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WO1998014813A1 - Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles - Google Patents

Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles Download PDF

Info

Publication number
WO1998014813A1
WO1998014813A1 PCT/US1997/017502 US9717502W WO9814813A1 WO 1998014813 A1 WO1998014813 A1 WO 1998014813A1 US 9717502 W US9717502 W US 9717502W WO 9814813 A1 WO9814813 A1 WO 9814813A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible circuit
recited
further characterized
connector
fiber optic
Prior art date
Application number
PCT/US1997/017502
Other languages
English (en)
Inventor
Ervin H. Mueller
John R. Rowlette, Sr.
Original Assignee
The Whitaker Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Whitaker Corporation filed Critical The Whitaker Corporation
Priority to AU46025/97A priority Critical patent/AU4602597A/en
Publication of WO1998014813A1 publication Critical patent/WO1998014813A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • the present invention is directed to a fiber optic array transmitter/receiver device which utilizes flexible circuit technology for directly aligning light transmitting and/or receiving components, formed within a multi chip module on a flexible circuit, with the optical path of a fiber optic array connector.
  • the current state of the art uses 45 degree mirrors in a waveguiding media such as optical fiber or polymer waveguides, molded optics such as Lytel transceivers and IBM Jitney data links, or custom ceramic structures to turn the light emitting devices or light beam from a direction perpendicular to the electronic package to one that is parallel. Once the light is parallel with the electronic package, a connector or fiber pigtail approach can more easily be accommodated within the package to provide a disconnectable or permanent optical input/output interface to the data link.
  • the present invention utilizes flexible circuit technology, such as Multi Chip Module (MCM-E/F) technology, to provide the required 90 degree turn to the light path.
  • MCM-E/F Multi Chip Module
  • This approach allows the light emitting (or receiving) components, formed in the multi chip module and connected to a flexible circuit, to be directly in line with the optical path.
  • the 90 degree turn required to interface with the electronic package is accomplished with the flexible circuit.
  • This provides a relatively, linear optical path that can be easily interfaced with an optical connector.
  • a Polyguide (TM) polymer optical waveguide circuit accomplishes the connection between a source or receiver within the multi chip module and an optical connector end face.
  • the component parts, including multi chip module, optical waveguide circuit, and the optical connector are passively aligned using alignment pins of the optical connector.
  • the alignment pins are the only components aligning the optical source (or receiver) to cores of the optical fibers in the array connector.
  • FIG. 1 is an exploded left side perspective view of the invention according to a preferred embodiment thereof ;
  • FIG. 2 is an exploded right side perspective view of the device of Figure 1 ;
  • FIG. 3 is a right side view of the assembled device
  • FIG. 4 is a cross-sectional view taken along line 4-4 of Figure 3 ;
  • FIG. 5 is a perspective view of a two part flexible circuit used in the present invention.
  • FIG. 6 is a side view of the two part flexible circuit shown in Figure 5 ;
  • FIG. 7 is a perspective view of an L-shaped bracket used in the present invention.
  • FIG. 8 is a perspective view of a housing for use in the present invention.
  • FIG. 9 is a cross-sectional view of the housing shown in Figure 8.
  • a fiber optic array transmitter/receiver 10 Component parts of the transmitter/receiver include a fiber optic array connector 12 such as an MPX connector having an end face 34 at an exposed end thereof.
  • a substrate 14 such as a plastic ball grid array (PBGA) substrate, ceramic ball grid array (CBGA) , pin grid array (PGA) package ceramic lead frame or the like forms a base for additional components including an L-shaped bracket 16 having a vertical portion 16a and a horizontal portion 16b. The horizontal portion 16b of the L-shaped bracket 16 is mounted to a major surface of the substrate 14.
  • PBGA plastic ball grid array
  • CBGA ceramic ball grid array
  • PGA pin grid array
  • the L-shaped bracket includes an aperture or opening 36 of a somewhat rectangular shape formed through the vertical portion 16a thereof and a pair of slots 16c formed in the horizontal portion 16b thereof as shown in further detail in Figure 7.
  • the L-shaped bracket 16 used in the illustrated device is metal, any suitable material of sufficient strength, thermal transfer capability, and durability may be used in place of metal. Further, although the
  • MPX connector 12 is used by way of example, this data link packaging concept could be modified to use the USCONEC MPO connector, the Berg MAC connector, the
  • Methode MP connector or any other array connector that uses alignment pins.
  • a flexible circuit 18 is mounted on the L-shaped bracket such that a first horizontal portion 18a of the flexible circuit is mounted on the substrate 14, and another extended portion 18b of the flexible circuit 18 extends through the opening 36 of the L-shaped bracket 16.
  • the flexible circuit 18 is preferably the type which includes a flexible circuit based multi chip module (MCM) 19 fabricated using an FE MCM E/F process as described below, and includes the transmitter/receiver elements formed therein.
  • MCM flexible circuit based multi chip module
  • This multi chip module 19 is attached to the flexible circuit 18 on a side of the vertical portion 16a of the L-shaped bracket which opposes the horizontal portion 18a of the flexible circuit.
  • the multi chip module 19 is connected to portion 18b of the flexible circuit 18 such that the flexible circuit forms an effective bridge from the multi chip module 19 mounted on the L-shaped bracket 16 to the electronic substrate 14 thereby achieving an electrical connection therebetween and a 90° signal transition.
  • the multi chip module 19 uses flip-chip technology to provide a planar top surface. Also, the size of the aperture or opening 36 in the L-shaped bracket 16 is of a reduced size to provide better thermal and mechanical attachment for the multi chip module 19 to the customers printed circuit board.
  • the MCM attaches to the L-shaped bracket which attaches to the package substrate. The substrate then becomes a part of the transmitter/receives package that the user mounts to a PCB .
  • the multi chip module 19 is formed from a process which includes the steps of laser drilling apertures in polyimide film, conducting a Cu metallization, forming a
  • the multi chip module is encapsulated.
  • the flex circuit 18 is integrally formed with the multiachip module.
  • the device either a light source or detector is disposed on the MCM with any other desired electronics.
  • a tail portion of flex circuit connects the devices/electronics of the MCM to the substrate, preferably a ceramic lead frame.
  • the flex circuit could be bonded discretely to the MCM by soldering, for example.
  • a waveguide circuit 20 such as a Polyguide (TM) polymer waveguide circuit is mounted to a face of the vertical portion 16a of the L-shaped bracket which corresponds to a face to which the multi chip module 19 of the extended portion 18b of the flexible circuit 18 is mounted.
  • This waveguide circuit 20 performs three functions. First, it is an optical quality Aspacer block® that is mounted directly on the surface of the multi chip module 19 and buffers the multi chip module from the optical connector mating forces. Second, it provides an array of waveguides that couple the light from a source/detector array to the array of fibers in the array connector 12, thereby minimizing crosstalk between channels.
  • Each of the vertical portion 16a of the L-shaped bracket 16, the multi chip module 19 of the flexible circuit 18, and the waveguide circuit 20 have at least a pair of apertures formed therethrough at 28, 38, and 26, respectively.
  • a pair of connector or alignment pins 22 are insertable through the apertures 28, 38 and 26.
  • the polymer waveguide circuit assembly 20 is precisely slid onto the alignment pins 22. Additionally, the end face 34 of the fiber optic array connector 12 has a pair of apertures
  • the flexible circuit 18 may alternately be a Kapton
  • TM TM based flexible film with a custom metallization pattern defining the custom transmitter or receiver circuit.
  • This flexible circuit has the light emitting chip, such as a surface emitting Light Emitting Diode
  • the electronic chip that modulates the source is preferably bonded to the flexible circuit 18.
  • the chips may be a P-I-N diode or a metal-semiconductor-metal MSM detector array and preamplifier/postamplifier chip. Also, an integrated detector/preamp or detector/preamp/postamp could be used.
  • the surface of the active area of the emitter/detector has a normal vector which is parallel to the optic axis of the device.
  • a molded housing 24 having an opening 30 formed therein has features including a clip 25 molded into the design that allow the normal mating/demating action of the connector 12 to be accomplished with the housing 24.
  • the housing 24 is also keyed at 30a to prevent the connector 12 from being inserted into the housing in the wrong orientation (i.e. upside down) .
  • the substrate i.e. upside down
  • the flexible circuit 18 allows the fiber optic sources and detectors to be positioned in the package on the same axis as the optical fibers held in the fiber optic array connector 12.
  • the optical coupling between the source/detector and the optical fibers in the connector 12 is accomplished via the Polyguide polymer waveguide circuit 20 attached to the surface of the flexible circuit 18.
  • the electrical input/output from the source/driver chip is carried on the flexible circuit down to the substrate 14 and out to the customer printed circuit board (not shown) .
  • the fiber optic array connector 12 is connectable to the substrate 14 only because of the molded housing 24.
  • the substrate 14 and molded housing 24 are bonded together to create the necessary interface to mate with the connector 12.
  • the device disclosed allows the light emitting (or receiving) components, mounted on a flexible circuit 18, to be directly in line with the optics path.
  • the 90 degree turn required to interface with the electronic package is accomplished with the two part flexible circuit 18.
  • This provides a straight through, low loss optical path that can be easily interfaced with an optical connector.
  • the Polyguide (TM) polymer optical waveguide circuit 20 accomplishes the coupling between the multi chip module 19 of the flexible circuit 18 and the connector end face 34.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention se rapporte à un émetteur/récepteur à matrice de fibres optiques qui comporte un connecteur à matrice de fibres optiques (12) assurant l'interface avec un circuit de guide d'ondes (20) en matériau polymère, qui assure, lui, l'interface avec un module multipuce (19) relié à un circuit flexible (18). Ledit circuit flexible (18) est accouplé à une partie verticale (16a) d'une patte de fixation en forme de L (16) qui est elle-même maintenue en place du fait qu'elle est fixée à un support (14) par l'intermédiaire de sa partie horizontale (16b) et d'un boîtier moulé. Ledit circuit flexible (18) (ou une partie intégrante de ce circuit) est relié au module multipuce (19), et passe à travers une fente (36) de la patte de fixation en forme de L (16) aux fins de fixation audit substrat (14). Le connecteur (12), le circuit de guide d'ondes (20) et le module multipuce (19) sont disposés du même côté de la patte de fixation en forme de L (16) (du côté du connecteur).
PCT/US1997/017502 1996-09-30 1997-09-26 Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles WO1998014813A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU46025/97A AU4602597A (en) 1996-09-30 1997-09-26 Fiber optic array transmitter/receiver based on flexible circuit technology

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2706396P 1996-09-30 1996-09-30
US60/027,063 1996-09-30

Publications (1)

Publication Number Publication Date
WO1998014813A1 true WO1998014813A1 (fr) 1998-04-09

Family

ID=21835467

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/017502 WO1998014813A1 (fr) 1996-09-30 1997-09-26 Emetteur/recepteur a matrice de fibres optiques utilisant la technologie des circuits flexibles

Country Status (2)

Country Link
AU (1) AU4602597A (fr)
WO (1) WO1998014813A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999044087A1 (fr) * 1998-02-27 1999-09-02 The Whitaker Corporation Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques
US6459842B1 (en) 2000-12-13 2002-10-01 Teraconnect, Inc. Packaging system for two-dimensional optoelectronic arrays
US6601998B2 (en) 2000-12-13 2003-08-05 Teraconnect, Inc Optical waveguide assembly for interfacing a two-dimensional optoelectronic array to fiber bundles
EP1028341A3 (fr) * 1999-02-11 2004-07-21 Agilent Technologies, Inc. (a Delaware corporation) Système d'emballage integré pour dispositifs de communication optique permettant l'alignement automatique de fibres optiques
US7291833B2 (en) 1998-11-25 2007-11-06 Rohm And Haas Electronic Materials Llc Optoelectronic component
US7329056B2 (en) 2003-09-15 2008-02-12 Rohm And Haas Electronic Materials Llc Device package and methods for the fabrication and testing thereof
EP2759077A4 (fr) * 2011-09-23 2015-07-01 Te Connectivity Nederland Bv Interface optique pour communications bidirectionnelles
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US11624876B2 (en) 2020-07-01 2023-04-11 Corning Research & Development Corporation Fiber optic cable assembly having a connector with a holographic optical element and method of making same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5420953A (en) * 1994-02-17 1995-05-30 The Whitaker Corporation Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard
EP0710861A1 (fr) * 1994-11-02 1996-05-08 Sumitomo Electric Industries, Ltd. Circuit imprimé pour module optique avec structure flexible
US5539848A (en) * 1995-05-31 1996-07-23 Motorola Optical waveguide module and method of making

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5420953A (en) * 1994-02-17 1995-05-30 The Whitaker Corporation Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard
EP0710861A1 (fr) * 1994-11-02 1996-05-08 Sumitomo Electric Industries, Ltd. Circuit imprimé pour module optique avec structure flexible
US5539848A (en) * 1995-05-31 1996-07-23 Motorola Optical waveguide module and method of making

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LIU Y S ET AL: "OPTOELECTRONIC PACKAGING AND POLYMER WAVEGUIDES FOR MULTICHIP MODULE AND BOARD-LEVEL OPTICAL INTERCONNECT APPLICATIONS", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, LAS VEGAS, MAY 21 - 24, 1995, no. CONF. 45, 21 May 1995 (1995-05-21), INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, pages 185 - 188, XP000624968 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999044087A1 (fr) * 1998-02-27 1999-09-02 The Whitaker Corporation Dispositif d'optocouplage pour l'alignement passif de dispositifs optoelectroniques et de fibres optiques
US7291833B2 (en) 1998-11-25 2007-11-06 Rohm And Haas Electronic Materials Llc Optoelectronic component
US7380994B2 (en) 1999-02-11 2008-06-03 Avago Technologies Fiber Ip Pte Ltd Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
EP1028341A3 (fr) * 1999-02-11 2004-07-21 Agilent Technologies, Inc. (a Delaware corporation) Système d'emballage integré pour dispositifs de communication optique permettant l'alignement automatique de fibres optiques
US6459842B1 (en) 2000-12-13 2002-10-01 Teraconnect, Inc. Packaging system for two-dimensional optoelectronic arrays
US6601998B2 (en) 2000-12-13 2003-08-05 Teraconnect, Inc Optical waveguide assembly for interfacing a two-dimensional optoelectronic array to fiber bundles
US8993450B2 (en) 2003-09-15 2015-03-31 Nuvotronics, Llc Device package and methods for the fabrication and testing thereof
US7888793B2 (en) 2003-09-15 2011-02-15 Nuvotronics, Llc Device package and methods for the fabrication and testing thereof
US7329056B2 (en) 2003-09-15 2008-02-12 Rohm And Haas Electronic Materials Llc Device package and methods for the fabrication and testing thereof
US9410799B2 (en) 2003-09-15 2016-08-09 Nuvotronics, Inc. Device package and methods for the fabrication and testing thereof
US9647420B2 (en) 2003-09-15 2017-05-09 Nuvotronics, Inc. Package and methods for the fabrication and testing thereof
US9817199B2 (en) 2003-09-15 2017-11-14 Nuvotronics, Inc Device package and methods for the fabrication and testing thereof
EP2759077A4 (fr) * 2011-09-23 2015-07-01 Te Connectivity Nederland Bv Interface optique pour communications bidirectionnelles
US9178620B2 (en) 2011-09-23 2015-11-03 Te Connectivity Nederland B.V. Optical interface for bidirectional communications
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10553511B2 (en) 2017-12-01 2020-02-04 Cubic Corporation Integrated chip scale packages
US11624876B2 (en) 2020-07-01 2023-04-11 Corning Research & Development Corporation Fiber optic cable assembly having a connector with a holographic optical element and method of making same

Also Published As

Publication number Publication date
AU4602597A (en) 1998-04-24

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