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MY143357A - A carrier substrate for electronic components - Google Patents

A carrier substrate for electronic components

Info

Publication number
MY143357A
MY143357A MYPI20011836A MYPI20011836A MY143357A MY 143357 A MY143357 A MY 143357A MY PI20011836 A MYPI20011836 A MY PI20011836A MY PI20011836 A MYPI20011836 A MY PI20011836A MY 143357 A MY143357 A MY 143357A
Authority
MY
Malaysia
Prior art keywords
carrier substrate
electronic components
transparent
substrate
conductive layer
Prior art date
Application number
MYPI20011836A
Inventor
Thomas Dr Zenker
Christian Thiemann
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7639642&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY143357(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schott Ag filed Critical Schott Ag
Publication of MY143357A publication Critical patent/MY143357A/en

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Glass (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

THE INVENTION RELATES TO A CARRIER SUBSTRATE FOR ELECTRONIC COMPONENTS, IN PARTICULAR A LIGHTING MEANS, WHICH ARE APPLIED TO A SURFACE OF THE CARRIER SUBSTRATE WITH@A TRANSPARENT SUBSTRATE@A CONDUCTIVE LAYER APPLIED ON THE TRANSPARENT SUBSTRATE.THE INVENTION IS CHARACTERIZED BY THE FOLLOWING FEATURE:THE CONDUCTIVE LAYER IS TRANSPARENT OR QUASI-TRANSPARENT IN THE VISIBLE WAVELENGTH RANGE AND CAN BE STRUCTURED AT WILL .FIGURE 1
MYPI20011836A 2000-04-20 2001-04-18 A carrier substrate for electronic components MY143357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10019888A DE10019888B4 (en) 2000-04-20 2000-04-20 Transparent electronic component arrangement and method for its production

Publications (1)

Publication Number Publication Date
MY143357A true MY143357A (en) 2011-04-29

Family

ID=7639642

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20011836A MY143357A (en) 2000-04-20 2001-04-18 A carrier substrate for electronic components

Country Status (8)

Country Link
EP (4) EP1275153B2 (en)
AT (2) ATE421168T1 (en)
AU (1) AU2001252218A1 (en)
DE (5) DE10019888B4 (en)
ES (2) ES2320096T5 (en)
MY (1) MY143357A (en)
TW (1) TWI284397B (en)
WO (1) WO2001082378A1 (en)

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DE10343529A1 (en) 2003-09-19 2005-04-21 Pepperl & Fuchs Device for the optical transmission of information
DE102004039897A1 (en) * 2004-08-17 2006-03-02 Schott Ag Element with a variety of light emitting diodes
DE102004039883B3 (en) * 2004-08-17 2006-06-14 Schott Ag Transparent element comprises primary and secondary transparent plates, and an intermediate electrical consumer
DE102005019375A1 (en) 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED array
ATE546836T1 (en) 2005-04-21 2012-03-15 Fiat Ricerche USE OF A TRANSPARENT LED DISPLAY DEVICE IN A MOTOR VEHICLE
DE602005011415D1 (en) 2005-06-16 2009-01-15 Asulab Sa Production method for a transparent element with transparent electrodes and corresponding element
FR2892594B1 (en) 2005-10-21 2007-12-07 Saint Gobain LIGHT STRUCTURE COMPRISING AT LEAST ONE ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS
JP2009516924A (en) * 2005-11-21 2009-04-23 エージーシー フラット グラス ユーロップ エスエー Laminated assembly having light emitting diodes
DE202005020315U1 (en) 2005-12-15 2006-02-16 Döppner Bauelemente GmbH & Co. KG Electrical socket connection
EP1956580A1 (en) * 2006-12-18 2008-08-13 AGC Flat Glass Europe SA Display panel
EP1935633A1 (en) * 2006-12-21 2008-06-25 AGC Flat Glass Europe SA Translucent Panel for connecting components
ES2536919T3 (en) * 2007-01-18 2015-05-29 Polytron Technologies, Inc. Flat structure of a lighting apparatus with light emitting diodes
US20100096647A1 (en) * 2007-04-03 2010-04-22 Koninklijke Philips Electronics N.V. Light output device
EP2158080B1 (en) * 2007-06-04 2018-09-26 Philips Lighting Holding B.V. Light output device
DE102007031642A1 (en) 2007-07-06 2009-01-08 Döppner Bauelemente GmbH & Co. KG Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths
EP2179632B1 (en) * 2007-07-03 2010-11-17 Schott AG Substrate comprising a highly conductive layer
DE102008009775A1 (en) * 2007-07-03 2009-01-08 Döppner Bauelemente GmbH & Co. KG Large-area display device i.e. transparent multimedia facade, for building, has transparent elements with substrate on which lighting elements i.e. LEDs, are arranged, where power supply of LEDs takes place over conducting paths
EP2919225A1 (en) * 2007-08-02 2015-09-16 Koninklijke Philips N.V. Light output device
DE102007039416B4 (en) 2007-08-21 2018-03-29 Diehl Aircabin Gmbh Composite component with LEDs
DE102008009774A1 (en) 2008-02-19 2009-08-27 Schott Ag Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation
DE102009008658A1 (en) 2008-02-19 2009-09-10 Glaswerke Arnold Gmbh & Co. Kg Element i.e. disk, for use in e.g. clinic, has film operated in two states, and laminated glass elements including surface, where glass elements provide protection against ionizing radiation and ultra-violet radiation
DE202008008695U1 (en) 2008-06-28 2009-11-19 Schott Ag Modular lighting system
DE102009017659A1 (en) * 2009-04-16 2010-10-28 Schott Ag Method for the conductive connection of a component on a transparent substrate
DE202009010065U1 (en) 2009-07-24 2010-12-23 Schott Ag Stele with a glass element
BE1019185A3 (en) * 2010-02-16 2012-04-03 Agc Glass Europe PANEL WITH IMPROVED CONDUCTIVE PATTERN.
DE102012023932A1 (en) * 2012-12-06 2014-06-12 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Method for manufacturing starlight and night sky ambience integrated headliner for passenger motor car, involves making source to be in contact with contacts with plus and minus regions, and manufacturing regions as vaporized film
DE102015111573A1 (en) * 2015-07-16 2017-01-19 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
EP3242536A1 (en) 2016-05-03 2017-11-08 Schott VTF (Societe Par Actions Simplifiee) Panel comprising an electronic component
DE102016221923A1 (en) * 2016-11-09 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Lighting device for a motor vehicle
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Also Published As

Publication number Publication date
EP2009965A1 (en) 2008-12-31
EP1275153B1 (en) 2009-01-14
DE20122323U1 (en) 2005-04-14
EP1947694A1 (en) 2008-07-23
EP1450416B1 (en) 2007-04-25
EP1275153B2 (en) 2012-02-08
EP1275153A1 (en) 2003-01-15
WO2001082378A1 (en) 2001-11-01
EP1450416A1 (en) 2004-08-25
ES2320096T3 (en) 2009-05-19
ATE421168T1 (en) 2009-01-15
TWI284397B (en) 2007-07-21
DE50112414D1 (en) 2007-06-06
ES2282758T3 (en) 2007-10-16
DE50114659D1 (en) 2009-03-05
AU2001252218A1 (en) 2001-11-07
DE10019888A1 (en) 2001-10-31
ES2320096T5 (en) 2012-04-24
DE20122195U1 (en) 2004-09-23
ATE360891T1 (en) 2007-05-15
DE10019888B4 (en) 2011-06-16

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