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WO2003008168A1 - Dispositif de rainurage pour substrat constitue de matiere fragile - Google Patents

Dispositif de rainurage pour substrat constitue de matiere fragile Download PDF

Info

Publication number
WO2003008168A1
WO2003008168A1 PCT/JP2002/007233 JP0207233W WO03008168A1 WO 2003008168 A1 WO2003008168 A1 WO 2003008168A1 JP 0207233 W JP0207233 W JP 0207233W WO 03008168 A1 WO03008168 A1 WO 03008168A1
Authority
WO
WIPO (PCT)
Prior art keywords
material substrate
fragile material
scribing device
laser spots
peaks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/007233
Other languages
English (en)
Japanese (ja)
Inventor
Haruo Wakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to HK05102267.7A priority Critical patent/HK1069797B/xx
Priority to JP2003513754A priority patent/JPWO2003008168A1/ja
Publication of WO2003008168A1 publication Critical patent/WO2003008168A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

L'invention concerne un dispositif de rainurage pour substrat constitué de matière fragile, dans lequel plusieurs taches laser sont formées, de manière que plusieurs pointes de répartition de puissance soient produites le long d'une ligne de rainurage prédéterminée. Les intervalles entre la pluralité de taches laser et entre les pointes de répartition de puissance desdites taches sont déterminés en fonction du type de substrat constitué de matière fragile sur lequel la ligne de rainurage est formée.
PCT/JP2002/007233 2001-07-16 2002-07-16 Dispositif de rainurage pour substrat constitue de matiere fragile Ceased WO2003008168A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
HK05102267.7A HK1069797B (en) 2001-07-16 2002-07-16 Scribing device and method for fragile material substrate and scribing method for fragile material substrate
JP2003513754A JPWO2003008168A1 (ja) 2001-07-16 2002-07-16 脆性材料基板のスクライブ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-215055 2001-07-16
JP2001215055 2001-07-16

Publications (1)

Publication Number Publication Date
WO2003008168A1 true WO2003008168A1 (fr) 2003-01-30

Family

ID=19049763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007233 Ceased WO2003008168A1 (fr) 2001-07-16 2002-07-16 Dispositif de rainurage pour substrat constitue de matiere fragile

Country Status (5)

Country Link
JP (1) JPWO2003008168A1 (fr)
KR (1) KR100583889B1 (fr)
CN (2) CN100411825C (fr)
TW (1) TW542763B (fr)
WO (1) WO2003008168A1 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (fr) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Méthode pour former une fente verticale sur une plaque frittée et appareil de formation de fente verticale
JP2006167804A (ja) * 2004-11-19 2006-06-29 Canon Inc レーザ割断方法およびレーザ割断装置
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
JP2008264805A (ja) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd レーザー加工装置およびウエーハの裏面に装着された接着フィルムのレーザー加工方法
JP2009066613A (ja) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断装置および分断方法
JP2010520083A (ja) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法
CN102012552A (zh) * 2010-09-27 2011-04-13 江苏大学 多窗口多波长激光器光路自动调节系统
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2013004957A (ja) * 2011-06-17 2013-01-07 National Cheng Kung Univ 発光素子構造及びその製造方法
JP5562254B2 (ja) * 2008-12-16 2014-07-30 株式会社レミ 脆性材料の分割装置および割断方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100475419C (zh) * 2004-10-25 2009-04-08 三星钻石工业股份有限公司 裂痕形成方法及裂痕形成装置
EP1941981A4 (fr) * 2005-10-28 2014-01-01 Mitsuboshi Diamond Ind Co Ltd Procede de formation d une ligne de decoupe sur un substrat en materiau fragile et dispositif de formation de ligne de decoupe
US20110139758A1 (en) * 2009-08-06 2011-06-16 Applied Materials, Inc. Latitudinal iso-line scribe, stitching, and simplified laser and scanner controls
CN102282485B (zh) * 2009-08-06 2012-08-29 住友化学株式会社 偏光板的制造方法
CN102248308A (zh) * 2011-06-24 2011-11-23 广东工业大学 利用激光空化微射流进行微加工的方法
JP6721439B2 (ja) * 2016-07-11 2020-07-15 株式会社ディスコ レーザー加工装置
KR20210057265A (ko) * 2019-11-11 2021-05-21 삼성전자주식회사 레이저 어닐링 장치 및 그를 이용한 반도체 소자의 제조 방법
CN114589421B (zh) * 2020-12-07 2025-10-17 株式会社迪思科 SiC锭的加工方法和激光加工装置
CN113618251A (zh) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 一种基板划线的激光加工设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (ja) * 1993-02-12 1994-08-23 Nikon Corp レーザー加工装置
JPH1034364A (ja) * 1996-07-25 1998-02-10 Souei Tsusho Kk 複数点熱源による脆性材料の割断加工方法
JPH11784A (ja) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp レーザ加工装置
JP2000058489A (ja) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd 被加工物の分割方法及び分割装置
JP2001151525A (ja) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd ガラス板分割方法及び装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (ja) * 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
JPH0639572A (ja) * 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
JP3164508B2 (ja) * 1996-05-22 2001-05-08 株式会社システクアカザワ 罫書き装置
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
JP3895179B2 (ja) * 1999-11-24 2007-03-22 アプライド・フォトニクス・インコーポレーテッド 非金属基板を分離する方法及び装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (ja) * 1993-02-12 1994-08-23 Nikon Corp レーザー加工装置
JPH1034364A (ja) * 1996-07-25 1998-02-10 Souei Tsusho Kk 複数点熱源による脆性材料の割断加工方法
JPH11784A (ja) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp レーザ加工装置
JP2000058489A (ja) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd 被加工物の分割方法及び分割装置
JP2001151525A (ja) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd ガラス板分割方法及び装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (fr) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Méthode pour former une fente verticale sur une plaque frittée et appareil de formation de fente verticale
JP2006167804A (ja) * 2004-11-19 2006-06-29 Canon Inc レーザ割断方法およびレーザ割断装置
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2010520083A (ja) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
JP2008264805A (ja) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd レーザー加工装置およびウエーハの裏面に装着された接着フィルムのレーザー加工方法
JP2009066613A (ja) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断装置および分断方法
JP5562254B2 (ja) * 2008-12-16 2014-07-30 株式会社レミ 脆性材料の分割装置および割断方法
CN102012552A (zh) * 2010-09-27 2011-04-13 江苏大学 多窗口多波长激光器光路自动调节系统
JP2013004957A (ja) * 2011-06-17 2013-01-07 National Cheng Kung Univ 発光素子構造及びその製造方法

Also Published As

Publication number Publication date
JPWO2003008168A1 (ja) 2004-11-04
CN1827311A (zh) 2006-09-06
KR100583889B1 (ko) 2006-05-26
CN1255858C (zh) 2006-05-10
KR20040017248A (ko) 2004-02-26
CN100411825C (zh) 2008-08-20
HK1069797A1 (en) 2005-06-03
CN1529648A (zh) 2004-09-15
TW542763B (en) 2003-07-21

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