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WO1996008749A3 - Procede de production d'un composant tridimensionnel ou d'un groupe de composants - Google Patents

Procede de production d'un composant tridimensionnel ou d'un groupe de composants Download PDF

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Publication number
WO1996008749A3
WO1996008749A3 PCT/DE1995/001151 DE9501151W WO9608749A3 WO 1996008749 A3 WO1996008749 A3 WO 1996008749A3 DE 9501151 W DE9501151 W DE 9501151W WO 9608749 A3 WO9608749 A3 WO 9608749A3
Authority
WO
WIPO (PCT)
Prior art keywords
features
layers
galvanic
dimensional
production
Prior art date
Application number
PCT/DE1995/001151
Other languages
German (de)
English (en)
Other versions
WO1996008749A2 (fr
Inventor
Martina Rothe
Andreas Maciossek
Bernd Loechel
Original Assignee
Fraunhofer Ges Zur Foerderng D
Martina Rothe
Andreas Maciossek
Bernd Loechel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Zur Foerderng D, Martina Rothe, Andreas Maciossek, Bernd Loechel filed Critical Fraunhofer Ges Zur Foerderng D
Publication of WO1996008749A2 publication Critical patent/WO1996008749A2/fr
Publication of WO1996008749A3 publication Critical patent/WO1996008749A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

L'invention concerne un procédé de production d'un composant tridimensionnel ou d'un groupe de composants, notamment à la surface de puces de semi-conducteurs déjà fabriquées. La production de superstructures tridimensionnelles connues réalisées à la surface de puces est fondée sur la structuration de laques photosensibles et sur la modification galvanique subséquente de la forme desdites structures de laques. Les procédés connus font uniquement appel à des laques photosensibles et à des couches d'amorçage de galvanisation intermédiaires épaisses pour la réalisation des superstructures tridimensionnelles. La production de structures compliquées implique une plus grande complexité technique en raison de la faible stabilité des laques photosensibles. Pour la réalistion de superstructures tridimensionnelles, outre la déformation galvanique de laques photosensibles structurées par ex. par U.V. et pourvues de couches métalliques (16), ce procédé intègre également la modification de la forme à l'aide de couches métalliques auxiliaires (couches sacrificielles) (13) qui seront enlevées ultérieurement. Dans les superstructures multicouches, ces couches métalliques auxiliaires situées dans les couches de laques servent simultanément de couches d'amorçage d'action galvanique pour d'autres plans à structurer. Ce procédé de réalisation de superstructures tridimensionnelles s'utilise par exemple pour produire des bobines et des transformateurs à intégrer à la surface de puces, ce que l'état de la technique ne permettait pas jusqu'à maintenant.
PCT/DE1995/001151 1994-09-14 1995-08-23 Procede de production d'un composant tridimensionnel ou d'un groupe de composants WO1996008749A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4432725.0 1994-09-14
DE4432725A DE4432725C1 (de) 1994-09-14 1994-09-14 Verfahren zur Herstellung eines dreidimensionalen Bauteils oder einer Bauteilgruppe

Publications (2)

Publication Number Publication Date
WO1996008749A2 WO1996008749A2 (fr) 1996-03-21
WO1996008749A3 true WO1996008749A3 (fr) 1996-07-25

Family

ID=6528199

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1995/001151 WO1996008749A2 (fr) 1994-09-14 1995-08-23 Procede de production d'un composant tridimensionnel ou d'un groupe de composants

Country Status (2)

Country Link
DE (1) DE4432725C1 (fr)
WO (1) WO1996008749A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19523915A1 (de) * 1995-06-30 1997-01-02 Bosch Gmbh Robert Mikroventil und Verfahren zur Herstellung eines Mikroventils
ATE283542T1 (de) * 1999-04-14 2004-12-15 Takashi Nishi Mikrosolenoidspule und verfahren zu ihrer herstellung
US6625372B1 (en) * 1999-11-15 2003-09-23 Axsun Technologies, Inc. Mounting and alignment structures for optical components
DE19955975A1 (de) * 1999-11-19 2001-05-23 Inst Mikrotechnik Mainz Gmbh Lithographisches Verfahren zur Herstellung von Mikrobauteilen
US6763575B2 (en) * 2001-06-11 2004-07-20 Oak-Mitsui Inc. Printed circuit boards having integrated inductor cores
US6852454B2 (en) * 2002-06-18 2005-02-08 Freescale Semiconductor, Inc. Multi-tiered lithographic template and method of formation and use
DE10302771B4 (de) * 2003-01-24 2006-07-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. System und Verfahren zur Herstellung von Mikrobauteilen
WO2004080887A1 (fr) * 2003-03-07 2004-09-23 Massachusetts Institute Of Technology Microfabrication tridimensionnelle
DE102006058068B4 (de) 2006-12-07 2018-04-05 Infineon Technologies Ag Halbleiterbauelement mit Halbleiterchip und passivem Spulen-Bauelement sowie Verfahren zu dessen Herstellung
JP6302613B1 (ja) * 2017-03-01 2018-03-28 ナノコイル株式会社 ナノコイル型ｇｓｒセンサ素子の製造方法
US11532760B2 (en) 2017-05-22 2022-12-20 Howmedica Osteonics Corp. Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process
EP3597333A1 (fr) 2018-07-19 2020-01-22 Howmedica Osteonics Corporation Système et procédé d'analyses de profils et de localisation de faisceau d'électrons en cours de procédé

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258097A (en) * 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JURISCH R: "IDENTIFIKATION: KONTAKTLOS VIA HOCHFREQUENZ", ELEKTRONIK, vol. 42, no. 9, 4 May 1993 (1993-05-04), pages 86 - 90, 92, XP000362956 *

Also Published As

Publication number Publication date
WO1996008749A2 (fr) 1996-03-21
DE4432725C1 (de) 1996-01-11

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