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US7986236B2 - RFID tag and method and apparatus for manufacturing same - Google Patents

RFID tag and method and apparatus for manufacturing same Download PDF

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Publication number
US7986236B2
US7986236B2 US11/918,812 US91881206A US7986236B2 US 7986236 B2 US7986236 B2 US 7986236B2 US 91881206 A US91881206 A US 91881206A US 7986236 B2 US7986236 B2 US 7986236B2
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Prior art keywords
antenna
integrated circuit
microradios
rfid
feedpoints
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US11/918,812
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US20090066517A1 (en
Inventor
Kenneth R. Erikson
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RadioFIDO LLC
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BAE Systems Information and Electronic Systems Integration Inc
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Assigned to BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. reassignment BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ERIKSON, KENNETH R.
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Assigned to RADIOFIDO LLC reassignment RADIOFIDO LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • This invention relates to the manufacture of RFID tags and more particularly to the printing of an RFID antenna on a substrate using a conductive fluid, followed by deposition of randomly oriented RFID integrated circuits in a second fluid at the feed point of the antenna, with at least one of the integrated circuits at the feed point properly oriented and connected to the antenna, thus eliminating the need for individual IC orientation, alignment and placement.
  • Radio Frequency Identification (RFID) tags have been utilized extensively to trace pallets of merchandise from a point of shipment to a final destination.
  • the tags are typically passive devices that are read out with RF energy, usually in the 900 MHz range. These passive devices are parasitically powered by the RF energy impinging upon the antenna of the tag, thus powering the integrated circuits within the tag, with the result that the tag transmits the identity of the pallet in response to a probing signal from a reader in the vicinity of the tag.
  • the relatively low price for the tagging of items is not so important in high-value items such as pharmaceuticals, where the tag price may be as much as 25 or 50 cents from start to finish. Rather, mass merchants are interested in keeping track of how much material is on their shelves for inventory control.
  • an individual carries a reader with him- or herself and probes the individual items, either in a walk-by scenario or as the items come into the facility, for instance on a conveyor belt.
  • RFID technology is not merely a bar code technology, but rather one that can store data and, upon request from a reader, output data to a global database.
  • the data can be as simple as a product ID code.
  • the desideratum using item-level RFID tags is that the whole shipment history of a product from the time it leaves the manufacturing plant to its final destination can be tracked through various hands such as shippers, importers, wholesalers and warehousemen.
  • the RFID tag merely contains an identification number, this number is read out along the way during shipment such that the transport history of the item can be ascertained.
  • the current tags are passive tags in that they do not require or have a battery. This is useful because in item-level tagging, low cost is key, there is no space available for batteries and battery shelf life is not a problem.
  • a pallet is usually placed on a forklift truck and is driven, for instance, into a warehouse where it passes through the warehouse door at which a reader is located.
  • the reader sends out RF energy that charges up the passive tag by transferring energy to the integrated circuits within the tag.
  • the reader then transmits a special code that interrogates the RFID electronics so as to output the tag ID and any other related information stored by the tag.
  • the antenna dimensions are on the order of 2 inches by 2 inches, with the antenna dimensions being the dominating factor. It is noted that the larger the antenna, the greater the range, since a larger tag antenna can capture more energy from a reader. For short-range applications such as monitoring pill bottle inventories, the antenna can be indeed quite small.
  • the amount of energy available for the integrated circuits making up the tag is limited, with the energy being derived from a so-called rectenna that rectifies the RF energy and stores it on a capacitor. In these cases the energy from the capacitor is utilized to power up the circuitry that includes some kind of logic or even a microcomputer as well as a transmitter. Note that once the circuit is powered up the information is transmitted back to the reader.
  • pallets for instance, contain high value items, a 50- or 75-cent tag may be affordable; however, for item level tags the cost needs to be kept under 5 cents or less.
  • the output of the transmitter of the RFID tag is in general in the microwatt range due to the small size antenna required.
  • the cost per IC die goes down dramatically. This is because if one can utilize large wafers, one can make millions of individual die per wafer. With processing costs constant and sufficient yields, one can therefore reduce the cost of the tag under 5 cents.
  • the individual chips are extremely hard to test and hard to handle.
  • the integrated circuits must be of a size that they can be taken off some kind of dispensing apparatus and physically moved where they can be deposited on and electrically connected to the antenna.
  • pick-and-place machines currently are limited to integrated circuits that are larger than a millimeter on a side.
  • the saw blade dimensions defines the kerf, which is the material that the saw blade requires in the removal of material. Note that in the applications being discussed herein, the kerf is larger than the desired size of the chips. This results in very inefficient use of a wafer and therefore added cost per die.
  • Chemical etching is another alternative method.
  • conventional approaches lead to severe undercutting of the die, again adding to the kerf dimensions.
  • a shaped die Assuming that one can actually separate out the microscopic chips, mounting them to an antenna can be accomplished through the use of a shaped die and a specially shaped receiver cavity. In such so-called “self-assembly methods”, these shaped die are squeegeed over in a slurry across a substrate that has receiver cavities that are adapted to uniquely hold the specially-shaped dies.
  • the RFID tag is microminiaturized into what is termed a microradio by first providing an antenna fabricated using an electrically conductive fluid printed or patterned onto a substrate; and then by utilizing a second nonconductive fluid carrying randomly oriented microminiature RFID integrated circuits to deposit these circuits at the feed point of the antenna. Thereafter, conductive fluid that is non-miscible with the conductive fluid is deposited over the nonconductive fluid and the microradios to connect tag contacts that project up through the nonconductive fluid to the antenna. Those tags having contacts that already overlie an antenna feed point, connect to it because they are embedded in the conductive fluid used to print the antenna.
  • each integrated circuit microradio has conductive tabs or elements in three dimensions on either end of the die, such that when randomly oriented, at least some conductive tabs will be in the appropriate position to contact the antenna feed point.
  • these circuits are carried in random orientations with the second fluid such that by virtue of the three-dimensional contact structure and the number of integrated circuits deposited, at least one of the integrated circuits will couple to the feed point of the antenna.
  • the tag may be parasitically powered by energy from the reader and transmit a readable signal to the reader.
  • unprogrammed integrated circuits are deposited over the feed points of the antenna such that only those circuits that are appropriately coupled to the feed point of the antenna obtain parasitic powering and are therefore activated. Due to the exceptionally small size of the integrated circuits and due to a specialized three-dimensional integrated circuit fabrication technique in which the edges of the integrated circuit are provided with conductive material or pads on both sides of the circuit, it makes no difference what the random orientation is with respect to the antenna feed, but only that at least one of integrated circuits is sufficiently coupled to the feed point.
  • the net result is an RFID tag manufacturing technique suitable for item-level labeling in which the overall cost from start to finish for providing a tag on an item is kept below the 5-cent level mentioned above.
  • the system does not require costly and pick-and-place machines that are incapable of handling the micro-sized integrated circuits and does not require specific orientation of the microminiature circuit with respect to any cavity in a substrate to make sure that appropriate connection is made.
  • the present invention provides a method and system for manufacturing RFID tags. It is also applicable to directly applying a tag to an end item.
  • microradios are fabricated with a three-dimensional electrode configuration.
  • electrically conductive ink an antenna is initially deposited on a surface.
  • a plurality of microradios is then dispensed over the feed point of the antenna.
  • a programming station is used to enable microradios that are correctly coupled to the antenna and to disconnect microradios that are incorrectly connected. The same programming station may be used to program the memory of the tag with information regarding the end item.
  • FIG. 1 illustrates a silicon wafer containing a huge number of microradios.
  • FIG. 2 illustrates a cross-section of the integrated circuit portion of the tag.
  • FIG. 3 is a block diagram of an RFID tag containing an antenna and a microradio.
  • FIG. 4 is a block diagram of the system used to manufacture the RFID tag and apply it to an item.
  • FIG. 5 is a cross-section of the RFID tag in the region of the antenna containing microradios.
  • FIG. 6 is a diagram of the completed RFID tag.
  • FIG. 7 illustrates the RFID tag passing through a programming station.
  • FIG. 8 illustrates the RFID tags being interrogated by a reader.
  • RFID tags are becoming a well-established method for tracking materials during shipping and storage. In many applications they replace the printed bar code labels on items because they do not require a close proximity for the automatic reader. RFID tags that conform to the ISO/IEC 18000 standard also can contain significantly more data than a printed bar code label and can be modified en route to include waypoint or other information.
  • RFID tags cost about $US 0.50 (50 cents) and are usually fabricated by electrically bonding a custom integrated circuit (IC) to a substrate containing a printed circuit antenna.
  • IC integrated circuit
  • the usual fabrication method, well known in the electronics industry is flip-chip bonding.
  • An electrically conductive solder paste, such as a conductive epoxy is applied to the appropriate places on the antenna.
  • a “pick and place” machine picks up the IC die and places it onto the substrate in the proper location with respect to the antenna connections.
  • the conductive epoxy then self-cures or is heated to expedite the curing process, thereby mechanically and electrically bonding the die to the antenna.
  • the substrate may have an adhesive backing for eventual manual or machine application to the end item.
  • FIG. 1 integrated circuit wafer 10 has a plethora of individual microradios 12 designed and fabricated according to techniques well know in the industry.
  • FIG. 2 illustrates a cross-section of one of these microradios.
  • Section 30 is the base semiconductor material, containing the circuitry in layer 32 (exaggerated in thickness in this drawing for clarity).
  • Layer 32 is actually composed of several sub-layers of integrated circuit materials and conductive materials that are not shown in the figure.
  • the top sub-layer of 32 may be an electrical shield as is common in integrated circuits.
  • an electrically insulating layer 34 is applied over layer 32 .
  • an electrically conductive layer 36 that is electrically connected to the appropriate part of the IC layer 32 by connection 40 , serving as one connection to an antenna.
  • the thickness and material of layer 34 are chosen to provide the correct RF properties to permit antenna connection 36 to function correctly.
  • Microradio 12 further has conducting layer 42 applied to the bottom side of die 12 .
  • This layer is connected to the appropriate part of IC layer 32 by connection 42 , serving as the other connection to an antenna by a conductive layer 38 .
  • Connection 42 which traverses the bulk semiconductor material, is fabricated by one of several methods known in the industry, such as U.S. Pat. No. 6,836,020 “Electrical through wafer interconnects”.
  • FIG. 3 illustrates details of RFID tag 48 , which is one of the subjects of this invention.
  • Antenna 50 designed according to well-known principles, is responsive to RF energy in the chosen frequency band for the tag. As described below, this antenna is fabricated using electrically conductive ink.
  • IC Die 12 with conductive surfaces 36 and 38 contains programmable device 54 together with RF interface 56 , energy storage device 58 , controller 60 and memory 62 . The functions of the RF interface, energy storage, controller and memory are typical of passive RFID tags and will also be discussed below.
  • FIG. 4 illustrated the method of manufacture of the tag.
  • the tag is printed directly onto the end item.
  • End item 80 is shown on a conveyor 82 , moving past printer head 84 .
  • Printer head 84 is mounted on adjustable arm 94 and base 96 , which may contain control electronics.
  • Conductive ink 86 is held in reservoir 87 , which is connected to print head 84 by conduit 91 .
  • Reservoir 88 contains a mixture of microradios 12 suspended in nonconductive fluid 89 .
  • Reservoir 88 is connected to print head 84 by conduit 92 .
  • antenna 50 is first printed onto end item 80 using conductive ink 86 .
  • More than one microradio is then dispensed from print head 84 into the drying ink and in the correct location with respect to antenna 50 , where one or more of the contacts will be embedded in the drying ink and thus be connected to the antenna.
  • a second portion of conductive ink 86 is then applied over microradios 12 to complete the electrical connection to antenna 50 by connecting another contact to another portion of the antenna.
  • layer 100 floats on top of liquid 89 and is not miscible with the non-conducting fluid. It will be appreciated that the same result could be achieved by moving arm 94 over a stationary end item 80 .
  • FIG. 5 illustrates a cross-section of the tags in the region of antenna 50 where several microradios 12 are located, which will serve to clarify the manufacturing process described in FIG. 4 .
  • Antenna 50 is applied to end item 80 with conductive ink 86 .
  • Microradios 12 are dispersed in nonconductive fluid 89 .
  • Electrical connection between the microradios and antenna 50 is then established by conductive ink layer 100 .
  • FIG. 6 illustrates the final form of tag 48 , consisting of printed antenna 50 and a plurality of microradios 12 .
  • Antenna 50 is typically composed of a 10- to 20- ⁇ m thick layer of electrically conductive ink with a typical resistance of 20 to 50 mOhms/square.
  • end item 80 could be replaced by a separate substrate with an adhesive backing to form a more conventional tag that could subsequently be applied to an end item.
  • microradios 12 may be correctly connected between antenna 50 and layer 100 ; however, many will be either shorted out by conductive fluid or not connected at all. More importantly, some of the microradios that are connected may have electrode 36 connected to layer 100 and some may have electrode 38 connected to this layer. This creates a situation wherein these two forms of connect compete with each other or in some cases cancel each other out completely.
  • programmable device 54 is used to select one connection and disconnect the other, thus providing a workable tag.
  • This programmable device may be a simple fuse and diode in one preferred embodiment. For integrated circuit design considerations, it may be preferable to use an anti-fuse approach instead. Other programmable elements, for example, one that automatically recognizes the correct connection may be used.
  • FIG. 7 illustrates the method of programming device 54 .
  • end item 80 with tag 48 applied is moved past programming head 142 , which is mounted on adjustable arm 146 on base 144 .
  • a unipolar voltage pulse is applied between antenna 50 and conductive layer 100 .
  • the diode will not conduct and the fuse remains intact enabling the circuit.
  • the diode conducts and the fuse blows out creating an open circuit disabling the circuit function.
  • An additional benefit of programming head 142 is the ability to program tag 48 in the same operation using well-known techniques. Shown is RF energy 210 , transmitted by programming head 142 and received by tag 48 . Now referring back to FIG. 3 , the functions of the components of die 12 will be clarified. Antenna 50 intercepts a portion of RF energy 210 , where it is sent through programmable device 54 , which is now in a state to correctly pass the energy to the RF interface 56 . The RF interface causes energy storage device to charge up. This combination of antenna and RF interface is known in the industry as a rectenna. When sufficient voltage has been achieved in the energy storage device, the rest of the IC is able to function. Data specific to end item 80 is sent to controller 60 and stored into memory 62 .
  • end item 80 with applied tag 48 may be queried by a conventional reader 200 .
  • the rectenna charge energy storage device 58 in the same way it did during programming. Now, however, controller 60 queries memory 62 and send the stored data back to the RF interface, where it is sent through antenna 50 to reader 200 .
  • the same process used to program the tag may be used to store new information.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Near-Field Transmission Systems (AREA)
  • Credit Cards Or The Like (AREA)
US11/918,812 2005-08-25 2006-08-24 RFID tag and method and apparatus for manufacturing same Active 2028-09-05 US7986236B2 (en)

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US71121705P 2005-08-25 2005-08-25
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US20090315676A1 (en) * 2005-08-25 2009-12-24 Bae Systems Information And Electronis Systems Integration Inc. Method And Apparatus For Coupling Multiple Microradios To an RFID Tag Antenna
US20110187407A1 (en) * 2010-01-29 2011-08-04 International Business Machines Corporation Radio frequency-enabled electromigration fuse
US20210209433A1 (en) * 2018-07-20 2021-07-08 Vega Grieshaber Kg Measuring device with near field interaction device
US20210345019A1 (en) * 2018-10-01 2021-11-04 Elemental Machines, Inc. Method and Apparatus for Local Sensing
US11423277B2 (en) 2017-02-07 2022-08-23 Hewlett-Packard Development Company, L.P. Fluidic conductive trace based radio-frequency identification

Families Citing this family (8)

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US7777626B2 (en) * 2005-10-13 2010-08-17 BAE Systems Information and Electronic Systems, Integration, Inc. RFID tag incorporating at least two integrated circuits
US8827391B2 (en) * 2007-05-23 2014-09-09 Xerox Corporation Concurrently digitally printing/marking an image with a circuit
US8260201B2 (en) 2007-07-30 2012-09-04 Bae Systems Information And Electronic Systems Integration Inc. Dispersive antenna for RFID tags
US7970357B2 (en) 2007-07-30 2011-06-28 Bae Systems Information And Electronic Systems Integration Inc. Transponder with stabilized oscillator
US9684862B2 (en) * 2015-10-29 2017-06-20 International Business Machines Corporation Microelectronic smart tags
US10211521B1 (en) * 2016-06-16 2019-02-19 Verily Life Sciences Llc Millimeter wave sensor system
EP3531217B1 (fr) * 2018-02-22 2020-09-30 Electronic Product Services Ltd. Appareil de programmation
US11481590B1 (en) * 2020-08-17 2022-10-25 Express Scripts Strategic Development, Inc. Pill bottles with conductive ink and reading systems and methods

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090315676A1 (en) * 2005-08-25 2009-12-24 Bae Systems Information And Electronis Systems Integration Inc. Method And Apparatus For Coupling Multiple Microradios To an RFID Tag Antenna
US8164460B2 (en) * 2005-08-25 2012-04-24 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for coupling multiple microradios to an RFID tag antenna
US20110187407A1 (en) * 2010-01-29 2011-08-04 International Business Machines Corporation Radio frequency-enabled electromigration fuse
US8169321B2 (en) * 2010-01-29 2012-05-01 International Business Machines Corporation Radio frequency-enabled electromigration fuse
US11423277B2 (en) 2017-02-07 2022-08-23 Hewlett-Packard Development Company, L.P. Fluidic conductive trace based radio-frequency identification
US20210209433A1 (en) * 2018-07-20 2021-07-08 Vega Grieshaber Kg Measuring device with near field interaction device
US12061943B2 (en) * 2018-07-20 2024-08-13 Vega Grieshaber Kg Measuring device with near field interaction device
TWI853826B (zh) * 2018-07-20 2024-09-01 德商Ｖｅｇａ格里沙貝兩合公司 具有近場交互裝置之測量設備、操作該測量設備之方法，程式元件，及電腦可讀媒介
US20210345019A1 (en) * 2018-10-01 2021-11-04 Elemental Machines, Inc. Method and Apparatus for Local Sensing
US12160694B2 (en) * 2018-10-01 2024-12-03 Elemental Machines, Inc. Method and apparatus for local sensing

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US20090066517A1 (en) 2009-03-12
WO2007025060A2 (fr) 2007-03-01
WO2007025060A3 (fr) 2009-04-16

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