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WO1998053499B1 - Substrat d'encapsulation de composants electroniques, gabarit de montage a broches - Google Patents

Substrat d'encapsulation de composants electroniques, gabarit de montage a broches

Info

Publication number
WO1998053499B1
WO1998053499B1 PCT/IL1998/000230 IL9800230W WO9853499B1 WO 1998053499 B1 WO1998053499 B1 WO 1998053499B1 IL 9800230 W IL9800230 W IL 9800230W WO 9853499 B1 WO9853499 B1 WO 9853499B1
Authority
WO
WIPO (PCT)
Prior art keywords
major surfaces
valve metal
substrate according
substrate
pin jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IL1998/000230
Other languages
English (en)
Other versions
WO1998053499A1 (fr
Filing date
Publication date
Priority claimed from IL12086697A external-priority patent/IL120866A0/xx
Application filed filed Critical
Priority to JP55020098A priority Critical patent/JP4484251B2/ja
Priority to EP98921706A priority patent/EP1012880A1/fr
Priority to AU74474/98A priority patent/AU7447498A/en
Priority to CA002290819A priority patent/CA2290819A1/fr
Publication of WO1998053499A1 publication Critical patent/WO1998053499A1/fr
Publication of WO1998053499B1 publication Critical patent/WO1998053499B1/fr
Priority to US09/424,179 priority patent/US6448510B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Abstract

L'invention concerne un substrat (1, 16, 21, 31) d'encapsulation de composants électroniques, le substrat présentant un corps solide discret, d'une manière générale prismatoïde, en métal de valve initialement électroconducteur et présentant un ou plusieurs trous d'interconnexion (6, 19, 28, 32) espacés remplis d'un métal de valve original, chacun isolé électriquement et individuellement par une partie de corps oxydé poreux périphérique. L'invention concerne également un gabarit (41) de montage à broches destiné à masquer mécaniquement une surface en métal, le gabarit (41) de montage à broches présentant un lit de broches (42) résistant à l'anodisation, chaque broche (43) présentant une surface terminale avant (44) destinée à venir en juxtaposition étroite contre une surface en métal afin d'en masquer certaines parties.
PCT/IL1998/000230 1997-05-20 1998-05-20 Substrat d'encapsulation de composants electroniques, gabarit de montage a broches Ceased WO1998053499A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP55020098A JP4484251B2 (ja) 1997-05-20 1998-05-20 基板、基板の製造方法、ピン治具、調整方法
EP98921706A EP1012880A1 (fr) 1997-05-20 1998-05-20 Substrat d'encapsulation de composants electroniques, gabarit de montage a broches
AU74474/98A AU7447498A (en) 1997-05-20 1998-05-20 Substrate for electronic packaging, pin jig fixture
CA002290819A CA2290819A1 (fr) 1997-05-20 1998-05-20 Substrat d'encapsulation de composants electroniques, gabarit de montage a broches
US09/424,179 US6448510B1 (en) 1997-05-20 1999-05-20 Substrate for electronic packaging, pin jig fixture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL12086697A IL120866A0 (en) 1997-05-20 1997-05-20 Process for producing an aluminum substrate
IL120866 1997-05-20

Publications (2)

Publication Number Publication Date
WO1998053499A1 WO1998053499A1 (fr) 1998-11-26
WO1998053499B1 true WO1998053499B1 (fr) 1999-02-04

Family

ID=11070149

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL1998/000230 Ceased WO1998053499A1 (fr) 1997-05-20 1998-05-20 Substrat d'encapsulation de composants electroniques, gabarit de montage a broches

Country Status (7)

Country Link
US (1) US6448510B1 (fr)
EP (1) EP1012880A1 (fr)
JP (1) JP4484251B2 (fr)
AU (1) AU7447498A (fr)
CA (1) CA2290819A1 (fr)
IL (1) IL120866A0 (fr)
WO (1) WO1998053499A1 (fr)

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