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WO2001067837A1 - Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee - Google Patents

Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee Download PDF

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Publication number
WO2001067837A1
WO2001067837A1 PCT/JP2000/001357 JP0001357W WO0167837A1 WO 2001067837 A1 WO2001067837 A1 WO 2001067837A1 JP 0001357 W JP0001357 W JP 0001357W WO 0167837 A1 WO0167837 A1 WO 0167837A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit device
periodically arranged
metal plate
size
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2000/001357
Other languages
English (en)
Japanese (ja)
Inventor
Debasis Dawn
Yoji Ohashi
Toshihiro Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2000/001357 priority Critical patent/WO2001067837A1/fr
Priority to PCT/JP2001/000280 priority patent/WO2001067540A1/fr
Publication of WO2001067837A1 publication Critical patent/WO2001067837A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Definitions

  • the present invention relates to a shield metal plate and a circuit device using the same, particularly to a shield metal plate suitable for a circuit device for millimeter waves and microphone mouth waves.
  • Shields that provide electromagnetic shielding to prevent direct contact with the outside or crosstalk with peripheral circuits in integrated circuits or circuit devices with integrated circuits in the frequency band of millimeter waves, microwaves, or lower.
  • the metal plate is essential:
  • such a shield metal plate is used as a shield cover member for an integrated circuit or a circuit device having an integrated circuit, which is a target for preventing direct contact with the outside or crosstalk with peripheral circuits.
  • the photonic band gap structure shows a band rejection function and is often used for filters: and It is proposed to provide a two-dimensional photonic bandgap structure directly on the circuit to suppress the propagation of higher-order modes and, in some cases, to avoid unnecessary parallel-blade mode propagation in the circuit. Have been.
  • the present invention relates to a metal / reshield used as a shield or force bar having an arbitrary shape and a wavelength of half the waveguide length of a parallel mode.
  • a photonic bandgear (hereinafter referred to as PBG) element is formed at an interval corresponding to:
  • the shape of this PBG element can be circular, rectangular, square, or other polygons.
  • Valley / Ref The rate of suppression in rate mode depends on the number of repeated PBG elements, Therefore, the number of PBG elements provided in the meta / recover, the number of PBG repetitions and the height of the PBG are increased by the number of PBG elements and the height (depth) of the PBG elements.
  • the suppression level of the barrel array mode can be increased,
  • the PBG elements are arranged uniformly on the metal plate, it is possible to suppress the parallel mode propagation in any direction:
  • FIG. 1 is a diagram illustrating an embodiment of the present invention:
  • Figure 2 shows the micro-cross trip : circuit 2 covered with shielded metal plate 1 as seen from above the metal / red metal plate 1:
  • FIG. 3 shows measurement data of the micro-strip circuit 2 in the embodiment of FIG. Here is the diagram:
  • FIG. 4 is another embodiment of the present invention.
  • Fig. 5 shows an embodiment in which the shape of the PBG element 10 is a square pole.
  • FIG. 6 is the characteristic data corresponding to the embodiment of FIG.
  • FIG. 7 shows still another embodiment, in which the shape of the PBG element 10 is a hexagonal prism.
  • FIG. 8 is the characteristic data corresponding to the embodiment of FIG.
  • FIG. 9 shows characteristic data in still another dimension corresponding to the example of FIG. 7: Description of Embodiment of the Present Invention
  • FIG. 1 is a diagram illustrating an embodiment of the present invention: An example is shown in which a shield metallate 1 according to the present invention is used as a serial / red cover for a microstrip circuit:
  • FIG. 1 (A) shows the sealed metal plate 1 viewed from the back. It is a figure, and a plurality of cylinders 10 having a diameter D are provided at a center interval P:
  • FIG. 1 (B) is a diagram showing a cross-sectional structure of the shield metal plate 1: a plurality is provided at a center interval P
  • the height of the hollow cylinder 10 as a PGB element is defined by d:
  • a microstrip conductor 21 is provided on the front surface, and a ground plate 22 is formed on the back surface.
  • a shield metal plate 1 is arranged with a gap g:
  • FIG. 1 (C) is a perspective view of the metal / red metal plate 1, in which a microstrip conductor 21 is formed on a substrate 20 of a microstrip circuit 2, and a shield metal plate is formed. Covered by 1:
  • Figure 2 is a view of the situation where the microstrip circuit 2 is covered with the shield metal plate 1 from above the shield metal plate 1.
  • the path 2 is provided with a ground plate 22 on the back side of the substrate 20 and a microstrip conductor 21 on the front side:
  • the shield metal plate 1 is arranged on the front side of the substrate 20 so as to cover the micro-slitor conductor 21:
  • Fig. 3 is a diagram showing the measured data of the microslitzer circuit 2 configured in this way: The condition is that the diameter D of the hollow cylinder is 1.2 mm, the center interval P is 1.62 mm, The measured data was obtained when d was 1.2 mm, the return line was 9 and the gap g with the microphone strip circuit 2 was 0.5 mm:
  • the graph of S11 is the amount of reflection from the first port
  • the graph of S21 is the amount of transmission from the first port to the second port:
  • pp is The barrel blade mode and ms is the micro strip mode:
  • FIG. 4 shows another embodiment of the present invention: As shown in FIG. 1 (B), it shows a cross section of a shield metal alloy 1 placed on top of a microstrip circuit 2:
  • the shield metal shake one sheet 1 the central member as a plastic resin, such as dielectric central member 1 1 to c further those formed by subjecting a metal plated 1 2, the PBG device 1 0
  • the component parts can be filled with voids or dielectrics:
  • FIG. 5 shows an embodiment in which the shape of the PBG element 10 is a square pole:
  • FIG. 5 (A) shows the upper part of the shield metal plate 1 in a see-through manner:
  • FIG. The arrangement of the square prisms is shown:
  • Each dimension in the embodiment of FIG. 5 is represented by the size D of the sides of the square prism, the center spacing P, and the height d:
  • FIG. 6 shows characteristic data corresponding to the embodiment of FIG.
  • FIG. 7 is a further embodiment is the embodiment of a hexagonal prism shape of the PBG device 1 0:
  • the unnecessary parallel error mode can suppress more than 112 dB at 76 GHz without affecting the desired microstrip mode propagation.
  • the height (depth) of the hexagonal prism, which is the PBG element, is increased compared to Fig. 8:
  • the characteristic data in this case is similar to the characteristic graph of FIG. 8, and the unnecessary parallel plate mode does not affect the propagation of the desired microstrip mode. It can be understood that the suppression amount of the unnecessary parallel plate mode can be increased even by changing the height of the PBG element: industrial applicability
  • the use of the shielded metal plate according to the present invention suppresses unnecessary barrel blade mode without affecting the desired microstrip mode propagation. Is possible. Further, the shielded metal array according to the present invention can be used without being limited to a microstrip circuit for shielding.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une plaque métallique blindée convenant à des dispositifs à circuit hyperfréquence et à fréquences extrêmement élevées. Cette plaque métallique blindée est caractérisée en ce qu'elle présente une pluralité d'espaces disposés périodiquement, l'espacement séparant ces espaces équivalant à la moitié de la longueur d'onde du guide d'onde du mode à plaques parallèles. L'espacement séparant des éléments qui sont disposés périodiquement équivaut à la moitié de la longueur d'onde du guide d'onde du mode à plaques parallèles. On obtient ainsi un effet de limitation de bande qui supprime le mode à plaques parallèles non souhaité.
PCT/JP2000/001357 2000-03-06 2000-03-06 Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee Ceased WO2001067837A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2000/001357 WO2001067837A1 (fr) 2000-03-06 2000-03-06 Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee
PCT/JP2001/000280 WO2001067540A1 (fr) 2000-03-06 2001-01-17 Plaque metallique de blindage et ensemble circuit comprenant cette plaque

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/001357 WO2001067837A1 (fr) 2000-03-06 2000-03-06 Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee

Publications (1)

Publication Number Publication Date
WO2001067837A1 true WO2001067837A1 (fr) 2001-09-13

Family

ID=11735760

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2000/001357 Ceased WO2001067837A1 (fr) 2000-03-06 2000-03-06 Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee
PCT/JP2001/000280 Ceased WO2001067540A1 (fr) 2000-03-06 2001-01-17 Plaque metallique de blindage et ensemble circuit comprenant cette plaque

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/000280 Ceased WO2001067540A1 (fr) 2000-03-06 2001-01-17 Plaque metallique de blindage et ensemble circuit comprenant cette plaque

Country Status (1)

Country Link
WO (2) WO2001067837A1 (fr)

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GB2376804A (en) * 2001-04-20 2002-12-24 Hewlett Packard Co Electromagnetic interference shield with waveguides
JP4627527B2 (ja) * 2006-12-28 2011-02-09 日立オートモティブシステムズ株式会社 高周波半導体装置およびその実装方法
WO2009048095A1 (fr) * 2007-10-09 2009-04-16 Nec Corporation Dispositif de circuit possédant une ligne de transmission et carte de circuit imprimé
JP5281504B2 (ja) * 2009-07-02 2013-09-04 株式会社ユポ・コーポレーション 電磁波遮蔽体
DE102016119473B4 (de) 2015-10-15 2022-10-20 Nidec Elesys Corporation Wellenleitervorrichtung und Antennenvorrichtung mit der Wellenleitervorrichtung
CN206610893U (zh) 2015-11-05 2017-11-03 日本电产艾莱希斯株式会社 缝隙天线
CN206758622U (zh) 2015-11-05 2017-12-15 日本电产艾莱希斯株式会社 缝隙阵列天线、雷达装置、雷达系统以及无线通信系统
JP6879729B2 (ja) 2015-12-24 2021-06-02 日本電産株式会社 スロットアレーアンテナ、ならびに当該スロットアレーアンテナを備えるレーダ、レーダシステム、および無線通信システム
US10164344B2 (en) 2015-12-24 2018-12-25 Nidec Corporation Waveguide device, slot antenna, and radar, radar system, and wireless communication system including the slot antenna
JP6809908B2 (ja) 2016-01-15 2021-01-06 日本電産株式会社 導波路装置および当該導波路装置を備えるアンテナ装置
DE112017000573B4 (de) 2016-01-29 2024-01-18 Nidec Corporation Wellenleitervorrichtung und Antennenvorrichtung mit der Wellenleitervorrichtung
DE102017102284A1 (de) 2016-02-08 2017-08-10 Nidec Elesys Corporation Wellenleitervorrichtung und Antennenvorrichtung mit der Wellenleitervorrichtung
DE102017102559A1 (de) 2016-02-12 2017-08-17 Nidec Elesys Corporation Wellenleitervorrichtung und Antennenvorrichtung mit der Wellenleitervorrichtung
JP2019047141A (ja) 2016-03-29 2019-03-22 日本電産エレシス株式会社 マイクロ波ｉｃ導波路装置モジュール、レーダ装置およびレーダシステム
CN207098069U (zh) 2016-04-05 2018-03-13 日本电产艾莱希斯株式会社 波导路装置
JP2019054315A (ja) 2016-04-28 2019-04-04 日本電産エレシス株式会社 実装基板、導波路モジュール、集積回路実装基板、マイクロ波モジュール、レーダ装置およびレーダシステム
JP2018164252A (ja) 2017-03-24 2018-10-18 日本電産株式会社 スロットアレーアンテナ、および当該スロットアレーアンテナを備えるレーダ
CN108695585B (zh) 2017-04-12 2021-03-16 日本电产株式会社 高频构件的制造方法
JP7020677B2 (ja) 2017-04-13 2022-02-16 日本電産エレシス株式会社 スロットアンテナ装置
JP2018182740A (ja) 2017-04-13 2018-11-15 日本電産株式会社 スロットアレーアンテナ
CN108736166B (zh) 2017-04-14 2020-11-13 日本电产株式会社 缝隙天线装置以及雷达装置
DE112018002020T5 (de) 2017-05-11 2020-01-09 Nidec Corporation Wellenleitervorrichtung und antennenvorrichtung mit der wellenleitervorrichtung
JP2019009779A (ja) 2017-06-26 2019-01-17 株式会社Ｗｇｒ 伝送線路装置
US10547122B2 (en) 2017-06-26 2020-01-28 Nidec Corporation Method of producing a horn antenna array and antenna array
JP7103860B2 (ja) 2017-06-26 2022-07-20 日本電産エレシス株式会社 ホーンアンテナアレイ
JP7294608B2 (ja) 2017-08-18 2023-06-20 ニデックエレシス株式会社 アンテナアレイ
JP7298808B2 (ja) 2018-06-14 2023-06-27 ニデックエレシス株式会社 スロットアレイアンテナ
JP7095582B2 (ja) * 2018-12-11 2022-07-05 日本電信電話株式会社 高周波モジュール
JP7379176B2 (ja) 2019-01-16 2023-11-14 太陽誘電株式会社 導波路装置、電磁波閉じ込め装置、アンテナ装置、マイクロ波化学反応装置、およびレーダ装置

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JPS63164498A (ja) * 1986-12-26 1988-07-07 セイコーインスツルメンツ株式会社 電磁波吸収板
US5633786A (en) * 1995-08-21 1997-05-27 Motorola Shield assembly and method of shielding suitable for use in a communication device

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US5633786A (en) * 1995-08-21 1997-05-27 Motorola Shield assembly and method of shielding suitable for use in a communication device

Also Published As

Publication number Publication date
WO2001067540A1 (fr) 2001-09-13

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