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WO2003067945A1 - Carte de circuits imprimes comprenant un composant - Google Patents

Carte de circuits imprimes comprenant un composant Download PDF

Info

Publication number
WO2003067945A1
WO2003067945A1 PCT/EP2003/000715 EP0300715W WO03067945A1 WO 2003067945 A1 WO2003067945 A1 WO 2003067945A1 EP 0300715 W EP0300715 W EP 0300715W WO 03067945 A1 WO03067945 A1 WO 03067945A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
component
printed circuit
adhesive
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2003/000715
Other languages
German (de)
English (en)
Inventor
Dietmar Birgel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Priority to EP03737271A priority Critical patent/EP1380195A1/fr
Priority to AU2003210179A priority patent/AU2003210179A1/en
Publication of WO2003067945A1 publication Critical patent/WO2003067945A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Modern electrical devices in particular measuring devices, generally have at least one printed circuit board on which electronic components are arranged. These components must be mechanically attached to the circuit board and electrically connected to lines running in or on the circuit board.
  • spacers For this purpose, specially designed spacers have so far been applied to the printed circuit board and the components are positioned on the spacers.
  • the spacers are attached e.g. through electrochemical deposition processes and is usually very expensive.
  • Such components currently generally have snap mechanisms which are snapped onto or onto the printed circuit board. These snap mechanisms make automatic assembly impossible, since larger forces are required to snap the snap mechanisms in or out than forces in the range of millinewtons that are exerted by conventional automatic placement machines. It is an object of the invention to provide a printed circuit board with at least one component arranged on the printed circuit board, in which the component is positioned very precisely on the printed circuit board.
  • the invention consists in a printed circuit board
  • the position is a predetermined minimum distance between the circuit board and the component, which is caused by a size of the particles.
  • the component has a centering pin projecting into a hole in the printed circuit board, the adhesive is introduced into the hole, and the particles fix the centering pin in an upright position in the hole.
  • the particles of the adhesive are expansion particles that expand during the adhesive process and thereby increase a distance between the component and the printed circuit board.
  • the component is a wired component which has contact pins projecting into bores in the printed circuit board.
  • the particles of the adhesive are shrink particles which shrink during the adhesive process and thereby reduce a distance between the component and the printed circuit board.
  • the adhesive is introduced into a recess in the printed circuit board and the component is brought to close contact with the printed circuit board by the shrinking of the particles.
  • the invention further consists in an electrode
  • the invention further consists in a method for applying a component to a printed circuit board or an electrode, in which
  • Adhesive is applied to the printed circuit board or the electrode at designated adhesive points
  • the circuit board or the electrode is equipped with components, and
  • the circuit board or the electrode goes through a temperature cycle in an oven, in which a soldering takes place at the soldering points and
  • the adhesive at the gluing points by curing, stretching and curing or by shrinking and curing causes a fine adjustment of the positioning of the components.
  • a distance between the component and the circuit board can be adjusted very precisely to the size of the particles.
  • Fig. 1 shows a component glued to a circuit board
  • Fig. 2 shows a component soldered and glued to a circuit board
  • Fig. 4 shows a circuit board with a wired component
  • Fig. 5 shows an electrode with a ceramic attached thereon
  • FIG. 6 shows an electrode with a glued-on component, the adhesive being introduced into a recess in the electrode; and .
  • FIG. 7 shows an electrode with a glued-on component, the adhesive being applied to the electrode.
  • the particles 7 bring about a fine adjustment of a position of the component 3 on the printed circuit board 1.
  • the particles 7 bring about a fine adjustment of a predetermined minimum distance between the printed circuit board 1 and the component 3. If the component is 3 at the target location of an automatic placement machine, the adhesive 5 automatically assumes a layer thickness which is equal to the size of the particles 7 due to the contact pressure acting on it.
  • the particles 7 are preferably spherical.
  • the size of the particles, which determines the distance is equal to an average diameter of the Particles 7.
  • an average particle height is decisive.
  • a typical minimum distance, e.g. to reduce mechanical stresses acting on component 3 due to different thermal expansion coefficients of printed circuit board 1 and component 3 is, for example, approx. 50 ⁇ m to 100 ⁇ m.
  • Fig. 2 shows another component 9 arranged on the printed circuit board 1, e.g. a microchip.
  • the component 9, like the component 3 shown in FIG. 1, is connected to the printed circuit board 1 by means of an adhesive 5 containing particles 7.
  • the component 9 has two metallic contacts 11, which are connected by means of a solder connection 13 to metallic contact surfaces 15 arranged on a printed circuit board 1.
  • a thickness of the solder joint 13, i.e. a minimum distance between the contact surfaces 15 and the respectively opposite contacts 11 is equal to the size of the particles 7.
  • Adhesive 5 and particles 7 bring about a very precise adjustment of the thickness of the solder connection 13 and thus very high-quality soldering.
  • the connection is reliably stable even at very high temperatures and temperature fluctuations. The reason for this is the minimum distance between the component 9 and the printed circuit board 1 which is precisely maintained by the particles 7. Thermal voltages are distributed evenly over the minimum distance and prevent local voltage peaks which could damage the solder connection 13 and the adhesive.
  • Fig. 3 shows a printed circuit board with a projecting component 17, e.g. a connector, with uneven mass distribution.
  • the component 17 has a centering pin 21 projecting into a bore 19 in the printed circuit board 1. Due to manufacturing tolerances of both the bore 19 and the centering pin 21, there is a gap between the centering pin 21 and the bore 19. The gap is usually large enough to allow the component 17 to tilt undesirably.
  • This effect can be enhanced by making the particles 22 of a material with a very large surface roughness, e.g. made of aluminum oxide.
  • the surface roughness of the particles 22 results in a centering pin 21 made of a soft material, e.g. Plastic that the particles 22 cut into the centering pin 21 like small barbs.
  • Fig. 4 shows a circuit board 1 on which a wired component 23 is arranged.
  • the circuit board 1 has two through bores 25, into each of which a contact pin 27 of the component 23 projects.
  • an adhesive 5 containing particles 29 is again arranged here.
  • the adhesive 5 is used e.g. the fixation of the component 23 on the printed circuit board 1.
  • Such a fixation is e.g. required if the component 23 is applied to the circuit board 1 from a first side, but the contact pins 27 are to be soldered to the bores 25 from an opposite second side of the circuit board 1.
  • Shrinkage particles 37 are particles that shrink during the gluing process and thereby reduce the volume of the glue 5 and thus the distance between the component 35 and the printed circuit board 1. This is advantageous, for example, if the component 35 is to be arranged as directly as possible on the printed circuit board 1.
  • Suitable shrink particles 37 are, for example, materials such as polyethylene, polyolefins or polyvinyl chloride, as are also used for the production of commercially available shrink sleeves.
  • Shrink particles 37 have the great advantage that they ensure adequate wetting of the surfaces to be connected without the risk of adhesive 5 overflowing and thereby increasing the distance between the parts to be connected.
  • the circuit board preferably has a recess 39 into which the adhesive 5 is introduced. As a result of the shrinkage of the shrinkage particles 37 when the adhesive 5 hardens, the component 35 is then brought into close contact with the circuit board 1.
  • Fig. 5 shows this using the example of an electrode 33 embedded in the circuit board 1 on which a ceramic, e.g. a piezoelectric element is attached.
  • circuit board 1 is not required to connect component 35 to electrode 33.
  • FIGS. 6 and 7 show exemplary embodiments in which a single electrode 33 which is not integrated in a printed circuit board is connected to the component 35 arranged on the electrode 33, adhesive 5 being applied between the component 35 and the electrode 33 and containing particles which effect a fine adjustment of a position of the component 35 on the electrode 33.
  • the adhesive 5 is introduced into the recess 39 in the electrode 33. It preferably has shrink particles 37, which cause the component 35 to bear tightly on the electrode 33.
  • the adhesive 5 is applied to the electrode 33. It has particles 7 of a predefined size, which bring about a defined distance between the component 35 and the electrode 33. Such a defined distance is desired, for example, if there is a capacitive interaction between the electrode 33 and the component 35.
  • the corresponding components 3, 9, 17, 23, 35 are preferably applied to the circuit board 1 or the electrode 33 by applying solder 13 to the soldering points provided, and adhesive 5 is applied to the circuit board 1 or the electrode 33 at the provided adhesive points
  • Printed circuit board 1 or the electrode 33 is equipped with components 3, 9, 17, 23, 35, and the printed circuit board 1 or the electrode 33 undergoes a temperature cycle in an oven in which soldering takes place at the soldering points and the adhesive 5 at the adhesive points by curing, by stretching and curing or by shrinking and curing, fine adjustment of the positioning of the components 3, 9, 17, 23, 35 is effected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne une carte de circuits imprimés (1) comprenant au moins un composant (3, 9, 17, 23, 35) qui est positionné de manière très précise sur cette carte de circuits imprimés (1). Un adhésif (5) appliqué entre le composant (3, 9, 17, 23, 35) et la carte de circuits imprimés (1) contient des particules (7, 29, 37) qui permettent un réglage précis de la position du composant (3, 9, 17, 23, 35) sur la carte de circuits imprimés (1).
PCT/EP2003/000715 2002-02-06 2003-01-24 Carte de circuits imprimes comprenant un composant Ceased WO2003067945A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03737271A EP1380195A1 (fr) 2002-02-06 2003-01-24 Carte de circuits imprimes comprenant un composant
AU2003210179A AU2003210179A1 (en) 2002-02-06 2003-01-24 Printed circuit board comprising a component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10204959A DE10204959A1 (de) 2002-02-06 2002-02-06 Leiterplatte mit einem Bauteil
DE10204959.9 2002-02-06

Publications (1)

Publication Number Publication Date
WO2003067945A1 true WO2003067945A1 (fr) 2003-08-14

Family

ID=27588447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/000715 Ceased WO2003067945A1 (fr) 2002-02-06 2003-01-24 Carte de circuits imprimes comprenant un composant

Country Status (4)

Country Link
EP (1) EP1380195A1 (fr)
AU (1) AU2003210179A1 (fr)
DE (1) DE10204959A1 (fr)
WO (1) WO2003067945A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1750306A1 (fr) * 2005-08-05 2007-02-07 Delphi Technologies, Inc. Module électronique avec remplissage d'écartement et méthode
US20120286381A1 (en) * 2011-05-10 2012-11-15 Stmicroelectronics S.R.L. Electronic mems device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007035903A1 (de) * 2007-07-31 2009-03-12 Siemens Ag Kontaktierungsfolie und Verfahren zum Herstellen einer elektrisch leitenden Verbindung

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit
US4873397A (en) * 1986-12-25 1989-10-10 Tdk Corporation Electronic circuit element
JPH047381A (ja) * 1990-04-25 1992-01-10 Senju Metal Ind Co Ltd 電子部品の仮固定用接着剤
DE4121449A1 (de) * 1991-06-28 1993-01-07 Siemens Ag Hoergeraet, insbesondere am kopf tragbares mini-hoergeraet, und verfahren zur herstellung
US5210938A (en) * 1991-08-05 1993-05-18 Rohm Co., Ltd. Method of assembling an electronic part device
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
JPH10135597A (ja) * 1996-10-31 1998-05-22 Sony Corp 電子部品の実装構造及びその製造方法
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
DE19819054A1 (de) * 1998-04-29 1999-11-11 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Montage und Justierung von Bauteilen auf einer Befestigungsunterlage
EP1050888A1 (fr) * 1998-08-28 2000-11-08 Matsushita Electronics Corporation Colle electroconductrice, structure electroconductrice utilisant cette colle, piece electrique, module et carte a circuit, connexion electrique, fabrication de carte a circuit et de piece electronique ceramique
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
JP2000332388A (ja) * 1999-05-17 2000-11-30 Sony Corp 電子部品実装構造
DE19919716A1 (de) * 1999-04-30 2001-08-09 Daimler Chrysler Ag Mikroelektronische Baugruppe

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US5255431A (en) * 1992-06-26 1993-10-26 General Electric Company Method of using frozen epoxy for placing pin-mounted components in a circuit module
DE4332752A1 (de) * 1993-09-25 1995-03-30 Bosch Gmbh Robert Bauteil und Verfahren zu dessen Herstellung
DE4406418C1 (de) * 1994-02-28 1995-07-13 Bosch Gmbh Robert Anisotrop elektrisch leitender Kleber
DE19637214C2 (de) * 1996-08-22 2003-04-30 Pav Card Gmbh Verfahren zur Herstellung einer elektrischen und mechanischen Verbindung eines in einer Ausnehmung eines Kartenträgers einer Chipkarte eingesetzten Moduls
DE19905807A1 (de) * 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
DE19942631A1 (de) * 1999-09-07 2001-03-08 Endress Hauser Gmbh Co Verfahren zum Bestücken einer Leiterplatte

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit
US4873397A (en) * 1986-12-25 1989-10-10 Tdk Corporation Electronic circuit element
JPH047381A (ja) * 1990-04-25 1992-01-10 Senju Metal Ind Co Ltd 電子部品の仮固定用接着剤
DE4121449A1 (de) * 1991-06-28 1993-01-07 Siemens Ag Hoergeraet, insbesondere am kopf tragbares mini-hoergeraet, und verfahren zur herstellung
US5210938A (en) * 1991-08-05 1993-05-18 Rohm Co., Ltd. Method of assembling an electronic part device
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
JPH10135597A (ja) * 1996-10-31 1998-05-22 Sony Corp 電子部品の実装構造及びその製造方法
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
DE19819054A1 (de) * 1998-04-29 1999-11-11 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Montage und Justierung von Bauteilen auf einer Befestigungsunterlage
EP1050888A1 (fr) * 1998-08-28 2000-11-08 Matsushita Electronics Corporation Colle electroconductrice, structure electroconductrice utilisant cette colle, piece electrique, module et carte a circuit, connexion electrique, fabrication de carte a circuit et de piece electronique ceramique
DE19919716A1 (de) * 1999-04-30 2001-08-09 Daimler Chrysler Ag Mikroelektronische Baugruppe
JP2000332388A (ja) * 1999-05-17 2000-11-30 Sony Corp 電子部品実装構造

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Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 185 (E - 132) 21 September 1982 (1982-09-21) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 152 (C - 0929) 15 April 1992 (1992-04-15) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 14 5 March 2001 (2001-03-05) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1750306A1 (fr) * 2005-08-05 2007-02-07 Delphi Technologies, Inc. Module électronique avec remplissage d'écartement et méthode
US20120286381A1 (en) * 2011-05-10 2012-11-15 Stmicroelectronics S.R.L. Electronic mems device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof
US8981498B2 (en) * 2011-05-10 2015-03-17 Stmicroelectronics S.R.L. Electronic MEMS device comprising a chip bonded to a substrate and having cavities and manufacturing process thereof

Also Published As

Publication number Publication date
DE10204959A1 (de) 2003-08-14
AU2003210179A1 (en) 2003-09-02
EP1380195A1 (fr) 2004-01-14

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