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WO2002018100A3 - Method and apparatus for measuring a polishing condition - Google Patents

Method and apparatus for measuring a polishing condition Download PDF

Info

Publication number
WO2002018100A3
WO2002018100A3 PCT/IB2001/001532 IB0101532W WO0218100A3 WO 2002018100 A3 WO2002018100 A3 WO 2002018100A3 IB 0101532 W IB0101532 W IB 0101532W WO 0218100 A3 WO0218100 A3 WO 0218100A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
measuring
polishing condition
picture
measurement site
Prior art date
Application number
PCT/IB2001/001532
Other languages
French (fr)
Other versions
WO2002018100A2 (en
Inventor
David Haggart
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to KR10-2003-7002903A priority Critical patent/KR20030024920A/en
Priority to JP2002523057A priority patent/JP2004507900A/en
Priority to EP01956736A priority patent/EP1315598A2/en
Publication of WO2002018100A2 publication Critical patent/WO2002018100A2/en
Publication of WO2002018100A3 publication Critical patent/WO2002018100A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

In a method for determining the condition of the surface, such as thickness or reflectivity, of any specific location on a wafer (16) during a chemical mechanical polishing (CMP), at first, a location of a measurement site on the wafer surface is selected. Second, a picture (22) of the surface within the measurement site is taken, for example, through a window (14). Third, the picture is analyzed. This provides an exact endpointing and an exact final thickness of a specific layer on the wafer.
PCT/IB2001/001532 2000-08-31 2001-08-27 Method and apparatus for measuring a polishing condition WO2002018100A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7002903A KR20030024920A (en) 2000-08-31 2001-08-27 Method and apparatus for measuring a polishing condition
JP2002523057A JP2004507900A (en) 2000-08-31 2001-08-27 Method and apparatus for measuring polishing condition
EP01956736A EP1315598A2 (en) 2000-08-31 2001-08-27 Method and apparatus for measuring a polishing condition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65289800A 2000-08-31 2000-08-31
US09/652,898 2000-08-31

Publications (2)

Publication Number Publication Date
WO2002018100A2 WO2002018100A2 (en) 2002-03-07
WO2002018100A3 true WO2002018100A3 (en) 2002-05-16

Family

ID=24618652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/001532 WO2002018100A2 (en) 2000-08-31 2001-08-27 Method and apparatus for measuring a polishing condition

Country Status (5)

Country Link
EP (1) EP1315598A2 (en)
JP (1) JP2004507900A (en)
KR (1) KR20030024920A (en)
TW (1) TW534854B (en)
WO (1) WO2002018100A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1302522C (en) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 An Endpoint Detection System of a Chemical Mechanical Polishing Device
JP4464642B2 (en) 2003-09-10 2010-05-19 株式会社荏原製作所 Polishing state monitoring apparatus, polishing state monitoring method, polishing apparatus, and polishing method
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP2013122956A (en) * 2011-12-09 2013-06-20 Disco Abrasive Syst Ltd Processing device
EP3917750A1 (en) 2019-01-28 2021-12-08 Borealis AG Process for producing a polymer composition
US20230026751A1 (en) * 2019-12-03 2023-01-26 Ebara Corporation Polishing apparatus and polishing method
JP7648403B2 (en) * 2021-02-19 2025-03-18 株式会社岡本工作機械製作所 Grinding method and grinding device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11198033A (en) * 1997-10-31 1999-07-27 Canon Inc Polishing apparatus and polishing method
WO1999064205A1 (en) * 1998-06-08 1999-12-16 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
JP2000033561A (en) * 1998-07-21 2000-02-02 Dainippon Screen Mfg Co Ltd End point detecting device and end point detecting method
US6102775A (en) * 1997-04-18 2000-08-15 Nikon Corporation Film inspection method
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6102775A (en) * 1997-04-18 2000-08-15 Nikon Corporation Film inspection method
JPH11198033A (en) * 1997-10-31 1999-07-27 Canon Inc Polishing apparatus and polishing method
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method
WO1999064205A1 (en) * 1998-06-08 1999-12-16 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
JP2000033561A (en) * 1998-07-21 2000-02-02 Dainippon Screen Mfg Co Ltd End point detecting device and end point detecting method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *

Also Published As

Publication number Publication date
WO2002018100A2 (en) 2002-03-07
JP2004507900A (en) 2004-03-11
TW534854B (en) 2003-06-01
EP1315598A2 (en) 2003-06-04
KR20030024920A (en) 2003-03-26

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