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WO2003041165A3 - Interface thermique electriquement conductrice - Google Patents

Interface thermique electriquement conductrice Download PDF

Info

Publication number
WO2003041165A3
WO2003041165A3 PCT/US2001/032544 US0132544W WO03041165A3 WO 2003041165 A3 WO2003041165 A3 WO 2003041165A3 US 0132544 W US0132544 W US 0132544W WO 03041165 A3 WO03041165 A3 WO 03041165A3
Authority
WO
WIPO (PCT)
Prior art keywords
flakes
edges
heat transfer
metal flakes
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/032544
Other languages
English (en)
Other versions
WO2003041165A2 (fr
Inventor
Ignatius J Rasiah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to CNA2007100968120A priority Critical patent/CN101038795A/zh
Priority to KR1020047001319A priority patent/KR100782235B1/ko
Priority to US10/483,370 priority patent/US7083850B2/en
Priority to CNB018235581A priority patent/CN1319162C/zh
Priority to JP2003543099A priority patent/JP4202923B2/ja
Priority to EP01988123A priority patent/EP1436835A2/fr
Priority to PCT/US2001/032544 priority patent/WO2003041165A2/fr
Priority to CA002454155A priority patent/CA2454155A1/fr
Priority to TW091124081A priority patent/TW578180B/zh
Publication of WO2003041165A2 publication Critical patent/WO2003041165A2/fr
Publication of WO2003041165A3 publication Critical patent/WO2003041165A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1103—Making porous workpieces or articles with particular physical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un matériau de transfert de chaleur poreux, souple et élastique comprenant un réseau de flocons métalliques. De tels matériaux de transfert de chaleur sont, de préférence, obtenus, dans un premier temps, par formation d'une pâte conductrice comprenant un solvant volatil organique et des flocons métalliques conducteurs. La pâte conductrice est chauffée à une température inférieure au point de fusion des flocons métalliques, évaporant ainsi le solvant et frittant uniquement les bords des flocons qui sont fusionnés aux bords de flocons adjacents, de manière que des pores ouverts soient définis entre au moins quelques flocons parmi les flocons adjacents, formant ainsi un réseau de flocons métalliques. Grâce à cette structure en réseau, le matériau de transfert de chaleur présente aussi bien un faible module de stockage inférieur à environ 10 Gpa que de bonnes propriétés de résistance électrique.
PCT/US2001/032544 2001-10-18 2001-10-18 Interface thermique electriquement conductrice Ceased WO2003041165A2 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CNA2007100968120A CN101038795A (zh) 2001-10-18 2001-10-18 导电膏及传热材料
KR1020047001319A KR100782235B1 (ko) 2001-10-18 2001-10-18 소결된 금속 플레이크
US10/483,370 US7083850B2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
CNB018235581A CN1319162C (zh) 2001-10-18 2001-10-18 传热材料及其形成方法
JP2003543099A JP4202923B2 (ja) 2001-10-18 2001-10-18 熱伝導性材料、マイクロエレクトロニクス装置、熱伝導性材料を形成する方法及びマイクロチップから熱を伝導して取り去る方法
EP01988123A EP1436835A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
PCT/US2001/032544 WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
CA002454155A CA2454155A1 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
TW091124081A TW578180B (en) 2001-10-18 2002-10-18 Sintered metal flakes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/032544 WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice

Publications (2)

Publication Number Publication Date
WO2003041165A2 WO2003041165A2 (fr) 2003-05-15
WO2003041165A3 true WO2003041165A3 (fr) 2003-07-24

Family

ID=21742921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/032544 Ceased WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice

Country Status (7)

Country Link
EP (1) EP1436835A2 (fr)
JP (1) JP4202923B2 (fr)
KR (1) KR100782235B1 (fr)
CN (2) CN1319162C (fr)
CA (1) CA2454155A1 (fr)
TW (1) TW578180B (fr)
WO (1) WO2003041165A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
TW200923975A (en) * 2007-10-12 2009-06-01 Cheil Ind Inc Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods
CN101911219B (zh) 2008-01-17 2015-12-16 日亚化学工业株式会社 导电性材料及其制造方法、电子设备、发光装置及其制造方法
CN101319775B (zh) * 2008-07-18 2010-06-09 东莞东海龙环保科技有限公司 功率型led灯具的高导热柔性填隙材料
EP2405449B1 (fr) * 2009-03-06 2017-08-16 Toyo Aluminium Kabushiki Kaisha Composition de pâte électriquement conductrice et film électriquement conducteur formé à l'aide de celle-ci
EP2612755B1 (fr) * 2010-08-31 2019-03-20 Sekisui Polymatech Co., Ltd. Feuille thermoconductrice
US10000670B2 (en) * 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
CN107709418B (zh) 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
JP6927455B2 (ja) * 2019-03-20 2021-09-01 住友ベークライト株式会社 熱伝導性組成物および半導体装置
CN112207481A (zh) * 2020-09-09 2021-01-12 中山大学 一种低温无压烧结微米银焊膏及其制备方法和应用
CN113492281A (zh) * 2021-05-27 2021-10-12 中山大学 一种在裸铜上低温无压直接烧结的微米银焊膏及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (ja) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk 多孔型放熱体
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
EP0816423A1 (fr) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Article thermiquement conductrice de polytétrafluoréthylène
JPH1135914A (ja) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1019760B (zh) * 1987-06-11 1992-12-30 国家机械工业委员会上海材料研究所 由球形金属粉末制造多孔元件的方法
JPH08213026A (ja) * 1994-11-28 1996-08-20 Katayama Tokushu Kogyo Kk 電池電極基板用金属多孔体、電池電極板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (ja) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk 多孔型放熱体
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
EP0816423A1 (fr) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Article thermiquement conductrice de polytétrafluoréthylène
JPH1135914A (ja) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 392 (M - 755) 19 October 1988 (1988-10-19) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 10 31 October 1997 (1997-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
WO2003041165A2 (fr) 2003-05-15
TW578180B (en) 2004-03-01
KR20040051582A (ko) 2004-06-18
JP4202923B2 (ja) 2008-12-24
CA2454155A1 (fr) 2003-05-15
CN1319162C (zh) 2007-05-30
KR100782235B1 (ko) 2007-12-05
CN101038795A (zh) 2007-09-19
CN1545731A (zh) 2004-11-10
EP1436835A2 (fr) 2004-07-14
JP2005509293A (ja) 2005-04-07

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