[go: up one dir, main page]

WO2002018100A3 - Procede et appareil permettant de mesurer un etat de polissage - Google Patents

Procede et appareil permettant de mesurer un etat de polissage Download PDF

Info

Publication number
WO2002018100A3
WO2002018100A3 PCT/IB2001/001532 IB0101532W WO0218100A3 WO 2002018100 A3 WO2002018100 A3 WO 2002018100A3 IB 0101532 W IB0101532 W IB 0101532W WO 0218100 A3 WO0218100 A3 WO 0218100A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
measuring
polishing condition
picture
measurement site
Prior art date
Application number
PCT/IB2001/001532
Other languages
English (en)
Other versions
WO2002018100A2 (fr
Inventor
David Haggart
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to KR10-2003-7002903A priority Critical patent/KR20030024920A/ko
Priority to JP2002523057A priority patent/JP2004507900A/ja
Priority to EP01956736A priority patent/EP1315598A2/fr
Publication of WO2002018100A2 publication Critical patent/WO2002018100A2/fr
Publication of WO2002018100A3 publication Critical patent/WO2002018100A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

L'invention concerne un procédé permettant de déterminer l'état d'une surface, tel que l'épaisseur ou la réflectivité, de n'importe quelle zone sur une plaquette (16) pendant un polissage chimico-mécanique (PCM). Ce procédé consiste, dans un premier temps, à choisir une zone d'un site de mesure sur la surface de la plaquette; puis, à capturer une image (22) de la surface se trouvant dans la limite du site de mesure, par exemple, à travers une fenêtre (14); puis, à analyser ladite image. Ce procédé permet d'obtenir un critère d'évaluation précis et une épaisseur finale précise d'une couche spécifique sur la plaquette.
PCT/IB2001/001532 2000-08-31 2001-08-27 Procede et appareil permettant de mesurer un etat de polissage WO2002018100A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7002903A KR20030024920A (ko) 2000-08-31 2001-08-27 폴리싱 상태를 측정하기 위한 방법 및 장치
JP2002523057A JP2004507900A (ja) 2000-08-31 2001-08-27 研磨状態を測定するための方法と装置
EP01956736A EP1315598A2 (fr) 2000-08-31 2001-08-27 Procede et appareil permettant de mesurer un etat de polissage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65289800A 2000-08-31 2000-08-31
US09/652,898 2000-08-31

Publications (2)

Publication Number Publication Date
WO2002018100A2 WO2002018100A2 (fr) 2002-03-07
WO2002018100A3 true WO2002018100A3 (fr) 2002-05-16

Family

ID=24618652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/001532 WO2002018100A2 (fr) 2000-08-31 2001-08-27 Procede et appareil permettant de mesurer un etat de polissage

Country Status (5)

Country Link
EP (1) EP1315598A2 (fr)
JP (1) JP2004507900A (fr)
KR (1) KR20030024920A (fr)
TW (1) TW534854B (fr)
WO (1) WO2002018100A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1302522C (zh) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
JP4464642B2 (ja) 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP2013122956A (ja) * 2011-12-09 2013-06-20 Disco Abrasive Syst Ltd 加工装置
EP3917750A1 (fr) 2019-01-28 2021-12-08 Borealis AG Procédé de production d'une composition polymère
US20230026751A1 (en) * 2019-12-03 2023-01-26 Ebara Corporation Polishing apparatus and polishing method
JP7648403B2 (ja) * 2021-02-19 2025-03-18 株式会社岡本工作機械製作所 研削方法及び研削装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11198033A (ja) * 1997-10-31 1999-07-27 Canon Inc 研磨装置及び研磨方法
WO1999064205A1 (fr) * 1998-06-08 1999-12-16 Speedfam-Ipec Corporation Procede et appareil de detection de point d'extremite lors d'un polissage chimico-mecanique
JP2000033561A (ja) * 1998-07-21 2000-02-02 Dainippon Screen Mfg Co Ltd 終点検出装置、終点検出方法
US6102775A (en) * 1997-04-18 2000-08-15 Nikon Corporation Film inspection method
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6102775A (en) * 1997-04-18 2000-08-15 Nikon Corporation Film inspection method
JPH11198033A (ja) * 1997-10-31 1999-07-27 Canon Inc 研磨装置及び研磨方法
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method
WO1999064205A1 (fr) * 1998-06-08 1999-12-16 Speedfam-Ipec Corporation Procede et appareil de detection de point d'extremite lors d'un polissage chimico-mecanique
JP2000033561A (ja) * 1998-07-21 2000-02-02 Dainippon Screen Mfg Co Ltd 終点検出装置、終点検出方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *

Also Published As

Publication number Publication date
WO2002018100A2 (fr) 2002-03-07
JP2004507900A (ja) 2004-03-11
TW534854B (en) 2003-06-01
EP1315598A2 (fr) 2003-06-04
KR20030024920A (ko) 2003-03-26

Similar Documents

Publication Publication Date Title
EP0881484A3 (fr) Procédé et appareil pour la monitorage "in-situ" de l'épaisseur durant polissage chimique-mécanique
US6334807B1 (en) Chemical mechanical polishing in-situ end point system
MY128145A (en) In-situ method and apparatus for end point detection in chemical mechanical polishing
US6676482B2 (en) Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
EP0827193A3 (fr) Méthode de détermination de l'étape finale du polissage et appareil
WO2002087825A8 (fr) Systeme de detection de point d'extremite integre a systeme de surveillance optique et de surveillance des courants de foucault
EP0881040A3 (fr) Procédé et dispositif pour le contrÔle de l'épaisseur à l'aide d'un spectromètre à longueurs d'ondes multiples durant le polissage mécano-chimique
WO2002082530A3 (fr) Mesure d'epaisseur in-situ a utiliser dans le traitement de semi-conducteurs
AU9108998A (en) Method and apparatus for detecting the endpoint in chemical-mechanical polishingof semiconductor wafers
WO2000000560A3 (fr) Boue de polissage mecano chimique et son procede d'utilisation
WO2003009349A3 (fr) Procedes et compositions pour polir mecaniquement et chimiquement des substrats d'isolation de tranchees peu profondes
US20030053042A1 (en) Method and apparatus for optical endpoint detection during chemical mechanical polishing
EP1014437B8 (fr) Methode de mesurement in-situ et appareil de fabrication de semi-conducteurs
KR960040559A (ko) 연마방법 및 그 장치
EP1108501A3 (fr) Procédé et dispositif pour le contrôle et la détection in-situ de la fin d'une opération de polissage mécano-chimique
EP0827192A3 (fr) Méthode de mesure de la densité de porteurs d'un semi-conducteur, méthode de fabrication associé et tranche semi-conductrice
DE69908110D1 (de) Verfahren und vorrichtung zur schichtdickenbestimmung beim wafertransportsystem
EP0806266A3 (fr) Procédé de polissage et dispositif pour sa mise en oeuvre
WO2001071779A3 (fr) Procede et appareil de planarisation d'un contacteur a semi-conducteurs
WO2003066282A3 (fr) Systemes et procedes de caracterisation d'un processus de polissage
AU1072700A (en) An apparatus for integrated monitoring of wafers and for process control in the semiconductor manufacturing and method for use thereof
EP1072359A3 (fr) Dispositif de polissage de plaquette semiconductrice
EP0874396A3 (fr) Méthode de détermination de la caractéristique d'une tranche semi-conductrice utilisant un moniteur d'épaisseur de film
WO2003005430A3 (fr) Procede et appareil de controle d'un processus de placage
WO2003046531A3 (fr) Procede de detection de defauts

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1020037002903

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2002523057

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2001956736

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020037002903

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2001956736

Country of ref document: EP

WWR Wipo information: refused in national office

Ref document number: 2001956736

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2001956736

Country of ref document: EP