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USD381030S - Sputtering target - Google Patents

Sputtering target Download PDF

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Publication number
USD381030S
USD381030S US29/047,081 US4708195F USD381030S US D381030 S USD381030 S US D381030S US 4708195 F US4708195 F US 4708195F US D381030 S USD381030 S US D381030S
Authority
US
United States
Prior art keywords
sputtering target
present
view
sputtering
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/047,081
Inventor
Avi Tepman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/047,081 priority Critical patent/USD381030S/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TEPMAN, AVI
Application granted granted Critical
Publication of USD381030S publication Critical patent/USD381030S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view showing substantially the top of a sputtering target of the present invention;
FIG. 2 is a perspective view showing substantially the bottom of a sputtering target of the present invention;
FIG. 3 is a top view of a sputtering target of the present invention;
FIG. 4 is a side view of a sputtering target of the present invention;
FIG. 5 is a bottom view of a sputtering target of the present invention; and,
FIG. 6 is a cross-sectional view of a sputtering target of the present invention.

Claims (1)

  1. The ornamental design for a sputtering target, as shown and described.
US29/047,081 1995-11-21 1995-11-21 Sputtering target Expired - Lifetime USD381030S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/047,081 USD381030S (en) 1995-11-21 1995-11-21 Sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/047,081 USD381030S (en) 1995-11-21 1995-11-21 Sputtering target

Publications (1)

Publication Number Publication Date
USD381030S true USD381030S (en) 1997-07-15

Family

ID=71462239

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/047,081 Expired - Lifetime USD381030S (en) 1995-11-21 1995-11-21 Sputtering target

Country Status (1)

Country Link
US (1) USD381030S (en)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD666227S1 (en) 2008-09-17 2012-08-28 Kile Ronald J Transparent oil monitoring and maintenance cover
USD699772S1 (en) 2012-11-16 2014-02-18 Ronald J. Kile Transparent oil monitoring and maintenance cover
USD725688S1 (en) 2013-04-22 2015-03-31 Ronald J. Kile Transparent oil monitoring and maintenance cover
USD828190S1 (en) * 2016-10-03 2018-09-11 Sintokogio, Ltd. Probe
USD830865S1 (en) * 2016-10-03 2018-10-16 Sintokogio, Ltd. Probe
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD876299S1 (en) * 2018-02-02 2020-02-25 Amsted Rail Company, Inc. Vented brake cylinder
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460708A (en) * 1990-11-30 1995-10-24 Texas Instruments Incorporated Semiconductor processing system
US5480530A (en) * 1993-03-09 1996-01-02 Leybold Aktiengesellschaft Mask for covering the margin of a disk-shaped substrate
US5529673A (en) * 1995-02-17 1996-06-25 Sony Corporation Mechanically joined sputtering target and adapter therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460708A (en) * 1990-11-30 1995-10-24 Texas Instruments Incorporated Semiconductor processing system
US5480530A (en) * 1993-03-09 1996-01-02 Leybold Aktiengesellschaft Mask for covering the margin of a disk-shaped substrate
US5529673A (en) * 1995-02-17 1996-06-25 Sony Corporation Mechanically joined sputtering target and adapter therefor

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD529057S1 (en) * 2004-08-16 2006-09-26 Williams Advanced Materials, Inc. Sputtering target
USD666227S1 (en) 2008-09-17 2012-08-28 Kile Ronald J Transparent oil monitoring and maintenance cover
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD699772S1 (en) 2012-11-16 2014-02-18 Ronald J. Kile Transparent oil monitoring and maintenance cover
USD700227S1 (en) 2012-11-16 2014-02-25 Ronald J. Kile Transparent oil monitoring and maintenance cover
USD725688S1 (en) 2013-04-22 2015-03-31 Ronald J. Kile Transparent oil monitoring and maintenance cover
USD828190S1 (en) * 2016-10-03 2018-09-11 Sintokogio, Ltd. Probe
USD830865S1 (en) * 2016-10-03 2018-10-16 Sintokogio, Ltd. Probe
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD876299S1 (en) * 2018-02-02 2020-02-25 Amsted Rail Company, Inc. Vented brake cylinder
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

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