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WO1994005139A1 - Process for producing finely structured electroconductive layers - Google Patents

Process for producing finely structured electroconductive layers Download PDF

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Publication number
WO1994005139A1
WO1994005139A1 PCT/DE1993/000673 DE9300673W WO9405139A1 WO 1994005139 A1 WO1994005139 A1 WO 1994005139A1 DE 9300673 W DE9300673 W DE 9300673W WO 9405139 A1 WO9405139 A1 WO 9405139A1
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WO
WIPO (PCT)
Prior art keywords
layer
activation layer
copper
substrate
activation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1993/000673
Other languages
German (de)
French (fr)
Inventor
Horst Magenau
Werner Gruenwald
Kurt Schmid
Ralf Haug
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO1994005139A1 publication Critical patent/WO1994005139A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1841—Multistep pretreatment with use of metal first

Definitions

  • the invention is based on a method for producing finely structured electrically conductive layers on a substrate, e.g. PCBs.
  • an electrically conductive paste for example gold resinate
  • an application drum and from there transferred to a silicone rubber pressure roller rotating in opposite directions and then rolled onto the substrate by the latter.
  • a silicone rubber pressure roller rotating in opposite directions and then rolled onto the substrate by the latter.
  • another literature reference Shimida et al "Manufacturing of fine-line films by printing technique, IMC 1990 Proceedings May / July 1990, p. 581 ff) uses an intaglio plate on which the printing roller rolls and thereby the there applied paste in a given structure and quantity so that it can then be passed on to the substrate in the same structure.
  • the method according to the invention with the characterizing features of claim 1 has the advantage that the thin activation layer can be printed with much better quality in terms of structural fineness and edge sharpness than a thick layer. However, this thin activation layer has a much higher one
  • Square resistance (quotient of specific resistance and layer thickness), which is about 400 mfi for a gold resinate layer about 0.1 ⁇ m thick.
  • Electroless deposition of copper or nickel in the reduction bath is preferably used to attach the layer of high electrical conductivity, since - in contrast to the galvanic bath - neither an electrical contacting of the activation layer is necessary nor an electrically conductive and uninterrupted activation layer has to be required.
  • formaldehyde is used as the reducing agent.
  • a precondition for the electroless deposition is that the activation layer is germinated, ie has particles on which the copper or nickel ions from the reduction bath attach. Such germs are in the contain used activation layer, which is produced according to a preferred embodiment of the invention from palladium resinate, copper resinate, gold resinate or platinum resinate. It is also possible to use a thick-film paste to produce the activation layer, in which corresponding nuclei in the form of palladium, copper, platinum or gold particles are embedded.
  • the thin activation layer is preferably applied using a printing process known per se, as described in the quotations relating to the prior art mentioned at the beginning.
  • the layer material for the thin activation layer is by means of an elastically deformable roller, e.g. made of silicone rubber, rolled onto the substrate after the layer material with the desired structure has previously been applied to the roll using suitable measures.
  • a finely structured, highly conductive layer is applied to a substrate, e.g. a printed circuit board, manufactured as follows:
  • a thin activation layer in the desired layer structure with a layer thickness of approximately 0.1 ⁇ m is applied to the substrate.
  • Layer material is a palladium or copper organic compound is used. Examples of these are palladium resinate or copper resinate. The use of gold or platinum resinate is also possible.
  • the activation layer can be applied to the substrate in various ways. The so-called tampon offset printing is preferred. Process used, which is described in detail in the references mentioned above. In such a tampon printing process, the layer material of the activation layer is first applied in the specified shape and quantity to an application drum or an intaglio plate and from there to a printing roller made of silicone rubber by transferring the printing roller onto the application drum or intaglio plate. Rolls plate. The layer structure thus picked up by the pressure roller is then rolled onto the substrate by the pressure roller.
  • the layer material for the activation layer is first baked after being rolled on. Then a thicker conductive layer made of an electrically highly conductive metal is deposited without current from a corresponding reduction bath onto the activation layer.
  • a thicker conductive layer made of an electrically highly conductive metal is deposited without current from a corresponding reduction bath onto the activation layer.
  • copper or nickel is used as the metal and formaldehyde is used as the reducing agent.
  • the thick conductive layer deposited on the activation layer from the reduction bath has a layer thickness of approx. 10-15 m. you
  • Square resistance i.e. the quotient of specific resistance and layer thickness is only approx. 5 m_ ⁇ when using copper. , so that it has a high electrical conductivity.
  • a paste can also be used which is enriched with particles of palladium, copper, platinum or gold.
  • the metal from a galvanic bath.
  • the activation layer must be made electrically conductive and uninterrupted and contacted with the one potential of a current source.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A process is disclosed for producing finely structured conductive layers on a substrate, for example printed circuit cards. In order to improve the fineness of the structure and contour sharpness, a thin activation layer having the desired structure is at first applied on the substrate, preferably by printing, and then a thicker conductive layer made of an electroconductive metal, such as copper or nickel, is added to the activation layer, by precipitation from a corresponding galvanic bath or by a currentless process from a corresponding reduction bath.

Description

Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger SchichtenProcess for the production of finely structured electrically conductive layers

Stand der TechnikState of the art

Die Erfindung geht aus von einem Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten auf einem Substrat, z.B. Leiterkarten.The invention is based on a method for producing finely structured electrically conductive layers on a substrate, e.g. PCBs.

Bei einem bekannten Verfahren dieser Art (GB 2 110 162 A bzw. DE 31 45 586 C2 ) wird eine elektrisch leitfähige Paste, z.B. Goldresinat, in einem Druckverfahren auf definierte Gebiete des Substrats aufgebracht. Dabei wird zunächst die Paste in vorgegebener Form und Menge auf eine Auftragtrommel aufgebracht und von dort auf eine zu dieser gegensinnig drehenden Druckwalze aus Silikongummi übertragen und dann durch letztere auf das Substrat aufgewalzt. Anstelle der Auftragtrommel wird in einer weiteren Literaturstelle ( Shimida et al "Manufacturing of fine-line films by printing technique, IMC 1990 Proceedings Mai/Juli 1990, S. 581 ff) eine Intaglio-Platte verwendet, auf welcher die Druckwalze abrollt und dadurch die dort aufgetragene Paste in vorgegebene Struktur und Menge aufnimmt, um sie dann in gleiche Struktur auf das Substrat weiterzugeben.In a known method of this type (GB 2 110 162 A or DE 31 45 586 C2), an electrically conductive paste, for example gold resinate, is applied to defined areas of the substrate in a printing process. First, the paste in the specified form and quantity is applied to an application drum and from there transferred to a silicone rubber pressure roller rotating in opposite directions and then rolled onto the substrate by the latter. In place of the applicator drum, another literature reference (Shimida et al "Manufacturing of fine-line films by printing technique, IMC 1990 Proceedings May / July 1990, p. 581 ff) uses an intaglio plate on which the printing roller rolls and thereby the there applied paste in a given structure and quantity so that it can then be passed on to the substrate in the same structure.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße Verfahren mit den kennzeichnenden Merkmalen des Anspruchs 1 hat den Vorteil, daß die dünne Aktivierungsschicht sich mit wesentlich besserer Qualität bezüglich Strukturfeinheit und Kantenschärfe drucken läßt als eine dicke Schicht. Allerdings hat diese dünne Aktivierungsschicht einen sehr viel höherenThe method according to the invention with the characterizing features of claim 1 has the advantage that the thin activation layer can be printed with much better quality in terms of structural fineness and edge sharpness than a thick layer. However, this thin activation layer has a much higher one

Quadratwiderstand (Quotient aus spezifischem Widerstand und Schichtdicke), der bei einer etwa 0,1 μm dicken Gold- resinat-Schicht bei 400 mfi liegt. Durch die_Verstärkung dieser Schicht infolge Anlagerung einer elektrisch leitfähigen Metallschicht mit größerer Dicke im galvanischen Bad oder stromlos im Reduktionsbad wird die elektrische Leitfähigkeit deutlich verbessert, ohne daß die Strukturfeinheit und Kantenschärfe der strukturierten Schicht leidet. So sinkt beispielsweise der Quadratwiderstand bei Anlagerung einer 10 - 15 μm dicken Schicht aus Kupfer auf ca. 5 mlλ.Square resistance (quotient of specific resistance and layer thickness), which is about 400 mfi for a gold resinate layer about 0.1 μm thick. By strengthening this layer as a result of an electrically conductive metal layer having a greater thickness being deposited in the galvanic bath or without current in the reduction bath, the electrical conductivity is significantly improved without the structural fineness and sharpness of the edges of the structured layer suffering. For example, the square resistance drops to approx. 5 mlλ when a 10 - 15 μm thick layer of copper is deposited.

Zur Anlagerung der Schicht hoher elektrischer Leitfähigkeit wird bevorzugt das stromlose Abscheiden von Kupfer oder Nickel im Reduktionsbad angewendet, da hierbei - im Gegensatz zum galvanischen Bad - weder eine elektrische Kontaktierung der Aktivierungsschicht notwendig ist noch eine elektrisch leitfähige und unterbrechungslose Aktivierungsschicht gefordert werden muß. Als Reduktionsmittel wird beispielsweise Formaldehyd verwendet. Voraussetzung für das stromlose Abscheiden ist, daß die Aktivierungsschicht bekeimt ist, d. h. Partikel aufweist, an welchen sich die Kupfer- oder Nickelionen aus dem Reduktionsbad anlagern. Solche Keime sind in der verwendeten Aktivierungsschicht enthalten, die gemäß einer bevorzugten Ausführungsform der Erfindung aus Palladium- Resinat, Kupfer-Resinat, Gold-Resinat oder Platin-Resinat hergestellt wird. Es ist auch möglich zur Herstellung der Aktivierungsschicht eine Dickschichtpaste zu verwenden, in welcher entsprechende Keime in Form von Palladium-, Kupfer-, Platin- oder Goldpartikeln eingelagert sind.Electroless deposition of copper or nickel in the reduction bath is preferably used to attach the layer of high electrical conductivity, since - in contrast to the galvanic bath - neither an electrical contacting of the activation layer is necessary nor an electrically conductive and uninterrupted activation layer has to be required. For example, formaldehyde is used as the reducing agent. A precondition for the electroless deposition is that the activation layer is germinated, ie has particles on which the copper or nickel ions from the reduction bath attach. Such germs are in the contain used activation layer, which is produced according to a preferred embodiment of the invention from palladium resinate, copper resinate, gold resinate or platinum resinate. It is also possible to use a thick-film paste to produce the activation layer, in which corresponding nuclei in the form of palladium, copper, platinum or gold particles are embedded.

Durch die in den weiteren Ansprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen des im Anspruch 1 angegebenen Verfahrens möglich. Bevorzugt wird die Aufbringung der dünnen Aktivierungsschicht mit einem an sich bekannten Druckverfahren vorgenommen, wie dies aus den eingangs genannten Zitatstellen zum Stand der Technik beschrieben ist. Das Schichtmaterial für die dünne Aktivierungsschicht wird mittels einer elastisch verformbaren Rolle, z.B. aus Silikongummi, auf das Substrat aufgewalzt, nachdem zuvor das Schichtmaterial in der gewünschten Struktur mittels geeigneter Maßnahmen auf die Rolle aufgebracht worden ist.Advantageous further developments and improvements of the method specified in claim 1 are possible through the measures listed in the further claims. The thin activation layer is preferably applied using a printing process known per se, as described in the quotations relating to the prior art mentioned at the beginning. The layer material for the thin activation layer is by means of an elastically deformable roller, e.g. made of silicone rubber, rolled onto the substrate after the layer material with the desired structure has previously been applied to the roll using suitable measures.

Beschreibung des AusführungsbeispielsDescription of the embodiment

Bei dem vorgeschlagenen Verfahren wird eine fein strukturierte, gut leitfähige Schicht auf einem Substrat, z.B. einer Leiterplatte, wie folgt hergestellt:In the proposed method, a finely structured, highly conductive layer is applied to a substrate, e.g. a printed circuit board, manufactured as follows:

Zunächst wird auf das Substrat eine dünne Aktivierungsschicht in der gewünschten Schichtstruktur mit einer Schichtdicke von ca. 0,1 um aufgebracht. AlsFirst, a thin activation layer in the desired layer structure with a layer thickness of approximately 0.1 μm is applied to the substrate. As

Schichtmaterial wird eine palladium- oder kupferorganische Verbindung verwendet. Beispiele hierfür sind Palladium- Resinat oder Kupfer-Resinat. Auch die Verwendung von Gold¬ oder Platin-Resinat ist möglich. Die Aktivierungsschicht kann in verschiedener Weise auf das Substrat aufgebracht werden. Bevorzugt wird das sog. Tampon-Offset-Druck- Verfahren verwendet, das in den eingangs genannten Literaturstellen ausführlich beschrieben ist. Bei einem solchen Tampon-Druck-Verfahren wird zunächst das Schichtmaterial der Aktivierungsschicht in der vorgegebenen Form und Menge auf eine Auftragtrommel oder eine Intaglio- Platte aufgebracht und von dort auf eine Druckwalze aus Silikongummi dadurch übertragen, daß sich die Druckwalze auf der Auftragtrommel oder Intaglio-Platte abwälzt. Die so von der Druckwalze aufgenommene Schichtstruktur wird dann von der Druckwalze auf das Substrat aufgewalzt. Bei Verwendung der vorstehend genannten Resinate als Schichtmaterial für die Aktivierungsschicht wird diese nach Aufwalzen zunächst eingebrannt. Danach wird auf die Aktivierungsschicht eine dickere Leitschicht aus einem elektrisch gut leitendem Metall aus einem entsprechenden Reduktionsbad stromlos abgeschieden. Als Metall wird beispielsweise Kupfer oder Nickel verwendet und als Reduktionsmittel Formaldehyd. Die aus dem Reduktionsbad auf der Aktivierungsschicht abgeschiedene dicke Leitschicht weist eine Schichtdicke von ca. 10 - 15 m auf. IhrLayer material is a palladium or copper organic compound is used. Examples of these are palladium resinate or copper resinate. The use of gold or platinum resinate is also possible. The activation layer can be applied to the substrate in various ways. The so-called tampon offset printing is preferred. Process used, which is described in detail in the references mentioned above. In such a tampon printing process, the layer material of the activation layer is first applied in the specified shape and quantity to an application drum or an intaglio plate and from there to a printing roller made of silicone rubber by transferring the printing roller onto the application drum or intaglio plate. Rolls plate. The layer structure thus picked up by the pressure roller is then rolled onto the substrate by the pressure roller. If the above-mentioned resinates are used as the layer material for the activation layer, this is first baked after being rolled on. Then a thicker conductive layer made of an electrically highly conductive metal is deposited without current from a corresponding reduction bath onto the activation layer. For example, copper or nickel is used as the metal and formaldehyde is used as the reducing agent. The thick conductive layer deposited on the activation layer from the reduction bath has a layer thickness of approx. 10-15 m. you

Quadratwiderstand, d.h. der Quotient aus spezifischem Widerstand und Schichtdicke, beträgt bei Verwendung von Kupfer nur ca. 5 m_Ω. , so daß sie eine hohe elektrische Leitfähigkeit aufweist.Square resistance, i.e. the quotient of specific resistance and layer thickness is only approx. 5 m_Ω when using copper. , so that it has a high electrical conductivity.

Anstelle einer palladium-, platin-, gold- oder kupferorganischen Verbindung für das Aufdrucken der Aktivierungsschicht auf das Substrat kann auch eine Paste verwendet werden, die mit Partikeln von Palladium, Kupfer, Platin oder Gold angereichert ist.Instead of a palladium, platinum, gold or copper organic compound for printing the activation layer on the substrate, a paste can also be used which is enriched with particles of palladium, copper, platinum or gold.

Es ist auch möglich, die Abscheidung des Metalls aus einem galvanischen Bad vorzunehmen. In diesem Fall muß die Aktivierungsschicht elektrisch leitfähig und unterbrechungslos ausgeführt und mit dem einen Potential einer Stromquelle kontaktiert werden. -.-.-.-.-.- It is also possible to deposit the metal from a galvanic bath. In this case, the activation layer must be made electrically conductive and uninterrupted and contacted with the one potential of a current source. -.-.-.-.-.-

Claims

Ansprüche Expectations 1. Verfahren zur Herstellung fein strukturierter lεitfähiger Schichten auf einem Substrat, z.B. Leiterkarten, dadurch gekennzeichnet, daß zunächst eine dünne Aktivierungsschicht in der gewünschten Schichtstruktur auf das Substrat aufgebracht und dann auf die Aktivierungsschicht eine dickere Leitschicht aus einem elektrisch gut leitendem Metall, wie Kupfer oder Nickel, aus einem entsprechenden galvanischen Bad oder bevorzugt stromlos aus einem entsprechenden Reduktionsbad abgeschieden wird.1. Process for the production of finely structured conductive layers on a substrate, e.g. Printed circuit boards, characterized in that first a thin activation layer in the desired layer structure is applied to the substrate and then a thicker conductive layer made of an electrically highly conductive metal, such as copper or nickel, from a corresponding galvanic bath or preferably de-energized from a corresponding reduction bath onto the activation layer is deposited. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Aufbringung der dünnen Aktivierungsschicht mit einem an sich bekannten Druckverfahren vorgenommen wird, bei welchem das Schichtmaterial mittels einer elastisch verformbaren Rolle auf das Substrat aufgewalzt wird. 2. The method according to claim 1, characterized in that the application of the thin activation layer is carried out with a printing method known per se, in which the layer material is rolled onto the substrate by means of an elastically deformable roller. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß als Schichtmaterial für die Aktivierungsschicht eine palladium-, platin-, gold- oder kupferorganische Verbindung, z.B. Palladium-, Platin-, Gold- oder Kupfer-Resinat, verwendet wird.3. The method according to claim 1 or 2, characterized in that as a layer material for the activation layer, a palladium, platinum, gold or copper organic compound, e.g. Palladium, platinum, gold or copper resinate is used. 4. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß als Schichtmaterial für die Aktivierungsschicht eine Dickschichtpaste mit Partikeln von Palladium, Kupfer, Platin oder Gold verwendet wird.4. The method according to claim 1 or 2, characterized in that a thick-film paste with particles of palladium, copper, platinum or gold is used as the layer material for the activation layer. 5. Verfahren nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß vor Aufbringen der Leitschicht die Aktivierungsschicht einem Einbrennprozeß unterzogen wird.5. The method according to claim 3 or 4, characterized in that the activation layer is subjected to a stoving process before application of the conductive layer. 6. Verfahren nach einem der Ansprüche 1 - 5, dadurch gekennzeichnet, daß die Aktivierungsschicht mit einer Schichtdicke von etwa 0,1 um aufgedruckt wird.6. The method according to any one of claims 1-5, characterized in that the activation layer is printed with a layer thickness of about 0.1 microns. Verfahren nach einem der Ansprüche 1 - 6, dadurch gekennzeichnet, daß die dickere Leitschicht aus elektrisch gut leitendem Metall mit einer Schichtdicke von etwa 10 - 15 um abgeschieden wird. Method according to one of claims 1-6, characterized in that the thicker conductive layer of electrically good conductive metal is deposited with a layer thickness of approximately 10-15 µm.
PCT/DE1993/000673 1992-08-17 1993-07-30 Process for producing finely structured electroconductive layers Ceased WO1994005139A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4227085.5 1992-08-17
DE19924227085 DE4227085A1 (en) 1992-08-17 1992-08-17 Process for the production of finely structured electrically conductive layers

Publications (1)

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WO1994005139A1 true WO1994005139A1 (en) 1994-03-03

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US5784779A (en) * 1995-05-20 1998-07-28 Robert Bosch Gmbh Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate

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DE19833593C2 (en) * 1998-07-25 2002-03-14 Daimler Chrysler Ag Selective metallization process
DE10109786A1 (en) * 2001-02-28 2002-12-12 Fractal Ag Process for the production of printed circuit boards
DE102005003723A1 (en) * 2005-01-26 2006-07-27 Heraeus Sensor Technology Gmbh Thermopile e.g. for measuring temperature differences, has thin-film or thick-film conductor paths on substrate
DE102005038392B4 (en) * 2005-08-09 2008-07-10 Atotech Deutschland Gmbh Method for producing pattern-forming copper structures on a carrier substrate
DE102006033055A1 (en) * 2006-07-14 2008-01-17 Man Roland Druckmaschinen Ag Electrically conductive structures

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US4361603A (en) * 1979-04-13 1982-11-30 Kubasov Vladimir L Electrode for electrochemical processes and production method therefor
GB2110162A (en) * 1981-11-17 1983-06-15 Bosch Gmbh Robert A method of producing electrically conductive areas
EP0164921A2 (en) * 1984-05-17 1985-12-18 John Murray Improvements in and relating to printed circuit boards
GB2181303A (en) * 1985-09-29 1987-04-15 Asahi Chem Res Lab A method for forming electrically conductive circuits on a base board
EP0254201A1 (en) * 1986-07-24 1988-01-27 Kalman F. Zsamboky Method of metallizing ceramic substrates
EP0272129A2 (en) * 1986-12-17 1988-06-22 Fujitsu Limited Method for production of ceramic circuit board
EP0322997A2 (en) * 1987-12-31 1989-07-05 Jungpoong Products Co., Ltd. Process for making printed circuit boards
EP0335565A2 (en) * 1988-03-28 1989-10-04 Hitachi Chemical Co., Ltd. Process for producing printed wiring board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4361603A (en) * 1979-04-13 1982-11-30 Kubasov Vladimir L Electrode for electrochemical processes and production method therefor
GB2110162A (en) * 1981-11-17 1983-06-15 Bosch Gmbh Robert A method of producing electrically conductive areas
EP0164921A2 (en) * 1984-05-17 1985-12-18 John Murray Improvements in and relating to printed circuit boards
GB2181303A (en) * 1985-09-29 1987-04-15 Asahi Chem Res Lab A method for forming electrically conductive circuits on a base board
EP0254201A1 (en) * 1986-07-24 1988-01-27 Kalman F. Zsamboky Method of metallizing ceramic substrates
EP0272129A2 (en) * 1986-12-17 1988-06-22 Fujitsu Limited Method for production of ceramic circuit board
EP0322997A2 (en) * 1987-12-31 1989-07-05 Jungpoong Products Co., Ltd. Process for making printed circuit boards
EP0335565A2 (en) * 1988-03-28 1989-10-04 Hitachi Chemical Co., Ltd. Process for producing printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784779A (en) * 1995-05-20 1998-07-28 Robert Bosch Gmbh Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate

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Publication number Publication date
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