shaped support member 6 0 o
  • the contact film 61 formed by the ring-shaped support member 60 is provided with two ring sandwiching pieces 60a and 60b of different outer diameters in the lateral direction in the inside and outside in double layers. It is good to hold it.
  • a pipe 6 3 is provided via a connecting member 6 2. The other end of the pipe 6 3 of o is connected to a squeeze-feeder 6 4.
  • This compressed air supply unit 6 4 is a compressed air
  • air pressure regulator 6 5 is installed in piping 6 3
  • the pressure control valve 65 regulates the flow rate of the air supplied into the hole 4 by adjusting the opening degree, or turns on the gas supply by the opening operation and closing operation. Go off.
  • the pressure control valve 65 in the air pressure control valve 65 is expanded upward when the contact film 61 is expanded upward.
  • the frictional resistance between the contact film 6 1 and the back surface of the floating glass substrate 2 restricts the movement of the glass substrate 2, and the amount of supplied air does not affect the back surface of the glass substrate 2 or the like. Adjust 0
  • the pressure in the hole 4 is gradually increased because the hole 4 is airtightly formed, and the pressure applied to the contact film 61 is also gradually according to the pressure. It gets higher.
  • the contact film 61 swells upward as shown by the dotted line in FIG. In this bulge, the contact film 61 is formed to have a uniform film thickness, so the rising height of the central portion of the contact film 61 becomes the highest, and the height gradually decreases as the central portion of the contact film 61 moves away from the central portion.
  • the small friction resistance between the glass substrate 2 and the contact film 6 1 causes the glass substrate 2 to move without moving. It will be held on one.
  • the contact film 1 is resiliently expanded by the supply of compressed air, the contact film 1 abuts against the glass substrate 2 flexibly, and the back surface of the glass substrate 2 is affected by damage or the like.
  • There is a substrate holding mechanism such as that shown in FIG. 3, for example, in the substrate transfer section S 1 of the floating stage 1 of the LCD line.
  • the first substrate holding mechanism 3 A provided at the loss or the first substrate holding mechanism 3 provided on the floating stage 100 of the substrate inspection apparatus shown in FIG. 6
  • the contact film 61 can be expanded simply by a simple configuration.
  • the present invention is not limited to the embodiments of the first to third embodiments and the present invention is not limited to the first to third embodiments.
  • Good 0 For example, in each of the above embodiments, the case has been described in which the present invention is applied to the floating stage 1 of the LCD manufacturing fan or the floating stage 100 of the substrate inspection apparatus. The present invention may be applied to each floating stage 100 on the loading and unloading side in various substrate manufacturing apparatuses.
  • the loading side of the floating stage 1 is provided with a loading port o
  • Each The first substrate holding mechanism 3 A lifts the contact members 13 by the driving of the pneumatic cylinder 6 from the suction hand of the loading side ⁇ -hom to the glass plate 2.
  • the loading port pops down the suction plate so that the glass substrate 2 is raised on the contact members 13 of the first plate holding mechanism 3A on the floating stage 1.
  • ascent stage 1 blows air from multiple air blowout holes 1h.
  • the pneumatic cylinder 6 lowers the first substrate holding mechanism 3A and stops at a position slightly higher than the position where the glass substrate 2 floats at the end o,
  • the glass substrate 2 is placed on each contact member 1 3 in a state of being floated up, so it does not move even in a state of being floated up.
  • it is arranged by the alignment mechanism composed of the reference pin 4 2 and the pressing pin 4 3 like
  • Each of the first and second substrate holding mechanisms 3 A and 3 B in the substrate delivery section S or inspection section S 2 of the LCD manufacturing line is not limited to four each, for example, each apex of a triangle Or three or more points where the glass substrate 2 is held stably and the frictional resistance between the glass substrate 2 and each contact member 13 does not increase.
  • the elastic support of the contact member 1 3 is not limited to the core spring 1 8, and a cylindrically formed rubber may be used.
  • the contact member 13 and the suction pad 22 may change the size of the contact area to the back surface of the glass substrate 2 to adjust the size of the frictional resistance generated with the glass substrate 2.
  • the weight of the glass substrate 2 changes according to the size, and therefore, according to the weight of the glass substrate 2.
  • the present invention has been described, for example, in the case where it is applied to the transport of a large glass substrate 1 of a liquid crystal display, but it can also be applied to the transport of various kinds of semiconductor materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Un organe de contact (13) ménagé au sommet d'un élément de support (10) est soulevé par un mécanisme de levage (6) avec un substrat (2) à lévitation, ce qui permet à l'élément de contact (13) de rester en contact avec la face arrière du substrat (2) et de limiter ainsi le mouvement du substrat (2) à lévitation.
PCT/JP2004/006000 2003-04-30 2004-04-26 Dispositif de levitation de substrat Ceased WO2004096679A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2004800004365A CN1697768B (zh) 2003-04-30 2004-04-26 基板上浮装置
JP2005504478A JP4418428B2 (ja) 2003-04-30 2004-04-26 基板浮上装置
KR1020047020899A KR101053770B1 (ko) 2003-04-30 2004-04-26 기판 부상 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-125701 2003-04-30
JP2003125701 2003-04-30

Publications (1)

Publication Number Publication Date
WO2004096679A1 true WO2004096679A1 (fr) 2004-11-11

Family

ID=33410239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/006000 Ceased WO2004096679A1 (fr) 2003-04-30 2004-04-26 Dispositif de levitation de substrat

Country Status (5)

Country Link
JP (1) JP4418428B2 (fr)
KR (1) KR101053770B1 (fr)
CN (2) CN102152966B (fr)
TW (1) TWI368757B (fr)
WO (1) WO2004096679A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004342771A (ja) * 2003-05-14 2004-12-02 Hoya Corp 基板保持具、基板処理装置、基板検査装置及びこれらの使用方法
JP2006182560A (ja) * 2004-11-30 2006-07-13 Daihen Corp 基板搬送装置
JP2006222287A (ja) * 2005-02-10 2006-08-24 Matsushita Electric Ind Co Ltd 基板搬送装置、部品実装装置、及び基板搬送方法
JP2006269498A (ja) * 2005-03-22 2006-10-05 Olympus Corp 基板保持装置及び基板の保持方法
WO2007037005A1 (fr) * 2005-09-29 2007-04-05 Hirata Corporation Dispositif de réception de pièces de travail
JP2007250871A (ja) * 2006-03-16 2007-09-27 Olympus Corp 基板搬送装置
JP2007281285A (ja) * 2006-04-10 2007-10-25 Olympus Corp 基板搬送装置
JP2008304836A (ja) * 2007-06-11 2008-12-18 Nsk Ltd 露光装置用基板搬送機構及びそれを用いた基板位置調整方法
KR100928742B1 (ko) 2005-09-02 2009-11-27 히라따기꼬오 가부시키가이샤 가공대상물 반입출 시스템 및 반송장치
JP2010251769A (ja) * 2010-05-24 2010-11-04 Olympus Corp 基板保持装置及び基板の保持方法
US20110043784A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
KR101613121B1 (ko) 2014-03-18 2016-04-18 주식회사 에스에프에이 패턴 인쇄장치
JP2018139280A (ja) * 2017-02-24 2018-09-06 リンテック株式会社 位置決め装置および位置決め方法
US20230375945A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Workpiece support

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102148176B (zh) * 2010-02-09 2013-02-06 北京北方微电子基地设备工艺研究中心有限责任公司 升降装置及具有该装置的半导体器件加工设备
CN103182695B (zh) * 2011-12-29 2015-07-01 财团法人金属工业研究发展中心 可重组工具机的组构装置
KR101854959B1 (ko) * 2012-04-03 2018-05-04 가부시키가이샤 니콘 반송 장치, 및 전자 디바이스 형성 방법
CN102717314A (zh) * 2012-06-29 2012-10-10 苏州晟成新能源科技有限公司 修边机
JP6032234B2 (ja) * 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
US10381256B2 (en) * 2015-03-12 2019-08-13 Kla-Tencor Corporation Apparatus and method for chucking warped wafers
CN106960810A (zh) * 2016-01-11 2017-07-18 锡宬国际有限公司 晶圆承载装置
KR101717680B1 (ko) * 2016-07-19 2017-03-20 디앤에이 주식회사 기판 안착장치
KR101865274B1 (ko) * 2016-08-31 2018-06-07 씨디에스(주) 경사구조를 이용한 기판 부상 이송장치
JP7134039B2 (ja) * 2018-09-14 2022-09-09 東京エレクトロン株式会社 基板載置機構、成膜装置、および成膜方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514034U (ja) * 1991-08-05 1993-02-23 横河電機株式会社 ウエハ搬送装置
JP2003040422A (ja) * 2001-07-27 2003-02-13 Toyota Industries Corp 物体浮揚搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP2002181714A (ja) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd 薄板検査装置
JP2003063643A (ja) * 2001-08-30 2003-03-05 Nippon Sekkei Kogyo:Kk 薄板の搬送方法及び装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514034U (ja) * 1991-08-05 1993-02-23 横河電機株式会社 ウエハ搬送装置
JP2003040422A (ja) * 2001-07-27 2003-02-13 Toyota Industries Corp 物体浮揚搬送装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004342771A (ja) * 2003-05-14 2004-12-02 Hoya Corp 基板保持具、基板処理装置、基板検査装置及びこれらの使用方法
JP2006182560A (ja) * 2004-11-30 2006-07-13 Daihen Corp 基板搬送装置
JP2006222287A (ja) * 2005-02-10 2006-08-24 Matsushita Electric Ind Co Ltd 基板搬送装置、部品実装装置、及び基板搬送方法
JP2006269498A (ja) * 2005-03-22 2006-10-05 Olympus Corp 基板保持装置及び基板の保持方法
KR100928742B1 (ko) 2005-09-02 2009-11-27 히라따기꼬오 가부시키가이샤 가공대상물 반입출 시스템 및 반송장치
WO2007037005A1 (fr) * 2005-09-29 2007-04-05 Hirata Corporation Dispositif de réception de pièces de travail
KR100957615B1 (ko) * 2005-09-29 2010-05-13 히라따기꼬오 가부시키가이샤 가공대상물 수납장치
JP4758432B2 (ja) * 2005-09-29 2011-08-31 平田機工株式会社 ワーク収納装置
JP2007250871A (ja) * 2006-03-16 2007-09-27 Olympus Corp 基板搬送装置
JP2007281285A (ja) * 2006-04-10 2007-10-25 Olympus Corp 基板搬送装置
JP2008304836A (ja) * 2007-06-11 2008-12-18 Nsk Ltd 露光装置用基板搬送機構及びそれを用いた基板位置調整方法
US20110043784A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2010251769A (ja) * 2010-05-24 2010-11-04 Olympus Corp 基板保持装置及び基板の保持方法
KR101613121B1 (ko) 2014-03-18 2016-04-18 주식회사 에스에프에이 패턴 인쇄장치
JP2018139280A (ja) * 2017-02-24 2018-09-06 リンテック株式会社 位置決め装置および位置決め方法
US20230375945A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Workpiece support

Also Published As

Publication number Publication date
CN1697768B (zh) 2011-03-30
TW200500635A (en) 2005-01-01
KR20060015414A (ko) 2006-02-17
JP4418428B2 (ja) 2010-02-17
CN102152966B (zh) 2013-03-27
CN102152966A (zh) 2011-08-17
KR101053770B1 (ko) 2011-08-02
JPWO2004096679A1 (ja) 2006-07-13
TWI368757B (en) 2012-07-21
CN1697768A (zh) 2005-11-16

Similar Documents

Publication Publication Date Title
WO2004096679A1 (fr) Dispositif de levitation de substrat
JP6780732B2 (ja) 搬送装置、露光装置、及びデバイス製造方法
JP4652351B2 (ja) 基板支持装置、基板支持方法
US20110062641A1 (en) Stage equipped with alignment function, processing apparatus having the stage equipped with alignment function, and method of aligning substrate
JP6055705B2 (ja) 転写装置および転写方法
WO2007046152A1 (fr) Dispositif de tete d'aspiration
CN101323396A (zh) 基板吸附装置和基板搬送装置以及外观检查装置
CN1981370A (zh) 移载装置
CN106182726A (zh) 图案形成装置及图案形成方法
CN101144920A (zh) 基板检查装置
CN108701635B (zh) 基板浮起输送装置
JP2008063020A (ja) 基板搬送装置およびそれを用いた基板検査システム
KR101183043B1 (ko) 기판을 보관 및 공급하는 시스템
KR20170072146A (ko) 전사 장치 및 전사 방법
KR101830009B1 (ko) 전사 장치 및 전사 방법
JP2012023104A (ja) 基板載置装置
JP2006339464A (ja) 素子転写装置、素子の転写方法および表示装置の製造方法
JP2009206315A (ja) テーブルへの基板搭載装置
JP6595276B2 (ja) 基板処理装置および基板処理方法
JP3817258B2 (ja) 基板位置合わせ装置
WO2008068845A1 (fr) Dispositif de transport de palette et dispositif d'inspection de substrat
KR102570673B1 (ko) 기판 이송장치
TWI891288B (zh) 安裝工具及安裝裝置
JP2011113086A (ja) 受け渡し機構、ステージ装置、搬送装置、露光装置、及びデバイス製造方法
JP2018207026A (ja) 保持装置、その制御方法、リソグラフィ装置、及び物品製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2005504478

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047020899

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20048004365

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1020047020899

Country of ref document: KR

122 Ep: pct application non-entry in european phase