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WO1999044087A1 - Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques - Google Patents

Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques Download PDF

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Publication number
WO1999044087A1
WO1999044087A1 PCT/US1999/004174 US9904174W WO9944087A1 WO 1999044087 A1 WO1999044087 A1 WO 1999044087A1 US 9904174 W US9904174 W US 9904174W WO 9944087 A1 WO9944087 A1 WO 9944087A1
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic
optical
alignment
disposed
coupling device
Prior art date
Application number
PCT/US1999/004174
Other languages
English (en)
Inventor
Ching-Long Jiang
Original Assignee
The Whitaker Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Whitaker Corporation filed Critical The Whitaker Corporation
Priority to AU28795/99A priority Critical patent/AU2879599A/en
Priority to DE69939010T priority patent/DE69939010D1/de
Priority to EP99909629A priority patent/EP1060428B1/fr
Publication of WO1999044087A1 publication Critical patent/WO1999044087A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4222—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera by observing back-reflected light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • the present invention relates to a device for passively aligning an optical fiber to an optoelectronic device.
  • the present application is related to U.S. Patent Applications (The Whitaker Corporation Docket Nos. 17212 and 17213), the disclosures of which are incorporated herein by reference.
  • silicon substrates as an optical bench, preferably known as silicon waferboard technology
  • silicon waferboard as an optical bench generally utilizes etched features in the silicon waferboard, for example the grooves for holding the optical fiber.
  • the silicon waferboard is a monocrystalline material, anisotropic etching is done to create the v grooves for holding the fiber along the surface of the silicon wafer and alignment fiducials used to hold edge emitting optoelectronic devices and effect passive alignment. Further details of anisotropic etching to effect v grooves and alignment feducials can be found for example in U.S.
  • amorphous silicon can be used as the optical bench, with other known techniques such as reactive ion etching (RIE) to effect fiducials utilized for alignment.
  • RIE reactive ion etching
  • the alignment of an optical fiber to an optoelectronic device in silicon waferboard is most readily effected by the coupling of the fiber to an edge emitting optoelectronic device. This is because of the geometry of the silicon waferboard.
  • the fiber is usually held in an etched v groove on the silicon waferboard, and the alignment of the edge emitting optoelectronic device to the fiber relies on precision alignment pedestals on silicon waferboard and the precision notch on the edge emitting optoelectronic device.
  • U.S. Patent 5,179,609 to Blonder, et al. discloses an example of the use of silicon waferboard to effect coupling between the device and the fiber in a co- linear fashion.
  • the disclosure of this patent is specifically incorporated herein by reference.
  • This reference makes use of two pieces of monocrystalline material as mounting members that have etched therein detense and complimentary locations on each of the pieces of the members . These detents receive microspheres to effect alignment of the mounting members to effect the coupling of the device to the fiber. This is a relatively complicated structure and not practical from manufacturing perspective.
  • Another example of a technique for in-line alignment of an optical fiber to a surface emitting/receiving optoelectronic device is as disclosed in U.S.
  • the reference Boudreau, et al. discloses an alignment frame for coupling an optical fiber to an optical electronic device with the optical electronic device readily and accurately placed and bonded to the frame by way of alignment pedestals and standoffs.
  • This passive alignment member has certain benefits as are discussed in the application referenced above.
  • the invention to Boudreau, et al. is a pigtailed device.
  • a connectorized device which enables the coupling of an optical fiber to an optical electronic device which is either surface emitting or surface receiving in a passively aligned manner.
  • the present invention relates to a passive alignment scheme for aligning surface emitting/detecting optical electronic devices to optical fibers through the use of a mini-MT ferrule used in a RJ connector by way of silicon waferboard technology.
  • the mini-MT ferrule has guide pins which are used to align the optical fiber ultimately to the optoelectronic device.
  • a light coupling device having holes for receiving the guide pins as well as lens elements for coupling light between the optical fibers and the optical electronic devices is used.
  • the light coupling device is positioned between the optical fibers in the ferrule and the optoelectronic devices mounted on the silicon waferboard and has a recess on each end to accurately control the distance between the lenses and the optical electronic devices as well as the distance between the lenses and the optical fibers.
  • the distance between the lens and guide pinholes is precisely controlled to properly effect the alignment of the optical fibers to the lenses and ultimately to the optical electronic devices.
  • Silicon waferboard technology is used rather extensively in the invention of the present disclosure as the optical bench for the optical electronic devices .
  • alignment fidicuals to include x-y alignment pedestals and z-alignment standoffs are also used to accurately locate and precisely align in a passive manner the optical electronic devices of the present invention.
  • Figure 1 shows an example of this invention in a mini MT-RJ transceiver.
  • the silicon wafer board has two circular holes for alignment with respect to guide pins.
  • Figure 2 shows another example of this invention in a mini MT-RJ transceiver.
  • the silicon wafer board has two diamond shape holes for alignment with respect to guide pins .
  • Figure 3 shows the pedestals and standoffs on the silicon wafer board for passive alignment with the optoelectronic chips in the x-y and z directions, respec ively.
  • Figure 4 is a perspective view of the light coupling device of the present disclosure.
  • Figure 5 is a top view of the light coupling device of Figure 4.
  • Figure 1 shows an example of this invention in a MT-RJ transceiver.
  • the guide pins 201 provide alignment through silicon wafer board 202, light coupling device 203, and mini-MT ferrule in a RJ connector 204.
  • a dry etching with sub- micron accuracy process is used to produce the two circular shaped holes 205 for alignment with the guide pins 201 and different shaped pedestals and standoffs 206, 301 for passive alignment with the optoelectronic chips 303, 304 in the x-y and z directions, respectively.
  • the dry etching technique is well known to one of ordinary skill in the art.
  • the optoelectronic chips have the mating notches, cleaved edges, and/or other alignment fiducials for passive alignment with the silicon wafer board.
  • the light coupling device has two holes 209 for alignment with the guide pins 201 and two lenses 207 for collimating the light from the optoelectronic chips to the fiber in the mini-MT ferrule and vice versa. The precise locations of these two lenses with respect to the two holes in this light coupling device provide a very effective method of light coupling between the fibers and the optoelectronic chips .
  • the lenses 401 as well as the alignment holes 402 for receiving the pin are shown disposed on the light coupling device 400.
  • the light coupling device is fabricated from polymer material, for example Redal. However, other materials such as polycarbonate or suitable polymers or plastics within the purview of one of ordinary skill in the art can be used to fabricate the light coupling device 400.
  • the lenses 401 are molded and are maintained at a precise distance D3 from the center of the guide pins 402 as is shown in top view in figure 5.
  • the light coupling device 400 has a recess on each side shown as 403. The recess is also on the reverse side of the light coupling device.
  • the ridge 404 between the lenses 401 is to minimize cross-talk, as it must be remembered that one lens couples light between a fiber and a light emitting device and the other lens couples light between a fiber and a light detecting device.
  • the distance between the lenses 207,401 and the opto-electronic devices 303,304 is shown as Dl in Figure 5 and the distance between the lenses 207,401 and the optical fibers 208 is shown as D2 is Figure 5. Furthermore, again as shown in Figure 5, the distance between the lenses 401 and the guide pin holes 402 is designated as D3. These distances are controlled with great precision to properly couple the optoelectronic devices and the optical fibers to the lens elements 401. Through the optical coupling device 400, a precise coupling between the fibers 208 (shown in in Figure2) is achieved.
  • the apparatus shown in Figure 2 is similar to that Figure 1, except a wet etching process with sub-micron accuracy is used to produce the two diamond shaped holes 209 in the silicon wafer board with certain crystal orientation.
  • the light coupling device is the same in both embodiments .
  • the wet etching technique is well known to one of ordinary skill in the art.
  • the mating of the silicon wafer board and the optoelectronic chips 303 is shown in Figure 3.
  • the pedestals and standoffs 301 are schematically shown on the silicon wafer board.
  • the notches and/or cleaved edges are shown on the optoelectronic chips.
  • the passive alignment fiducials 301 are shown in Figure 3.
  • the holes for the guide pins 302 are for receiving the guide pins 201.
  • the devices shown as 303, 304 are the surface emitting/detecting devices of the present disclosure.
  • 303 is a PIN detector while the device 304 is a transmitting device, for example VCSEL or a surface emitting LED (SLED) .
  • the choice of the devices is dependent upon the ultimate use of the device as it is well known to one of ordinary skill in the art that light emitting diodes are for lower speed (transmission rate) operation and lasers are for higher data rate operation.
  • the alignment fiducials, pedestals and standoffs provide for x,y and z alignment via the silicon waferboard 300.
  • These alignment fidicuals are fabricated by techniques well known to one of ordinary skill in the art, and can be fabricated by both wet and dry etching techniques.
  • the invention having been described in detail, it is clear that various modifications and variations of the present disclosure are readily apparent to one of ordinary skill in the art having had the benefit of the present disclosure. To the extent that a mini-MT ferrule having optical fibers that are coupled to surface emitting/detecting optical electronic devices by way of a light coupling device as disclosed herein as well as

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention concerne un système d'alignement passif permettant d'aligner des dispositifs optoélectroniques détecteurs/émetteurs de surface (303, 304) sur des fibres optiques (208) grâce à l'emploi d'un mini-gabarit MT dans une connexion RJ (204) au moyen de la technologie des tranches de silicium. Le mini-gabarit MT est muni de goupilles de guidage (201) qui assurent l'alignement final de la fibre optique sur le dispositif optoélectronique. On utilise un dispositif de photocouplage (203) avec passages (209) pour les goupilles de guidage ainsi que des éléments en lentilles (207) assurant le photocouplage entre les fibres optiques et le dispositif optoélectronique. Le dispositif de photocouplage est positionné entre les fibres optiques dans le gabarit et les dispositifs photoélectroniques sur la tranche de silicium (202). Par ailleurs, on utilise des repères d'alignement (301) avec saillies d'alignement en x et y et des entretoises d'alignement en z pour le positionnement et l'alignement passif précis des dispositifs électroniques.
PCT/US1999/004174 1998-02-27 1999-02-26 Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques WO1999044087A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU28795/99A AU2879599A (en) 1998-02-27 1999-02-26 Optical coupling device for passive alignment of optoelectronic devices and optical fibers
DE69939010T DE69939010D1 (de) 1998-02-27 1999-02-26 Ten von optoelektronischen bauteilen und lichtleitfasern
EP99909629A EP1060428B1 (fr) 1998-02-27 1999-02-26 Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/031,585 US5913002A (en) 1997-12-31 1998-02-27 Optical coupling device for passive alignment of optoelectronic devices and fibers
US09/031,585 1998-02-27

Publications (1)

Publication Number Publication Date
WO1999044087A1 true WO1999044087A1 (fr) 1999-09-02

Family

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Family Applications (1)

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PCT/US1999/004174 WO1999044087A1 (fr) 1998-02-27 1999-02-26 Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques

Country Status (5)

Country Link
US (1) US5913002A (fr)
EP (1) EP1060428B1 (fr)
AU (1) AU2879599A (fr)
DE (1) DE69939010D1 (fr)
WO (1) WO1999044087A1 (fr)

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WO2004045111A3 (fr) * 2002-11-13 2004-07-08 Matsushita Electric Industrial Co Ltd Module de communication optique et son substrat
WO2006045277A3 (fr) * 2004-10-29 2006-07-27 Osram Opto Semiconductors Gmbh Dispositif d'eclairage, phares de vehicules automobiles et procede de production d'un dispositif d'eclairage
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WO2004045111A3 (fr) * 2002-11-13 2004-07-08 Matsushita Electric Industrial Co Ltd Module de communication optique et son substrat
US7232263B2 (en) 2002-11-13 2007-06-19 Matsushita Electric Industrial Co., Ltd. Optical communications module and substrate for the same
WO2006045277A3 (fr) * 2004-10-29 2006-07-27 Osram Opto Semiconductors Gmbh Dispositif d'eclairage, phares de vehicules automobiles et procede de production d'un dispositif d'eclairage
US8439529B2 (en) 2004-10-29 2013-05-14 Osram Opto Semiconductors Gmbh Lighting device, automotive headlights and method for producing a lighting device
US8997924B2 (en) 2007-03-21 2015-04-07 Ashtech Industries, Llc Utility materials incorporating a microparticle matrix
US9076428B2 (en) 2007-03-21 2015-07-07 Ashtech Industries, Llc Sound attenuation building material and system

Also Published As

Publication number Publication date
DE69939010D1 (de) 2008-08-14
US5913002A (en) 1999-06-15
AU2879599A (en) 1999-09-15
EP1060428B1 (fr) 2008-07-02
EP1060428A1 (fr) 2000-12-20

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