USD401252S - Shield and cover for target of sputter coating apparatus - Google Patents
Shield and cover for target of sputter coating apparatus Download PDFInfo
- Publication number
- USD401252S USD401252S US29/082,647 US8264798F USD401252S US D401252 S USD401252 S US D401252S US 8264798 F US8264798 F US 8264798F US D401252 S USD401252 S US D401252S
- Authority
- US
- United States
- Prior art keywords
- shield
- target
- cover
- coating apparatus
- sputter coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a perspective view of a shield and cover for target of sputter coating apparatus embodying the design of the invention;
FIG. 2 is a top plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;
FIG. 3 is a bottom plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;
FIG. 4 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the bottom of FIG. 2;
FIG. 5 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the top of FIG. 2;
FIG. 6 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the left side of FIG. 2;
FIG. 7 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the right side of FIG. 2; and,
FIG. 8 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 8--8 of FIG. 2.
Claims (1)
- The ornamental design for a shield and cover for target of sputter coating apparatus, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/082,647 USD401252S (en) | 1998-01-27 | 1998-01-27 | Shield and cover for target of sputter coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/082,647 USD401252S (en) | 1998-01-27 | 1998-01-27 | Shield and cover for target of sputter coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD401252S true USD401252S (en) | 1998-11-17 |
Family
ID=71605909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/082,647 Expired - Lifetime USD401252S (en) | 1998-01-27 | 1998-01-27 | Shield and cover for target of sputter coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD401252S (en) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040251130A1 (en) * | 2003-06-12 | 2004-12-16 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| US7403029B2 (en) | 1999-05-27 | 2008-07-22 | Nanonexus Corporation | Massively parallel interface for electronic circuit |
| USD575311S1 (en) * | 2007-10-30 | 2008-08-19 | Konecny Dale F | Drill dust collection attachment |
| US7579848B2 (en) | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
| US7621761B2 (en) | 2000-06-20 | 2009-11-24 | Nanonexus, Inc. | Systems for testing and packaging integrated circuits |
| US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD672795S1 (en) * | 2012-05-04 | 2012-12-18 | Kevin Ross Inkster | Turbo plane blade with four teeth |
| USD678370S1 (en) * | 2011-11-10 | 2013-03-19 | Kevin Ross Inkster | Turbo plane blade with three teeth |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD904066S1 (en) * | 2019-09-19 | 2020-12-08 | Georgia-Pacific LLC | Core plug |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD947789S1 (en) * | 2020-05-22 | 2022-04-05 | Hosiden Corporation | Electric connection terminal |
| US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5690795A (en) | 1995-06-05 | 1997-11-25 | Applied Materials, Inc. | Screwless shield assembly for vacuum processing chambers |
-
1998
- 1998-01-27 US US29/082,647 patent/USD401252S/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5690795A (en) | 1995-06-05 | 1997-11-25 | Applied Materials, Inc. | Screwless shield assembly for vacuum processing chambers |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7403029B2 (en) | 1999-05-27 | 2008-07-22 | Nanonexus Corporation | Massively parallel interface for electronic circuit |
| US7884634B2 (en) | 1999-05-27 | 2011-02-08 | Verigy (Singapore) Pte, Ltd | High density interconnect system having rapid fabrication cycle |
| US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
| US7579848B2 (en) | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
| US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US7872482B2 (en) | 2000-05-23 | 2011-01-18 | Verigy (Singapore) Pte. Ltd | High density interconnect system having rapid fabrication cycle |
| US7952373B2 (en) * | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| US7621761B2 (en) | 2000-06-20 | 2009-11-24 | Nanonexus, Inc. | Systems for testing and packaging integrated circuits |
| US7097744B2 (en) | 2003-06-12 | 2006-08-29 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| US20040251130A1 (en) * | 2003-06-12 | 2004-12-16 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| USD575311S1 (en) * | 2007-10-30 | 2008-08-19 | Konecny Dale F | Drill dust collection attachment |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD678370S1 (en) * | 2011-11-10 | 2013-03-19 | Kevin Ross Inkster | Turbo plane blade with three teeth |
| USD672795S1 (en) * | 2012-05-04 | 2012-12-18 | Kevin Ross Inkster | Turbo plane blade with four teeth |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD904066S1 (en) * | 2019-09-19 | 2020-12-08 | Georgia-Pacific LLC | Core plug |
| USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD947789S1 (en) * | 2020-05-22 | 2022-04-05 | Hosiden Corporation | Electric connection terminal |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
| US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
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