[go: up one dir, main page]

WO1999004429A1 - Puits thermique en alliage a memoire de forme - Google Patents

Puits thermique en alliage a memoire de forme Download PDF

Info

Publication number
WO1999004429A1
WO1999004429A1 PCT/GB1998/002014 GB9802014W WO9904429A1 WO 1999004429 A1 WO1999004429 A1 WO 1999004429A1 GB 9802014 W GB9802014 W GB 9802014W WO 9904429 A1 WO9904429 A1 WO 9904429A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
shape
transformation temperature
electronic device
fin portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1998/002014
Other languages
English (en)
Inventor
Mark Stephen Topping
Maria Therese O'connell
Rosa Lynda NUÑO
Cuong Van Pham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co Ltd
Ford Motor Co
Original Assignee
Ford Motor Co Ltd
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co Ltd, Ford Motor Co filed Critical Ford Motor Co Ltd
Publication of WO1999004429A1 publication Critical patent/WO1999004429A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • heat sinks are usually made of copper or aluminum, and are typically finned in order to provide a greater surface area-to-volume ratio to improve convection of heat away from the heat sink.
  • FIG. 7A-C are elevational views of heat sinks constructed of a one-way SMA according to the present invention each showing a not-mechanically-connected means for restoring.
  • FIG. 1 shows an array of heat sinks 10 attached to an outer surface 52 of an electronic device 50.
  • Each heat sink 10 comprises a stationary base portion 12 capable of being thermally attached to an electronic device 50, and at least one deflectable fin portion 14 contiguous with and extending from the base portion 12.
  • FIG. 2 An alternative embodiment of this is shown in FIG. 2, where there is only one base portion 12 having a plurality of fin portions 14 extending therefrom.
  • the heat sink 10 will absorb heat from the device 50 by conduction and will dissipate heat to the surrounding atmosphere by convection.
  • the heat sink 10 will continue to do this at a constant rate, albeit at a rate significantly lower than a conventional copper or aluminum heat sink of the same volume would.
  • the heat sink 10 will begin to absorb thermal energy from the device 50 at a much higher rate, converting this thermal energy into mechanical deformation energy whereby each fin portion 14 will deflect from its first shape to its second shape. (This of course assumes that enough thermal energy is output by the device 50 in order to complete this shape transformation.
  • each fin portion 14 might deflect only a portion of the way between the first and second shapes.
  • the wicking away and transformation of heat is typically so great at this point that the device 50 is cooled to a temperature T below T t , whereupon the heat sink 10 will likewise cool below this temperature, thereby causing each fin portion 14 to deflect from its second shape back to its first, whereupon the accelerated wicking and conversion may begin again.
  • each fin portion 14 will be self-deflecting back and forth between its first and second shapes (and the entire heat sink 10 will be cycling back and forth between its martensite and austenite phases) as the heat sink absorbs heat and converts it into mechanical deformation.
  • each fin portion should be unrestrained from any external, mechanically interfering element so that each fin portion is free to cyclically deflect between its first and second shapes in response to temperature changes in the device 50.
  • each fin portion 14 When the heat sink 10 is composed of a one-way SMA, each fin portion 14 has a first shape as originally manufactured, and is capable of being bent into a second "bent" shape while the heat sink 10 is at a temperature T below the SMA' s transformation temperature T t . Each fin portion 14 is further capable of deflecting back to its first shape from the second "bent" shape when the heat sink temperature T is at or above T t .
  • the SMA material may be alloyed such that a predetermined T t point is provided, which may correspond to a critical operating temperature of an electronic device 50 to which each heat sink base portion 12 may be attached.
  • the absorption and conversion (and therefore dissipation) of thermal energy away from the electronic device 50 is so dramatic that the overall heat sink size can be made much smaller than would be the case for conventional aluminum or copper heat sinks having substantially the same thermal dissipation effect.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cette invention se rapporte à un puits thermique composé d'un alliage à mémoire de forme, susceptible de se transformer dans un seul sens ou dans les deux sens, qui est doté d'une température de transformation martensite/austénite préétablie. Ce puits thermique (10) comporte une partie base fixe (12) pouvant être thermiquement reliée à un dispositif électronique (50), et au moins une partie de type ailette (14), susceptible d'être déviée, qui est contiguë à la partie base (12) et fait saillie à partir de cette dernière. Chaque partie ailette (14) possède une première forme ou est pliée de façon à adopter une première forme lorsque le puits thermique (10) est à une température inférieure à la température de transformation. Lorsque le puits thermique (10) se trouve à une température supérieure ou égale à la température de transformation, l'alliage à mémoire de forme transforme l'énergie thermique du dispositif (50) en énergie de déformation mécanique de sorte que chaque partie de type ailette (14) fléchit automatiquement et adopte une seconde forme.
PCT/GB1998/002014 1997-07-17 1998-07-10 Puits thermique en alliage a memoire de forme Ceased WO1999004429A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89596497A 1997-07-17 1997-07-17
US08/895,964 1997-07-17

Publications (1)

Publication Number Publication Date
WO1999004429A1 true WO1999004429A1 (fr) 1999-01-28

Family

ID=25405373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1998/002014 Ceased WO1999004429A1 (fr) 1997-07-17 1998-07-10 Puits thermique en alliage a memoire de forme

Country Status (1)

Country Link
WO (1) WO1999004429A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130255248A1 (en) * 2012-03-30 2013-10-03 General Electric Company Thermally-controlled component and thermal control process
US8611069B2 (en) 2010-05-18 2013-12-17 Empire Technology Development Llc Ultracapacitors employing phase change materials
CN103824825A (zh) * 2014-02-13 2014-05-28 中国科学院工程热物理研究所 微槽道相变换热装置
JP2015153875A (ja) * 2014-02-13 2015-08-24 セイコーインスツル株式会社 半導体装置
CN108323111A (zh) * 2018-02-09 2018-07-24 苏州天脉导热科技股份有限公司 单向散热模组
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
CN112340064A (zh) * 2020-11-03 2021-02-09 中国电子科技集团公司第二十九研究所 一种不依靠外源驱动的单向热导通空间辐冷器
US11031312B2 (en) 2017-07-17 2021-06-08 Fractal Heatsink Technologies, LLC Multi-fractal heatsink system and method
US11209220B2 (en) 2010-05-04 2021-12-28 Fractal Heatsink Technologies LLC Fractal heat transfer device
CN114199063A (zh) * 2021-12-14 2022-03-18 浙江大学 一种基于记忆金属的管壳式换热器及实现接触熔化的方法
US11598593B2 (en) 2010-05-04 2023-03-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
CN115802727A (zh) * 2023-01-31 2023-03-14 荣耀终端有限公司 散热屏蔽组件、制造方法及电子设备
US11609053B2 (en) 2016-07-12 2023-03-21 Fractal Heatsink Technologies LLC System and method for maintaining efficiency of a heat sink
CN117134539A (zh) * 2023-09-11 2023-11-28 贝德凯利电气(苏州)有限公司 一种高压直流风机水冷散热结构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198565A (ja) * 1984-10-19 1986-05-16 Canon Inc サ−マルヘツドユニツト
US4654092A (en) * 1983-11-15 1987-03-31 Raychem Corporation Nickel-titanium-base shape-memory alloy composite structure
JPS636915A (ja) * 1986-06-26 1988-01-12 Fuji Electric Co Ltd 無接点開閉器
JPH0370162A (ja) * 1989-08-09 1991-03-26 Mitsubishi Electric Corp Ｉｃチップの放熱フィン装置
JPH04291750A (ja) * 1991-03-20 1992-10-15 Hitachi Ltd 放熱フィンおよび半導体集積回路装置
US5483098A (en) * 1992-04-21 1996-01-09 Motorola, Inc. Drop-in heat sink package with window frame flag
US5548481A (en) * 1993-04-05 1996-08-20 Ford Motor Company Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654092A (en) * 1983-11-15 1987-03-31 Raychem Corporation Nickel-titanium-base shape-memory alloy composite structure
JPS6198565A (ja) * 1984-10-19 1986-05-16 Canon Inc サ−マルヘツドユニツト
JPS636915A (ja) * 1986-06-26 1988-01-12 Fuji Electric Co Ltd 無接点開閉器
JPH0370162A (ja) * 1989-08-09 1991-03-26 Mitsubishi Electric Corp Ｉｃチップの放熱フィン装置
JPH04291750A (ja) * 1991-03-20 1992-10-15 Hitachi Ltd 放熱フィンおよび半導体集積回路装置
US5483098A (en) * 1992-04-21 1996-01-09 Motorola, Inc. Drop-in heat sink package with window frame flag
US5548481A (en) * 1993-04-05 1996-08-20 Ford Motor Company Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 273 (M - 518) 17 September 1986 (1986-09-17) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 207 (E - 621) 14 June 1988 (1988-06-14) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 233 (E - 1077) 14 June 1991 (1991-06-14) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 104 (E - 1328) 3 March 1993 (1993-03-03) *

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11598593B2 (en) 2010-05-04 2023-03-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
US11209220B2 (en) 2010-05-04 2021-12-28 Fractal Heatsink Technologies LLC Fractal heat transfer device
US8611069B2 (en) 2010-05-18 2013-12-17 Empire Technology Development Llc Ultracapacitors employing phase change materials
US9123477B2 (en) 2010-05-18 2015-09-01 Empire Technology Development Llc Ultracapacitors employing phase change materials
US9587632B2 (en) * 2012-03-30 2017-03-07 General Electric Company Thermally-controlled component and thermal control process
US20130255248A1 (en) * 2012-03-30 2013-10-03 General Electric Company Thermally-controlled component and thermal control process
CN103824825A (zh) * 2014-02-13 2014-05-28 中国科学院工程热物理研究所 微槽道相变换热装置
JP2015153875A (ja) * 2014-02-13 2015-08-24 セイコーインスツル株式会社 半導体装置
CN103824825B (zh) * 2014-02-13 2017-01-04 中国科学院工程热物理研究所 微槽道相变换热装置
US12339078B2 (en) 2016-07-12 2025-06-24 Fractal Heatsink Technologies LLC System and method for maintaining efficiency of a heat sink
US11609053B2 (en) 2016-07-12 2023-03-21 Fractal Heatsink Technologies LLC System and method for maintaining efficiency of a heat sink
US11031312B2 (en) 2017-07-17 2021-06-08 Fractal Heatsink Technologies, LLC Multi-fractal heatsink system and method
US11670564B2 (en) 2017-07-17 2023-06-06 Fractal Heatsink Technologies LLC Multi-fractal heatsink system and method
US12288731B2 (en) 2017-07-17 2025-04-29 Fractal Heatsink Technologies LLC Multi-fractal heatsink system and method
CN108323111A (zh) * 2018-02-09 2018-07-24 苏州天脉导热科技股份有限公司 单向散热模组
CN112340064A (zh) * 2020-11-03 2021-02-09 中国电子科技集团公司第二十九研究所 一种不依靠外源驱动的单向热导通空间辐冷器
CN114199063B (zh) * 2021-12-14 2023-01-03 浙江大学 一种基于记忆金属的管壳式换热器及实现接触熔化的方法
CN114199063A (zh) * 2021-12-14 2022-03-18 浙江大学 一种基于记忆金属的管壳式换热器及实现接触熔化的方法
CN115802727A (zh) * 2023-01-31 2023-03-14 荣耀终端有限公司 散热屏蔽组件、制造方法及电子设备
CN117134539A (zh) * 2023-09-11 2023-11-28 贝德凯利电气(苏州)有限公司 一种高压直流风机水冷散热结构
CN117134539B (zh) * 2023-09-11 2024-03-19 贝德凯利电气(苏州)有限公司 一种高压直流风机水冷散热结构

Similar Documents

Publication Publication Date Title
WO1999004429A1 (fr) Puits thermique en alliage a memoire de forme
US5224356A (en) Method of using thermal energy absorbing and conducting potting materials
US3725835A (en) Memory material actuator devices
US7665300B2 (en) Thin, flexible actuator array to produce complex shapes and force distributions
US5095595A (en) Actuator for restraint/release (r/r) devices, particularly for space applications
US20100319881A1 (en) Heat spreader with vapor chamber and method for manufacturing the same
TW200406569A (en) Flat plate heat transfer device and manufacturing method thereof
US6668550B2 (en) Method and apparatus for converting dissipated heat to work energy
US20130239565A1 (en) Spatially graded sma actuators
JP4375738B2 (ja) 感温ぺレット型温度ヒューズ
US4765139A (en) Thermocouple for heating and cooling of memory metal actuators
EP3509099B1 (fr) Dissipateur thermique
JPH08204070A (ja) 電子部品の冷却構造
US3964011A (en) Single turn variable resistance device having a split shaft rotor
Abadie et al. Thermoelectric control of shape memory alloy microactuators: a thermal model
US3117205A (en) Rod-in-tube actuated temperature sensing device
US20070107431A1 (en) System and method for conveying thermal energy
US20250091411A1 (en) Elastocaloric Element for a Temperature Control System
US3386066A (en) Switch having simplified structural features
Krishnan et al. A shape memory alloy based cryogenic thermal conduction switch
Chien et al. Disk-shaped miniature heat pipe (DMHP) with radiating micro grooves for a TO can laser diode package
JPH06214067A (ja) 冷却デバイス
JPH0312998A (ja) ヒートシンク
JPS61197770A (ja) 形状変形部材
JPS5685842A (en) Semiconductor device having heat dissipating fin

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA CN JP MX

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: CA