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WO2003038158A3 - Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices - Google Patents

Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices Download PDF

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Publication number
WO2003038158A3
WO2003038158A3 PCT/DE2002/003916 DE0203916W WO03038158A3 WO 2003038158 A3 WO2003038158 A3 WO 2003038158A3 DE 0203916 W DE0203916 W DE 0203916W WO 03038158 A3 WO03038158 A3 WO 03038158A3
Authority
WO
WIPO (PCT)
Prior art keywords
electroplating
conductive structures
coating already
already conductive
electroplating device
Prior art date
Application number
PCT/DE2002/003916
Other languages
German (de)
English (en)
Other versions
WO2003038158A2 (fr
Inventor
Andreas Mueller-Hipper
Ewald Simmerlein-Erlbacher
Andreas Karl
Original Assignee
Infineon Technologies Ag
Andreas Mueller-Hipper
Ewald Simmerlein-Erlbacher
Andreas Karl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10234705A external-priority patent/DE10234705B4/de
Application filed by Infineon Technologies Ag, Andreas Mueller-Hipper, Ewald Simmerlein-Erlbacher, Andreas Karl filed Critical Infineon Technologies Ag
Publication of WO2003038158A2 publication Critical patent/WO2003038158A2/fr
Priority to US10/916,308 priority Critical patent/US20050061661A1/en
Publication of WO2003038158A3 publication Critical patent/WO2003038158A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

La présente invention concerne un dispositif de galvanisation (10) conçu pour réaliser un dépôt galvanoplastique d'une couche électro-conductrice sur un substrat (12). Ce dispositif comprend un bain électrolytique (14) dans lequel se trouvent un dispositif d'anode (30) et au moins une unité de mise en contact (16). Chaque unité de mise en contact (16) présente une pluralité de zones électro-conductrices (20) dont au moins une est connectée à la cathode ou à l'anode.
PCT/DE2002/003916 2001-10-25 2002-10-16 Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices WO2003038158A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/916,308 US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10153056.0 2001-10-25
DE10153056 2001-10-25
DE10234705.0 2002-07-30
DE10234705A DE10234705B4 (de) 2001-10-25 2002-07-30 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/916,308 Continuation US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Publications (2)

Publication Number Publication Date
WO2003038158A2 WO2003038158A2 (fr) 2003-05-08
WO2003038158A3 true WO2003038158A3 (fr) 2004-09-16

Family

ID=26010464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003916 WO2003038158A2 (fr) 2001-10-25 2002-10-16 Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices

Country Status (3)

Country Link
US (1) US20050061661A1 (fr)
TW (1) TW574437B (fr)
WO (1) WO2003038158A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323660A1 (de) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
WO2006098336A1 (fr) * 2005-03-15 2006-09-21 Fujifilm Corporation Procédé de placage, film conducteur émetteur de lumière et film de protection électromagnétique
US20090101511A1 (en) * 2006-04-18 2009-04-23 Rene Lochtman Electroplating device and method
DE502007002680D1 (de) * 2006-04-18 2010-03-11 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung
EP1865094B1 (fr) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Appareil pour placage électrochimique sur des surfaces et système de placage
KR101414105B1 (ko) * 2007-03-28 2014-07-01 도레이 카부시키가이샤 웹의 압접 방법, 압접 장치, 급전 방법, 급전 장치, 연속 전해 도금 장치 및 도금막 부착 웹의 제조 방법
DE102008004592A1 (de) * 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
US9725817B2 (en) * 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
EP4010516A1 (fr) * 2019-08-05 2022-06-15 SMS Group GmbH Procédé et système de revêtement électrolytique d'une bande et/ou d'un matériau tissé, électriquement conducteurs, au moyen d'une technologie à impulsions
CN112663119B (zh) * 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (de) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Verfahren und vorrichtung zum metallbeschichten, insbesondere zum verkupfern von zylindrischen koerpern
EP0677599A1 (fr) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO2001061079A1 (fr) * 2000-02-18 2001-08-23 Enthone Inc. Procede de plaquage electrolytique d'une piece enduite d'un polymere electro-conducteur

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
DE4229403C2 (de) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (de) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Verfahren und vorrichtung zum metallbeschichten, insbesondere zum verkupfern von zylindrischen koerpern
EP0677599A1 (fr) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO2001061079A1 (fr) * 2000-02-18 2001-08-23 Enthone Inc. Procede de plaquage electrolytique d'une piece enduite d'un polymere electro-conducteur

Also Published As

Publication number Publication date
TW574437B (en) 2004-02-01
WO2003038158A2 (fr) 2003-05-08
US20050061661A1 (en) 2005-03-24

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