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WO1994011917A1 - Filtre monolithique - Google Patents

Filtre monolithique Download PDF

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Publication number
WO1994011917A1
WO1994011917A1 PCT/JP1993/001688 JP9301688W WO9411917A1 WO 1994011917 A1 WO1994011917 A1 WO 1994011917A1 JP 9301688 W JP9301688 W JP 9301688W WO 9411917 A1 WO9411917 A1 WO 9411917A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
capacitor
filter
input
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1993/001688
Other languages
English (en)
Japanese (ja)
Inventor
Shinya Nakai
Hideaki Ninomiya
Hideaki Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33369092A external-priority patent/JPH06163322A/ja
Priority claimed from JP33959692A external-priority patent/JPH06164223A/ja
Priority claimed from JP35363192A external-priority patent/JPH06188609A/ja
Priority claimed from JP9889393A external-priority patent/JPH06296102A/ja
Application filed by TDK Corp filed Critical TDK Corp
Priority to DE4395836T priority Critical patent/DE4395836T1/de
Priority to DE4395836A priority patent/DE4395836C2/de
Publication of WO1994011917A1 publication Critical patent/WO1994011917A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters
    • H01P1/20345—Multilayer filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1775—Parallel LC in shunt or branch path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Definitions

  • the present invention relates to a high-frequency filter used in mobile communication devices such as a mobile phone and a cordless phone, wherein a dielectric such as ceramics is laminated, and a center conductor forming an inductor is provided between or on each of these layers.
  • the present invention relates to a multilayer filter provided with electrodes forming a capacitor.
  • An input / output capacitor is formed by the first electrode and the second electrode, and the end of the second electrode and the open end of the center conductor are connected by another side electrode different from the above, and the ceramic A resonance capacitor connected in parallel with the center conductor is formed by the second electrode and the shield electrode facing each other via the box.
  • the first electrode on the input terminal side and the electrode for the zero point forming capacitor face each other, and the first electrode on the output terminal side and the electrode for the zero point forming capacitor face each other, These constitute a zero point forming capacitor.
  • This zero point forming capacitor constitutes a kind of trap circuit provided at a predetermined frequency at the zero point (f ⁇ ) to suppress an interference signal of an adjacent channel or to suppress unnecessary radiation.
  • the entirety of the zero-point forming capacitor electrode is surrounded by ceramics.
  • the capacitance of the capacitor for forming a zero point varies, thereby causing a shift in the frequency of the zero point and a reduction in the level drop at the zero point, which may affect the characteristics of the multilayer bandpass filter. Rust occurs.
  • the main factors that can change the capacitance of the zero point forming capacitor are: the area where the zero point forming capacitor electrode and the first electrode face each other, the distance between these electrodes, and the dielectric constant of the ceramic.
  • the electrode for the zero-point forming capacitor is surrounded by ceramics, the electrode cannot be trimmed and faces the zero-point forming capacitor electrode among the first electrodes. Since the surface is also surrounded by ceramics, a necessary portion of the first electrode cannot be trimmed.
  • the area where the zero-point forming capacitor electrode and the first electrode face each other cannot be changed.
  • the capacity of the zero-point forming capacitor cannot be adjusted after firing the multilayer bandpass filter.
  • the adjustment of other built-in capacitors is the same as above.
  • the above-mentioned problem is a problem that also occurs in a multilayer filter other than the multilayer band-pass filter.
  • an input / output capacitor is formed by connecting an extension electrode to an input / output terminal, and the extension electrode and the capacitor electrode are opposed to each other via ceramics.
  • the capacitor electrode is connected to the capacitor electrode, a resonance capacitor is formed between the capacitor electrode and the ground electrode, and in the multilayer filter having the zero-point forming capacitor, after firing of the multilayer filter, the capacitor for the zero-point formation is formed.
  • the present invention provides a second aspect in which a first extension electrode and a second extension electrode are connected to the two input / output terminals, respectively, and each of the extension electrodes and the capacitor electrode face each other via a dielectric.
  • the first input / output capacitor and the second input / output capacitor are formed, the capacitor electrode is connected to the open end of the center conductor constituting the inductor, and a resonance capacitor is formed between the capacitor electrode and the ground electrode. It is an object of the present invention to provide a multilayer filter and a filter circuit that can form a zero point below and above a predetermined band in a multilayer filter having a capacitor for forming a zero point.
  • FIG. 22 is a diagram illustrating an example of a conventional multilayer bandpass filter.
  • FIG. 22 (1) is a longitudinal sectional view
  • FIG. 22 (2) is a right side view thereof.
  • FIG. 22 (1) is a view cut along the line II in FIG. 22 (2) and viewed from the direction of the arrow.
  • the solder is omitted.
  • the resonance circuit in the filter is composed of an intagter and a resonance capacitor
  • the center conductor 110 forms an inductor
  • the resonance capacitor electrode 1 2 0, ground electrode 1 2 1 and ceramics 1 3 0 form a resonance capacitor
  • open end 1 1 1 of center conductor 1 1 1 and electrode end 1 of resonance capacitor electrode 1 2 0 e Are connected by a connection surface electrode 140.
  • the connection surface electrode 140 is provided on the surface (the so-called side surface) 131 of the multilayer filter F103.
  • the short-circuit end 1 1 2 of the center conductor 1 1 0 and the ground electrode 1 2 1 are connected to the ground electrode 1 2 2 provided on the surface of the filter F 103, and the ground pattern is 15 1 is provided, and the ground electrode 122 and the ground pattern 15 1 are connected via solder.
  • several layers of thin green sheets (ceramics before firing) are laminated, and then a conductive paste for forming the center conductor 110 is printed, and the green paste is printed thereon.
  • the sheets are laminated, a conductive paste for forming the ground electrode 121 is printed, a green sheet is laminated thereon, and a conductive paste for forming the resonance capacitor electrode 120 is printed, and the green paste is printed thereon.
  • a conductor for forming the connection surface electrode 140 and the ground electrode 122 is formed. Transfer printing of conductive paste (silver paste).
  • connection surface electrode 140 When transferring and printing the conductive paste for the connection surface electrode 140, the filter F103 before transfer printing is transported, and on the other hand, a vertically grooved drum is prepared. The paste is poured, and the position of the front surface electrode 140 in the surface 13 1 of the filter F 103 before transfer printing is preliminarily positioned so as to face the groove, and transfer printing is performed.
  • the connection surface electrode 140 is transferred and printed from the top end to the bottom end 141 of the surface 131 of the filter F103.
  • FIG. 23 is a diagram showing an equivalent circuit in the above conventional example.
  • a resonance circuit is formed by the inductor L101 and the resonance capacitor C101, a resonance circuit is formed by the inductor L102 and the resonance capacitor C102, and the center conductor 110 is formed by the inductor L101.
  • 0 1 is formed
  • a resonance capacitor C 101 is formed by the resonance capacitor electrode 120, the ground electrode 122, and the ceramic 130
  • the Inktor L 102 and the resonance capacitor C 102 are also formed. It is formed as described above.
  • the structures relating to the input / output capacitors C 103 and C 104 are omitted.
  • the band pass filter F 103 is fixed to the mother board 150 via solder, but the connection surface electrode 140 is connected to the pattern of the mother board 150. Are not connected, and the lower end 14 1 of the connecting surface electrode 140 is floating from the pattern of the mother board 150.
  • the ground pattern 15 2 exists near the lower end 1 4 1 of the connection surface electrode 1 40, the gap between the lower end 1 4 1 of the connection surface electrode 1 4 0 and the ground pattern 1 5 2
  • the capacitors C 105 and C 106 shown in FIG. 23 are formed, and the resonance points (resonance frequencies) of the resonance circuit are changed by the capacitors C 105 and C 106.
  • the wiring pattern through which the signal passes is disposed near the lower end 141 of the electrode, unnecessary coupling occurs, which causes a problem that the operation of the entire system is disrupted.
  • a ground pattern or the like is located near the lower end 144 of the connection surface electrode 140. Since it is necessary to avoid arranging wiring patterns, there is a problem that circuit design is complicated. The above problem is also a problem that occurs in filters other than the bandpass filter.
  • an object of the present invention is to provide a stacked filter in which the operation of the entire system is not disturbed by the coupling.
  • Another object of the present invention is to provide a filter manufacturing method and a filter capable of making the plating film thickness almost uniform even if the area of the electrode to be plated is different.
  • the multilayer bandpass filter when focusing on the multilayer bandpass filter, has a plurality of resonance circuits each including an inductor formed by a center conductor and a resonance capacitor.
  • the narrow band of the band-pass filter is formed by the connected internal electrode, the internal ground electrode made of the internal layer, and the ceramics. The thickness of the ceramic provided between the conductor and the conductor may be reduced, or the spacing between the resonance circuits may be increased.
  • An object of the present invention is to provide a band control method capable of controlling the band of a multilayer band-pass filter without increasing loss and without increasing the overall shape of the multilayer band-pass filter. It is intended for.
  • the present invention relates to a plurality of series capacitors provided between a first extension electrode and a second extension electrode and connected in series with each other, a connection point between these series capacitors, and a center conductor.
  • a zero point forming capacitor is constituted by an intermediate capacitor connected to the open end of the capacitor.
  • FIG. 1 is a perspective view showing a laminated bandpass filter according to an embodiment of the present invention.
  • FIG. 2 is a vertical left side view of the section taken along line II-II in FIG. is there.
  • FIG. 3 is a plan view of each of the layers S0 to S4 when the above embodiment is divided into the layers S0 to S4.
  • FIG. 4 is a diagram showing an equivalent circuit of the above embodiment and its frequency characteristics.
  • FIG. 5 is an explanatory diagram for adjusting the capacitance of the zero point forming capacitor C0 in the above embodiment, and is a top view of the multilayer bandpass filter.
  • FIG. 6 is an explanatory diagram in the case where the capacitance of a capacitor other than the zero point forming capacitor C O is also adjusted in the above embodiment, and is a top view of the multilayer bandpass filter.
  • FIG. 7 is an explanatory diagram of a laminated bandpass filter F2 according to another embodiment of the present invention.
  • FIG. 8 is a diagram showing an equivalent circuit in another embodiment of the present invention.
  • FIG. 9 is a diagram illustrating an example of a case where the first-stage resonance circuit and the second-stage resonance circuit are capacitively coupled in the above embodiment.
  • FIG. 10 is a perspective view showing a laminated band-pass filter F4 according to another embodiment of the present invention, in which a closed point can be formed below and above a predetermined band, respectively.
  • FIG. 11 is a vertical left side view of the surface taken along the line XI-XI in FIG. 10 viewed from the direction of the arrow.
  • FIG. 12 is a plan view of each layer S 10 to S 15 in the case where the above embodiment is divided into each layer S 10 to S 15.
  • FIG. 13 is a diagram showing an equivalent circuit of the embodiment shown in FIGS. 10 to 12 and its frequency characteristics.
  • FIG. 14 is a plan view showing a state after the capacitance of each capacitor has been adjusted in the embodiment shown in FIGS.
  • FIG. 15 is a diagram showing a modification of the embodiment shown in FIGS.
  • FIG. 16 is a diagram showing a filter F6 which is another modification of the embodiment shown in FIGS.
  • FIG. 17 is a circuit diagram showing a modification of the equivalent circuit shown in FIG. 13 and its frequency characteristics.
  • FIG. 18 is a diagram showing a filter F7 corresponding to the circuit diagram shown in FIG.
  • FIG. 19 is a diagram showing another filter F8 corresponding to the circuit diagram shown in FIG.
  • FIG. 20 is an explanatory diagram of the first embodiment of the present invention in which the characteristics of the entire bandpass filter do not change when the mother board is mounted.
  • FIG. 21 is an explanatory diagram of the second embodiment of the present invention in which the characteristics of the entire bandpass filter do not change when the mother board is mounted.
  • FIG. 22 is an explanatory diagram of a conventional example.
  • FIG. 23 is a diagram showing an equivalent circuit in the above conventional example.
  • FIG. 24 is an explanatory diagram of a laminated band-pass filter F201, which is an embodiment of the present invention, capable of making the plating film thickness substantially uniform even when the area of the electrode to be plated is different.
  • FIG. 25 is a diagram showing an experimental example in the embodiment shown in FIG.
  • FIG. 26 is an explanatory view after trimming the thin line in the embodiment shown in FIG.
  • FIG. 27 is a perspective view showing another embodiment of the present invention in which the plated film thickness can be made substantially uniform even if the area of the electrode to be plated is different.
  • FIG. 28 is a plan view showing another embodiment of the present invention in which the plating film thickness can be made substantially uniform even if the area of the electrode to be plated is different, and is the same direction as FIG. 24 (1).
  • FIG. 28 is a plan view showing another embodiment of the present invention in which the plating film thickness can be made substantially uniform even if the area of the electrode to be plated is different, and is the same direction as FIG. 24 (1).
  • FIG. 29 is an explanatory diagram of the laminated filter F proposed by the present applicant.
  • FIG. 30 is a diagram showing an equivalent circuit of the multilayer filter F and its frequency characteristics.
  • FIG. 31 is an explanatory diagram showing a state of plating in the multilayer filter F.
  • FIG. 32 is an explanatory diagram of a multilayer bandpass filter F303 which is another embodiment of the present invention for controlling the bandwidth of the multilayer bandpass filter.
  • the layers S300, S301, S302b, It is a top view of each layer S300-S304 at the time of dividing into S303 and S304.
  • FIG. 33 (2) shows the change in the bandwidth ⁇ f when the ratio (dZd ⁇ ) of the non-slit length to the length of the internal ground electrode IG7 is changed in the multilayer bandpass filter F303.
  • FIG. 33 is a diagram showing a frequency characteristic of a band-pass filter showing an example
  • FIG. 33 (1) is a graph obtained by quantitatively plotting a relationship between (d / d Q ) and a bandwidth ⁇ .
  • FIG. 1 is a perspective view showing a multilayer bandpass filter F1 according to an embodiment of the present invention.
  • FIG. 2 is a vertical left side of a section taken along line II-II in FIG.
  • FIG. 3 is a plan view of each of the layers S0 to S4 when the above embodiment is divided into the layers S0 to S4.
  • the same members have the same reference characters allotted, and the same applies to FIG. 4 and subsequent drawings.
  • This embodiment is composed of four layers S1, S2, S3 and S4. In the manufacturing process, the first layer S1 is placed on the green sheet (ceramics before firing).
  • the conductive paste forming the center conductor 1 and the second center conductor L2 is printed, and a green sheet of the second layer S2 is laminated thereon, and a ground electrode G is formed on the green sheet. 2 is printed thereon, and a green sheet of the third layer S3 is laminated thereon, and the first capacitor electrode 20 and the second capacitor electrode are formed on the green sheet.
  • a conductive base for forming the electrode 30 and the capacity increasing electrode 50 is printed, and a green sheet of the fourth layer S4 is laminated thereon and fired. After the firing, a conductive paste for forming the first extension electrode 11, the second extension electrode 41, and the ground electrode G3 is printed on the upper surface of the fourth layer S4.
  • the opposing portion 11 e at the right end portion and in the drawing of the second extended electrode 41 1, the opposing portion 4 1 e at the left end portion are laminated.
  • the upper surface of the band-pass filter F 1 is closely opposed, and the opposed portion 11 e and the opposed portion 4 e face the capacitance increasing electrode 50.
  • a zero point forming capacitor C 0 is formed in the portion.
  • the capacitance increasing electrode 50 is provided at a position facing the opposing portion 11 e and the opposing portion 41 e with the ceramic therebetween.
  • the first extended electrode 11 and the duland electrode G 3 face the capacitor electrode 20 via ceramics, and the second extended electrode 41 and the ground electrode G 3 are electrically connected to the ceramic electrode. Opposing the capacitor electrode 30 via the box.
  • the first center conductor Ll and the second center conductor L2 constitute an inductor.
  • the multilayer band The first input / output electrode 10 connected to the extension electrode 11 and the second input / output electrode connected to the extension electrode 4 1 on the left, right, back, and bottom of the pass filter F1, respectively. 40, a ground electrode G, and a conductive base forming the ground electrode G1 are printed. On the front side of the multilayer bandpass filter F1, a conductive base forming a connection conductor 21 connecting the center conductor 1 and the capacitor electrode 20 is printed, and the center conductor L2 and the capacitor are formed. The conductive paste that forms the connection conductor 31 that connects to the connection electrode 30 is printed.
  • FIG. 4 is an equivalent circuit diagram in the above embodiment and a characteristic diagram of the bandpass filter in the above embodiment.
  • the opposing portion 11 e of the first extended electrode 11 and the opposing portion 41 e of the second extended electrode 41 face the capacitance increasing electrode 50, respectively.
  • a zero point forming capacitor C0 is formed.
  • a first input / output capacitor C 1 is formed by the first extension electrode 11, the first capacitor electrode 20, and the ceramic, and the second extension electrode 41 and the second capacitor
  • a second input / output capacitor C4 is formed by the electrode 30 and the ceramic.
  • first capacitor electrode 20 is connected to the first center conductor L1
  • first resonance capacitor C2 is connected between the first capacitor electrode 20 and the ground electrodes G2 and G3.
  • the second capacitor electrode 30 is connected to the second center conductor L2, and the second resonance between the second capacitor electrode 30 and the ground electrodes G2, G3. Capacitor C3 is formed.
  • FIG. 5 is an explanatory diagram in the case of adjusting the capacitance of the zero-point forming capacitor C O in the above embodiment, and is a top view of the multilayer bandpass filter F1.
  • the facing portion 11e of the first extended electrode 11 and the facing portion 41e of the second extended electrode 41 are separated from each other. Since it is exposed, it is easy to trim the opposing portions 11 e and 41 e. That is, the facing portion 11e is trimmed to provide a trimming portion T1, the facing portion 41e is trimmed to provide a trimming portion T2, or the trimming portions T1 and T1 are trimmed.
  • the part facing the electrode 50 is reduced, and the capacity of the zero point forming capacitor C 0 is reduced.Therefore, the capacity of the zero point forming capacitor C 0 must be adjusted. Can be. Trimming is performed by sand blast, laser beam, etc.
  • FIG. 6 is an explanatory diagram in the case where the capacitance of a capacitor other than the zero point forming capacitor C0 is also adjusted in the above embodiment, and is a top view of the filter F1.
  • the extension electrode 11 when the extension electrode 11 is trimmed to form a trimming portion T3, the capacitance of the input / output capacitor C1 can be reduced, and the capacitor electrode 20 is connected to the ground electrode G3.
  • the capacitance of the resonance capacitor C2 can be reduced.
  • the portion of the ground electrode G3 facing the capacitor electrode 30 to form a trimming portion T5
  • the capacitance of the resonance capacitor C3 can be reduced
  • the extension electrode 4 1 Is trimmed to form a trimming portion T6 the capacitance of the input / output capacitor C4 can be reduced.
  • the codes shown in brackets below the respective codes are the codes of the electrodes constituting the codes, and the codes with underlining are the electrodes of the electrodes to be trimmed when adjusting the capacitance. Sign.
  • the trimming parts T1, T2, T3, TR2, T5, and ⁇ 6 required for adjusting the capacitance of the capacitors CO, C1, C2, C3, and C4 are all laminated. Since it is located on the top surface of the bandpass filter F1, it is only necessary to control the sandblast nozzle in the X-axis and ⁇ -axis directions when adjusting the capacity of the five capacitors. Since there is no need to do this, the work of adjusting the capacity is easy.
  • the opposing portion 11 e of the first extended electrode 11 and the opposing portion 41 e of the second extended electrode 41 are close to each other on the upper surface of the multilayer bandpass filter F 1.
  • the opposing portions 11 e and 41 e may be close to each other on a surface other than the upper surface of the multilayer bandpass filter F 1, and the zero-point forming capacitor C 0 And the other electrodes C1 to C5 may be provided on different surfaces.
  • the opposing portions 11 e and 41 e face the capacitance increasing electrode 50 to form the zero point forming capacitor C 0, the opposing portions 11 e and 41 e correspond to each other. It is not necessary that the opposing portions 11 e and 41 e are in close proximity to each other as long as 41 e faces the capacitance increasing electrode 50.
  • ground electrode G3 is provided on the upper surface of the multilayer bandpass filter in each of the above embodiments, the ground electrode G3 may be omitted from the upper surface.
  • FIG. 7 is an explanatory diagram of a laminated bandpass filter F2 according to another embodiment of the present invention.
  • FIG. 7 is a plan view showing layers S0, S1, S2, S3a, S4, and S5 constituting the multilayer bandpass filter F2 in a divided manner.
  • the multilayer bandpass filter F2 is obtained by reversing the vertical relationship between the extension electrodes 11 and 41 and the capacitance increasing electrode in the multilayer bandpass filter F1.
  • the multilayer bandpass filter F2 is different from the multilayer bandpass filter F1 in that the third layer S3a is provided instead of the third layer S3, and the fifth layer S5 is newly provided. is there.
  • the third layer S3a is provided with capacitor electrodes 20 and 30 on the ceramic, and the fifth layer S5 is provided at a position facing the facing portions 11e and 41e. Capacity increase This is provided with an electrode 51 for use.
  • the capacitance of the zero point forming capacitor CO can be adjusted by reducing the area of the capacitance increasing electrode 51, and the capacitance increasing electrode 51 Since it is exposed to the bandpass filter F2, the capacity of the zero point forming capacitor C0 can be adjusted after firing the multilayer bandpass filter F2.
  • the first-stage resonance circuit is formed by the inductor formed by the center conductor L1 and the resonance capacitor C2, and the inductor formed by the center conductor L2 and the resonance capacitor C3 are formed by two.
  • the resonance circuit of the second stage is configured, that is, the band-pass filter is configured by the two-stage resonance circuit, but as shown in FIG. 8, the band-pass filter is configured by the single-stage resonance circuit. Is also good.
  • the embodiment shown in FIG. 8 is an example of a band-pass filter when the resonance circuit is configured in one stage.
  • the center conductor L 2 and the resonance capacitor C 3 are deleted from the circuit diagram shown in FIG. In the drawing of the capacitor C4, the left end is in contact with the right end of the drawing of the input / output capacitor C1.
  • the embodiment shown in FIG. 8 in which the capacitor electrodes 20 and 30 are connected in FIG. 3 and the center conductor L2 is deleted is shown in FIG.
  • the above-described embodiment may be applied to a bandpass filter configured by three or more resonance circuits.
  • the first-stage resonance circuit composed of the intagta constituted by the center conductor L1 and the resonance capacitor C2, and the inductor constituted by the center conductor L2 and the resonance capacitor C3
  • the second resonance circuit is inductively coupled to the second resonance circuit, but these may be capacitively coupled as shown in Fig. 9, or inductively coupled + capacitively coupled. You may do so.
  • the first and second extension electrodes have a capacitance increasing electrode opposed to the first and second extension electrodes via a dielectric, and the first and second extension electrodes have a capacitance increasing electrode.
  • a zero point forming capacitor is formed, and at least one of the first extended electrode, the second extended electrode, and the capacitance increasing electrode is provided on the surface of the multilayer filter. The capacity of the zero point forming capacitor can be adjusted.
  • the first-stage resonance circuit and the second-stage resonance circuit are capacitively coupled, and the fourth layer S4a is used instead of the fourth layer S4 shown in Fig. 3 (1).
  • a conductive paste for forming the coupling electrode 60 is printed so that it does not come into contact with other electrodes (extension electrodes 11 and 41, ground electrode G3), and in this case, the ceramics.
  • the coupling electrode 60 is printed so as to overlap with the capacitor electrodes 20 and 30 via.
  • the first-stage resonance circuit and the second-stage resonance circuit are capacitively coupled via the coupling electrode 60 and the ceramics.
  • the frequency characteristics of the band-pass filter obtained by the above embodiment are shown in Fig. 4 (2).
  • the zero point is formed at 1.4 GHz, and for reference, the band-pass filter characteristics before the zero point is formed. Is shown in Fig. 30 (2).
  • the band-pass filter has been described.
  • filters other than the open-pass filter such as a band-eliminate filter, a high-pass filter, a single-pass filter, and the like, can be similarly described.
  • FIG. 10 is another embodiment of the present invention, and is a perspective view showing a laminated band-pass filter F4 which can make an opening point below and above a predetermined band.
  • FIG. 11 is a vertical left side view of the surface taken along the line XI-XI in FIG. 10 viewed from the direction of the arrow.
  • FIG. 12 is a plan view of each of the layers S 11 to S 15 when the above embodiment is divided into the layers S 11 to S 15.
  • FIG. 13 is an equivalent circuit diagram of the above embodiment.
  • This embodiment is composed of five layers S11, S12, S13, S14, and SI5.
  • the green sheet (ceramics before firing) of the first layer S11 is formed.
  • a conductive paste for forming the first center conductor L1 and the second center conductor L2 is printed thereon, and a green sheet of the second layer S12 is laminated thereon.
  • a conductive paste for forming the ground electrode G2 is printed on the green sheet, and a green sheet of the third layer S13 is laminated on the conductive paste.
  • the conductive base for forming the capacitor electrode 20 and the second capacitor electrode 30 is printed, and the fourth layer S14 green sheet is laminated thereon, and the green sheet is formed on the green sheet.
  • a conductive paste for forming the zero point forming electrode 70 is printed, and a fifth layer S15 green sheet is laminated thereon and fired. After this firing, a conductive paste for forming the first extension electrode 11a, the second extension electrode 41a, and the ground electrode G3 is printed on the upper surface of the fifth layer S15. A conductive paste for forming the ground electrode G1 is printed on the lower surface (S10) of S11.
  • the zero point forming electrode 70 is an electrode that forms a plurality of series capacitors between the first extended electrode 11a and the second extended electrode 41a via a dielectric material.
  • the zero-point forming electrode 70 faces the first extended electrode 11a, the second extended electrode 41a, and the capacitor electrodes 20 and 30, respectively.
  • a zero-point forming capacitor is formed by facing these electrodes 11a, 41a, 20 and 30.
  • the connecting conductor 21 extends toward the upper surface, further extends to a part of the upper surface, and this portion is referred to as an extension electrode 22.
  • the conductive paste to be formed is printed, and similarly, the connecting conductor 31 extends toward the upper surface, further extends to a part of the upper surface, and this portion is called an extension electrode 32, and the extension electrode 3
  • the conductive paste forming 2 is printed. Also, a part of the first extended electrode 11a and a part of the second extended electrode 41a face the zero point forming electrode 70, respectively, and a part of the extended electrode 22 and the extended electrode 3 A part of 2 faces the zero-point forming electrode 70.
  • FIG. 13 (1) is an equivalent circuit diagram of the embodiment shown in FIGS. 10 to 12, and FIG. 13 (2) is a frequency characteristic diagram thereof.
  • a first input / output capacitor C1 is formed by a first extension electrode 11a, a first capacitor electrode 20 and a ceramic, and a second input / output capacitor C1 is provided.
  • 4 is formed by the second extension electrode 41a, the second capacitor electrode 30 and the ceramic, and the first resonance capacitor C2 is formed by the first capacitor electrode 20 And ground electrode G2, G3 and ceramics
  • the second resonance capacitor C3 is formed between the second capacitor electrode 30 and the ground electrodes G2 and G3.
  • the series capacitor C5 is formed by the first extension electrode 11a, the zero point forming electrode 70, and the ceramic, and the series capacitor C6 is formed by the second extension electrode 41.
  • the intermediate coupling capacitor C7 is composed of a capacitor electrode 20, an extension electrode 22, a zero-point forming electrode 70, and a ceramic.
  • the intermediate coupling capacitor C8 is formed by the capacitor electrode 30, the extension electrode 32, the zero point forming electrode 70, and the ceramic. Note that one of the intermediate coupling capacitors C7 and C8 may be deleted.
  • the series capacitors C5 and C6 and the intermediate coupling capacitors C7 and C8 form a zero point forming capacitor.
  • the zero point forming capacitors have zero points below and above a predetermined frequency band. At this zero point, interfering signals on adjacent channels are suppressed or unwanted radiation is suppressed.
  • Fig. 13 (2) The frequency characteristics of the bandpass filter obtained by the equivalent circuit shown in Fig. 13 (1) are shown in Fig. 13 (2), where the zero point is formed at 1.4 GHz and 2.2 GHz. ing.
  • FIG. 14 is a plan view showing a state after the capacitance of each capacitor has been adjusted in the embodiment shown in FIGS.
  • the first extension electrode 11a, the second extension electrode 41a, and the electrodes forming the resonance capacitors C2 and C3 are provided on the same surface. Is placed.
  • the capacitance of the first input / output capacitor C1 can be reduced.
  • the capacitance of the resonance capacitor C2 can be reduced.
  • Part of ground electrode G 3 facing capacitor electrode 30 T 5 By trimming, the capacitance of the resonance capacitor C 3 can be reduced, and by trimming the portion T 6 of the second extended electrode 41 a facing the capacitor electrode 30, The capacity of the second input / output capacitor C4 can be reduced.
  • the capacity of the series capacitor C5 can be reduced.
  • the capacitance of the series capacitor C6 can be reduced.
  • the capacity of the intermediate coupling capacitor C 7 can be reduced.
  • the capacitance of the intermediate coupling capacitor C 8 can be reduced by trimming the portion T 10 facing the zero-point forming electrode 70 with o.
  • FIG. 15 is a diagram showing a modification of the embodiment shown in FIGS.
  • the filter F5 of this modified example has a conductive paste corresponding to the zero-point forming electrode 70 in the fourth layer S14a, as compared with the filter F4 shown in FIGS. Is not printed on the same surface of the extension electrodes 11a and 41a on the fifth layer S15a, and the zero point is located between the extension electrodes 11a and 41a.
  • the difference is that a forming electrode 71 is provided.
  • the zero-point forming electrode 71 has the same basic function as the zero-point forming electrode 70, and the series capacitors C5, C 6 and the intermediate coupling capacitors C 7 and C 8 are formed by facing the capacitor electrodes 20 and 30, respectively.
  • the zero-point forming electrodes 70 and 71 are replaced with the capacitor-forming electrodes 20 and 30 on the same surface. It is conceivable to provide a zero-point forming electrode between 20 and 30. When this is embodied, it becomes the same as the embodiment of FIG. That is, assuming that the capacitance increasing electrode 50 in FIG. 3 is a zero point forming electrode, two zero points can be provided as in the embodiment shown in FIGS. That is, the capacitance adding electrode 50 as the zero point forming electrode is opposed to the extension electrodes 11a and 41a, so that the series connection is possible. The capacitors C5 and C6 are formed, and the intermediate coupling capacitors C7 and C8 are formed by opposing the capacitor electrodes 20 and 30.
  • FIG. 16 is a diagram showing a filter F6 which is another modification of the embodiment shown in FIGS.
  • the filter F 6 is obtained by removing the extension electrodes 22 and 32 from the filter F 4 shown in FIG. 10. Even in this case, two zero points can be created.
  • two series capacitors are provided between the first input / output terminal 10 and the second input / output terminal 40, but three or more series capacitors are provided. You may.
  • FIG. 17 (1) is a diagram showing a modification of the equivalent circuit shown in FIG. 13, and FIG. 17 (2) is a frequency characteristic diagram thereof.
  • a capacitor C5a is provided instead of the series capacitors C5 and C6 in Fig. 17, and capacitors C7a and C8a are provided instead of the intermediate coupling capacitors C7 and C8. It is.
  • the capacitor C7a is provided between the input terminal IN and the second center conductor L2, and the capacitor C8a is provided between the output terminal OUT and the first center conductor L1. I have.
  • FIG. 18 is a diagram illustrating a multilayer bandpass filter F7 corresponding to the circuit diagram of FIG.
  • FIG. 18 shows a state after the electrodes are provided on the ceramics and then trimming is performed for the sake of convenience, and the trimming portions T3 to T6 are the same as those shown in FIG. It is similar.
  • the filter F7 is the same as the filter F7 shown in FIG. 15 from the 0th layer to the 3rd layer, and the fourth layer S14a has an extension electrode 11 as shown in FIG. b and 4 1 b Is provided.
  • the extension electrode 11b is opposed to the capacitor electrode 20 via ceramics, is further extended, and is also opposed to the capacitor electrode 30 via ceramics.
  • the extension electrode 41b is opposed to the capacitor electrode 30 via the ceramics, is further extended, and is also opposed to the capacitor electrode 20 via the ceramics.
  • a capacitor C5a is formed by the extension electrodes 11b and 41b facing each other, and the capacitance of the capacitor C5a is reduced by trimming the trimming portion C5a. Can be.
  • Capacitor C 7 a is formed by the opposing portion of extension electrode 11 b and capacitor electrode 30, and by trimming trimming portion T 7 a, the capacity of capacitor C 7 a can be reduced.
  • Capacitor C 8 a is formed by the portion of extension electrode 4 1 b facing capacitor electrode 20, and the capacitance of capacitor C 8 a can be reduced by trimming trimming portion T 8 a. .
  • the capacitors C5a, C7a, and C8a form a zero-point forming capacitor.
  • FIG. 19 is a diagram showing another laminated bandpass filter F8 corresponding to the circuit diagram of FIG. However, in FIG. 19, the capacitor C8a is present, but the capacitor C7a is omitted.
  • the filter F8 is the same as that shown in FIG. 15 from the 0th layer to the 2nd layer, but the projection 21 is provided on the capacitor electrode 20 in the third layer S13c. ing.
  • an electrode 80 is provided on the extension electrodes 11 c and 41 c and the protrusion 21, and the extension electrodes 11 c and 41 c, the protrusion 21 and the electrode 8 are provided.
  • an insulating layer (not shown) is provided between 0 and 0, an insulating layer (not shown) is provided.
  • FIG. 19 shows a state in which electrodes and the like are provided on the ceramics and then trimming is performed for convenience of explanation, and the trimming portions T3 to T6 are the same as those shown in FIG. Is similar to
  • a capacitor C5a is formed by the extension electrodes 11c and 41c facing the electrode 80 via the insulating layer, and the trimming portion T5a is trimmed. The capacitance of the capacitor C5a can be reduced.
  • the capacitor C 8 a is formed by the protrusion 22 facing the electrode 80 via the insulating layer, and trimming is performed. By trimming the section T8a, the capacitance of the capacitor C8a can be reduced.
  • the capacitors C5a and C8a form a zero point forming capacitor.
  • a plurality of series capacitors provided between the first extension electrode and the second extension electrode and connected in series with each other, and a connection point between these series capacitors Since a zero-point forming capacitor is formed by the intermediate coupling capacitor and the like connected between and the open end of the center conductor, zero points can be formed below and above a predetermined band.
  • FIG. 20 is an explanatory diagram of the first embodiment of the present invention in which the characteristics of the entire band-pass filter do not change when the mother board is mounted.
  • FIG. 20 (1) is a longitudinal sectional view of FIG. 2) is a right side view thereof, that is, FIG. 20 (1) is a view cut along the line I-I of FIG. 20 (2) and viewed from the direction of the arrow.
  • the solder is omitted.
  • the same members as those used in the conventional example shown in FIG. 26 are denoted by the same reference numerals. The same applies to other embodiments.
  • FIG. 20 the same members as those used in the conventional example shown in FIG. 26 are denoted by the same reference numerals. The same applies to other embodiments.
  • FIG. 20 is a longitudinal sectional view of FIG. 2 is a right side view thereof, that is, FIG. 20 (1) is a view cut along the line I-I of FIG. 20 (2) and viewed from the direction of the arrow.
  • the solder is omitted.
  • the resonance circuit in the multilayer bandpass filter F 101 is composed of an integrator and a resonance capacitor, and the center conductor 110 forms an inductor, and The electrode 12 0, the ground electrode 12 1, and the ceramics 13 30 form a resonance capacitor, and the open end 1 1 1 of the center conductor 1 10 and the electrode end 1 2 of the resonance capacitor electrode 1 2 0 0 e is connected by the connection surface electrode 160.
  • the connection surface electrode 160 is provided on the surface 13 1 (so-called side surface) of the multilayer filter F 101.
  • connection surface electrode 160 is provided only in a portion connecting the open end 111 of the center conductor 110 and the electrode end 120 e of the resonance capacitor electrode 120,
  • the connection surface electrode 16 0 is not provided in the lower region 1 6 0 d which is the region opposite to the resonance capacitor electrode 1 2 0 when viewed from the open end 1 1 1 of the center conductor 1 1 0, and , The area on the opposite side of the open end 1 1 1 of the center conductor 110 from the resonance capacitor electrode 120
  • the connection surface electrode 160 is not provided in the upper region 160 u which is the region. That is, the connection surface electrode 160 is cut between the lower region 160 d and the upper region 160 u.
  • the multilayer filter F101 when the multilayer filter F101 is mounted on the motherboard 150, even if the ground pattern 152 is provided under the connection surface electrode 160. Since the lower region 160 d where the electrode 160 does not exist is large, the capacitance formed between the connecting surface electrode 160 and the ground pattern 152 is so small that it can be neglected.
  • the pattern of the motherboard 150 does not affect the characteristics of the entire bandpass filter. Also, even if a wiring pattern through which a signal passes is provided instead of the ground pattern 152, unnecessary coupling does not occur between the wiring pattern and the wiring pattern. Does not go out of order. Therefore, the limitation in mounting the multilayer filter F101 on the motherboard 150 is greatly reduced.
  • the connection surface electrode 16 When the multilayer filter F101 is mounted upside down on the mother board 150, the upper region 160u where the electrode 160 does not exist is large, so the connection surface electrode 16 When the multilayer filter F101 is mounted on the motherboard 150, the capacitance of the capacitor formed between 0 and the ground pattern 1502 is negligibly small. The pattern of 0 does not affect the characteristics of the entire bandpass filter.
  • the steps up to sintering are the same as in the conventional example, and the green sheet, the conductive paste for forming the center conductor 110, the green sheet, and the ground electrode 121 are used.
  • a conductive paste to be formed, a green sheet, a conductive paste for forming the resonance capacitor electrode 120, and a green sheet are laminated in this order, and are fired.
  • a conductive paste (silver paste) for forming the connection surface electrode 160 is transferred and printed, leaving the lower region 160 d and the upper region 160 u.
  • FIG. 9 is an explanatory diagram of a second embodiment of the present invention in which the characteristics of the entire bandpass filter do not change when a mother board is mounted.
  • the first embodiment shown in FIG. 20 is for a resonance capacitor as viewed from the open end of the center conductor on the surface of the multilayer filter provided with the connection surface electrode.
  • the second embodiment shown in FIG. In this example, the surface electrode for connection is cut in a region opposite to the electrode for the resonance capacitor as viewed from above.
  • connection surface electrode In the embodiments shown in FIGS. 20 and 21, respectively, from the open end of the center conductor or the electrode for the resonance capacitor to the end of the surface 13 1 on which the connection surface electrode is provided, the connection surface electrode The connection surface electrode is pressed so that it extends and ends in the middle.
  • a wiring pattern such as a ground pattern is disposed below the connection surface electrode. Even if the capacitance of the capacitor formed between the surface electrode for connection and the wiring pattern such as the ground pattern is so small that it can be ignored, the wiring of the mother board can be reduced when the multilayer filter is mounted on the mother board.
  • the pattern does not affect the resonance point of the resonance circuit, and unnecessary coupling does not disrupt the operation of the entire system, greatly reducing restrictions when mounting a multilayer filter on a motherboard. Is done.
  • FIG. 29 is an explanatory diagram of the multilayer filter F proposed by the present applicant.
  • This filter F is easy to adjust the capacitance and adjusts the capacitance of the capacitor.
  • the automatic adjuster can be simplified.
  • FIG. 29 (1) is a perspective view of the filter F
  • FIG. 29 (2) is a plan view thereof
  • FIG. 30 (1) is an equivalent circuit diagram thereof
  • FIG. 0 (2) is a characteristic diagram of the bandpass filter by the equivalent circuit.
  • an input terminal C is formed by connecting an extension electrode 211 to an input terminal 210 and facing the extension electrode 211 and a capacitor electrode 220 via a ceramic S.
  • the capacitor electrode 220 is formed, the capacitor electrode 220 is connected to the open end of the center conductor L201, and the resonance capacitor C203 is connected between the capacitor electrode 220 and the ground electrode G203.
  • the electrode 2 11 forming the input capacitor C 201 and the electrode G 203 forming the resonance capacitor C 202 are formed on the same surface. Is what it is.
  • the configuration of the output side is also the same as that of the input side described above.
  • An extension electrode 241 is connected to the output terminal 240, and the extension electrode 241 and the capacitor electrode 230 are connected via the ceramics S.
  • the output capacitor C204 is formed by facing the capacitor electrode 230, the capacitor electrode 230 is connected to the open end of the center conductor L202, and the capacitor electrode 230 and the ground electrode G203 are connected.
  • the resonance capacitor C 203 is formed between the electrodes 241 forming the output capacitor C 204 and the electrode G 203 forming the resonance capacitor C 203, It is formed on the same surface.
  • the electrodes 2 11 1 and 2 4 1 forming the input / output capacitors C 201 and C 204 and the electrodes G 203 forming the resonance capacitors C 202 and C 203 Are formed on the same surface, when adjusting both the capacitance of the resonance capacitors C202 and C203 and the capacitance of the input and output capacitors C201 and C204, the It is sufficient to control the nozzle and the like only in the X-axis and Y-axis directions, and the capacity adjustment work is easy, and the automatic adjusting machine for adjusting the capacity of the capacitor can be simplified.
  • the input electrode 210, the output electrode 240, and the ground electrode G202 (connected to the ground electrode G203) basically use a paste made of silver / palladium as a ceramic.
  • FIG. 31 is an explanatory diagram showing the state of plating in the background art shown in FIG. 29, and the film thickness due to the plating is enlarged.
  • the silver-palladium film 2 1 1a, the copper film 2 1 1b, the nickel film 2 1 1c, and the tin film 2 1 1d form the extension electrode 2 1 1 and the silver-palladium film 2 4 1a, Copper film 2 4 1b, nickel film 2 4 1c, tin film 2 4 1d form extension electrode 241, silver / palladium film 2 10a, copper film 2 10b, nickel film 2 1 0 c and the tin film 210 d form the input terminal 210.
  • One electrode and the steel ball are stochastically in constant contact with each other, and the time for which the steel ball contacts the electrode of the filter F is longer as the area of the electrode is larger and shorter as the area of the electrode is smaller.
  • the thickness of the plating increases in proportion to the energizing time. Therefore, the larger the electrode area of the filter F is, the thicker the electrode is, and the smaller the electrode area is, the thinner the electrode becomes.
  • the plating time is set in accordance with the plating film thickness in the portion where the electrode area is small, the plating film thickness in the portion where the electrode area is large is too thick, and the plating film that is too thick is adjacent to this.
  • the stress between the film and the film is too strong, and the film is too thick (nickel film or tin film)
  • the plating time is set in accordance with the plating film thickness in the part where the electrode area is large, the plating film thickness in the part where the electrode area is small is too thin, and when the nickel film is too thin, the solder heat resistance becomes poor. If the silver / palladium film is peeled off from the ceramic S and the tin film is too thin, the solderability will be reduced and the solder will not be easily attached.
  • the problem that the plating film thickness is not uniform occurs not only in the multilayer bandpass filter but also in other multilayer filters, and similarly in filters other than the multilayer filter. This is a problem that arises.
  • FIG. 24 is an explanatory diagram of a laminated band-pass filter F 201 which is an embodiment of the present invention capable of making the plating film thickness substantially uniform even when the area of the electrode to be plated is different.
  • FIG. 24 (1) is a perspective view showing the filter F201
  • FIG. 24 (2) is a plan view thereof.
  • the laminated bandpass filter F201 is printed on a green sheet (ceramics before firing) with a conductive paste for forming the center conductors L201 and L202.
  • a green sheet, a conductive paste for forming capacitor electrodes 220 and 230, and a green sheet are sequentially laminated and fired, and the surface of the ceramics S constituting the filter F201 is formed on the surface.
  • Each electrode is printed by transfer or the like and baked. That is, on the surface of the ceramic S, the input terminal 210, the extension electrode 211 connected to the input terminal 210, the connecting conductors 221, 231, the output terminal 240, the output terminal 2
  • the extension electrodes 241, the ground electrodes G201, G202, G203 connected to 40 are printed and fired.
  • Each electrode is formed by printing a paste made of silver and palladium on the surface of the ceramic S with a thickness of about 10 zm.
  • a conductive thin wire 251 which connects the extension electrodes 21 1 and 241 in a DC manner, an extension electrode 211, and a ground electrode G203 And a conductive thin wire 252 for direct current connection.
  • the conductive paste for forming the extension electrodes 211, 241, and the ground electrode G203 is printed, and at the same time, the conductive paste for forming the fine wires 251.252 is printed. I am trying to do it. Then, using the same electrical plating as described in the background art, the copper plating and the nickel plating are applied to the electrodes 210, 211, 240, 241, G201, G202, and G203 made of silver palladium. Do tin plating.
  • a copper film 210b, a nickel film 211c, and a tin film 210d are formed on the silver / palladium film 210a corresponding to the input terminal 210.
  • a copper film, a nickel film, and a tin film are sequentially formed on the extension electrodes 211, the extension electrodes 241, the output terminals 240, and the ground electrodes G201, G202, and G203.
  • the electrodes 210, 211, 240, 241, G201, G202, and G203 conduct DC through thin wires 251 and 252.
  • the plating is performed uniformly on all parts of each electrode 210, 211, 240, 241, G201, G202, and G203. Copper, nickel, and tin films are formed uniformly.
  • FIG. 25 is a diagram showing an experimental example in the embodiment shown in FIG.
  • the input terminal 210 constituting the input terminal and the extension electrode 211 have the same potential and constitute the output terminal.
  • the output terminal 240 and the extension electrode have the same potential, and the ground electrodes G201, G202, and G203 forming the ground electrode portion have the same potential.
  • the area of the ground electrode is about eight times the area of the input and output terminals, and the thin wires 25 1, 252
  • the thickness of the tin film in the input terminal portion and the output terminal portion and the thickness of the tin film in the ground electrode portion are different by about 5 times.
  • the difference between the thickness of the tin film in the input terminal portion and the output terminal portion and the thickness of the tin film in the ground electrode portion is compressed to about 10%. You. In other words, when the thin wires 251 and 252 are used, the film thickness due to the plating becomes substantially uniform even if the areas of the electrodes to be plated differ greatly.
  • FIG. 26 is a view showing an example after trimming the thin wires 251, 252 in the above embodiment, and after the trimming, traces of the fine wires 25 1 t and 25 2 t remain. I have.
  • the extension electrode 211, the extension electrode 241, and the ground electrode G203 are electrically independent from each other, so that the performance as a filter is improved. Does not impair.
  • another conductive thick film may be used.
  • the nickel film by electric plating other materials for improving the solder heat resistance.
  • another substance such as a solder film (tin-lead film) that improves solderability is formed by electric plating. You may do so. That is, in the embodiment shown in FIG. 24, a plurality of conductive thick films which are electrically independent from each other are printed on the surface of the dielectric material constituting the filter, and the conductive thick films are connected in a DC manner.
  • This method prints lines, attaches a substance that improves solder heat resistance or solderability to the conductive thick film by electric plating, and trims the conductive lines.
  • a conductive thin wire 251 which connects the extension electrodes 21 1 and 24 1 in a DC manner, an extension electrode 21 1 and a ground electrode G 203 Are printed simultaneously with the printing of the extension electrode and the ground electrode G 203, but instead of the extension electrode and the ground electrode G 2 After printing the conductive paste for 03, the conductive paste for the fine lines 251, 252 may be printed.
  • a thick conductive wire may be used, and the electrodes may be connected in a DC manner with a conductive material having a shape other than the wire. Further, other than sandblasting, the thin wires 251, 252 may be trimmed by other means such as a laser beam.
  • FIG. 7 is a perspective view showing another embodiment of the present invention that can be performed.
  • the conductive line that connects the conductive thick films in a DC manner may be a line that connects the conductive thick films other than those described above, and the position where the conductive line is provided is the filter F 20. 1, top, side, or bottom. That is, as shown in FIG. 27, a thin wire 2 53 connecting the extension electrode 2 41 and the ground electrode G 203 and a thin wire 2 connecting the input terminal 210 and the ground electrode G 202 are formed.
  • Fine wire 2 5 connecting input terminal 2 1 0 and connecting conductor 2 2 1
  • Fine wire 2 5 connecting connecting conductor 2 2 1 to extension electrode 2 1 1, Connecting conductor 2 3
  • the conductive line may be provided on any surface of the filter F201, but it is sufficient that one conductive thick film is connected by at least one conductive line.
  • FIG. 28 is a plan view showing another embodiment of the present invention in which the plating film thickness can be made substantially uniform even if the area of the electrode to be plated is different, and is the same direction as FIG. 24 (2).
  • FIG. 28 is a plan view showing another embodiment of the present invention in which the plating film thickness can be made substantially uniform even if the area of the electrode to be plated is different, and is the same direction as FIG. 24 (2).
  • FIG. 28 (1) shows that a conductive thick film 260 is printed on the surface of ceramics S as a dielectric material constituting the filter F201, and a substance that improves the solder heat resistance or solderability is used as the material.
  • FIG. 28 is a diagram showing a state after the conductive thick film 260 is attached to the conductive thick film 260 by means of plating.
  • FIG. 288 (2) shows that one conductive thick film 260 is then turned into three conductive thick films. It is a figure showing the state after division.
  • the conductive thick film 260 is trimmed for the regions 261, 262, and 263 using a laser beam, sand blast, or the like, and this trimming results in one conductive thick film 26 Divide 0 into three conductive thick films. These three divided conductive thick films form the extended electrode and the ground electrode G 203 of the filter F 201 shown in FIG. Note that one conductive thick film 260 may be divided into two or four or more conductive thick films.
  • FIG. 32 is an explanatory diagram of a multilayer bandpass filter F303, which is another embodiment of the present invention for controlling the bandwidth of the multilayer bandpass filter.
  • the respective layers S300, S300 are shown in FIG. It is a top view of each layer S300-S304 in the case of dividing into 1, S302b, S303, and S304.
  • each layer S 300, S 301, S 303, and S 304 is the same as the laminated type N-pass filter F 301, but instead of the second layer S 302 in the laminated band-pass filter F 301. Is provided with a second layer S 302 b.
  • a slit 371 is provided at the center of the internal ground electrode IG7 (the portion of the internal ground electrode IG7 not facing the center conductors L301 and L302).
  • the length of the central portion of the internal ground electrode IG7 and the length in the same direction as the longitudinal direction of the central conductors L301 and L302 are set to, and the length of the slit 371 is subtracted from the length do.
  • the ratio (dZdj)) increases when the ratio (dZdjj) of the non-slit length to the length of the internal duland electrode IG7 is changed to 0 to 1 (slit 371 becomes (Shorter), the bandwidth increases, and as the ratio (dZd Q ) decreases (slit 371 increases), the bandwidth decreases.
  • FIG. 33 (1) shows an example of a change in the bandwidth ⁇ when the ratio (dZdo) of the non-slit length to the length of the internal ground electrode IG7 is changed in the multilayer bandpass filter F303. It is a graph shown.
  • Fig. 33 (2) defines the bandwidth of the frequency at the point ((G-3) dB) where the gain attenuates by 3 dB from the gain GdB at the center frequency in the frequency characteristic diagram, and defines (dZdo) as 6 is a graph showing a state where the bandwidth ⁇ decreases when the value is changed from 1 to 0.
  • the loss does not increase, and the overall shape of the multilayer bandpass filter F303 does not increase, so that only the band of the multilayer bandpass filter F303 is used. Can be controlled. Providing products with different bandwidths in this way can sufficiently respond to user requests.
  • one internal ground electrode is formed.
  • a plurality of internal ground electrodes may be provided.
  • capacitor electrodes 320 and 330 are further provided between the internal ground electrodes.
  • the capacitor electrode 320, Although 330 is provided, another internal ground electrode may be provided on these capacitor electrodes 320 and 330, and another capacitor electrode may be provided thereon.
  • the capacitor electrodes 320 and 330 are provided on the internal ground electrode IG7, but another capacitor electrode is provided below the internal ground electrode IG7. Below this, another internal ground electrode may be provided.
  • slits are provided on internal ground electrodes other than the internal ground electrode whose length is to be adjusted, but the slit length is adjusted. It is preferable that the length of the slit ((!. — D)) of the internal ground electrode other than the internal ground electrode to be used is the same as d Q. That is, the internal ground electrode whose length is to be adjusted All other internal ground electrodes are provided with slits in the same direction as the longitudinal direction of the core conductors L301 and L302. In this way, the variable range of the bandwidth to be adjusted is reduced.
  • the slit 371 in the multilayer bandpass filter F303 is shown in Fig.32 (3) from the connection conductors 321 and 331 of the internal ground electrode IG7 as ( Fig. 3 2
  • the slit 371 is provided in the internal ground electrode IG7.
  • the slit is not necessarily required to be a slit, and a groove having a certain width, that is, a notch is formed in the slit 311. 7 It may be provided instead of 1.
  • a cut-out portion 350 shown in Fig. 36 is provided, and the length of the cut-out portion 350 (the same direction as the longitudinal direction of the core conductors L301 and L302). May be controlled to adjust the band of the multilayer band-pass filter.
  • the laminated band-pass filter F303 two resonance circuits are provided. However, the same applies to the case where three or more resonance circuits are provided.
  • the bandwidth of both resonance circuits can be controlled.

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  • Filters And Equalizers (AREA)
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Abstract

Un condensateur à formation de points zéro comporte une pluralité de condensateurs en séries disposés entre des première et deuxième électrodes supplémentaires qui sont reliées l'une à l'autre en séries; et un condensateur intermédiaire qui est relié entre les points de connexion de ces condensateurs en séries et l'extrémité libre d'un conducteur central. Par conséquent, des points zéro peuvent être formés aux limites inférieure et supérieure d'une bande de fréquences spécifiée.
PCT/JP1993/001688 1992-11-19 1993-11-17 Filtre monolithique Ceased WO1994011917A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE4395836T DE4395836T1 (de) 1992-11-19 1993-11-17 Filter des Typs mit abgelagerter Schicht
DE4395836A DE4395836C2 (de) 1992-11-19 1993-11-17 Filter mit Dielektrischen Schichten

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP33369092A JPH06163322A (ja) 1992-11-19 1992-11-19 積層型フィルタ
JP4/333690 1992-11-19
JP33959692A JPH06164223A (ja) 1992-11-26 1992-11-26 フィルタの製造方法およびフィルタ
JP4/339596 1992-11-26
JP35363192A JPH06188609A (ja) 1992-10-25 1992-12-14 積層型フィルタおよびフィルタ回路
JP4/353631 1992-12-14
JP5/98893 1993-04-01
JP9889393A JPH06296102A (ja) 1993-02-10 1993-04-01 積層型部品および積層型バンドパスフィルタの帯域制御方法

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WO1994011917A1 true WO1994011917A1 (fr) 1994-05-26

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PCT/JP1993/001688 Ceased WO1994011917A1 (fr) 1992-11-19 1993-11-17 Filtre monolithique

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US (1) US5523729A (fr)
DE (2) DE4395836T1 (fr)
WO (1) WO1994011917A1 (fr)

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US5781081A (en) * 1995-09-01 1998-07-14 Ngk Spark Plug Co., Ltd. LC-type dielectric filter having an inductor on the outermost layer and frequency adjusting method therefor
JP3481069B2 (ja) * 1997-02-26 2003-12-22 日本特殊陶業株式会社 トリミングコンデンサ付積層回路
JP2910758B1 (ja) * 1998-04-27 1999-06-23 株式会社村田製作所 積層型ｌｃ部品
US6114925A (en) * 1998-06-18 2000-09-05 Industrial Technology Research Institute Miniaturized multilayer ceramic filter with high impedance lines connected to parallel coupled lines
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US5523729A (en) 1996-06-04
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