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WO2001013175A3 - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

Info

Publication number
WO2001013175A3
WO2001013175A3 PCT/KR2000/000883 KR0000883W WO0113175A3 WO 2001013175 A3 WO2001013175 A3 WO 2001013175A3 KR 0000883 W KR0000883 W KR 0000883W WO 0113175 A3 WO0113175 A3 WO 0113175A3
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive resin
exposed area
resin composition
well
chemical bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2000/000883
Other languages
French (fr)
Other versions
WO2001013175A2 (en
Inventor
Yong-Sik Ahn
Kyung-Jun Kim
Yun-Il Hwang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Corp
Original Assignee
LG Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chemical Co Ltd filed Critical LG Chemical Co Ltd
Priority to JP2001517215A priority Critical patent/JP2003507758A/en
Priority to EP00952027A priority patent/EP1410108A2/en
Publication of WO2001013175A2 publication Critical patent/WO2001013175A2/en
Publication of WO2001013175A3 publication Critical patent/WO2001013175A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The present invention relates to a photosensitive resin composition capable of being developed by an alkaline aqueous solution, and provides a photosensitive resin which has superior resolving power by having a chemical bond between a binder resin and a crosslinking compound as well as a chemical bond between binder resin chains at an exposed area during an exposure process, thus maximizing a solubility difference between an exposed area and a non-exposed area during a developing process, and which has process benefits as well as superior film characteristics by reducing a consumed amount of a crosslinking compound, thus minimizing total amount of UV irradiation necessary.
PCT/KR2000/000883 1999-08-17 2000-08-10 Photosensitive resin composition Ceased WO2001013175A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001517215A JP2003507758A (en) 1999-08-17 2000-08-10 Photosensitive resin composition
EP00952027A EP1410108A2 (en) 1999-08-17 2000-08-10 Photosensitive resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1999/33884 1999-08-17
KR10-1999-0033884A KR100493961B1 (en) 1999-08-17 1999-08-17 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
WO2001013175A2 WO2001013175A2 (en) 2001-02-22
WO2001013175A3 true WO2001013175A3 (en) 2001-06-14

Family

ID=19607497

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2000/000883 Ceased WO2001013175A2 (en) 1999-08-17 2000-08-10 Photosensitive resin composition

Country Status (5)

Country Link
EP (1) EP1410108A2 (en)
JP (1) JP2003507758A (en)
KR (1) KR100493961B1 (en)
TW (1) TWI286666B (en)
WO (1) WO2001013175A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003082937A2 (en) 2002-03-28 2003-10-09 Huntsman Advanced Materials (Switzerland) Gmbh Polymerisable composition
JP4583022B2 (en) * 2002-12-13 2010-11-17 大日本印刷株式会社 Method for producing regenerative photoreactive compound for color-splitting light transmission structure
JP4704496B2 (en) * 2002-12-13 2011-06-15 大日本印刷株式会社 Photoreactive compound for color-splitting light transmission structure and color-splitting light transmission structure
KR20050070619A (en) * 2003-12-30 2005-07-07 제일모직주식회사 Photosensitive resin composition for color filter
JP4571417B2 (en) * 2004-02-18 2010-10-27 ユニチカ株式会社 Laminated film with an easy adhesion layer
KR100709891B1 (en) * 2004-03-22 2007-04-20 주식회사 엘지화학 Alkali-soluble resin and photosensitive composition containing same
WO2006080786A1 (en) 2005-01-25 2006-08-03 Lg Chem. Ltd. Thermally curable resin composition with extended storage stability and good adhesive property
KR100900138B1 (en) * 2007-02-08 2009-06-01 주식회사 엘지화학 Alkali-developable resins, method for preparing the same and photosensitive composition comprising the alkali-developable resins
KR100835605B1 (en) * 2007-06-19 2008-06-09 제일모직주식회사 CMOS image sensor thermosetting resin composition for color filters, a color filter comprising a transparent film manufactured using the same, and an image sensor manufactured using the color filter
US7847013B2 (en) 2007-06-19 2010-12-07 Cheil Industries Inc. Glycidyl-, OH-, COOH- and aryl-(meth)acrylate copolymer for color filter
KR20110120124A (en) 2010-04-28 2011-11-03 주식회사 엘지화학 Alkali-soluble polymer compound and photosensitive resin composition using the same
CN103038705B (en) 2010-05-03 2016-04-20 巴斯夫欧洲公司 For the color filter of cryogenic applications
KR20140003343A (en) 2012-06-29 2014-01-09 주식회사 엘지화학 Composition for manufacturing resin, resin manufactured by using the same, curable resin composition comprising resin, photosensitive material manufactured by using the photoresist resin composition, and display device comprising the same
KR101603844B1 (en) 2013-06-18 2016-03-15 주식회사 엘지화학 Curable composition, cured film manufactured by using the curable composition and display device having the same
KR101603845B1 (en) 2013-06-18 2016-03-15 주식회사 엘지화학 Copolymer, photosensitive resin composition comprising the same, photosensitive material manufactured by using the photosensitive resin composition and display device having the photosensitive material

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239849A (en) * 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
US4495271A (en) * 1981-05-20 1985-01-22 Hoechst Aktiengesellschaft Radiation polymerizable mixture and copying material produced therefrom
US4629680A (en) * 1984-01-30 1986-12-16 Fuji Photo Film Co., Ltd. Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution
US4692396A (en) * 1984-04-10 1987-09-08 Hiroyuki Uchida Photopolymerizable resin composition for producing aqueous-development type dry film resists
US5356754A (en) * 1992-09-25 1994-10-18 Mitsubishi Rayon Co., Ltd. Crosslinking curable resin composition
US5419998A (en) * 1991-08-30 1995-05-30 Hercules Incorporated Photopolymerizable composition for use in an alkaline-etch resistant dry film photoresist
EP0770923A1 (en) * 1995-10-27 1997-05-02 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and photosensitive resin laminated film containing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2818768B2 (en) * 1989-02-09 1998-10-30 三菱レイヨン株式会社 Crosslinkable curable resin composition
JP3254572B2 (en) * 1996-06-28 2002-02-12 バンティコ株式会社 Photopolymerizable thermosetting resin composition
JP3805438B2 (en) * 1996-08-30 2006-08-02 太陽インキ製造株式会社 Alkali-developable photo-curable glass paste composition and method for manufacturing plasma display panel partition using the same
JP3920449B2 (en) * 1998-03-13 2007-05-30 太陽インキ製造株式会社 Alkali-developable photocurable composition and fired product pattern obtained using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239849A (en) * 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
US4495271A (en) * 1981-05-20 1985-01-22 Hoechst Aktiengesellschaft Radiation polymerizable mixture and copying material produced therefrom
US4629680A (en) * 1984-01-30 1986-12-16 Fuji Photo Film Co., Ltd. Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution
US4692396A (en) * 1984-04-10 1987-09-08 Hiroyuki Uchida Photopolymerizable resin composition for producing aqueous-development type dry film resists
US5419998A (en) * 1991-08-30 1995-05-30 Hercules Incorporated Photopolymerizable composition for use in an alkaline-etch resistant dry film photoresist
US5356754A (en) * 1992-09-25 1994-10-18 Mitsubishi Rayon Co., Ltd. Crosslinking curable resin composition
EP0770923A1 (en) * 1995-10-27 1997-05-02 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and photosensitive resin laminated film containing the same

Also Published As

Publication number Publication date
KR100493961B1 (en) 2005-06-10
KR20010018075A (en) 2001-03-05
EP1410108A2 (en) 2004-04-21
WO2001013175A2 (en) 2001-02-22
TWI286666B (en) 2007-09-11
JP2003507758A (en) 2003-02-25

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