[go: up one dir, main page]

USD946540S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents

Temporary protective film for manufacturing semiconductor devices Download PDF

Info

Publication number
USD946540S1
USD946540S1 US35/355,127 US35512768F USD946540S US D946540 S1 USD946540 S1 US D946540S1 US 35512768 F US35512768 F US 35512768F US D946540 S USD946540 S US D946540S
Authority
US
United States
Prior art keywords
semiconductor devices
protective film
manufacturing semiconductor
temporary protective
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,127
Other versions
USD995286S1 (en
USD996276S1 (en
USD981983S1 (en
USD966992S1 (en
USD983061S1 (en
USD998964S1 (en
USD989300S1 (en
USD975561S1 (en
USD1013924S1 (en
USD975937S1 (en
USD999626S1 (en
USD972551S1 (en
USD981985S1 (en
USD984496S1 (en
USD976642S1 (en
USD978596S1 (en
USD968628S1 (en
USD976536S1 (en
USD965969S1 (en
USD995965S1 (en
USD969789S1 (en
USD971336S1 (en
USD978463S1 (en
USD981707S1 (en
USD989367S1 (en
USD994194S1 (en
USD976711S1 (en
USD976459S1 (en
USD975049S1 (en
USD984143S1 (en
USD972554S1 (en
USD978305S1 (en
USD1056703S1 (en
USD978299S1 (en
USD1006454S1 (en
USD972552S1 (en
USD1010696S1 (en
USD973589S1 (en
USD975995S1 (en
USD983159S1 (en
USD969930S1 (en
USD974938S1 (en
USD987051S1 (en
USD1030063S1 (en
USD981984S1 (en
USD971672S1 (en
USD1029055S1 (en
USD991189S1 (en
USD979098S1 (en
USD1000017S1 (en
USD975691S1 (en
USD979423S1 (en
USD1000741S1 (en
USD980910S1 (en
USD999635S1 (en
USD974761S1 (en
USD995107S1 (en
USD969491S1 (en
USD999253S1 (en
USD1034591S1 (en
USD999636S1 (en
USD986218S1 (en
USD1017925S1 (en
USD984747S1 (en
USD1002921S1 (en
USD984318S1 (en
USD994666S1 (en
USD972997S1 (en
USD962883S1 (en
USD982671S1 (en
USD972550S1 (en
USD978737S1 (en
USD972553S1 (en
USD973622S1 (en
USD977339S1 (en
USD987980S1 (en
Inventor
Naoki Tomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Materials Co Ltd filed Critical Showa Denko Materials Co Ltd
Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOMORI, NAOKI
Application granted granted Critical
Publication of USD946540S1 publication Critical patent/USD946540S1/en
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

1. Temporary protective film for manufacturing semiconductor devices
1.1 : Perspective
1.2 : Perspective
1.3 : Front
1.4 : Back
1.5 : Top
1.6 : Bottom
1.7 : Left
1.8 : Right
1.9 : A-A Sectional view
The article includes a core part and a film part, and is shown with the width of the core part as smaller than the width of the film part, and the film part is wound while partially protruding from the core part; this article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of this article has an adhesive layer on one side; since the core part does not protrude from the film part, this article can be easily positioned when set to equipment for manufacturing semiconductor devices, and it is possible to prevent this article from being misaligned when it is temporarily adhered to the back surface of the lead frame; reproduction 1.9 is a cross-sectional view taken along the line A-A of reproduction 1.7; the parts shown with solid lines in the drawings are parts for which a partial design registration is sought; the broken lines shown in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design; the parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product.

Claims (1)

    CLAIM
  1. The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
US35/355,127 2020-11-02 2021-04-22 Temporary protective film for manufacturing semiconductor devices Active USD946540S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2020-23696F JP1685752S (en) 2020-11-02 2020-11-02
JP2020-023696D 2020-11-02

Publications (1)

Publication Number Publication Date
USD946540S1 true USD946540S1 (en) 2022-03-22

Family

ID=75966648

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,127 Active USD946540S1 (en) 2020-11-02 2021-04-22 Temporary protective film for manufacturing semiconductor devices

Country Status (2)

Country Link
US (1) USD946540S1 (en)
JP (1) JP1685752S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD998577S1 (en) * 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) * 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) * 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2694533A (en) * 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US2699251A (en) * 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US4983932A (en) * 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US7669631B2 (en) * 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20100080989A1 (en) * 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD847258S1 (en) * 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) * 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2699251A (en) * 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US2694533A (en) * 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US4983932A (en) * 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US7669631B2 (en) * 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
US20100080989A1 (en) * 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) * 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD690278S1 (en) * 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD847258S1 (en) * 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Back-grinding tape with heat resistance is for special heating process after wafer grinding", Nov. 6, 2021 (cited in an office action dated Nov. 9, 2021 in Design U.S. Appl. No. 35/512,766).
"Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature-water-soluble-plastic-film-for-mold-release.html. *
"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html. *
"RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/015.html. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD998577S1 (en) * 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) * 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

Also Published As

Publication number Publication date
JP1685752S (en) 2021-05-24

Similar Documents

Publication Publication Date Title
USD962883S1 (en) Temporary protective film for manufacturing semiconductor devices
USD1013257S1 (en) Base part for electronic vaping device
USD1034502S1 (en) Electronic device
USD943569S1 (en) Electronic device mount for vehicles
USD934565S1 (en) Case for an electronic device
USD890112S1 (en) Electronic device
USD894167S1 (en) Transparent case with adjustable strap for an electronic device
USD966226S1 (en) Electronic device
USD1013695S1 (en) Cover for electronic device
USD964985S1 (en) Electronic device
USD938428S1 (en) Cover for an electronic device
USD876646S1 (en) Set of adhesive tapes
USD961584S1 (en) Electronic watch device
USD861699S1 (en) Electronic device mount
USD951957S1 (en) Display for an electronic device
USD946540S1 (en) Temporary protective film for manufacturing semiconductor devices
USD857024S1 (en) Electronic device mount
USD855624S1 (en) Electronic device mount
USD857699S1 (en) Electronic device mount
USD855626S1 (en) Electronic device mount
USD868793S1 (en) Base for an electronic display device
USD1013694S1 (en) Cover for electronic device
USD934228S1 (en) Hands-free holder for electronic and other devices
USD960166S1 (en) Display for an electronic device
USD938429S1 (en) Cover for an electronic device

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY