WO1997036303A1 - Composition de pate pour la preparation d'un electrolyte solide et procede de fabrication d'un condensateur electrolytique solide - Google Patents
Composition de pate pour la preparation d'un electrolyte solide et procede de fabrication d'un condensateur electrolytique solide Download PDFInfo
- Publication number
- WO1997036303A1 WO1997036303A1 PCT/JP1997/000974 JP9700974W WO9736303A1 WO 1997036303 A1 WO1997036303 A1 WO 1997036303A1 JP 9700974 W JP9700974 W JP 9700974W WO 9736303 A1 WO9736303 A1 WO 9736303A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solid electrolyte
- forming
- paste composition
- manganese dioxide
- electrolytic capacitor
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 61
- 239000007784 solid electrolyte Substances 0.000 title claims abstract description 47
- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 239000007787 solid Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 239000002612 dispersion medium Substances 0.000 claims abstract description 13
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 118
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000007822 coupling agent Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 8
- 229920002125 Sokalan® Polymers 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004584 polyacrylic acid Substances 0.000 claims description 7
- 239000002609 medium Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000010407 anodic oxide Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000012452 mother liquor Substances 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229920003169 water-soluble polymer Polymers 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 229920002401 polyacrylamide Polymers 0.000 claims description 2
- 229920000151 polyglycol Polymers 0.000 claims description 2
- 239000010695 polyglycol Substances 0.000 claims description 2
- 229920001444 polymaleic acid Polymers 0.000 claims description 2
- 229920001289 polyvinyl ether Polymers 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims 1
- 150000003949 imides Chemical class 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 abstract description 10
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 15
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052715 tantalum Inorganic materials 0.000 description 8
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 239000011550 stock solution Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 235000013772 propylene glycol Nutrition 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- MLSXBTKTDZUPHO-UHFFFAOYSA-N B1=[C-]C(C=C1)=O Chemical compound B1=[C-]C(C=C1)=O MLSXBTKTDZUPHO-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 241000556720 Manga Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
Definitions
- the present invention relates to a paste composition for forming a solid electrolyte and a method for producing a solid electrolytic capacitor using the same.
- the present invention relates to a paste composition for forming a solid electrolyte used for forming an electrode layer on an electronic component such as a capacitor, and a method for producing a solid electrolytic capacitor using the same.
- a manganese dioxide layer or the like having an arbitrary thickness.
- a cathode layer is formed by successively applying carbon, silver paste, and the like.
- a manufacturing method is used in which an external lead is soldered after the application and the resin is packaged by a resin dipping method, a resin molding method, or the like.
- the thickness of the coating layer that can be formed at one time during the thermal decomposition step of the chemical conversion treatment is extremely small. It was necessary to repeat the pyrolysis process several times to several times to form the slag, and there was a problem that the time required and the energy cost were extremely large. Also, nitric acid manga In the pyrolysis process, NO was generated due to the thermal decomposition of gas, and there were also environmental problems such as the treatment of these decomposition gases.
- this method makes it difficult for the thickness of the manganese dioxide layer and the like to be uniform, and if this thickness is small, the carbon layer directly contacts the oxide film and leaks. There was a problem that the current easily increased.
- the manganese dioxide layer and the like are thicker at the corners than at the other parts. There was a problem that the water resistance and moisture resistance were reduced.
- the resin sheathing is performed by the resin dipping method, the dimensions are likely to vary, and when the resin sheath shrinks, the corners are stressed and the characteristics are likely to deteriorate.
- Japanese Patent Application Laid-Open No. 51-76559 describes that manganese dioxide powder is mixed into volatile solvents such as water, alcohol, thinner, carbon tetrachloride, and ammonium carbonate. A method is disclosed. However, in this method, the manganese dioxide powder in the solution is difficult to disperse, and the particles agglomerate during storage. Sedimentation occurs, making it difficult to obtain a uniform coating film.
- Japanese Patent Application Laid-Open No. 7-233298 discloses a method of replacing a part of the metal powder used for the conductive base with manganese dioxide powder. In this method, however, a solid electrolyte is used. All the properties could not be fully realized.
- the present invention has been made to solve the above-mentioned problems, and a paste composition for forming a solid electrolyte capable of forming a uniform coating film in which manganese dioxide powder is unlikely to settle, and an electrolytic solution.
- a method for manufacturing a solid electrolytic capacitor using the base composition which can shorten the manufacturing time of a capacitor, improve leakage current characteristics, heat resistance, moisture resistance, etc., and improve the accuracy of external dimensions.
- the purpose is to do. Disclosure of the invention
- the present invention has the following gist to achieve the above object.
- a paste composition for forming a solid electrolyte comprising (A) manganese dioxide powder, (B) a dispersing resin and (C) a dispersing medium as essential components. Since this composition has excellent conductivity and can obtain a predetermined film thickness by one application, it is suitable for forming a solid electrolyte layer of a tantalum capacitor element.
- this composition can improve the conductivity of the manganese dioxide powder itself and reduce the resistance of the coating film.
- the dispersing resin is cellulose and its derivatives, polyglycols, polyacrylic acid, polyacrylic acid soda, polyacrylinoleamide, polyvinyl vinylidone, polydisperse resin.
- Vinyl ether, water-soluble alk Is a water-soluble polymer resin selected from the group consisting of polymethacrylate, polymaleic acid copolymer, polyethylenimine and polyvinyl alcohol [1] to [
- the paste composition for forming a solid electrolyte according to any one of the above.
- a water-soluble polymer resin as the dispersing resin, the composition can be easily dispersed in a dispersing medium and can provide a stable paste composition for forming a solid electrolyte. .
- the dispersion medium is at least one organic solvent or pure water selected from the group consisting of alcohols, ethylene glycols and propylene glycols, or a mixture thereof [1] to
- manganese dioxide powder is easily prepared by using an organic solvent selected from alcohol, ethylene glycol, and propylene glycol, or pure water, or a mixture thereof as a dispersion medium. And a stable solid electrolyte layer can be formed.
- This method can provide a method for manufacturing a solid electrolytic capacitor capable of shortening the manufacturing time, improving leakage current characteristics, heat resistance, moisture resistance, and improving the accuracy of external dimensions.
- FIG. 1 shows a characteristic graph of equivalent series resistance ESR of Examples 7 and 8 of the present invention and Comparative Example 3.
- FIG. 2 shows characteristic graphs of leakage currents of Examples 7 and 8 and Comparative Example 3 of the present invention.
- the paste composition for forming a solid electrolyte of the present invention contains (A) manganese dioxide powder, (B) a dispersion resin and (C) a dispersion medium as essential components.
- Examples of the (A) manganese dioxide powder used in the present invention include powders having an ⁇ -type, a type, a 7-type or a type crystal structure, and include a type crystal structure in consideration of conductivity.
- Manganese dioxide powder is preferred.
- Manganese dioxide containing Form 3 can be easily obtained by heating manganese dioxide at 250 ° C to 400 ° C for 1 to 5 hours.
- the average particle size of the manganese dioxide powder is 0.01 !, considering the conductivity and the applicability of the paste. Those with a size of ⁇ 50 are preferred, and those with a value of 0.01-10 ⁇ m are more preferred.
- the shape of the manganese dioxide powder is not limited to such a force as exemplified by a sphere, an irregular shape, and a crushed shape.
- the blending amount of the manganese dioxide powder in the present invention is preferably 1 to 90% by weight of the total amount of (A) manganese dioxide powder (B) dispersed resin and (C) dispersion medium, and is preferably 5 to 80%. %, More preferably 20% to 70% by weight. If the content is less than 1% by weight, it is difficult to form a coating film and the solid electrolyte functions as a solid electrolyte. When the content exceeds 9-0 unit amount%, the coatability as a paste and the adhesiveness to a substrate tend to decrease.
- the (B) dispersed resin used in the present invention is (A) one that improves the dispersibility of the manganese dioxide powder, water-soluble, and (A) one that easily binds to the manganese dioxide powder.
- derivatives such as cenorellose, methinoresenolylose, ethylcellulose, carboxymethylcellulose, and hydroxyshethylcellulose, polyethylene glycol, and polypropylene glycol
- Polyacrylic acid, polyacrylic acid, polyacrylic acid soda, polyacrylamide, polyvinyl borolidone, water-soluble alkyd, polyvinyl ether, polymalein Acid copolymers, polyethyleneimine and polyvinyl alcohol are exemplified as being preferred.
- the compounding amount of (B) the dispersing resin is 0.5 to 40% by weight of the total amount of (A) manganese dioxide powder, (B) the dispersing resin and (C) the dispersing medium.
- the content is preferably 1 to 20% by weight, more preferably 2 to 10% by weight. If the amount is less than 0.5% by weight, the dispersion of manganese dioxide tends to be insufficient. If the amount exceeds 40% by weight, the conductivity tends to decrease and the performance as a solid electrolyte tends to deteriorate. is there.
- the (C) dispersion medium used in the present invention is not particularly limited as long as it can dissolve the (B) dispersion resin and maintain the dispersion stability of (A) manganese dioxide powder, but are not limited to alcohol-based dispersion media.
- the preferred solvent include an ethylene glycol-based or propylene glycol-based organic solvent, or pure water or pure water in which a manganese salt such as manganese nitrate is dissolved. Is done. -.
- organic solvents or pure water may be used alone or in a combination of two or more at any ratio.
- the blending amount of (C) the dispersion medium is preferably 10 to 95% by weight of the total amount of (A) manganese dioxide powder, (B) the dispersion resin, and (C) the dispersion medium.
- the content is more preferably from 20 to 90% by weight, and particularly preferably from 25 to 80% by weight. If the compounding power is less than 10% by weight, the dispersion of the manganese dioxide powder becomes insufficient, and if it exceeds 95% by weight, the film thickness of the coating film becomes too thin to obtain a sufficient film thickness at one time. Tend.
- (D) a coupling agent as necessary in order to stably disperse (A) manganese dioxide.
- the method of using the coupling agent is as follows: (A) manganese dioxide, (B) dispersing resin, and (C) dispersing medium by directly adding to (A) There is a method in which manganese dioxide powder is used after treatment with (D) a capping agent.
- the method of treating manganese dioxide powder includes, for example, (A) a method of adding (D) a coupling agent directly to manganese dioxide powder and mixing with stirring (dry treatment method) and a method of hexane.
- a coupling agent is preliminarily dissolved in a solvent such as toluene or the like, and (A) manganese dioxide powder is added thereto, mixed and stirred, and then the solvent is removed and dried (wet processing method).
- the paste composition for forming a solid electrolyte of the present invention may be, for example, an antioxidant, a chelating agent, or an additive having various functions, as long as it does not adversely affect the properties of the cured product when the paste and the coating film are formed.
- a modifier and the like can be added.
- carbon black, graphite carbon, or the like can be used in combination to impart conductivity. The amount of these is preferably 0.5 to 10 parts by weight based on 100 parts by weight of the manganese dioxide powder.
- the base composition for forming a solid electrolyte of the present invention may be prepared by mixing a predetermined amount of (A) manganese dioxide powder, (B) a dispersion resin and (C) a dispersion medium with an ordinary stirrer, triturator, three-roll or roll mill. It can be easily obtained by uniformly kneading or dispersing using a solvent or the like, and a uniform and thick coating film can be obtained by one application without changing the characteristics as a solid electrolyte. It can be suitably used as a solid electrolyte layer such as a tantalum capacitor.
- the present invention relates to a method for producing a solid electrolytic capacitor using the paste composition for forming a solid electrolyte.
- a solid electrolytic capacitor can be obtained by forming an anodized film on a sintered body obtained from a valve metal powder or by immersing the sintered body with the anodized film in a semiconductor mother liquor and thermally decomposing it. Immersed in the paste composition for solid electrolyte formation described above and dried Thus, a solid electrolytic capacitor is manufactured by forming a semiconductor layer.
- a valve metal such as tantalum is embedded in one end of a tantalum lead wire or the like, the other end is drawn out, compression-molded with a press, and then pressed in a vacuum. Heat at a temperature of about 100 ° C for several 10 minutes to form a sintered body. Next, the sintered body is welded to a metal bar such as stainless steel at a place such as a tan wire, and the sintered body is formed by applying a voltage in a chemical solution such as nitric acid and phosphoric acid. , An anodic oxide film of Ta 2 O, is formed.
- the sintered body having the anodic oxide film formed thereon is immersed in a semiconductor mother liquor such as a manganese nitrate solution to be impregnated with the solution, and then baked at a temperature of 200 ° C. to 350 ° C. to undergo thermal decomposition. Then, a semiconductor layer mainly including a manganese dioxide layer is formed inside the sintered body, and then re-formed to repair the anodized film damaged by sintering.
- a semiconductor mother liquor such as a manganese nitrate solution to be impregnated with the solution
- a semiconductor layer mainly including a manganese dioxide layer is formed inside the sintered body, and then re-formed to repair the anodized film damaged by sintering.
- Manganese dioxide powder (RB-A manufactured by Mitsui Kinzoku Co., Ltd.) was heated at 350 ° C for 3 hours. (Average particle size: 2 m) 10 Q Add 60 parts by weight of n-hexane and 1 part by weight of AL-M (Ajinomoto Co., Alumino-based coupling agent) Then, the mixture was stirred and mixed with a roll mill. Thereafter, n-hexane was removed to obtain a manganese dioxide powder having a surface-treated type crystal structure.
- AL-M Al-M
- the conductivity was measured by forming a coating film of about 50 m on a ceramic plate by screen printing, and after curing, using a digital multimeter by a four-terminal method.
- the dispersibility was measured using a grain gauge according to the method of JIS-K540.
- the thickness of the coating was measured by dipping a ceramic plate of 1 ⁇ 2 cm in a paste for about 3 seconds, pulling it up, drying it, and measuring the coating thickness using a micrometer.
- Example 1 100 parts by weight of the surface-treated manganese dioxide powder having a / 5-type crystal structure used in Example 1 was added to 5 parts by weight of sodium polyacrylate (AC_103) and the product AL— After preliminarily mixing 2 parts by weight of M and 40 parts by weight of pure water in a mortar, the mixture was kneaded with three rolls to obtain a paste composition for forming a solid electrolyte.
- Table 1 shows the conductivity, dispersibility, and coating film thickness of this base composition.
- Example 4 The same procedure as in Example 1 was carried out except that a 50% by weight aqueous solution of manganese nitrate was used as the dispersion medium. Table 1 shows the dispersibility and coating film thickness. [Example 4]
- Example 1 The same procedure as in Example 1 was carried out except that the dispersing resin and polyvinylpyrrolidone (manufactured by ISBI JAPAN Co., Ltd.) were used, and the conductivity, dispersibility, Table 1 shows the coating thickness.
- a manganese dioxide layer is formed on a ceramic substrate by a conventional method of thermally decomposing a 50% by weight aqueous solution of manganese nitrate without using a paste composition in which manganese dioxide powder is dispersed to form a conductive and coated film.
- Table 1 shows the results of the examination.
- the conductive paste composition of the present invention had good dispersibility and excellent conductivity, and was able to obtain a predetermined film thickness by one application. .
- Example 1 To form a manganese dioxide layer, the sintered body was immersed in a manganese nitrate solution, and the process of thermal decomposition and re-chemical formation by chemical formation was repeated eight times, and the paste composition for forming a solid electrolyte formed in Example 1 was obtained.
- a solid electrolytic capacitor according to a conventional method was manufactured under the same conditions as in Example 6, except that no material was used.
- Example 6 shows the same characteristics as Comparative Example 2. That is, it was clarified that Example 6 exhibited good characteristics even when a series of steps such as immersion in a manganese nitrate solution and thermal decomposition were performed 1 to 2 times in the comparative example which is a conventional method.
- Example 6 After repeating the series of processes of immersing the sintered body in a manganese nitrate solution, sintering, and re-forming as shown in Example 6 three times, the solid electrolyte-forming paste composition prepared in Example 1 was used as a stock solution.
- a solid electrolytic capacitor was produced under the same conditions as in Example 6, except that the immersion and drying treatments were repeated twice to form a manganese dioxide layer.
- An electrolytic capacitor was manufactured.
- a solid electrolytic capacitor was produced by the conventional method under the same conditions as in Comparative Example 2, except that the sintered body was immersed in a manganese nitrate solution, and the steps of thermal decomposition and re-chemical formation by chemical conversion were repeated six times.
- both ESR and LC have the same or better characteristics as those of Comparative Example 3. It is also clear that a range of 180 to 200 for both properties is a particularly preferred drying temperature.
- the paste composition for forming a solid electrolyte of the present invention is suitable for uniformly forming a solid electrolyte of an electronic component such as a solid electrolytic capacitor such as an indium capacitor.
- the method for producing a solid electrolytic capacitor using the paste composition for forming is effective for producing a solid electrolytic capacitor such as a tantalum capacitor in a short time and with high accuracy.
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Abstract
L'invention concerne une composition de pâte destinée à la préparation d'un électrolyte solide et renfermant (A) une poudre d'oxyde de manganèse, (B) une résine de dispersion et (C) un milieu de dispersion constituant les composants essentiels, ainsi qu'un procédé de préparation d'un condensateur électrolytique solide à l'aide de la composition. Cette composition de pâte présente une excellente conductivité. Il est possible de former un film d'une épaisseur donnée grâce à une seule application de cette composition de pâte. Lorsqu'on met en ÷uvre ce procédé de fabrication de condensateur électrolytique solide à l'aide de la composition de pâte, le temps de fabrication du condensateur électrolytique solide peut être raccourci. Par ce procédé, il est possible d'améliorer les caractéristiques du courant de fuite, la résistance à la chaleur et la résistance à l'humidité du condensateur et d'obtenir des dimensions externes plus précises.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955996 | 1996-03-26 | ||
| JP8/69559 | 1996-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1997036303A1 true WO1997036303A1 (fr) | 1997-10-02 |
Family
ID=13406237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1997/000974 WO1997036303A1 (fr) | 1996-03-26 | 1997-03-24 | Composition de pate pour la preparation d'un electrolyte solide et procede de fabrication d'un condensateur electrolytique solide |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO1997036303A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2489786A (en) * | 2011-04-07 | 2012-10-10 | Avx Corp | Hermetically sealed solid electrolytic capacitor assembly containing an inert gas |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59197123A (ja) * | 1983-04-23 | 1984-11-08 | エルナ−株式会社 | 電解コンデンサおよびその製造方法 |
| JPS6047734B2 (ja) * | 1981-10-12 | 1985-10-23 | 日立コンデンサ株式会社 | 固体電解コンデンサの製法 |
| JPS63104319A (ja) * | 1986-10-21 | 1988-05-09 | マルコン電子株式会社 | 積層形ペ−パ−レス電解コンデンサの製造方法 |
| JPS63119518A (ja) * | 1986-11-08 | 1988-05-24 | 昭和電工株式会社 | 固体電解コンデンサ |
-
1997
- 1997-03-24 WO PCT/JP1997/000974 patent/WO1997036303A1/fr active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6047734B2 (ja) * | 1981-10-12 | 1985-10-23 | 日立コンデンサ株式会社 | 固体電解コンデンサの製法 |
| JPS59197123A (ja) * | 1983-04-23 | 1984-11-08 | エルナ−株式会社 | 電解コンデンサおよびその製造方法 |
| JPS63104319A (ja) * | 1986-10-21 | 1988-05-09 | マルコン電子株式会社 | 積層形ペ−パ−レス電解コンデンサの製造方法 |
| JPS63119518A (ja) * | 1986-11-08 | 1988-05-24 | 昭和電工株式会社 | 固体電解コンデンサ |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2489786A (en) * | 2011-04-07 | 2012-10-10 | Avx Corp | Hermetically sealed solid electrolytic capacitor assembly containing an inert gas |
| US8947857B2 (en) | 2011-04-07 | 2015-02-03 | Avx Corporation | Manganese oxide capacitor for use in extreme environments |
| GB2489786B (en) * | 2011-04-07 | 2015-04-15 | Avx Corp | Manganese oxide capacitor for use in extreme environments |
| US9508492B2 (en) | 2011-04-07 | 2016-11-29 | Avx Corporation | Manganese oxide capacitor for use in extreme environments |
| US10014120B2 (en) | 2011-04-07 | 2018-07-03 | Avx Corporation | Manganese oxide capacitor for use in extreme environments |
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