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AU2003210179A1 - Printed circuit board comprising a component - Google Patents

Printed circuit board comprising a component

Info

Publication number
AU2003210179A1
AU2003210179A1 AU2003210179A AU2003210179A AU2003210179A1 AU 2003210179 A1 AU2003210179 A1 AU 2003210179A1 AU 2003210179 A AU2003210179 A AU 2003210179A AU 2003210179 A AU2003210179 A AU 2003210179A AU 2003210179 A1 AU2003210179 A1 AU 2003210179A1
Authority
AU
Australia
Prior art keywords
component
circuit board
printed circuit
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003210179A
Other languages
English (en)
Inventor
Dietmar Birgel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of AU2003210179A1 publication Critical patent/AU2003210179A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2003210179A 2002-02-06 2003-01-24 Printed circuit board comprising a component Abandoned AU2003210179A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10204959A DE10204959A1 (de) 2002-02-06 2002-02-06 Leiterplatte mit einem Bauteil
DE10204959.9 2002-02-06
PCT/EP2003/000715 WO2003067945A1 (fr) 2002-02-06 2003-01-24 Carte de circuits imprimes comprenant un composant

Publications (1)

Publication Number Publication Date
AU2003210179A1 true AU2003210179A1 (en) 2003-09-02

Family

ID=27588447

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003210179A Abandoned AU2003210179A1 (en) 2002-02-06 2003-01-24 Printed circuit board comprising a component

Country Status (4)

Country Link
EP (1) EP1380195A1 (fr)
AU (1) AU2003210179A1 (fr)
DE (1) DE10204959A1 (fr)
WO (1) WO2003067945A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7118940B1 (en) * 2005-08-05 2006-10-10 Delphi Technologies, Inc. Method of fabricating an electronic package having underfill standoff
DE102007035903A1 (de) * 2007-07-31 2009-03-12 Siemens Ag Kontaktierungsfolie und Verfahren zum Herstellen einer elektrisch leitenden Verbindung
ITTO20110408A1 (it) * 2011-05-10 2012-11-11 St Microelectronics Srl Dispositivo elettronico mems comprendente una piastrina incollata ad un substrato e dotata di cavita' e relativo processo di fabbricazione

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
JPH047381A (ja) * 1990-04-25 1992-01-10 Senju Metal Ind Co Ltd 電子部品の仮固定用接着剤
DE4121449A1 (de) * 1991-06-28 1993-01-07 Siemens Ag Hoergeraet, insbesondere am kopf tragbares mini-hoergeraet, und verfahren zur herstellung
JP3225062B2 (ja) * 1991-08-05 2001-11-05 ローム株式会社 熱硬化性樹脂シート及びそれを用いた半導体素子の実装方法
US5255431A (en) * 1992-06-26 1993-10-26 General Electric Company Method of using frozen epoxy for placing pin-mounted components in a circuit module
DE4332752A1 (de) * 1993-09-25 1995-03-30 Bosch Gmbh Robert Bauteil und Verfahren zu dessen Herstellung
US5820716A (en) * 1993-11-05 1998-10-13 Micron Technology, Inc. Method for surface mounting electrical components to a substrate
DE4406418C1 (de) * 1994-02-28 1995-07-13 Bosch Gmbh Robert Anisotrop elektrisch leitender Kleber
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
DE19637214C2 (de) * 1996-08-22 2003-04-30 Pav Card Gmbh Verfahren zur Herstellung einer elektrischen und mechanischen Verbindung eines in einer Ausnehmung eines Kartenträgers einer Chipkarte eingesetzten Moduls
JPH10135597A (ja) * 1996-10-31 1998-05-22 Sony Corp 電子部品の実装構造及びその製造方法
DE19701165C1 (de) * 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
DE19819054B4 (de) * 1998-04-29 2007-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Montage und Justierung von Bauteilen auf einer Befestigungsunterlage
US6479763B1 (en) * 1998-08-28 2002-11-12 Matsushita Electric Industrial Co., Ltd. Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
DE19905807A1 (de) * 1999-02-11 2000-08-31 Ksw Microtec Ges Fuer Angewand Verfahren zur Herstellung elektrisch leitender Verbindungen
DE19919716B4 (de) * 1999-04-30 2005-11-03 Conti Temic Microelectronic Gmbh Mikroelektronische Baugruppe
JP2000332388A (ja) * 1999-05-17 2000-11-30 Sony Corp 電子部品実装構造
DE19942631A1 (de) * 1999-09-07 2001-03-08 Endress Hauser Gmbh Co Verfahren zum Bestücken einer Leiterplatte

Also Published As

Publication number Publication date
EP1380195A1 (fr) 2004-01-14
DE10204959A1 (de) 2003-08-14
WO2003067945A1 (fr) 2003-08-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase