WO2001067540A1 - Plaque metallique de blindage et ensemble circuit comprenant cette plaque - Google Patents
Plaque metallique de blindage et ensemble circuit comprenant cette plaque Download PDFInfo
- Publication number
- WO2001067540A1 WO2001067540A1 PCT/JP2001/000280 JP0100280W WO0167540A1 WO 2001067540 A1 WO2001067540 A1 WO 2001067540A1 JP 0100280 W JP0100280 W JP 0100280W WO 0167540 A1 WO0167540 A1 WO 0167540A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit device
- metal plate
- periodically arranged
- voids
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Definitions
- the present invention relates to a shield metal plate and a circuit device using the same.
- it relates to shield metal plates suitable for millimeter wave and microwave circuit devices.
- a shield member that performs electromagnetic shielding to prevent direct contact with the outside or crosstalk with peripheral circuits.
- the evening plate is essential.
- such a shield metal plate is used as a shield cover member for an integrated circuit or a circuit device having an integrated circuit, which is a target for preventing direct contact with the outside or crosstalk with peripheral circuits.
- This parallel plate mode is equivalent to the so-called waveguide mode, and causes radiation loss due to power leakage, or crosstalk or interference with peripheral circuits and packages.
- an object of the present invention is to provide a novel metal shield structure to prevent unnecessary parallel plate mode propagation in a shield plate without directly processing an integrated circuit or package to be shielded. It is to control.
- the present invention provides a photonic with an arbitrary shape for a metal shield used as a shield or a cover at an interval corresponding to half the guided wavelength of a parallel plate mode. It forms a band gap (hereinafter referred to as PBG) device.
- PBG band gap
- the shape of this PBG element can be circular, rectangular, square, or any other polygon.
- the suppression level in the parallel plate mode depends on the number of repetitions of the PBG element, the size and spacing of the PBG element. It is determined by the ratio and the height (depth) of the PBG element. Therefore, the suppression level of the parallel plate mode can be increased by increasing the number of PBG elements provided on the metal cover, the size of the PBG elements, and the height of the PBG.
- the PBG elements are uniformly arranged on the metal plate, it is possible to suppress parallel plate mode propagation in any direction.
- FIG. 1 is an embodiment of the present invention, and shows an example in which a shield metal plate 1 is used as a shield cover for a microstrip circuit.
- Fig. 2 shows an embodiment in which the present invention is applied to a coplanar waveguide. It is the figure which observed the structure from the upper part.
- FIG. 3 is a diagram showing measurement data of the microstrip circuit 2 in the embodiment of FIG.
- FIG. 4 shows another embodiment of the present invention.
- FIG. 5 shows an embodiment in which the shape of the PBG element 10 is a square pole.
- FIG. 6 shows characteristic data corresponding to the embodiment of FIG.
- FIG. 7 shows still another embodiment, in which the shape of the PBG element 10 is a hexagonal prism.
- FIG. 8 shows characteristic data corresponding to the embodiment of FIG.
- FIG. 9 shows characteristic data in still another dimension corresponding to the embodiment of FIG. Description of an embodiment of the present invention
- FIG. 1 is a diagram illustrating an embodiment of the present invention. An example is shown in which the shield metal plate 1 according to the present invention is used as a shield cover for a microstrip circuit.
- FIG. 1 (A) is a view of the shield metal plate 1 as viewed from the back surface.
- the hollow metal column 10 has a diameter D as a size, and a plurality of hollow columns 10 are provided at a center interval P.
- FIG. 1B is a diagram showing a cross-sectional structure of the shield metal plate 1.
- the height of a plurality of hollow cylinders 10 as PBG elements provided at a center interval P is defined by d.
- the shield metal plate 1 is disposed with a gap g on the substrate 20 of the microstrip circuit 2 having the microstrip conductor 21 on the front surface and the ground plate 22 formed on the back surface.
- FIG. 1 (C) is a perspective view of the shield metal plate 1, in which the microstrip conductor 21 is formed on the substrate 20 of the microstrip circuit 2, and Covered by metal plate 1.
- FIG. 2 is a diagram observing the configuration of an embodiment in which the present invention is applied to a coplanar waveguide circuit from above.
- a coplanar waveguide 3 is formed on a substrate 20 with a central transmission conductor 21 and ground planes 22 and 23 disposed on both sides thereof. ing.
- the shield metal plate 1 is disposed on the front side of the substrate 20 so as to cover the center conductor 21 of the coplanar waveguide 3 and the ground planes 22, 23 arranged on both sides thereof. Are located in
- FIG. 3 is a diagram showing measurement data when the shield metal plate 1 is applied to the microstrip circuit 2 as shown in FIG.
- the condition is that the diameter D of the hollow cylinder is 1.2 mm, the center interval P is 1.62 mm, the height d is 1.2 mm, the number of repeating rows is 9, and the gap g with the microstrip circuit 2 is g. This is the measurement data when the value is set to 0.5 mm.
- the graph of S11 is the amount of reflection from the first port
- the graph of S21 is the amount of transmission from the first port to the second port.
- Pp is parallel plate mode
- ms is microstrip mode.
- the unnecessary parallel plate mode is given about ⁇ 10 dB of suppression at 76 GHz without affecting the desired microstrip mode propagation. (See S21 (pp)).
- FIG. 4 shows another embodiment of the present invention.
- FIG. 2 shows a cross section of a shield metal plate 1 disposed above a coplanar waveguide 3 similarly to FIG.
- the shield metal plate 1 is used as a central member, and a metal member 12 is formed on a dielectric central member 11 such as a plastic resin. Furthermore, the portion constituting the PBG element 10 can be a void or filled with a dielectric.
- FIG. 5 This is an embodiment in which the shape of the element 10 is a square pole.
- FIG. 5 (A) shows the upper part of the shield mail plate 1 in a see-through manner without illustration.
- FIG. 5B shows an arrangement of hollow square pillars as PBG elements.
- Figure 5 Each dimension in the embodiment is represented by the size D of the side of the rectangular prism, the center interval P, and the height d.
- FIG. 6 shows characteristics data corresponding to the embodiment of FIG.
- the unnecessary parallel plate mode can suppress 110 dB or more at 76 GHz without affecting the desired microstrip mode propagation. Has been given.
- FIG. 7 shows still another embodiment, in which the shape of the PBG element 10 is a hexagonal prism.
- FIG. 7 (A) shows the upper portion of the shielded mail plate 1 in a see-through manner as in FIG. 5 (A).
- Figure 7 (B) shows the arrangement of hexagonal prisms.
- Each dimension in the embodiment of FIG. 7 is represented by the size D of the side of the square pole, the center interval P, the depth c of the corner, and the height d.
- FIG. 8 shows characteristic data corresponding to the embodiment of FIG.
- the unnecessary parallel plate mode is given a suppression of --12 dB or more at 76 GHz without affecting the desired microstrip mode propagation. I have.
- the unnecessary parallel plate mode does not affect the desired microstrip mode transmission, and the characteristic data in this case is 76 GHz And a suppression of more than 13 dB. Therefore, even if the height of the PBG element is changed, It can be understood that the mode suppression amount is increased.
- the shielded metal plate of the present invention can be used without being limited to the microstrip circuit for the object to be shielded.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
L'invention concerne une plaque métallique de blindage utilisée dans un circuit à ondes millimétriques, notamment un circuit à micro-ondes, caractérisé en ce que la plaque possède des écartements disposés périodiquement, et l'intervalle entre ces écartements correspond à la moitié de la longueur d'onde de propagation du mode de plaque parallèle.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2000/001357 WO2001067837A1 (fr) | 2000-03-06 | 2000-03-06 | Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee |
| JPPCT/JP00/01357 | 2000-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2001067540A1 true WO2001067540A1 (fr) | 2001-09-13 |
Family
ID=11735760
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2000/001357 Ceased WO2001067837A1 (fr) | 2000-03-06 | 2000-03-06 | Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee |
| PCT/JP2001/000280 Ceased WO2001067540A1 (fr) | 2000-03-06 | 2001-01-17 | Plaque metallique de blindage et ensemble circuit comprenant cette plaque |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2000/001357 Ceased WO2001067837A1 (fr) | 2000-03-06 | 2000-03-06 | Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee |
Country Status (1)
| Country | Link |
|---|---|
| WO (2) | WO2001067837A1 (fr) |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2376804A (en) * | 2001-04-20 | 2002-12-24 | Hewlett Packard Co | Electromagnetic interference shield with waveguides |
| JP2008167182A (ja) * | 2006-12-28 | 2008-07-17 | Hitachi Ltd | 高周波半導体装置およびその実装方法 |
| WO2009048095A1 (fr) * | 2007-10-09 | 2009-04-16 | Nec Corporation | Dispositif de circuit possédant une ligne de transmission et carte de circuit imprimé |
| JP2011014723A (ja) * | 2009-07-02 | 2011-01-20 | Yupo Corp | 電磁波遮蔽体 |
| US9786995B2 (en) | 2015-11-05 | 2017-10-10 | Nidec Elesys Corporation | Slot array antenna |
| US10027032B2 (en) | 2015-10-15 | 2018-07-17 | Nidec Corporation | Waveguide device and antenna device including the waveguide device |
| US10042045B2 (en) | 2016-01-15 | 2018-08-07 | Nidec Corporation | Waveguide device, slot array antenna, and radar, radar system, and wireless communication system including the slot array antenna |
| US10090600B2 (en) | 2016-02-12 | 2018-10-02 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10158158B2 (en) | 2016-02-08 | 2018-12-18 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10164344B2 (en) | 2015-12-24 | 2018-12-25 | Nidec Corporation | Waveguide device, slot antenna, and radar, radar system, and wireless communication system including the slot antenna |
| US10236591B2 (en) | 2015-11-05 | 2019-03-19 | Nidec Corporation | Slot antenna |
| US10374323B2 (en) | 2017-03-24 | 2019-08-06 | Nidec Corporation | Slot array antenna and radar having the slot array antenna |
| US10381741B2 (en) | 2015-12-24 | 2019-08-13 | Nidec Corporation | Slot array antenna, and radar, radar system, and wireless communication system including the slot array antenna |
| US10547122B2 (en) | 2017-06-26 | 2020-01-28 | Nidec Corporation | Method of producing a horn antenna array and antenna array |
| US10559890B2 (en) | 2016-01-29 | 2020-02-11 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10594045B2 (en) | 2016-04-05 | 2020-03-17 | Nidec Corporation | Waveguide device and antenna array |
| US10601144B2 (en) | 2017-04-13 | 2020-03-24 | Nidec Corporation | Slot antenna device |
| US10608345B2 (en) | 2017-04-13 | 2020-03-31 | Nidec Corporation | Slot array antenna |
| US10651138B2 (en) | 2016-03-29 | 2020-05-12 | Nidec Corporation | Microwave IC waveguide device module |
| US10658760B2 (en) | 2017-06-26 | 2020-05-19 | Nidec Corporation | Horn antenna array |
| JP2020096030A (ja) * | 2018-12-11 | 2020-06-18 | 日本電信電話株式会社 | 高周波モジュール |
| US10707584B2 (en) | 2017-08-18 | 2020-07-07 | Nidec Corporation | Antenna array |
| US10714802B2 (en) | 2017-06-26 | 2020-07-14 | WGR Co., Ltd. | Transmission line device |
| US10727561B2 (en) | 2016-04-28 | 2020-07-28 | Nidec Corporation | Mounting substrate, waveguide module, integrated circuit-mounted substrate, microwave module |
| US10992056B2 (en) | 2017-04-14 | 2021-04-27 | Nidec Corporation | Slot antenna device |
| US11061110B2 (en) | 2017-05-11 | 2021-07-13 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US11088464B2 (en) | 2018-06-14 | 2021-08-10 | Nidec Corporation | Slot array antenna |
| US11411292B2 (en) | 2019-01-16 | 2022-08-09 | WGR Co., Ltd. | Waveguide device, electromagnetic radiation confinement device, antenna device, microwave chemical reaction device, and radar device |
| US11611138B2 (en) | 2017-04-12 | 2023-03-21 | Nidec Corporation | Method of producing a radio frequency member |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49113162A (fr) * | 1973-03-06 | 1974-10-29 | ||
| JPS6197207U (fr) * | 1984-12-03 | 1986-06-21 | ||
| JPH01140900U (fr) * | 1988-03-23 | 1989-09-27 | ||
| JPH0216796A (ja) * | 1988-07-05 | 1990-01-19 | Nippon Mektron Ltd | 可撓性多層回路基板及びその製造方法 |
| JPH0653351A (ja) * | 1992-05-20 | 1994-02-25 | Internatl Business Mach Corp <Ibm> | 多層配線を有する電子パッケージ基板及び方法 |
| JPH06252631A (ja) * | 1993-02-26 | 1994-09-09 | Hitachi Chem Co Ltd | トリプレート型平面アンテナ |
| JPH08506696A (ja) * | 1993-02-02 | 1996-07-16 | エイ・エス・ティー・リサーチ・インコーポレイテッド | 遮蔽グリッドを含む回路基板配列およびその構成 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63164498A (ja) * | 1986-12-26 | 1988-07-07 | セイコーインスツルメンツ株式会社 | 電磁波吸収板 |
| US5633786A (en) * | 1995-08-21 | 1997-05-27 | Motorola | Shield assembly and method of shielding suitable for use in a communication device |
-
2000
- 2000-03-06 WO PCT/JP2000/001357 patent/WO2001067837A1/fr not_active Ceased
-
2001
- 2001-01-17 WO PCT/JP2001/000280 patent/WO2001067540A1/fr not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49113162A (fr) * | 1973-03-06 | 1974-10-29 | ||
| JPS6197207U (fr) * | 1984-12-03 | 1986-06-21 | ||
| JPH01140900U (fr) * | 1988-03-23 | 1989-09-27 | ||
| JPH0216796A (ja) * | 1988-07-05 | 1990-01-19 | Nippon Mektron Ltd | 可撓性多層回路基板及びその製造方法 |
| JPH0653351A (ja) * | 1992-05-20 | 1994-02-25 | Internatl Business Mach Corp <Ibm> | 多層配線を有する電子パッケージ基板及び方法 |
| JPH08506696A (ja) * | 1993-02-02 | 1996-07-16 | エイ・エス・ティー・リサーチ・インコーポレイテッド | 遮蔽グリッドを含む回路基板配列およびその構成 |
| JPH06252631A (ja) * | 1993-02-26 | 1994-09-09 | Hitachi Chem Co Ltd | トリプレート型平面アンテナ |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2376804A (en) * | 2001-04-20 | 2002-12-24 | Hewlett Packard Co | Electromagnetic interference shield with waveguides |
| JP2008167182A (ja) * | 2006-12-28 | 2008-07-17 | Hitachi Ltd | 高周波半導体装置およびその実装方法 |
| WO2009048095A1 (fr) * | 2007-10-09 | 2009-04-16 | Nec Corporation | Dispositif de circuit possédant une ligne de transmission et carte de circuit imprimé |
| JP2011014723A (ja) * | 2009-07-02 | 2011-01-20 | Yupo Corp | 電磁波遮蔽体 |
| US10027032B2 (en) | 2015-10-15 | 2018-07-17 | Nidec Corporation | Waveguide device and antenna device including the waveguide device |
| US9786995B2 (en) | 2015-11-05 | 2017-10-10 | Nidec Elesys Corporation | Slot array antenna |
| US10236591B2 (en) | 2015-11-05 | 2019-03-19 | Nidec Corporation | Slot antenna |
| US10381741B2 (en) | 2015-12-24 | 2019-08-13 | Nidec Corporation | Slot array antenna, and radar, radar system, and wireless communication system including the slot array antenna |
| US10164344B2 (en) | 2015-12-24 | 2018-12-25 | Nidec Corporation | Waveguide device, slot antenna, and radar, radar system, and wireless communication system including the slot antenna |
| US10042045B2 (en) | 2016-01-15 | 2018-08-07 | Nidec Corporation | Waveguide device, slot array antenna, and radar, radar system, and wireless communication system including the slot array antenna |
| US10559890B2 (en) | 2016-01-29 | 2020-02-11 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10158158B2 (en) | 2016-02-08 | 2018-12-18 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10090600B2 (en) | 2016-02-12 | 2018-10-02 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10651138B2 (en) | 2016-03-29 | 2020-05-12 | Nidec Corporation | Microwave IC waveguide device module |
| US10594045B2 (en) | 2016-04-05 | 2020-03-17 | Nidec Corporation | Waveguide device and antenna array |
| US10727561B2 (en) | 2016-04-28 | 2020-07-28 | Nidec Corporation | Mounting substrate, waveguide module, integrated circuit-mounted substrate, microwave module |
| US10374323B2 (en) | 2017-03-24 | 2019-08-06 | Nidec Corporation | Slot array antenna and radar having the slot array antenna |
| US11611138B2 (en) | 2017-04-12 | 2023-03-21 | Nidec Corporation | Method of producing a radio frequency member |
| US10601144B2 (en) | 2017-04-13 | 2020-03-24 | Nidec Corporation | Slot antenna device |
| US10608345B2 (en) | 2017-04-13 | 2020-03-31 | Nidec Corporation | Slot array antenna |
| US10992056B2 (en) | 2017-04-14 | 2021-04-27 | Nidec Corporation | Slot antenna device |
| US11061110B2 (en) | 2017-05-11 | 2021-07-13 | Nidec Corporation | Waveguide device, and antenna device including the waveguide device |
| US10714802B2 (en) | 2017-06-26 | 2020-07-14 | WGR Co., Ltd. | Transmission line device |
| US10547122B2 (en) | 2017-06-26 | 2020-01-28 | Nidec Corporation | Method of producing a horn antenna array and antenna array |
| US10658760B2 (en) | 2017-06-26 | 2020-05-19 | Nidec Corporation | Horn antenna array |
| US10707584B2 (en) | 2017-08-18 | 2020-07-07 | Nidec Corporation | Antenna array |
| US11088464B2 (en) | 2018-06-14 | 2021-08-10 | Nidec Corporation | Slot array antenna |
| JP2020096030A (ja) * | 2018-12-11 | 2020-06-18 | 日本電信電話株式会社 | 高周波モジュール |
| JP7095582B2 (ja) | 2018-12-11 | 2022-07-05 | 日本電信電話株式会社 | 高周波モジュール |
| US11411292B2 (en) | 2019-01-16 | 2022-08-09 | WGR Co., Ltd. | Waveguide device, electromagnetic radiation confinement device, antenna device, microwave chemical reaction device, and radar device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001067837A1 (fr) | 2001-09-13 |
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