NO20022132L - Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse - Google Patents

Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse

Info

Publication number: NO20022132L
Authority: NO; Norway
Prior art keywords: component; solder material; providing; soldered connection; cooled
Prior art date: 1999-11-08

Application number

NO20022132A

Other languages

English (en)

Other versions

NO323074B1 (no

NO20022132D0 (no

Inventor

Stefan Weber

Alfred Kemper

Original Assignee

Ping Gmbh Vakuumtechnik

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-11-08

Filing date

2002-05-03

Publication date

2002-05-03

2002-05-03 Application filed by Ping Gmbh Vakuumtechnik filed Critical Ping Gmbh Vakuumtechnik

2002-05-03 Publication of NO20022132D0 publication Critical patent/NO20022132D0/no

2002-05-03 Publication of NO20022132L publication Critical patent/NO20022132L/no

2006-12-27 Publication of NO323074B1 publication Critical patent/NO323074B1/no

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Die Bonding (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Manufacturing Of Electrical Connectors (AREA)
Coating With Molten Metal (AREA)
Heat Treatment Of Articles (AREA)
Tunnel Furnaces (AREA)
Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

NO20022132A 1999-11-08 2002-05-03 Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse NO323074B1 (no)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19953654A DE19953654A1 (de)	1999-11-08	1999-11-08	Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
PCT/DE2000/003848 WO2001034334A1 (de)	1999-11-08	2000-11-02	Verfahren und vorrichtung zur herstellung einer lotverbindung

Publications (3)

Publication Number	Publication Date
NO20022132D0 NO20022132D0 (no)	2002-05-03
NO20022132L true NO20022132L (no)	2002-05-03
NO323074B1 NO323074B1 (no)	2006-12-27

Family

ID=7928273

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO20022132A NO323074B1 (no)	1999-11-08	2002-05-03	Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse

Country Status (19)

Country	Link
US (1)	US6796483B1 (no)
EP (1)	EP1233841B1 (no)
JP (1)	JP4727110B2 (no)
KR (1)	KR100645984B1 (no)
CN (1)	CN1275730C (no)
AT (1)	ATE297829T1 (no)
AU (1)	AU779191B2 (no)
CA (1)	CA2390498C (no)
CZ (1)	CZ302495B6 (no)
DE (2)	DE19953654A1 (no)
DK (1)	DK1233841T3 (no)
ES (1)	ES2243338T3 (no)
HU (1)	HU225907B1 (no)
IL (2)	IL149489A0 (no)
MX (1)	MXPA02004579A (no)
NO (1)	NO323074B1 (no)
PL (1)	PL194904B1 (no)
PT (1)	PT1233841E (no)
WO (1)	WO2001034334A1 (no)

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US7793819B2 (en)	2007-03-19	2010-09-14	Infineon Technologies Ag	Apparatus and method for connecting a component with a substrate
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DE102016103213A1 (de) *	2016-02-24	2017-08-24	Semikron Elektronik Gmbh & Co. Kg	Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes
CN107855623B (zh) *	2017-12-29	2023-07-18	山东才聚电子科技有限公司	一种真空焊接炉控制系统及其控制方法
CN109059543A (zh) *	2018-07-16	2018-12-21	苏州洛特兰新材料科技有限公司	一种用于陶瓷材料生产的工业窑炉
DE102019211212B4 (de)	2019-07-29	2025-03-27	Rehm Thermal Systems Gmbh	Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN113543514B (zh) *	2020-04-15	2022-09-23	昆山达菲乐电子产品有限公司	回焊炉
KR102572094B1 (ko) *	2020-05-15	2023-08-30	핑크 게엠베하 써모시스테메	전자 조립체들을 연결하기 위한 시스템
KR102704735B1 (ko) *	2022-05-09	2024-09-09	한국광기술원	레이저 진공용접 장치
KR102846885B1 (ko) *	2022-12-16	2025-08-21	삼보모터스주식회사	진공 브레이징 자동화 장치 및 방법
CN115922172B (zh) *	2023-03-14	2023-06-02	无锡昌鼎电子有限公司	一种在线式真空焊接炉组装设备及其组装方法
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CN117139941A (zh) *	2023-10-30	2023-12-01	北京中科同志科技股份有限公司	真空系统及其工作方法

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1999
- 1999-11-08 DE DE19953654A patent/DE19953654A1/de not_active Ceased
2000
- 2000-11-02 HU HU0203145A patent/HU225907B1/hu unknown
- 2000-11-02 MX MXPA02004579A patent/MXPA02004579A/es active IP Right Grant
- 2000-11-02 DE DE50010577T patent/DE50010577D1/de not_active Expired - Lifetime
- 2000-11-02 CA CA002390498A patent/CA2390498C/en not_active Expired - Lifetime
- 2000-11-02 PL PL355529A patent/PL194904B1/pl unknown
- 2000-11-02 AU AU25010/01A patent/AU779191B2/en not_active Ceased
- 2000-11-02 AT AT00988556T patent/ATE297829T1/de active
- 2000-11-02 DK DK00988556T patent/DK1233841T3/da active
- 2000-11-02 KR KR1020027005763A patent/KR100645984B1/ko not_active Expired - Fee Related
- 2000-11-02 US US10/129,575 patent/US6796483B1/en not_active Expired - Lifetime
- 2000-11-02 CN CNB008154392A patent/CN1275730C/zh not_active Expired - Lifetime
- 2000-11-02 WO PCT/DE2000/003848 patent/WO2001034334A1/de not_active Ceased
- 2000-11-02 ES ES00988556T patent/ES2243338T3/es not_active Expired - Lifetime
- 2000-11-02 EP EP00988556A patent/EP1233841B1/de not_active Expired - Lifetime
- 2000-11-02 PT PT00988556T patent/PT1233841E/pt unknown
- 2000-11-02 IL IL14948900A patent/IL149489A0/xx active IP Right Grant
- 2000-11-02 CZ CZ20021603A patent/CZ302495B6/cs not_active IP Right Cessation
- 2000-11-02 JP JP2001536316A patent/JP4727110B2/ja not_active Expired - Lifetime
2002
- 2002-05-03 NO NO20022132A patent/NO323074B1/no not_active IP Right Cessation
- 2002-05-06 IL IL149489A patent/IL149489A/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
CN1387468A (zh)	2002-12-25
WO2001034334A1 (de)	2001-05-17
CZ20021603A3 (cs)	2003-05-14
AU779191B2 (en)	2005-01-13
DE19953654A1 (de)	2001-05-23
PT1233841E (pt)	2005-09-30
JP2003517376A (ja)	2003-05-27
NO323074B1 (no)	2006-12-27
KR20020062935A (ko)	2002-07-31
HU225907B1 (en)	2007-12-28
CN1275730C (zh)	2006-09-20
EP1233841A1 (de)	2002-08-28
ES2243338T3 (es)	2005-12-01
US6796483B1 (en)	2004-09-28
DE50010577D1 (de)	2005-07-21
CA2390498A1 (en)	2001-05-17
CZ302495B6 (cs)	2011-06-15
PL194904B1 (pl)	2007-07-31
MXPA02004579A (es)	2004-09-10
PL355529A1 (en)	2004-05-04
JP4727110B2 (ja)	2011-07-20
NO20022132D0 (no)	2002-05-03
ATE297829T1 (de)	2005-07-15
AU2501001A (en)	2001-06-06
IL149489A (en)	2006-10-31
EP1233841B1 (de)	2005-06-15
IL149489A0 (en)	2002-11-10
DK1233841T3 (da)	2005-10-10
CA2390498C (en)	2009-06-30
HUP0203145A2 (en)	2002-12-28
KR100645984B1 (ko)	2006-11-13

Publication	Publication Date	Title
NO20022132L (no)	2002-05-03	Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse
MY150425A (en)	2014-01-15	Method and device for heat treatment, especially connection by soldering
TW357414B (en)	1999-05-01	Method and apparatus for heat-treating substrates
MY110743A (en)	1999-02-27	Method and apparatus for in forming pre-positioned solder bumps on a pad arrangement
KR950702089A (ko)	1995-05-17	개선된 고온 특성을 갖는 주석-비스무트 납땜 연결 및 그 형성 공정(tin-bismuth solder connection having improved high temperature properties, and process for forming same)
DE59711523D1 (de)	2004-05-27	Halbleiterkörper mit Lotmaterialschicht und Verfahren zum Auflöten des Halbleiterkörpers auf eine metallene Trägerplatte
WO2003012833A3 (en)	2004-03-04	Process and apparatus for mounting semiconductor components to substrates and parts therefor
SE9004081D0 (sv)	1990-12-20	Saett att tillverka vaermeoeverfoeringsorgan samt verktyg foer att genomfoera saettet
TW200514642A (en)	2005-05-01	Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps
GB2099742B (en)	1985-07-31	Bonding metals to non-metals
MY125967A (en)	2006-09-29	Apparatus, assembly and method for processing electronic components
ATE522307T1 (de)	2011-09-15	Verfahren zum laserlöten und zur temperaturüberwachung von halbleiterchips sowie nach diesem verfahren hergestellte chipkarte
ATE349290T1 (de)	2007-01-15	Lötverfahren und -vorrichtung zum schnellen kühlen
WO2003030246A3 (de)	2003-09-18	Vorrichtung zum verlöten von kontakten auf halbleiterchips
NO20031112L (no)	2003-09-15	Fremgangsmåte og anordning for bearbeidelse av en legeringssmelte for et stöpeforlöp
ATE158736T1 (de)	1997-10-15	Löten
DE10335111A1 (de)	2005-03-10	Montageverfahren für ein Halbleiterbauteil
JPH09181436A (ja)	1997-07-11	半田付け方法及び半田ごて
DE3767487D1 (de)	1991-02-21	Verfahren zum herstellen von silber/me0-kontaktplaettchen mit loet- oder schweissfaehiger unterseite.
SE0003297L (sv)	2002-03-19	Sätt och anordning för presshärdning
WO2002101828A3 (de)	2003-09-12	Verfahren zum umschmelzen von auf verbindungsstellen aufgebrachtem lotmaterial
TW359881B (en)	1999-06-01	Method of bonding component to substrate and its apparatus, method of bonding semiconductor chip to lead frame and its apparatus
JPH0239649Y2 (no)	1990-10-24
JPH01183885A (ja)	1989-07-21	電子部品のはんだ付け方法
ES2196950A1 (es)	2003-12-16	Metodo de solar.

Legal Events

Date	Code	Title	Description
2016-06-27	MM1K	Lapsed by not paying the annual fees