[go: up one dir, main page]

WO2003008168A1 - Scribing device for fragile material substrate - Google Patents

Scribing device for fragile material substrate Download PDF

Info

Publication number
WO2003008168A1
WO2003008168A1 PCT/JP2002/007233 JP0207233W WO03008168A1 WO 2003008168 A1 WO2003008168 A1 WO 2003008168A1 JP 0207233 W JP0207233 W JP 0207233W WO 03008168 A1 WO03008168 A1 WO 03008168A1
Authority
WO
WIPO (PCT)
Prior art keywords
material substrate
fragile material
scribing device
laser spots
peaks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/007233
Other languages
French (fr)
Japanese (ja)
Inventor
Haruo Wakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to HK05102267.7A priority Critical patent/HK1069797B/en
Priority to JP2003513754A priority patent/JPWO2003008168A1/en
Publication of WO2003008168A1 publication Critical patent/WO2003008168A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

A scribing device for a fragile material substrate, wherein a plurality of laser spots are formed so as to provide a plurality of peaks of strength distribution on the fragile material substrate along a predetermined scribing line, and intervals between the plurality of laser spots and intervals between the peaks of strength distribution of the laser spots are set according to the type of the fragile material substrate on which a scribing line is formed.
PCT/JP2002/007233 2001-07-16 2002-07-16 Scribing device for fragile material substrate Ceased WO2003008168A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
HK05102267.7A HK1069797B (en) 2001-07-16 2002-07-16 Scribing device and method for fragile material substrate and scribing method for fragile material substrate
JP2003513754A JPWO2003008168A1 (en) 2001-07-16 2002-07-16 Scribing device for brittle material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-215055 2001-07-16
JP2001215055 2001-07-16

Publications (1)

Publication Number Publication Date
WO2003008168A1 true WO2003008168A1 (en) 2003-01-30

Family

ID=19049763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007233 Ceased WO2003008168A1 (en) 2001-07-16 2002-07-16 Scribing device for fragile material substrate

Country Status (5)

Country Link
JP (1) JPWO2003008168A1 (en)
KR (1) KR100583889B1 (en)
CN (2) CN100411825C (en)
TW (1) TW542763B (en)
WO (1) WO2003008168A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (en) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus
JP2006167804A (en) * 2004-11-19 2006-06-29 Canon Inc Laser cleaving method and laser cleaving apparatus
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2008264805A (en) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd Laser processing apparatus and laser processing method for adhesive film mounted on back side of wafer
JP2009066613A (en) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd Apparatus and method for cutting brittle material substrate
JP2010520083A (en) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト Method for manufacturing a component using asymmetric energy introduction along a separation line or target break line
CN102012552A (en) * 2010-09-27 2011-04-13 江苏大学 Light path automatic adjusting system for multi-window multi-wavelength laser
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2013004957A (en) * 2011-06-17 2013-01-07 National Cheng Kung Univ Light-emitting element structure and manufacturing method of the same
JP5562254B2 (en) * 2008-12-16 2014-07-30 株式会社レミ Brittle material splitting apparatus and splitting method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100475419C (en) * 2004-10-25 2009-04-08 三星钻石工业股份有限公司 Crack forming method and crack forming apparatus
EP1941981A4 (en) * 2005-10-28 2014-01-01 Mitsuboshi Diamond Ind Co Ltd Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
US20110139758A1 (en) * 2009-08-06 2011-06-16 Applied Materials, Inc. Latitudinal iso-line scribe, stitching, and simplified laser and scanner controls
CN102282485B (en) * 2009-08-06 2012-08-29 住友化学株式会社 Method for manufacturing polarizing plate
CN102248308A (en) * 2011-06-24 2011-11-23 广东工业大学 Method for performing microprocessing by utilizing laser cavitation micro jet flow
JP6721439B2 (en) * 2016-07-11 2020-07-15 株式会社ディスコ Laser processing equipment
KR20210057265A (en) * 2019-11-11 2021-05-21 삼성전자주식회사 laser annealing apparatus and manufacturing method of semiconductor device using the same
CN114589421B (en) * 2020-12-07 2025-10-17 株式会社迪思科 Method for processing SiC ingot and laser processing device
CN113618251A (en) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 Laser processing equipment for substrate scribing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (en) * 1993-02-12 1994-08-23 Nikon Corp Laser beam working machine
JPH1034364A (en) * 1996-07-25 1998-02-10 Souei Tsusho Kk Cutting method for brittle materials using multiple heat sources
JPH11784A (en) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp Laser processing equipment
JP2000058489A (en) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd Method and apparatus for dividing workpiece
JP2001151525A (en) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd Method and device for dividing glass sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (en) * 1988-06-01 1989-12-11 Nippei Toyama Corp Variable beam laser processing device
JPH0639572A (en) * 1991-01-11 1994-02-15 Souei Tsusho Kk Wafer cutting device
JPH0929472A (en) * 1995-07-14 1997-02-04 Hitachi Ltd Cleaving method, cleaving device and chip material
JP3164508B2 (en) * 1996-05-22 2001-05-08 株式会社システクアカザワ Scoring device
JPH10128567A (en) * 1996-10-30 1998-05-19 Nec Kansai Ltd Laser beam splitting method
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
JP3895179B2 (en) * 1999-11-24 2007-03-22 アプライド・フォトニクス・インコーポレーテッド Method and apparatus for separating non-metallic substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06234092A (en) * 1993-02-12 1994-08-23 Nikon Corp Laser beam working machine
JPH1034364A (en) * 1996-07-25 1998-02-10 Souei Tsusho Kk Cutting method for brittle materials using multiple heat sources
JPH11784A (en) * 1997-06-11 1999-01-06 Mitsubishi Electric Corp Laser processing equipment
JP2000058489A (en) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd Method and apparatus for dividing workpiece
JP2001151525A (en) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd Method and device for dividing glass sheet

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005102638A1 (en) * 2004-04-27 2005-11-03 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus
JP2006167804A (en) * 2004-11-19 2006-06-29 Canon Inc Laser cleaving method and laser cleaving apparatus
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
JP2010520083A (en) * 2007-02-28 2010-06-10 セラムテック アクチエンゲゼルシャフト Method for manufacturing a component using asymmetric energy introduction along a separation line or target break line
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2008264805A (en) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd Laser processing apparatus and laser processing method for adhesive film mounted on back side of wafer
JP2009066613A (en) * 2007-09-11 2009-04-02 Mitsuboshi Diamond Industrial Co Ltd Apparatus and method for cutting brittle material substrate
JP5562254B2 (en) * 2008-12-16 2014-07-30 株式会社レミ Brittle material splitting apparatus and splitting method
CN102012552A (en) * 2010-09-27 2011-04-13 江苏大学 Light path automatic adjusting system for multi-window multi-wavelength laser
JP2013004957A (en) * 2011-06-17 2013-01-07 National Cheng Kung Univ Light-emitting element structure and manufacturing method of the same

Also Published As

Publication number Publication date
JPWO2003008168A1 (en) 2004-11-04
CN1827311A (en) 2006-09-06
KR100583889B1 (en) 2006-05-26
CN1255858C (en) 2006-05-10
KR20040017248A (en) 2004-02-26
CN100411825C (en) 2008-08-20
HK1069797A1 (en) 2005-06-03
CN1529648A (en) 2004-09-15
TW542763B (en) 2003-07-21

Similar Documents

Publication Publication Date Title
WO2003008168A1 (en) Scribing device for fragile material substrate
AU2001266018A1 (en) Substrate with a reduced light-scattering, ultraphobic surface and a method for the production of the same
EP1378495A4 (en) Scribing method, cutter wheel, scribing device using the cutter wheel, and cutter wheel manufacturing device for manufacturing the cutter wheel
AU2003232469A1 (en) Method for the production of structured layers on substrates
PL363685A1 (en) Process for directly bonding rubber to at least a second substrate, and the resulting article
EP0792955A3 (en) Sapphire single crystal, semiconductor laser diode using the same for substrate, and method for manufacturing the same
AU2003275629A1 (en) Method and device for scribing fragile material substrate
AU3169799A (en) Heat sink, and semiconductor laser and semiconductor laser stacker using the same
AU5332500A (en) Semi conducteur laser with temperature independant performances
TW353202B (en) Scribe and break of hard-to-scribe materials
AU7445296A (en) Determinate, delayed-ripening cherry tomato plants
AU1383501A (en) Semiconductor device for electro-optic applications, method for manufacturing said device and corresponding semiconductor laser device
AU2001254607A1 (en) Semiconductor polymers, method for the production thereof and an optoelectronic component
AU2002343185A1 (en) A method of manufacturing a semiconductor device
PT965589E (en) PROCESS AND INTERMEDIARIES FOR THE PRODUCTION OF COMPOUNDS PYRIDINE-2,3-DICARBOXYLATE
AU5658099A (en) Method of manufacturing a pallet, and a pallet manufactured by the method
AU2003259901A1 (en) Method and composition for forming a protective coating on an assay substrate and substrate produced by the same
IL161237A0 (en) Method for the production of protective coatings on the surface of chemically active materials
AU2003214116A1 (en) Z-substituted acrylamides, methods for production thereof and agents comprising the same
AU2002250116A1 (en) Polymer on substrate waveguide structure and corresponding production method
AU2003208275A1 (en) Trojan inhibitors, method for the production and use thereof
AU2002318587A1 (en) Scribing device for fragile material substrate
AU2003264387A1 (en) Catalyst for oligomerization and process for producing oligomer with the same
AU2002334670A1 (en) Regulatable, catalytically active nucleic acids
WO2003035259A3 (en) Arrays with hairpin structures

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2003513754

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020037017063

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20028141822

Country of ref document: CN

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase