USD1078667S1 - Wafer support of semiconductor manufacturing apparatus - Google Patents

Description

FIG. 1 is a front, top and right side perspective view of a wafer support of semiconductor manufacturing apparatus-showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 ;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 2 ;

FIG. 10 is an enlarged portion view taken from encircled portion labeled, “FIG. 10 ,” in FIG. 2 ;

FIG. 11 is a perspective view of FIG. 8 , shown without broken line environment, for ease of illustration;

FIG. 12 is a front elevational view of FIG. 11 ;

FIG. 13 is a left side elevational view of FIG. 11 ;

FIG. 14 is a right side elevational view of FIG. 11 ;

FIG. 15 is a top plan view of FIG. 11 ;

FIG. 16 is a bottom plan view of FIG. 11 ; and,

FIG. 17 is a rear elevational view of FIG. 11 .

The even dashed broken lines in the drawings are for the purpose of illustrating portions of the article that form no part of the claimed design.

The dot, dot dashed broken lines in the drawings are for the purpose of illustrating the boundaries of the enlarged portion view of FIG. 10 in FIGS. 2 and 10 and form no part of the claimed design.

The single dot dashed lines in the drawings represent the boundary between the part for which the design is claimed and the part not claimed.

Claims (1)

CLAIM
1. The ornamental design for a wafer support of semiconductor manufacturing apparatus, as shown and described.

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