US2168909A - Producing etched surfaces on aluminum - Google Patents
Producing etched surfaces on aluminum Download PDFInfo
- Publication number
- US2168909A US2168909A US113703A US11370336A US2168909A US 2168909 A US2168909 A US 2168909A US 113703 A US113703 A US 113703A US 11370336 A US11370336 A US 11370336A US 2168909 A US2168909 A US 2168909A
- Authority
- US
- United States
- Prior art keywords
- copper
- aluminum
- solution
- etching
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052782 aluminium Inorganic materials 0.000 title description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 33
- 239000000243 solution Substances 0.000 description 35
- 238000005530 etching Methods 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- 239000003513 alkali Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910017052 cobalt Inorganic materials 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 150000001869 cobalt compounds Chemical class 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 2
- 229930006000 Sucrose Natural products 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229960004793 sucrose Drugs 0.000 description 2
- 239000007991 ACES buffer Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241001446467 Mama Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000001476 sodium potassium tartrate Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
Definitions
- This invention relates to the production of etched aluminum surfaces, and particularly to the production of etched surfaces having uniform reflecting properties and brightness on cop r-free aluminum. 7
- Etched aluminum surfaces have found wide application on articles used as light reflectors, engraved name plates, and more recently for reflectors used for the reflection of ultra violet m radiation.
- a solution of sodium hydroxide has been extensively used for producing this type of surface. The common procedure is to etch the aluminum surface in a hot solution of sodium hydroxide, then dip the article in nitric acid, and
- the aluminum to be etched should contain a small amount of copper, the best results being obtained by etching aluminum con-- zo taining about 0.1 to 0.2 per cent copper.
- the etch obtained is frequently nonuniform and the surface appears hazy and 25 streaked. This difliculty becomes more pronounced as the copper content of the aluminum treated decreases below about 0.05 per cent.
- Copper is generally present as an impurity in 45 commercial aluminum.
- copper-free aluminum used herein in describing this invention and in the appended claims contemplates, therefore, both aluminum and aluminum alloys completely free of copper, and aluminum and 50 aluminum alloys containing less than about 0.05
- the article having a copper-free aluminum surface is immersed in a hot solution containing an alkali, such as sodium or potassium hydroxide or carbonate, 9. compound of a metal such as copper or cobalt, and, if necessary, a reagent adapted to hold the metal compound in solution.
- concentration of the caustic etching solution is not critical.
- a suitable etching action may be obtained using a solution having a causticity equal to that obtained in an alkali metal hydroxide solution in a range of
- the metal compound may be introduced into the caustic solution by the addition thereto of any suitable soluble salt.
- copper be present in the etching solution.
- a copper salt is introduced into the alkali solution it is generally n also that an agent be added capable of holding in solution the copper compound formed.
- an agent be added capable of holding in solution the copper compound formed.
- I have foundammonium hydroxide to be particularly suitable, but good results have also been obtained by the addition of glycerin, sodium-potassium tartrate, and cane sugar.
- cobalt salts are added to the alkali etching solution it is generally necessary to add also an agent capable of holding the cobalt compound formed in solution.
- Sodium-potasium tartrate or cane sugar is preferred for this purpose; glycerin or ammonium hydroxide also work satisfactorily.
- the amount of metallic compound to be added varies with the concentration of the alkali solution employed, as well as with the temperature of the etching treatment.
- the amounts required are quite small, usually of the order of 0.005 to 0.03 per cent of the metal added in the form of the metallic compound. This amount is not critical, however, and can be varied if desired.
- the metal compound should be replenished from time to time because the metal or some compound of the metal is removed from the bath as a dark deposit or coating which forms on the surface of each article treated.
- the amount of stabilizing agent added to hold the copper or cobalt compound in solution also varies with the strength of the etching solution and the amount of the metallic compound present.
- the time of etching will depend upon the amount of impurities in the surface of the article and the degree of diffusivity desired. An etch of 5 to 10 minutes has generally been found to give good results.
- the temperature of the bath is preferably maintained at about 140 to 170 F., although higher or lower temperatures may be used if desired.
- the dark film formed on the aluminum surface during the treatment in the etching solution is removed by treating the article with a solution of strong nitric acid. This treatment dissolves the dark film to expose a uniformly etched bright metallic reflecting surface free from streaks and haze.
- a tank was filled with 100 gallons of 5% sodium hydroxide solution, and A pound of copper sulfate and 3 pounds of ammonium hydroxide were added.
- the resulting blue solution was heated to 140 F. and a strip of copper-free aluminum sheet was immersed in the bath for a The sheet so treated was then taken from the bath and treated in a 50% in the first step of the process was removed from the surface of the sheet.
- the sheet was then removed from the acid bath, washed and dried, and exhibited a uniformly etched reflecting surface free from streaks and haze and having a bright metallic lustre.
- a method of etching an article having a. copper-free aluminum surface which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt.
- a method of etching an article having a copper-free aluminum surface which comprises treating said surface with a hot etching solution of sodium hydroxide having dissolved therein a metal selected from the group consisting of copper, and cobalt.
- a method of etching an article having a copper-free aluminum surface which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
- a method of etching an article having a copper-free aluminum surface which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with nitric acid solution.
- a method of etching an article having a copper-free aluminum surface which comprises treating said surface with a hot etching solution of sodium hydroxide having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
- a method of etching an article having a copper-free aluminum surface which comprises treating the surface with a hot etching solution of an alkali having dissolved therein a copper compound.
- a method of etching an article having a copper-free aluminum surface which comprises treating the surface with a hot etching solution of an alkali containing a copper compound and a reagent capable of maintaining said copper compound in solution.
- a method of etching an article having a copper-free aluminum surface which comprises treating the surface with a hot etching solution of an alkali having dissolved therein a cobalt compound.
- a method of etching an article having a copper-free aluminum surface which comprises treating the surface with a hot etching solution of an alkali containing a cobalt compound and a reagent capable of maintaining said cobalt compound in solution.
- a method of etching an article having a copper-free aluminum surface which comprises treating said surface with a hot etching solution of potassium hydroxide having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
mama Aug. '8, 1939 UNITED STATES PRODUCING ETOHED SUII'ACES ON ALUMINUM Ralph D. Mason, New I ensington, P8, to Aluminum Company of America, Pittsburgh,
Pennlrlnnla Pa., a corporation of No Ih'awing. Application Decunber 1, 1936,
Serial No. 113,703
10 Claim.
This invention relates to the production of etched aluminum surfaces, and particularly to the production of etched surfaces having uniform reflecting properties and brightness on cop r-free aluminum. 7
Etched aluminum surfaces have found wide application on articles used as light reflectors, engraved name plates, and more recently for reflectors used for the reflection of ultra violet m radiation. A solution of sodium hydroxide has been extensively used for producing this type of surface. The common procedure is to etch the aluminum surface in a hot solution of sodium hydroxide, then dip the article in nitric acid, and
15 subsequently wash and dry. It is known that in order to obtain a uniform etch and bright surface by this process, the aluminum to be etched should contain a small amount of copper, the best results being obtained by etching aluminum con-- zo taining about 0.1 to 0.2 per cent copper. when aluminum surfaces containing only a few hundredths of one per cent copper are treated in this manner, the etch obtained is frequently nonuniform and the surface appears hazy and 25 streaked. This difliculty becomes more pronounced as the copper content of the aluminum treated decreases below about 0.05 per cent.
It is an object of this invention to overcome the difliculties heretofore encountered in the etching 30 of copper-free aluminum surfaces, and to produce copper-free aluminum articles having uniformly etched surfaces of high reflectivity and having a 11gb metallic lustre.
It is a further object of this invention to pro- 35 vide a method of etching articles having surfaces of copper-free aluminum whereby there is produced thereon a uniform reflecting surface substantially free from haze and streaks. It is a further object of this invention to produce animproved etching solution for application to copper-free aluminum to produce thereon an etched reflecting surface of uniform reflectivity and brightness.
Copper is generally present as an impurity in 45 commercial aluminum. The term copper-free aluminum" used herein in describing this invention and in the appended claims contemplates, therefore, both aluminum and aluminum alloys completely free of copper, and aluminum and 50 aluminum alloys containing less than about 0.05
per cent copper as an impurity.
I have discovered that when a copper-free aluminum surface is etched in a solution of an alkali to which certain metallic salts have been as added. the su face c n b u i o y etched to concentration of 5 to 15 per cent.
produce a surface substantially free from any streaked or hazy appearanceand having a uniform reflectivity and brightness and a high metallic lustre.
In practicingmy invention, the article having a copper-free aluminum surface is immersed in a hot solution containing an alkali, such as sodium or potassium hydroxide or carbonate, 9. compound of a metal such as copper or cobalt, and, if necessary, a reagent adapted to hold the metal compound in solution. The concentration of the caustic etching solution is not critical. A suitable etching action may be obtained using a solution having a causticity equal to that obtained in an alkali metal hydroxide solution in a range of The metal compound may be introduced into the caustic solution by the addition thereto of any suitable soluble salt.
While the compounds of cobalt and copper give good results, it is preferable that copper be present in the etching solution. when a copper salt is introduced into the alkali solution it is generally n also that an agent be added capable of holding in solution the copper compound formed. For this purpose I have foundammonium hydroxide to be particularly suitable, but good results have also been obtained by the addition of glycerin, sodium-potassium tartrate, and cane sugar. Similarly, when cobalt salts are added to the alkali etching solution it is generally necessary to add also an agent capable of holding the cobalt compound formed in solution. Sodium-potasium tartrate or cane sugar is preferred for this purpose; glycerin or ammonium hydroxide also work satisfactorily.
The amount of metallic compound to be added varies with the concentration of the alkali solution employed, as well as with the temperature of the etching treatment. The amounts required are quite small, usually of the order of 0.005 to 0.03 per cent of the metal added in the form of the metallic compound. This amount is not critical, however, and can be varied if desired. In commercial practice, when the bath is in continuous use, the metal compound should be replenished from time to time because the metal or some compound of the metal is removed from the bath as a dark deposit or coating which forms on the surface of each article treated. The amount of stabilizing agent added to hold the copper or cobalt compound in solution also varies with the strength of the etching solution and the amount of the metallic compound present.
-" nitric acid bath in which the dark deposit formed period of 3 minutes.
Usually amounts below about 10 per cent are sufficient, although more may be used if desired.
The time of etching will depend upon the amount of impurities in the surface of the article and the degree of diffusivity desired. An etch of 5 to 10 minutes has generally been found to give good results. The temperature of the bath is preferably maintained at about 140 to 170 F., although higher or lower temperatures may be used if desired. The dark film formed on the aluminum surface during the treatment in the etching solution is removed by treating the article with a solution of strong nitric acid. This treatment dissolves the dark film to expose a uniformly etched bright metallic reflecting surface free from streaks and haze.
As a specific example of the method of my invention a tank was filled with 100 gallons of 5% sodium hydroxide solution, and A pound of copper sulfate and 3 pounds of ammonium hydroxide were added. The resulting blue solution was heated to 140 F. and a strip of copper-free aluminum sheet was immersed in the bath for a The sheet so treated was then taken from the bath and treated in a 50% in the first step of the process was removed from the surface of the sheet. The sheet was then removed from the acid bath, washed and dried, and exhibited a uniformly etched reflecting surface free from streaks and haze and having a bright metallic lustre.
I claim:
1. A method of etching an article having a. copper-free aluminum surface, which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt.
2. A method of etching an article having a copper-free aluminum surface, which comprises treating said surface with a hot etching solution of sodium hydroxide having dissolved therein a metal selected from the group consisting of copper, and cobalt.
3. A method of etching an article having a copper-free aluminum surface, which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
4. A method of etching an article having a copper-free aluminum surface, which comprises treating said surface with a hot etching solution of an alkali having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with nitric acid solution.
5. A method of etching an article having a copper-free aluminum surface, which comprises treating said surface with a hot etching solution of sodium hydroxide having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
6. A method of etching an article having a copper-free aluminum surface, which comprises treating the surface with a hot etching solution of an alkali having dissolved therein a copper compound.
7. A method of etching an article having a copper-free aluminum surface, which comprises treating the surface with a hot etching solution of an alkali containing a copper compound and a reagent capable of maintaining said copper compound in solution.
8. A method of etching an article having a copper-free aluminum surface, which comprises treating the surface with a hot etching solution of an alkali having dissolved therein a cobalt compound.
9. A method of etching an article having a copper-free aluminum surface, which comprises treating the surface with a hot etching solution of an alkali containing a cobalt compound and a reagent capable of maintaining said cobalt compound in solution.
10. A method of etching an article having a copper-free aluminum surface, which comprises treating said surface with a hot etching solution of potassium hydroxide having dissolved therein a compound of a metal selected from the group consisting of copper and cobalt until a dark deposit is formed thereon, and thereafter removing the deposit by treating the article with a solvent for said deposit.
RALPH B. MASON.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US113703A US2168909A (en) | 1936-12-01 | 1936-12-01 | Producing etched surfaces on aluminum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US113703A US2168909A (en) | 1936-12-01 | 1936-12-01 | Producing etched surfaces on aluminum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2168909A true US2168909A (en) | 1939-08-08 |
Family
ID=22351002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US113703A Expired - Lifetime US2168909A (en) | 1936-12-01 | 1936-12-01 | Producing etched surfaces on aluminum |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2168909A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2472304A (en) * | 1944-03-13 | 1949-06-07 | Aluminum Co Of America | Method of etching aluminum |
| US2614913A (en) * | 1950-10-20 | 1952-10-21 | Gen Motors Corp | Brightening bath |
| US2620265A (en) * | 1950-09-28 | 1952-12-02 | Kaiser Aluminium Chem Corp | Composition for treating aluminum and aluminum alloys |
| DE762716C (en) * | 1939-12-17 | 1953-03-16 | Versuchsanstalt Fuer Luftfahrt | Process for roughening the surfaces of objects made of aluminum alloys for the purpose of applying firmly adhering galvanic chromium deposits |
| US2637929A (en) * | 1950-04-27 | 1953-05-12 | Walter J Hausman | Process for producing lithographic printing plates |
| US2641653A (en) * | 1950-04-05 | 1953-06-09 | Automatic Elect Lab | Ringer circuit using cold cathode tube |
| US2650875A (en) * | 1950-12-09 | 1953-09-01 | Diversey Corp | Method of etching aluminum and aluminum base alloys |
| US2653860A (en) * | 1953-03-09 | 1953-09-29 | Enthone | Etching aluminum using saccharic acid as a modifier |
| US2653861A (en) * | 1953-03-09 | 1953-09-29 | Enthone | Etching aluminum using hexahydroxyheptanoic acid as a modifier |
| US2657981A (en) * | 1950-01-31 | 1953-11-03 | Victoreen Instr Company | Method of etching and polishing aluminum |
| US2671717A (en) * | 1950-08-29 | 1954-03-09 | Gen Electric | Chemical brightening of aluminum |
| US2673143A (en) * | 1951-03-10 | 1954-03-23 | Diversey Corp | Producing a mirrorlike finish on aluminum |
| US2836566A (en) * | 1954-01-27 | 1958-05-27 | Detrex Chem Ind | Cleaning composition and method |
| US2897066A (en) * | 1956-10-12 | 1959-07-28 | Hunt Capacitors Ltd A | Electrical capacitors |
| US2918357A (en) * | 1955-11-02 | 1959-12-22 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US2939772A (en) * | 1955-07-18 | 1960-06-07 | Turco Products Inc | Process for etching aluminum and aluminum alloy surfaces |
| US2975040A (en) * | 1955-11-02 | 1961-03-14 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US2975039A (en) * | 1955-11-02 | 1961-03-14 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US4337114A (en) * | 1980-10-29 | 1982-06-29 | Sprague Electric Company | Nodular copper removal from aluminum foil surfaces |
-
1936
- 1936-12-01 US US113703A patent/US2168909A/en not_active Expired - Lifetime
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE762716C (en) * | 1939-12-17 | 1953-03-16 | Versuchsanstalt Fuer Luftfahrt | Process for roughening the surfaces of objects made of aluminum alloys for the purpose of applying firmly adhering galvanic chromium deposits |
| US2472304A (en) * | 1944-03-13 | 1949-06-07 | Aluminum Co Of America | Method of etching aluminum |
| US2657981A (en) * | 1950-01-31 | 1953-11-03 | Victoreen Instr Company | Method of etching and polishing aluminum |
| US2641653A (en) * | 1950-04-05 | 1953-06-09 | Automatic Elect Lab | Ringer circuit using cold cathode tube |
| US2637929A (en) * | 1950-04-27 | 1953-05-12 | Walter J Hausman | Process for producing lithographic printing plates |
| US2671717A (en) * | 1950-08-29 | 1954-03-09 | Gen Electric | Chemical brightening of aluminum |
| US2620265A (en) * | 1950-09-28 | 1952-12-02 | Kaiser Aluminium Chem Corp | Composition for treating aluminum and aluminum alloys |
| US2614913A (en) * | 1950-10-20 | 1952-10-21 | Gen Motors Corp | Brightening bath |
| US2650875A (en) * | 1950-12-09 | 1953-09-01 | Diversey Corp | Method of etching aluminum and aluminum base alloys |
| US2673143A (en) * | 1951-03-10 | 1954-03-23 | Diversey Corp | Producing a mirrorlike finish on aluminum |
| US2653861A (en) * | 1953-03-09 | 1953-09-29 | Enthone | Etching aluminum using hexahydroxyheptanoic acid as a modifier |
| US2653860A (en) * | 1953-03-09 | 1953-09-29 | Enthone | Etching aluminum using saccharic acid as a modifier |
| US2836566A (en) * | 1954-01-27 | 1958-05-27 | Detrex Chem Ind | Cleaning composition and method |
| US2939772A (en) * | 1955-07-18 | 1960-06-07 | Turco Products Inc | Process for etching aluminum and aluminum alloy surfaces |
| US2918357A (en) * | 1955-11-02 | 1959-12-22 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US2975040A (en) * | 1955-11-02 | 1961-03-14 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US2975039A (en) * | 1955-11-02 | 1961-03-14 | Pennsalt Chemicals Corp | Chemical composition and process for aluminum etching |
| US2897066A (en) * | 1956-10-12 | 1959-07-28 | Hunt Capacitors Ltd A | Electrical capacitors |
| US4337114A (en) * | 1980-10-29 | 1982-06-29 | Sprague Electric Company | Nodular copper removal from aluminum foil surfaces |
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