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WO2003041165A3 - Electrically conductive thermal interface - Google Patents

Electrically conductive thermal interface Download PDF

Info

Publication number
WO2003041165A3
WO2003041165A3 PCT/US2001/032544 US0132544W WO03041165A3 WO 2003041165 A3 WO2003041165 A3 WO 2003041165A3 US 0132544 W US0132544 W US 0132544W WO 03041165 A3 WO03041165 A3 WO 03041165A3
Authority
WO
WIPO (PCT)
Prior art keywords
flakes
edges
heat transfer
metal flakes
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/032544
Other languages
French (fr)
Other versions
WO2003041165A2 (en
Inventor
Ignatius J Rasiah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to CNA2007100968120A priority Critical patent/CN101038795A/en
Priority to KR1020047001319A priority patent/KR100782235B1/en
Priority to US10/483,370 priority patent/US7083850B2/en
Priority to CNB018235581A priority patent/CN1319162C/en
Priority to JP2003543099A priority patent/JP4202923B2/en
Priority to EP01988123A priority patent/EP1436835A2/en
Priority to PCT/US2001/032544 priority patent/WO2003041165A2/en
Priority to CA002454155A priority patent/CA2454155A1/en
Priority to TW091124081A priority patent/TW578180B/en
Publication of WO2003041165A2 publication Critical patent/WO2003041165A2/en
Publication of WO2003041165A3 publication Critical patent/WO2003041165A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1103—Making porous workpieces or articles with particular physical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)

Abstract

A porous, flexible, resilient heat transfer material which comprises network of metal flakes. Such heat transfer materials are preferably produced by first forming a conductive paste comprising a volatile organic solvent and conductive metal flakes. The conductive paste is heated to a temperature below the melting point of the metal flakes, thereby evaporating the solvent and sintering the flakes only at their edges. The edges of the flakes are fused to the edges of adjacent flakes such that open pores are defined between at least some of the adjacent flakes, thereby forming a network of metal flakes. This network structure allows the heat transfer material to have a low storage modulus of less than about 10 Gpa, while having good electrical resistance properties.
PCT/US2001/032544 2001-10-18 2001-10-18 Electrically conductive thermal interface Ceased WO2003041165A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CNA2007100968120A CN101038795A (en) 2001-10-18 2001-10-18 Conductive paste and heat diffusion material
KR1020047001319A KR100782235B1 (en) 2001-10-18 2001-10-18 Sintered Metal Flake
US10/483,370 US7083850B2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
CNB018235581A CN1319162C (en) 2001-10-18 2001-10-18 Heat transfer material and method of forming same
JP2003543099A JP4202923B2 (en) 2001-10-18 2001-10-18 Thermally conductive material, microelectronic device, method of forming thermally conductive material, and method of conducting and removing heat from a microchip
EP01988123A EP1436835A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
CA002454155A CA2454155A1 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
TW091124081A TW578180B (en) 2001-10-18 2002-10-18 Sintered metal flakes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface

Publications (2)

Publication Number Publication Date
WO2003041165A2 WO2003041165A2 (en) 2003-05-15
WO2003041165A3 true WO2003041165A3 (en) 2003-07-24

Family

ID=21742921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/032544 Ceased WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface

Country Status (7)

Country Link
EP (1) EP1436835A2 (en)
JP (1) JP4202923B2 (en)
KR (1) KR100782235B1 (en)
CN (2) CN1319162C (en)
CA (1) CA2454155A1 (en)
TW (1) TW578180B (en)
WO (1) WO2003041165A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529112B1 (en) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 Display apparatus having porous heat transfer sheet
TW200923975A (en) * 2007-10-12 2009-06-01 Cheil Ind Inc Composition for fabrication of electrode, electrode fabricated using the same, plasma display panel, and associated methods
CN101911219B (en) 2008-01-17 2015-12-16 日亚化学工业株式会社 Conductive material and manufacturing method thereof, electronic device, light-emitting device and manufacturing method thereof
CN101319775B (en) * 2008-07-18 2010-06-09 东莞东海龙环保科技有限公司 High thermal conductivity flexible sealant of power type LED lamp
EP2405449B1 (en) * 2009-03-06 2017-08-16 Toyo Aluminium Kabushiki Kaisha Electrically conductive paste composition and electrically conductive film formed by using the same
EP2612755B1 (en) * 2010-08-31 2019-03-20 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
US10000670B2 (en) * 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
CN107709418B (en) 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 Sinterable films and pastes and methods of using the same
JP6927455B2 (en) * 2019-03-20 2021-09-01 住友ベークライト株式会社 Thermally conductive compositions and semiconductor devices
CN112207481A (en) * 2020-09-09 2021-01-12 中山大学 Low-temperature pressureless sintering micron silver soldering paste and preparation method and application thereof
CN113492281A (en) * 2021-05-27 2021-10-12 中山大学 Micron silver soldering paste directly sintered on bare copper at low temperature and without pressure, and preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (en) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk Porous-type heat radiator
JPH07118701A (en) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk Flaky metal powder, metallic porous body and production of the powder
JPH09162336A (en) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp Heat dissipation sheet
EP0816423A1 (en) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Thermally conductive polytetrafluoroethylene article
JPH1135914A (en) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd Conductive resin paste and semiconductor device manufactured using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1019760B (en) * 1987-06-11 1992-12-30 国家机械工业委员会上海材料研究所 Method for making porous elements from spherical metal powders
JPH08213026A (en) * 1994-11-28 1996-08-20 Katayama Tokushu Kogyo Kk Metallic porous body for battery electrode substrate, battery plate, and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (en) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk Porous-type heat radiator
JPH07118701A (en) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk Flaky metal powder, metallic porous body and production of the powder
JPH09162336A (en) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp Heat dissipation sheet
EP0816423A1 (en) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Thermally conductive polytetrafluoroethylene article
JPH1135914A (en) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd Conductive resin paste and semiconductor device manufactured using the same

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 392 (M - 755) 19 October 1988 (1988-10-19) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 10 31 October 1997 (1997-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
WO2003041165A2 (en) 2003-05-15
TW578180B (en) 2004-03-01
KR20040051582A (en) 2004-06-18
JP4202923B2 (en) 2008-12-24
CA2454155A1 (en) 2003-05-15
CN1319162C (en) 2007-05-30
KR100782235B1 (en) 2007-12-05
CN101038795A (en) 2007-09-19
CN1545731A (en) 2004-11-10
EP1436835A2 (en) 2004-07-14
JP2005509293A (en) 2005-04-07

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