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WO2001082378A1 - Substrat support pour composants electroniques - Google Patents

Substrat support pour composants electroniques Download PDF

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Publication number
WO2001082378A1
WO2001082378A1 PCT/EP2001/003080 EP0103080W WO0182378A1 WO 2001082378 A1 WO2001082378 A1 WO 2001082378A1 EP 0103080 W EP0103080 W EP 0103080W WO 0182378 A1 WO0182378 A1 WO 0182378A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier substrate
transparent
conductive layer
substrate
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/003080
Other languages
German (de)
English (en)
Inventor
Thomas Zenker
Christian Thiemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Carl Zeiss AG
Original Assignee
Carl Zeiss AG
Schott Glaswerke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7639642&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2001082378(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Carl Zeiss AG, Schott Glaswerke AG filed Critical Carl Zeiss AG
Priority to ES01925483T priority Critical patent/ES2320096T5/es
Priority to EP01925483A priority patent/EP1275153B2/fr
Priority to DE50114659T priority patent/DE50114659D1/de
Priority to AU2001252218A priority patent/AU2001252218A1/en
Publication of WO2001082378A1 publication Critical patent/WO2001082378A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials

Definitions

  • the invention relates to a carrier substrate for electronic components, in particular for illuminants, which are applied to a surface of the carrier substrate, with a transparent substrate and a conductive layer applied to the transparent substrate, and to an electronic component with such a carrier substrate and a method for producing such a substrate electronic component.
  • LEDs Light emitting diodes, so-called LEDs, are suitable for a variety of LEDs.
  • LED modules comprise a large number of light-emitting diodes on a carrier substrate.
  • the light-emitting diodes arranged on the carrier substrate in turn form a display unit which can be used, for example, to display destinations in a bus.
  • a display matrix has become known from DE-A-19729469.
  • the light-emitting diodes are arranged on a transparent film, the film comprising conductor tracks for the energy supply of the light sources.
  • the conductor tracks for supplying energy to the LED diodes are produced by a conductive paste or liquid which is opaque and is printed on or attached to transparent film.
  • the conductor tracks according to DE-A-19729469 are preferably arranged in an atrix shape.
  • the contacting of the individual light-emitting diodes on the conductor tracks is carried out with conductive adhesive.
  • a disadvantage of the display device according to DE-A-19729469 is that the
  • Conductor tracks that are applied to the transparent substrate are opaque. Another disadvantage is the time-consuming application to the transparent substrate, for example by fastening or printing.
  • a lighting device with light-emitting diodes which comprises a plurality of light-emitting diodes fastened on the surface of a glass plate.
  • the light-emitting diodes are electrically connected to conductor tracks attached to the glass plate and designed as a thin and invisible layer.
  • the conductor tracks and their connections are attached to the same surface of the glass plate on which the light-emitting diodes are located.
  • the conductor tracks are applied to the glass plate by evaporating metal, a suitable mask being used even before the vapor deposition.
  • a disadvantage of the lighting device according to EP-A-0900971 is that the conductor tracks are already structured during the vapor deposition process.
  • the object of the invention is to provide a carrier substrate for electronic components, in particular for light-emitting diodes or LED modules comprising a plurality of light-emitting diodes, that on the one hand ensures the necessary transparency, on the other hand is very inexpensive to manufacture and the high manufacturing costs of the systems according to the prior art avoids.
  • this object is achieved by a carrier substrate in which the conductive layer applied to the transparent substrate is transparent or quasi-transparent and can be structured as desired in the visible wavelength range.
  • Metal oxides are preferably used to produce transparent conductor tracks, for example ITO (lnO x : Sn), FTO
  • This layer is preferably applied to the transparent substrate by means of chemical vapor deposition (CVD) or physical vapor
  • PVD Physical or electrochemical coating
  • Spray pyrolysis, sputtering or the sol-gel process are just two examples.
  • Application by means of spray pyrolysis is particularly cost-effective, ZnO x : F being preferably used as the coating material. If you want to achieve particularly high optical properties, the preferred application method is sputtering.
  • Application process systems with any three-dimensional shape can be produced.
  • the substrate is first brought into the desired three-dimensional shape and then the conductive layer is applied.
  • This enables, for example, an application in the automotive sector, e.g. the production of any shape
  • the conductive layer may consist of a vapor-deposited or sputtered-on metal, such as Al, Ag, Au, Ni or Cr, which is generally quasi-transparent.
  • Metal layers are preferably used at high ambient temperatures.
  • transparent layers or glasses are understood to be layers or glasses with a transmission> 90% in the visible wavelength range.
  • quasi-transparent layers or glasses are understood to be layers or glasses with a transmission> 60%.
  • a further development of the invention provides for a special reflection layer to be applied to the conductive layer, for example a Ti0 2 , Si0 2 , or a mixed layer of Ti x Si... X 0 2 .
  • the conductive layer made of metal oxide or metal can be structured not only in the form of a matrix, as in the prior art, but in any way.
  • This enables the application of complete structures such as on single-layer PCBs (so-called printed circuit boards).
  • the structuring of the conductive layer can be carried out after application by deliberately interrupting the layer, for example by means of a laser which locally heats the coating and evaporates it. When using a laser to insert the
  • the layer has a particularly high absorption in the range of the laser wavelength of the laser used and the substrate is transmissive for this wavelength.
  • the structuring of a layer applied over the entire surface is possible with the aid of lithography and subsequent etching processes.
  • a structuring is also conceivable in that the conductor tracks are already applied in the predetermined structure during coating, for example during vapor deposition with the aid of mask techniques.
  • connection points can be applied to the conductive layer.
  • connection points comprise a conductive paste or lacquer, for example silver conductive lacquer or silver conductive lacquer paste.
  • the individual connection points can be applied by means of screen printing or
  • Stencil printing takes place and subsequent baking, a method of this type being able to be used at the same time for tempering the glasses if glasses are used as the transparent substrate.
  • An advantage of components manufactured in this way is that particularly strong glasses can be obtained without an additional further processing step.
  • Another advantage is that the application of the pads enables soldering on a transparent substrate for the first time. In the prior art, the connection of various components on a substrate with transparent conductor tracks has always been done by gluing. Soldering was only possible on opaque tracks. in the
  • solder connections are more stable, long-term resistant and less sensitive to environmental influences such as air humidity, heat, chemicals etc.
  • the carrier substrate can be equipped with light-emitting diodes using known standard methods from the electronics industry, for example by applying solder paste to the individual connection points or connection pads using stencil printing. The light-emitting diodes are then applied to the carrier plate.
  • a chip bonder can be used for this purpose, which fixes the individual illuminants on the carrier material before the soldering process. After the individual illuminants have been attached, the carrier substrate is then passed through a reflow oven. Alternatively, the LEDs equipped with a chip bonder can be sent through a wave solder bath.
  • a conductive adhesive to the carrier substrate by means of screen or stencil printing, so that the illuminants or electrical components can be applied directly to the carrier substrate.
  • Both isotropically conductive and anisotropically conductive adhesive can be used. If the distance between the conductor tracks is very small, the use of anisotropic adhesive is preferred.
  • control electronics are also applied to the carrier substrate.
  • a particularly preferred embodiment not only individual electrical or electronic components, such as. B. coils or capacitors applied to the carrier substrate, but additional boards or hybrid circuits with independent integrated circuits, which can include, for example, a current source or current control.
  • additional boards or hybrid circuits with independent integrated circuits which can include, for example, a current source or current control.
  • a preferred embodiment provides for the lamps to be protected by a second transparent substrate. The light emitting diodes then lie between the transparent carrier substrate and the further transparent substrate. In this way, the
  • Light sources are also protected from environmental influences such as moisture and mechanical shearing.
  • the further transparent substrate also has a conductive, transparent
  • a conductive plastic film is provided. This makes it possible to contact the light-emitting diodes directly between two conductive substrates without a housing. Instead of a coating on a transparent substrate, a conductive plastic film can also be provided.
  • the transparent substrate can be both a glass and a plastic substrate. It is particularly preferred if the glass substrate is hardened and tempered. Lime-soda glasses are used as particularly preferred glasses.
  • a plurality of carrier substrates with illuminants e.g. To connect and contact LEDs.
  • This enables carrier substrates of any shape.
  • Three-dimensional objects made of several carrier substrates are also conceivable, for example a cube or a pyramid made of square and triangular base plates.
  • the invention also provides such an electronic component and a method for producing such a component.
  • the carrier substrate according to the invention in particular an LED module with such a carrier substrate, all those applications can be considered in which lighting, signaling, information display or a decorative effect is to be achieved. It is particularly preferred to use such LED modules in furniture and showcase lights, for displaying lettering, symbols or graphics, for interior or exterior lighting and for escape route lighting. In a particularly preferred application, such LED modules are used in the automotive field, for example as a third brake light on a car, which directly into the
  • Rear light is integrated.
  • An alternative application in the automotive sector concerns the use of LED modules directly on the valve cover.
  • the LED modules according to the invention can also be used in so-called
  • Composite systems comprising a carrier substrate can be used.
  • a resistive touch panel on which the LEDs are mounted is conceivable.
  • Figure 1 shows an LED module according to the invention.
  • Figure 3 shows an LED module with another electrical applied
  • Figure 4 shows an LED module with an applied hybrid circuit.
  • Figure 5 two LED modules of different structure.
  • FIG. 1 shows a carrier substrate according to the invention with a conductive layer applied to the carrier substrate, which in turn has been structured in such a way that a circular conductor track 3 with connecting conductors 5, 7 is formed on the transparent carrier substrate 1. Individual connection points 9 are arranged on the circular conductor track 3.
  • Connection points 9 serve to conductively connect the individual illuminants, for example the light-emitting diodes 4, to the conductor track and thus to ensure their energy supply.
  • the carrier substrate is preferably a soda-lime glass.
  • FIGS. 2a to 2d show a process sequence according to the invention for producing an electronic component, in particular an LED module.
  • the transparent carrier substrate 1 mt is coated over the entire surface of a conductive layer, for example using the sol-gel method.
  • structuring is produced, for example by means of a laser, which locally heats the coating and evaporates it.
  • the carrier substrates, which are structured with the aid of a laser preferably comprise a conductive layer which is arranged in the region of the
  • connection pads 9 comprise a conductive paste or lacquer, for example
  • Conductive silver varnish or silver paste is applied to the conductive substrate by means of screen printing or stencil printing and then baked.
  • the transparent substrate in particular the transparent glass substrate, can be pretensioned at the same time. As a result, high mechanical strength is achieved in a single process step.
  • the contacts have been applied in the different areas 13.1-13.4, as shown in FIG. 2d, these are equipped with a standard method, for example by applying solder paste to the connection pads 9, for example by means of stencil printing.
  • the light-emitting diodes (LEDs) 4 are then applied to the carrier plate, it being possible to use a chip bonder which fastens the light-emitting diodes 4 to the carrier material before the soldering process. After fastening the individual LEDs, the carrier substrate 1 with the light-emitting diodes fastened thereon is replaced by a
  • Reflow furnace sent or through a wave solder bath.
  • a glass substrate typically a soda-lime glass, is coated with a fluorine-doped tin oxide.
  • the coating is applied as follows:
  • a soda-lime glass as a transparent substrate is heated to 500 ° C.
  • the glass is then sprayed with monobutyltin chloride and hydrofluoric acid in ethanol, the spray solution being the following Composition has:
  • the soda-lime glass comprises a transparent, fluorine-doped tin oxide layer.
  • the coating is then cut with a laser.
  • a laser With help of a
  • Squeegee is screen printed with a silver conductive paste, e.g. Cerdec SP 1248 applied.
  • the Cerdec 1248 paste is dried in a continuous oven at 140 ° C for 2 min and then baked and tempered by a tempering system at approx. 700 ° C for a soda lime glass. Then commercially available solder paste is applied by stencil printing and with
  • Light-emitting diodes for example NSCW 100 light-emitting diodes from Nichia.
  • the assembled substrate is preheated to 120 ° C for 2 min and then heated to 235 ° C for 5 sec. It is then slowly cooled.
  • FIG. 3 shows an embodiment of the invention in which a transparent carrier substrate 1 has been applied to the light-emitting diodes 4 in different areas 13.1, 13.2, 13.3 using the method described in FIGS. 2a-2d.
  • the carrier substrate also contains further electronic components, for example
  • Resistors 17, a semiconductor diode 19 and a transistor 21 instead of individual components, as shown in FIG. 4, in addition to the light-emitting diodes 4, entire electronic circuits can also be arranged on the carrier substrate according to the invention. The same components as in the previous figures are also the same in FIG. 4
  • FIG. 5 shows two LED modules with different geometrical characteristics, namely a triangular module 100 with three light-emitting diodes 102.1-102.3 and a rectangular LED module 110 with
  • the geometrically different LED modules 100, 110 can be connected in a flat configuration to form an LED module of any two-dimensional geometric shape and to form three-dimensional structures as shown in FIG. 7.
  • any three-dimensional structures for example also curved structures, can be produced.
  • a carrier substrate is specified for the first time, the conductive layer of which, in contrast to the prior art, is completely transparent and not opaque.
  • the method according to the invention allows the glasses to be pretensioned simultaneously in a single process step when the connection point or solder pads are burned in.
  • the freely structurable full-surface coating of glasses makes it possible to easily integrate other electronic components on the carrier substrate of the LED modules, for example the control electronics.
  • the structuring can take place independently of the coating with a conductive layer.
  • connection points makes it possible to apply soldered connections to a transparent carrier substrate.
  • any geometric shapes can be realized by joining together any substrate shapes, colors and decorative printing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un substrat support pour composants électroniques, notamment pour des moyens d'éclairage disposés sur une face dudit substrat, comportant un substrat transparent et une couche conductrice appliquée sur ce dernier. L'invention est caractérisée en ce que cette couche conductrice, dans la zone de longueur d'onde visible, est transparente ou quasi transparente et structurable à volonté.
PCT/EP2001/003080 2000-04-20 2001-03-17 Substrat support pour composants electroniques Ceased WO2001082378A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ES01925483T ES2320096T5 (es) 2000-04-20 2001-03-17 Sustrato de soporte para componentes electrónicos
EP01925483A EP1275153B2 (fr) 2000-04-20 2001-03-17 Substrat support pour composants electroniques
DE50114659T DE50114659D1 (de) 2000-04-20 2001-03-17 Trägersubstrat für elektronische bauteile
AU2001252218A AU2001252218A1 (en) 2000-04-20 2001-03-17 Carrier substrate for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10019888.0 2000-04-20
DE10019888A DE10019888B4 (de) 2000-04-20 2000-04-20 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
WO2001082378A1 true WO2001082378A1 (fr) 2001-11-01

Family

ID=7639642

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/003080 Ceased WO2001082378A1 (fr) 2000-04-20 2001-03-17 Substrat support pour composants electroniques

Country Status (8)

Country Link
EP (4) EP2009965A1 (fr)
AT (2) ATE360891T1 (fr)
AU (1) AU2001252218A1 (fr)
DE (5) DE10019888B4 (fr)
ES (2) ES2282758T3 (fr)
MY (1) MY143357A (fr)
TW (1) TWI284397B (fr)
WO (1) WO2001082378A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004062908A3 (fr) * 2003-01-10 2004-09-10 Glaverbel Vitrage comportant des composants electroniques
FR2858955A1 (fr) * 2003-08-20 2005-02-25 Daimler Chrysler Ag Source de rayons infrarouges pour vehicules adaptee a un systeme de vision nocturne a infrarouge
JP2006351531A (ja) * 2005-06-16 2006-12-28 Asulab Sa 透明電極を有する透明装置の製造方法
WO2007045786A1 (fr) * 2005-10-21 2007-04-26 Saint-Gobain Glass France Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
WO2007057454A1 (fr) * 2005-11-21 2007-05-24 Agc Flat Glass Europe Sa Assemblage feuilleté avec diodes luminescentes
EP1799019A1 (fr) 2005-12-15 2007-06-20 Döppner Bauelemente GmbH & Co. KG Raccordement électrique pour un socle
EP1935633A1 (fr) * 2006-12-21 2008-06-25 AGC Flat Glass Europe SA Panneau translucide pour connecter des composants electroniques
WO2008074800A1 (fr) * 2006-12-18 2008-06-26 Agc Flat Glass Europe Sa Panneau d'affichage
WO2008120170A1 (fr) * 2007-04-03 2008-10-09 Koninklijke Philips Electronics N.V. Dispositif d'émission de lumière
WO2009016561A3 (fr) * 2007-08-02 2009-03-26 Koninkl Philips Electronics Nv Dispositif d'émission de lumière
WO2010118821A1 (fr) 2009-04-16 2010-10-21 Schott Ag Procédé destiné à relier de manière conductrice un composant sur un substrat transparent
US8613997B2 (en) 2002-07-19 2013-12-24 Pilkington Plc Laminated glazing panel
WO2019185629A1 (fr) * 2018-03-27 2019-10-03 Symonics GmbH Dispositif d'affichage transparent

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10249005A1 (de) * 2002-10-21 2004-05-06 Siemens Ag Verfahren zur Herstellung einer Schaltungsanordnung
DE10343529A1 (de) * 2003-09-19 2005-04-21 Pepperl & Fuchs Vorrichtung zur optischen Übermittlung von Information
DE102004039897A1 (de) * 2004-08-17 2006-03-02 Schott Ag Element mit einer Vielzahl von Leuchtdioden
DE102004039883B3 (de) * 2004-08-17 2006-06-14 Schott Ag Transparentes Element, insbesondere Verbundglaselement, und Verfahren zum Tausch eines Verbrauchers darin
DE102005019375A1 (de) 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED-Array
EP1715521B1 (fr) * 2005-04-21 2012-02-22 C.R.F. Società Consortile per Azioni Utilisation d'un panneau d'affichage à diodes électroluminescentes dans un véhicule automobile
PL1947693T3 (pl) * 2007-01-18 2015-09-30 Polytron Tech Inc Płaska struktura urządzenia oświetleniowego z diodami emitującymi światło
WO2008149268A1 (fr) * 2007-06-04 2008-12-11 Koninklijke Philips Electronics N.V. Dispositif d'émission de lumière
WO2009003651A2 (fr) * 2007-07-03 2009-01-08 Schott Ag Dispositif d'affichage, en particulier façade multimédia transparente
DE102007031642A1 (de) 2007-07-06 2009-01-08 Döppner Bauelemente GmbH & Co. KG Substrat mit hochleitfähiger Schicht
DE102008009775A1 (de) 2007-07-03 2009-01-08 Döppner Bauelemente GmbH & Co. KG Anzeigevorrichtung, inbesondere transparente Multimediafassade
DE102007039416B4 (de) 2007-08-21 2018-03-29 Diehl Aircabin Gmbh Verbundbauteil mit Leuchtdioden
DE102008009774A1 (de) 2008-02-19 2009-08-27 Schott Ag Semitransparentes Element
DE102009008658A1 (de) 2008-02-19 2009-09-10 Glaswerke Arnold Gmbh & Co. Kg Element, insbesondere transparentes Element
DE202008008695U1 (de) 2008-06-28 2009-11-19 Schott Ag Modulares Beleuchtungssystem
DE202009010065U1 (de) 2009-07-24 2010-12-23 Schott Ag Stele mit einem Glaselement
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US8044415B2 (en) 2005-10-21 2011-10-25 Saint-Gobain Glass France Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof
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EP1799019A1 (fr) 2005-12-15 2007-06-20 Döppner Bauelemente GmbH & Co. KG Raccordement électrique pour un socle
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DE50114659D1 (de) 2009-03-05
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AU2001252218A1 (en) 2001-11-07
EP1450416B1 (fr) 2007-04-25
EP1947694A1 (fr) 2008-07-23
EP2009965A1 (fr) 2008-12-31
DE20122323U1 (de) 2005-04-14
MY143357A (en) 2011-04-29
EP1450416A1 (fr) 2004-08-25
EP1275153A1 (fr) 2003-01-15
DE20122195U1 (de) 2004-09-23
DE10019888A1 (de) 2001-10-31
ATE360891T1 (de) 2007-05-15
ES2320096T5 (es) 2012-04-24
DE10019888B4 (de) 2011-06-16
ATE421168T1 (de) 2009-01-15
EP1275153B1 (fr) 2009-01-14
DE50112414D1 (de) 2007-06-06
ES2282758T3 (es) 2007-10-16
TWI284397B (en) 2007-07-21

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