[go: up one dir, main page]

WO1997012714A3 - Dispositif de soudure et de dessoudure selectives sans contact de composants - Google Patents

Dispositif de soudure et de dessoudure selectives sans contact de composants Download PDF

Info

Publication number
WO1997012714A3
WO1997012714A3 PCT/DE1996/001820 DE9601820W WO9712714A3 WO 1997012714 A3 WO1997012714 A3 WO 1997012714A3 DE 9601820 W DE9601820 W DE 9601820W WO 9712714 A3 WO9712714 A3 WO 9712714A3
Authority
WO
WIPO (PCT)
Prior art keywords
infrared radiator
soldering
halogen infrared
components
quartz glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1996/001820
Other languages
German (de)
English (en)
Other versions
WO1997012714A2 (fr
Inventor
Ulrich Gerloff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hahn Meitner Institut fuer Kernforschung Berlin GmbH
Hahn Meitner Institut Berlin GmbH
Original Assignee
Hahn Meitner Institut fuer Kernforschung Berlin GmbH
Hahn Meitner Institut Berlin GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hahn Meitner Institut fuer Kernforschung Berlin GmbH, Hahn Meitner Institut Berlin GmbH filed Critical Hahn Meitner Institut fuer Kernforschung Berlin GmbH
Priority to EP96945466A priority Critical patent/EP0958089A2/fr
Publication of WO1997012714A2 publication Critical patent/WO1997012714A2/fr
Publication of WO1997012714A3 publication Critical patent/WO1997012714A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Ce dispositif de soudure et de dessoudure sélectives sans contact de composants sélectionnés est pourvu d'une tête de soudure et de positionnement de précision qui permet de traiter ultérieurement, d'équiper ou de réparer des cartes à haute densité de composants électroniques. La tête de soudure et de positionnement de précision comprend comme source de chaleur un émetteur infrarouge à halogène (HS) retenu dans un support (SH) qui permet de transmettre l'énergie de l'émetteur infrarouge à halogène (HS) à l'élément à souder ou à dessouder (BE), ainsi qu'un tube capillaire en verre quartzeux (QK) associé à des éléments de dépôt et d'enlèvement d'un composant sélectionné. La face frontale supérieure du tube capillaire en verre quartzeux (QZ) se situe dans le point focal de l'émetteur infrarouge à halogène (HS), à l'intérieur d'une enceinte fermée (K) pourvue d'un raccordement sous vide (VA). La surface supérieure de l'enceinte est constituée d'une plaque en verre quartzeux (QS) située à l'extérieur du point focal de l'émetteur infrarouge à halogène (HS). L'émetteur infrarouge à halogène (HS) est piloté par un élément thermique (TE) relié à un régulateur de la température (RT). Ce dispositif est utile pour traiter une grande diversité de composants et convient notamment comme outil manuel d'entretien et de réparation. Il peut être incorporé sous forme d'un agencement compact dans des appareils déjà connus sans grandes difficultés mécaniques.
PCT/DE1996/001820 1995-09-18 1996-09-18 Dispositif de soudure et de dessoudure selectives sans contact de composants Ceased WO1997012714A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP96945466A EP0958089A2 (fr) 1995-09-18 1996-09-18 Dispositif de soudure et de dessoudure selectives sans contact de composants

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19535858.9 1995-09-18
DE19535858 1995-09-18

Publications (2)

Publication Number Publication Date
WO1997012714A2 WO1997012714A2 (fr) 1997-04-10
WO1997012714A3 true WO1997012714A3 (fr) 1997-05-15

Family

ID=7773269

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001820 Ceased WO1997012714A2 (fr) 1995-09-18 1996-09-18 Dispositif de soudure et de dessoudure selectives sans contact de composants

Country Status (3)

Country Link
EP (1) EP0958089A2 (fr)
DE (1) DE19639993C2 (fr)
WO (1) WO1997012714A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3532925B2 (ja) * 1997-06-13 2004-05-31 ピーエーシー ティーイーシーエイチ−パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 欠陥のあるはんだ接合部を直す装置
DE19832887A1 (de) * 1998-07-22 2000-01-27 Innotronic Vertriebs Gmbh Verfahren und Vorrichtung zur Parametrierung einer Lötstation
DE19901623B4 (de) 1999-01-18 2007-08-23 Pac Tech-Packaging Technologies Gmbh Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate
DE19913813C2 (de) * 1999-03-26 2003-04-10 Atn Automatisierungstechnik Ni Vorrichtung zur berührungslosen, örtlich begrenzten Erwärmung von Material mit Hilfe von Strahlung
US6268991B1 (en) * 1999-06-25 2001-07-31 General Electric Company Method and arrangement for customizing electronic circuit interrupters
DE10146652A1 (de) * 2001-09-21 2003-04-10 Ikarus Solar Ag Verfahren zum Verbinden von Metallteilen
DE102005017839A1 (de) * 2005-04-18 2006-10-19 Martin Gmbh Verfahren zum Betrieb einer Unterheizung zur Erwärmung von Leiterplatten
DE202008017450U1 (de) * 2008-01-29 2009-12-17 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Folienanschluss
US10160053B1 (en) 2017-09-23 2018-12-25 John Jerome Kusnierek Cold gas blast jet for micro-electronic solder repair
US11996384B2 (en) * 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
EP0521178A1 (fr) * 1991-07-02 1993-01-07 Matsushita Electric Industrial Co., Ltd. Elément de chauffage par rayonnement lumineux

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
DE2735231A1 (de) * 1977-08-04 1979-02-15 Siemens Ag Verfahren und vorrichtung zur herstellung von loetverbindungen mittels energiestrahlung
JPS61140368A (ja) * 1984-12-14 1986-06-27 Japan Ranpu Kk 非接触型のハンダ付け加工装置
EP0309665B1 (fr) * 1987-08-31 1993-06-09 Siemens Aktiengesellschaft Tête de soudage pour le brasage et le débrasage de composants au moyen de gaz chaud, en particulier pour des composants pouvant être montés en surface (SMD)
DD286314A5 (de) * 1988-04-07 1991-01-24 Kombnat Veb Eaw Berlin-Treptow,Zft,De Vorrichtung zum loeten mit infrarotstrahlern
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US5060288A (en) * 1990-08-27 1991-10-22 Sierra Research And Technology, Inc. Infrared heater array for IC soldering
DE9113986U1 (de) * 1991-11-11 1992-04-16 Zevac Auslötsysteme GmbH, 3548 Arolsen Lötvorrichtung zum Ein- und Auslöten von elektrischen Bauelementen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
EP0521178A1 (fr) * 1991-07-02 1993-01-07 Matsushita Electric Industrial Co., Ltd. Elément de chauffage par rayonnement lumineux

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Sensor-based laser scanner links solder joint integrity to production line performance", DESIGN ENGINEERING, June 1987 (1987-06-01), LONDON ( GB ), pages 25, XP002028832 *

Also Published As

Publication number Publication date
DE19639993C2 (de) 2000-10-05
WO1997012714A2 (fr) 1997-04-10
DE19639993A1 (de) 1997-03-20
EP0958089A2 (fr) 1999-11-24

Similar Documents

Publication Publication Date Title
WO1997012714A3 (fr) Dispositif de soudure et de dessoudure selectives sans contact de composants
Lin et al. Study of fluxless soldering using formic acid vapor
DK0618035T3 (da) Lodde-/afloddeanordning, især til integrerede kredsløb
RU2095206C1 (ru) Способ пайки
WO2004003713A3 (fr) Unite de refroidissement de composant generateur de chaleur
NO20022132L (no) Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse
SE8305476D0 (sv) Sett och anordning for att astadkomma punktformig upphettning av en kropp, serskilt for att utfora hardlodning av guldslaglod
WO2005092051A3 (fr) Ensemble de corps noir et de bouchon d'objectif integre et procedes d'etalonnage de cameras infrarouge faisant intervenir cet ensemble
GB2099742B (en) Bonding metals to non-metals
CA1123920A (fr) Appareil de soudage au laser
WO2004073013A3 (fr) Composant electronique dote d'une puce a semi-conducteurs, notamment module de puissance haute frequence et procede de fabrication associe
US5669437A (en) High efficiency thermal interposer
CN101347055A (zh) 焊接安装结构及其制造方法以及制造装置、电子设备以及布线基板
JPH04296092A (ja) リフロー装置
US8076608B2 (en) Energy collection and power reduction in laser coupling process
JPH0677638A (ja) レーザー半田付け装置
CN106965039A (zh) 基于红外成像的切削温度检测装置
CN219425875U (zh) 一种led路灯生产用回流焊设备
US7993064B2 (en) Photonic power devices and methods of manufacturing the same
EP0065686A3 (fr) Module à dispositif de puissance
RU1818307C (ru) Способ художественной обработки изделий из стекла, преимущественно боросиликатного и хрустал
ATE511209T1 (de) Vorrichtung zum verlöten von kontakten auf halbleiterchips
JPS5464984A (en) Semiconductor laser device
JPS6482691A (en) Attachment of surface mounting component to printed board
JP2000353773A (ja) 冷却部品取付方法及びモジュール封止方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CZ HU JP PL

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

AK Designated states

Kind code of ref document: A3

Designated state(s): CZ HU JP PL

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1996945466

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1996945466

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1996945466

Country of ref document: EP