US3137571A - Palladium base alloy and method of producing same - Google Patents
Palladium base alloy and method of producing same Download PDFInfo
- Publication number
- US3137571A US3137571A US170223A US17022362A US3137571A US 3137571 A US3137571 A US 3137571A US 170223 A US170223 A US 170223A US 17022362 A US17022362 A US 17022362A US 3137571 A US3137571 A US 3137571A
- Authority
- US
- United States
- Prior art keywords
- palladium
- gallium
- alloys
- base alloy
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 39
- 229910045601 alloy Inorganic materials 0.000 title claims description 23
- 239000000956 alloy Substances 0.000 title claims description 23
- 229910052763 palladium Inorganic materials 0.000 title claims description 19
- 238000000034 method Methods 0.000 title description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 19
- 229910052733 gallium Inorganic materials 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910001252 Pd alloy Inorganic materials 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910000807 Ga alloy Inorganic materials 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001361 White metal Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
Definitions
- Alloys of metals of the platinum group with baser metals have been employed commercially for many years in applications such as electrical and switch contacts, electrical conductors, resistance Wire, and the like, where high electrical and thermal conductivity, resistance to heat and corrosion, ductility, and tensile strength are of importance.
- metals as platinum, palladium, rhodium and iridium have been alloyed with silver, nickel, copper and zinc.
- a known alloy of platinum containing about 8% tungsten is extensively used for the production of electronic components, for example as a wire contact member in diodes. This alloy has disadvantages which include a Rockwell hardness of only about 22, and a fairly low resistance to flexing or bending, frequently breaking when first sharply bent. Alloys of palladium and zinc have been proposed for telephone circuitry, but the preparation of these alloys offers some difficulty in that it involves diffusion of the zinc into the palladium at high temperatures.
- new and useful alloys have been prepared from palladium and gallium which possess outstanding properties of resilience, hardness and resistance to fatigue.
- These novel alloys comprise palladium containing from about /2% to about 15% by weight of gallium.
- the new alloys of the invention are useful as electrical contact elements, for example with silicon diodes.
- An alloy containing about /z% to 2 /z% and preferably about 1% to 2% gallium has proved especially useful for diodes as a substitute forgold bonded diodes.
- They can readily be manufactured in any form, shape or thickness, as for example, in the form of sheets or wires of any desired gauge. Their resilience renders them suitable for use for small springs for watches and scientific instruments.
- the resistivity of the alloys makes them especially valuable in potentiometers.
- the alloys of palladium and gallium are prepared simply and directly by heating together palladium metal in the form of strip or wire and the required quantity of gallium metal at a temperature slightly above the melting point of the palladium until the molten mass has become homogeneous. The mass is allowed to cool and can be fabricated into any desired shape.
- the novel alloys of the invention can be heat treated.
- the starting materials are palladium, preferably of pure grade (99.9%), having a melting point about 1554 C., and a specific gravity of 12.0, and gallium metal.
- the gallium is a silvery-white metal, having a melting point of 29.7 C., and hence generally liquid at ordinary temperatures, and having a boiling point of 1983 C. Its specific gravity is 5.9 (solid).
- the palladium-gallium alloys of the invention have a silvery-white appearance, and a melting point slightly below that of palladium.
- the specific gravity is about 11.15.
- Example 92 grams of palladium wire were heated together with 8 grams gallium in a crucible placed in an electric furnace until the palladium had completely melted, the temperature then being 2831 F., and the mass had become homogeneous.
- the molten alloy was allowed to cool, removed from the crucible, and formed into ribbon. If desired, the alloying can be conducted under an atmosphere of an inert gas, such as nitrogen.
- the resulting alloy was silvery-white in appearance, and had a specific gravity of 11.15. It possessed a tensile strength of about 200,000 pounds per square inch, and a hardness on the Rockwell C scale of 36.
- the alloy had an electrical resistance of 250 ohms per circular mil foot. It is very ductile and can readily be rolled into wire or flat ribbon.
- the electrical resistance properties of the alloys of the invention have been found to be a function of the amount of gallium present, higher percentages of gallium imparting higher resistance and vice versa.
- a palladium base alloy consisting essentially of from about /2% to about 2 /2% by Weight of gallium, the remainder of the alloy being palladium.
- a palladium base alloy consisting essentially of v 0 base alloy consisting essentially of 98% to 99% palladium and 2% to 1% gallium by weight.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Contacts (AREA)
Description
United States Patent 3,137,571 PALLABIUM BASE ALLOY AND METHGB 0F PRCDUCING SAME Irving Cooper, Brookl N.Y., assignor to Joseph E. Cooper 8; Sons Inc., New York, N.Y., a corporation of New York No Drawing. Filed Jan, 31, 1962, Ser. No. 170,223 8 Claims. (Ci. 75--1'72) This invention relates to novel alloys of palladium and gallium, and to a method for their production. More particularly, the invention concerns palladium base alloys containing from about /2% to about 15% by Weight of gallium.
Alloys of metals of the platinum group with baser metals have been employed commercially for many years in applications such as electrical and switch contacts, electrical conductors, resistance Wire, and the like, where high electrical and thermal conductivity, resistance to heat and corrosion, ductility, and tensile strength are of importance. Thus, such metals as platinum, palladium, rhodium and iridium have been alloyed with silver, nickel, copper and zinc. A known alloy of platinum containing about 8% tungsten is extensively used for the production of electronic components, for example as a wire contact member in diodes. This alloy has disadvantages which include a Rockwell hardness of only about 22, and a fairly low resistance to flexing or bending, frequently breaking when first sharply bent. Alloys of palladium and zinc have been proposed for telephone circuitry, but the preparation of these alloys offers some difficulty in that it involves diffusion of the zinc into the palladium at high temperatures.
In accordance with the present invention, new and useful alloys have been prepared from palladium and gallium which possess outstanding properties of resilience, hardness and resistance to fatigue. These novel alloys comprise palladium containing from about /2% to about 15% by weight of gallium.
The new alloys of the invention are useful as electrical contact elements, for example with silicon diodes. An alloy containing about /z% to 2 /z% and preferably about 1% to 2% gallium has proved especially useful for diodes as a substitute forgold bonded diodes. They can readily be manufactured in any form, shape or thickness, as for example, in the form of sheets or wires of any desired gauge. Their resilience renders them suitable for use for small springs for watches and scientific instruments. The resistivity of the alloys makes them especially valuable in potentiometers.
The alloys of palladium and gallium are prepared simply and directly by heating together palladium metal in the form of strip or wire and the required quantity of gallium metal at a temperature slightly above the melting point of the palladium until the molten mass has become homogeneous. The mass is allowed to cool and can be fabricated into any desired shape. The novel alloys of the invention can be heat treated.
The starting materials are palladium, preferably of pure grade (99.9%), having a melting point about 1554 C., and a specific gravity of 12.0, and gallium metal. The gallium is a silvery-white metal, having a melting point of 29.7 C., and hence generally liquid at ordinary temperatures, and having a boiling point of 1983 C. Its specific gravity is 5.9 (solid).
The palladium-gallium alloys of the invention have a silvery-white appearance, and a melting point slightly below that of palladium. The specific gravity is about 11.15.
3,137,571 Patented June 16, teen The preparation and properties of the novel palladiumgalliurn alloys of the invention as a class are illustrated by one preferred embodiment of the invention, which is a ribbon alloy of palladium containing 8% gallium by weight, and are set forth in the following example.
Example 92 grams of palladium wire were heated together with 8 grams gallium in a crucible placed in an electric furnace until the palladium had completely melted, the temperature then being 2831 F., and the mass had become homogeneous. The molten alloy was allowed to cool, removed from the crucible, and formed into ribbon. If desired, the alloying can be conducted under an atmosphere of an inert gas, such as nitrogen.
The resulting alloy was silvery-white in appearance, and had a specific gravity of 11.15. It possessed a tensile strength of about 200,000 pounds per square inch, and a hardness on the Rockwell C scale of 36.
The alloy had an electrical resistance of 250 ohms per circular mil foot. It is very ductile and can readily be rolled into wire or flat ribbon.
The electrical resistance properties of the alloys of the invention have been found to be a function of the amount of gallium present, higher percentages of gallium imparting higher resistance and vice versa. When rolled into ribbon of widths ranging from 0.015 to 0.0700 inch and thickness ranging from 0.002 to 0.0095 inch, they provide an electrical contact member which is especially effective and economical in connection with diodes.
The following is data on the various percentages of gallium alloyed with palladium.
Resistance,
Hardness ohms/c.m.f. 7
Pure Palladium 1R0ckwell B.
22-Rockwell B." 56Rockwell B. 4Rockwell O. 35Rockwel1 C. 45-Rockwell "0.
15% Gallium from about /2% to about 15% by weight of gallium, the
remainder of the alloy being palladium.
3. A palladium base alloy consisting essentially of from about /2% to about 2 /2% by Weight of gallium, the remainder of the alloy being palladium.
4. A palladium base alloy consisting essentially of v 0 base alloy consisting essentially of 98% to 99% palladium and 2% to 1% gallium by weight.
References Cited in the file of this patent Hansen: Constitution of Binary Alloys, 1958, McGraw-, Hill Book Company, Inc., New York, page 752.
Claims (1)
1. A PALLADIUM BASE ALLOY CONSISTING ESSENTIALLY OF FROM ABOUT 1/2% TO ABOUT 15% BY WEIGHT OF GALLIUM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US170223A US3137571A (en) | 1962-01-31 | 1962-01-31 | Palladium base alloy and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US170223A US3137571A (en) | 1962-01-31 | 1962-01-31 | Palladium base alloy and method of producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3137571A true US3137571A (en) | 1964-06-16 |
Family
ID=22619052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US170223A Expired - Lifetime US3137571A (en) | 1962-01-31 | 1962-01-31 | Palladium base alloy and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3137571A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4179288A (en) * | 1979-01-24 | 1979-12-18 | Neoloy Products, Inc. | Palladium base dental alloy |
| US5174954A (en) * | 1991-03-01 | 1992-12-29 | Ivoclar N.A. | Palladium alloys for dental implant restorations |
| US11318446B2 (en) * | 2020-05-28 | 2022-05-03 | Taizhou University | Activated carbon/Pd-Ga liquid alloy composite catalyst, preparation method and use thereof |
| EP4074435A3 (en) * | 2021-02-26 | 2022-12-21 | C. Hafner GmbH + Co. KG | Powder made of spherical particles of a noble metal alloy containing platinum or palladium, use of this powder in a powder-based production method for producing a three-dimensional object, and an additive method for producing a three-dimensional object using the aforementioned powder |
-
1962
- 1962-01-31 US US170223A patent/US3137571A/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| None * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4179288A (en) * | 1979-01-24 | 1979-12-18 | Neoloy Products, Inc. | Palladium base dental alloy |
| US5174954A (en) * | 1991-03-01 | 1992-12-29 | Ivoclar N.A. | Palladium alloys for dental implant restorations |
| US11318446B2 (en) * | 2020-05-28 | 2022-05-03 | Taizhou University | Activated carbon/Pd-Ga liquid alloy composite catalyst, preparation method and use thereof |
| EP4074435A3 (en) * | 2021-02-26 | 2022-12-21 | C. Hafner GmbH + Co. KG | Powder made of spherical particles of a noble metal alloy containing platinum or palladium, use of this powder in a powder-based production method for producing a three-dimensional object, and an additive method for producing a three-dimensional object using the aforementioned powder |
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