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WO2002067054A3 - High-resolution photoresist structuring of multi-layer structures deposited onto substrates - Google Patents

High-resolution photoresist structuring of multi-layer structures deposited onto substrates Download PDF

Info

Publication number
WO2002067054A3
WO2002067054A3 PCT/EP2002/001140 EP0201140W WO02067054A3 WO 2002067054 A3 WO2002067054 A3 WO 2002067054A3 EP 0201140 W EP0201140 W EP 0201140W WO 02067054 A3 WO02067054 A3 WO 02067054A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
deposited onto
substrate
structure elements
layer structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2002/001140
Other languages
French (fr)
Other versions
WO2002067054A2 (en
Inventor
Thomas Daeubler
Andreas Dietzel
Frank Voges
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
International Business Machines Corp
Original Assignee
IBM Deutschland GmbH
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH, International Business Machines Corp filed Critical IBM Deutschland GmbH
Priority to KR1020037010417A priority Critical patent/KR100582830B1/en
Priority to JP2002566721A priority patent/JP2004530255A/en
Priority to EP02710837A priority patent/EP1433027A2/en
Priority to AU2002229742A priority patent/AU2002229742A1/en
Publication of WO2002067054A2 publication Critical patent/WO2002067054A2/en
Publication of WO2002067054A3 publication Critical patent/WO2002067054A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

For fabricating a multi-layer structure of m 2 layers deposited on a substrate, a radiation irradiated by structure elements themselves is used for the lithographic exposure of a covering layer thus to achieve spatial self-alignment between the different layers. In a first step, a first layer is deposited onto the substrate. In a next step, the first layer is structured into structure elements. In a further step, a second layer of a material, which is sensitive to a physical and/or chemical interaction appropriate for an image transfer from the structure elements into the second layer, is deposited onto the substrate. The second layer is exposed with a pre-mentioned interaction originated or modulated by the structure elements. Finally, the exposed or non-exposed material of the second layer is removed from the substrate thus revealing the second layer structured in accordance with said image transfer.
PCT/EP2002/001140 2001-02-21 2002-02-05 High-resolution photoresist structuring of multi-layer structures deposited onto substrates Ceased WO2002067054A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020037010417A KR100582830B1 (en) 2001-02-21 2002-02-05 High resolution photoresist structuring for multilayer structures deposited on substrates
JP2002566721A JP2004530255A (en) 2001-02-21 2002-02-05 High-resolution photoresist structuring of multilayer structures deposited on substrates
EP02710837A EP1433027A2 (en) 2001-02-21 2002-02-05 High-resolution photoresist structuring of multi-layer structures deposited onto substrates
AU2002229742A AU2002229742A1 (en) 2001-02-21 2002-02-05 High-resolution photoresist structuring of multi-layer structures deposited onto substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01104098 2001-02-21
EP01104098.7 2001-02-21

Publications (2)

Publication Number Publication Date
WO2002067054A2 WO2002067054A2 (en) 2002-08-29
WO2002067054A3 true WO2002067054A3 (en) 2003-04-17

Family

ID=8176547

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/001140 Ceased WO2002067054A2 (en) 2001-02-21 2002-02-05 High-resolution photoresist structuring of multi-layer structures deposited onto substrates

Country Status (5)

Country Link
EP (1) EP1433027A2 (en)
JP (1) JP2004530255A (en)
KR (1) KR100582830B1 (en)
AU (1) AU2002229742A1 (en)
WO (1) WO2002067054A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009072658A1 (en) * 2007-12-04 2009-06-11 Canon Kabushiki Kaisha Method of manufacturing flat panel display
KR100980115B1 (en) 2008-01-07 2010-09-07 서울대학교산학협력단 LED Coating Method
WO2011132805A1 (en) * 2010-04-23 2011-10-27 우리엘에스티 주식회사 Method for coating an led
KR102037357B1 (en) * 2018-06-21 2019-11-26 (주)라이타이저 Fabrication method of color conversion diode
US11094530B2 (en) * 2019-05-14 2021-08-17 Applied Materials, Inc. In-situ curing of color conversion layer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1399696A (en) * 1972-06-19 1975-07-02 Burroughs Corp Display panel printing apparatus
US4666236A (en) * 1982-08-10 1987-05-19 Omron Tateisi Electronics Co. Optical coupling device and method of producing same
US4709990A (en) * 1984-03-08 1987-12-01 Kabushiki Kaisha Toshiba Method of manufacturing a color-matrix-type liquid crystal display device
US4873175A (en) * 1986-01-08 1989-10-10 Shinto Paint Co., Ltd. Method of forming functional coating film between fine electric conductive circuits
JPH0273306A (en) * 1988-09-09 1990-03-13 Toppan Printing Co Ltd Color filter and its manufacturing method
WO1991010170A1 (en) * 1989-12-22 1991-07-11 Manufacturing Sciences, Inc. Programmable masking apparatus
EP0722100A1 (en) * 1994-12-20 1996-07-17 Shinto Paint Company, Limited Method for manufacturing multi-color filter and full color display devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1399696A (en) * 1972-06-19 1975-07-02 Burroughs Corp Display panel printing apparatus
US4666236A (en) * 1982-08-10 1987-05-19 Omron Tateisi Electronics Co. Optical coupling device and method of producing same
US4709990A (en) * 1984-03-08 1987-12-01 Kabushiki Kaisha Toshiba Method of manufacturing a color-matrix-type liquid crystal display device
US4873175A (en) * 1986-01-08 1989-10-10 Shinto Paint Co., Ltd. Method of forming functional coating film between fine electric conductive circuits
JPH0273306A (en) * 1988-09-09 1990-03-13 Toppan Printing Co Ltd Color filter and its manufacturing method
WO1991010170A1 (en) * 1989-12-22 1991-07-11 Manufacturing Sciences, Inc. Programmable masking apparatus
EP0722100A1 (en) * 1994-12-20 1996-07-17 Shinto Paint Company, Limited Method for manufacturing multi-color filter and full color display devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 264 (P - 1057) 7 June 1990 (1990-06-07) *

Also Published As

Publication number Publication date
JP2004530255A (en) 2004-09-30
KR100582830B1 (en) 2006-05-23
KR20040024545A (en) 2004-03-20
AU2002229742A1 (en) 2002-09-04
EP1433027A2 (en) 2004-06-30
WO2002067054A2 (en) 2002-08-29

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