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US20180320717A1 - Device and method for gas maintenance in microfeatures on a submerged surface - Google Patents

Device and method for gas maintenance in microfeatures on a submerged surface Download PDF

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Publication number
US20180320717A1
US20180320717A1 US15/325,421 US201515325421A US2018320717A1 US 20180320717 A1 US20180320717 A1 US 20180320717A1 US 201515325421 A US201515325421 A US 201515325421A US 2018320717 A1 US2018320717 A1 US 2018320717A1
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electrode
microfeatures
microstructured surface
gas
substrate
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Muchen Xu
Chang-Jin Kim
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University of California San Diego UCSD
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University of California San Diego UCSD
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Publication of US20180320717A1 publication Critical patent/US20180320717A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/002—Influencing flow of fluids by influencing the boundary layer
    • F15D1/0065—Influencing flow of fluids by influencing the boundary layer using active means, e.g. supplying external energy or injecting fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B1/00—Hydrodynamic or hydrostatic features of hulls or of hydrofoils
    • B63B1/32—Other means for varying the inherent hydrodynamic characteristics of hulls
    • B63B1/34—Other means for varying the inherent hydrodynamic characteristics of hulls by reducing surface friction
    • B63B1/38—Other means for varying the inherent hydrodynamic characteristics of hulls by reducing surface friction using air bubbles or air layers gas filled volumes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B5/00—Electrogenerative processes, i.e. processes for producing compounds in which electricity is generated simultaneously
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/002—Influencing flow of fluids by influencing the boundary layer
    • F15D1/0025—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply
    • F15D1/003—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply comprising surface features, e.g. indentations or protrusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0093—Other properties hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B1/00—Hydrodynamic or hydrostatic features of hulls or of hydrofoils
    • B63B1/32—Other means for varying the inherent hydrodynamic characteristics of hulls
    • B63B1/34—Other means for varying the inherent hydrodynamic characteristics of hulls by reducing surface friction
    • B63B1/38—Other means for varying the inherent hydrodynamic characteristics of hulls by reducing surface friction using air bubbles or air layers gas filled volumes
    • B63B2001/387—Other means for varying the inherent hydrodynamic characteristics of hulls by reducing surface friction using air bubbles or air layers gas filled volumes using means for producing a film of air or air bubbles over at least a significant portion of the hull surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/002—Influencing flow of fluids by influencing the boundary layer
    • F15D1/0085—Methods of making characteristic surfaces for influencing the boundary layer

Definitions

  • the field of the invention generally relates to methods and devices that use microstructured hydrophobic surfaces including superhydrophobic surfaces and more particularly to methods and devices that maintain gas on the microstructured hydrophobic surfaces while they are submerged in liquid.
  • a superhydrophobic (SHPo) surface is defined as a solid surface on which water in air forms a contact angle greater than 150 degrees.
  • Such high contact angles have so far been found only on structured hydrophobic surfaces, the structures typically in micrometers, although not all structured hydrophobic surfaces are SHPo.
  • a typical demonstration of SHPo surfaces is water droplets rolling around on them with little resistance.
  • SHPo surfaces have shown promise when submerged in water (i.e., no droplet) as well because their surface structures or microfeatures can hold a gas film under water.
  • drag reduction as the gas held within (in between) the microfeatures lubricates water flows on them, effectively allowing the water to slip on the surface.
  • FIG. 1 illustrates the transition of a SHPo surface from a non-wetted state (top) to a wetted state (bottom).
  • the surface may get wet and lose its slip effect if it has defects, the liquid is under pressure, or the gas within the microfeatures diffuses away to the liquid over time.
  • the superhydrophobicity and its attendant benefits in drag reduction , biofouling prevention , etc. are lost.
  • a gas layer can be pneumatically pressurized either actively or passively so that it can withstand elevated liquid pressures.
  • hierarchically structures have been employed to make SHPo surfaces more resistant to liquid pressure.
  • these previous improvements do not work unless the liquid pressure is relatively small (e.g., even 0.5 atm is too high).
  • these approaches are only preventive measures. They are ineffective once the gas layer is disrupted.
  • the ability to maintain the gas on the structured hydrophobic surfaces under various adverse conditions is needed to utilize the gas trapping surfaces in most real applications. More desirable for robustness is the ability to restore the gas even after the surface becomes wetted by any unexpected events.
  • a successful scheme should be able to displace the liquid that has impregnated the surface structures with new gas and restore a stable gas film.
  • U.S. Patent Application Publication No. 2013/0122195 describes a method and device for restoring and maintaining superhydrophobicity in a self-regulating manner.
  • self-regulation means the restoration and maintenance are accomplished without any discrete sensing or control mechanism. More specifically, the gas is replenished only when and where the existing gas is lost without employing any sensing mechanism to detect the loss of the existing gas or control mechanism to decide to provide new gas.
  • the replenishing gas is generated from the electrolysis of the intruding water. Since this gas generation is electrolytic, i.e., electrochemical driven by electric power, the superhydrophobic surface is electrically connected to an external power source that provides the necessary energy.
  • the gas-recovering surface does not require any external assistance such as the external power source. That is to say, there is a need to provide for a surface that can maintain and restore superhydrophobicity in a “self-sufficient” manner, i.e., without the need for any external assistance, as well as the self-regulating manner.
  • the replenishing gas is generated from the chemical reactor by chemical means, which would not need energy input from outside.
  • the chemical gas generation was found to be inefficient and offer only a short lifetime of service.
  • electrolyte e.g., moisture
  • the chemical reaction-based gas generation surface of the type disclosed in the '195 publication suffers from a short lifespan.
  • a self-controlled, self-sufficient gas maintenance method with a longer service life is desired.
  • a microstructured surface is disclosed with non-wetting (i.e., hydrophobic if used with or in water) microfeatures or other structures that has a self-regulated, self-powered gas generator, which generates a gas or gases through electrochemical reaction.
  • the microfeatures may include, by way of example, trenches, ridges, posts, holes, random structures, or the like.
  • Self-regulation refers to a gas or gases that is generated within the microfeatures when all or a portion of the microfeatures are filled with an electrolyte (i.e., electrically conductive liquid, e.g., seawater) and not generated when the microfeatures are free of the electrolyte, all without any other component to sense the loss of gas or decide the time for gas generation.
  • Self-power refers to gas that is generated by a powering mechanism or feature built within the surface without using any external assistance such as an external source of electric power. Since electrochemical processes require electric energy, the disclosed device needs to be self-powered so as not to require an external power source such as battery.
  • the self-powered gas generation is a subset of self-sufficient gas-generation modalities or designs that do not require external assistance. For example, gas generation by a chemical process is self-sufficient but not self-powered. This difference is important because the gas generator based on electrochemical processes has a much longer lifespan compared with the gas generator based on chemical process.
  • the invention helps to maintain the gas on a gas-retaining microstructured surface (e.g., superhydrophobic surface) when submerged in a liquid.
  • a gas-retaining microstructured surface e.g., superhydrophobic surface
  • Examples of utility include (1) reducing the skin-friction drag of a solid object moving in a liquid (e.g., water vehicle or watercraft), (2) a liquid flowing past a solid surface (e.g., pipe flow), and (3) a surface that does not suffer or suffers less from biofouling under water.
  • a microstructured surface includes a plurality of microfeatures disposed on a substrate and defining a space located between inner surfaces of the plurality of microfeatures, wherein the inner surfaces between the plurality of microfeatures are hydrophobic.
  • the microstructured surface includes a gas generator formed from a first electrode of an electrode pair that is electrically connected to a second electrode of the electrode pair, the first electrode disposed within the space located between inner surfaces of the plurality of microfeatures and configured to generate a gas by a spontaneous electrochemical reaction when part of the space located between the microfeatures is filled with an electrolyte solution while the microstructured surface is submerged in the electrolyte solution.
  • a microstructured surface in another embodiment, includes a plurality of microfeatures disposed on a substrate and defining a space located between inner surfaces of the plurality of microfeatures, wherein the inner surfaces between the plurality of microfeatures are hydrophobic.
  • the microstructured surface includes a gas generator formed from a first electrode and a second electrode of an electrode pair electrically connected to one another, the first electrode and the second electrode disposed within the space located between inner surfaces of the plurality of microfeatures and configured to generate a gas in between the microfeatures by spontaneous electrochemical reaction when part of the space is filled with an electrolyte solution while the microstructured surface is submerged in the electrolyte solution.
  • a method of forming a microstructured surface includes depositing electrodes on a surface of a substrate; securing a mold against the surface of the substrate containing the electrodes, the mold containing a plurality of cavities therein; applying pressure between the mold and the substrate to force material from the substrate into the plurality of cavities to form a plurality of microfeatures; and separating the mold from the substrate.
  • FIG. 1 illustrates a SHPo surface according to the prior art.
  • FIG. 1 illustrates the transition of a SHPo surface from a non-wetted state (top) to a wetted state (bottom).
  • FIGS. 2A-2C illustrates one embodiment of a microstructured surface wherein one electrode of an electrode pair is disposed within the space located between adjacent microfeatures.
  • a cross-sectional view taken along the line A-A of FIG. 3A is shown.
  • FIG. 2A illustrates the microstructured surface in a dewetted state.
  • FIG. 2B illustrates the microstructured surface in a partially wetted state (e.g., one of the spaces between adjacent microstructures is filled with electrolyte).
  • FIG. 2C illustrates the microstructured surface in a de-wetting state wherein gas that is generated at the one electrode pushes the electrolyte fluid out of the space as indicated by the arrows.
  • FIGS. 3A and 3B illustrate two different electrode configurations of the embodiment of FIG. 2 .
  • FIG. 3A illustrates a wire pattern embodiment.
  • FIG. 3B illustrates a mesh pattern embodiment.
  • FIGS. 4A-4C illustrates another embodiment of a microstructured surface wherein an electrode pair is disposed within the space located between adjacent microfeatures.
  • a cross-sectional view taken along the line A-A of FIG. 5A is shown.
  • FIG. 4A illustrates the microstructured surface in a dewetted state.
  • FIG. 4B illustrates the microstructured surface in a partially wetted state (e.g., one of the spaces between adjacent microstructures is filled with electrolyte).
  • FIG. 4C illustrates the microstructured surface in a de-wetting state wherein gas that is generated at the electrode pair pushes the electrolyte fluid out of the space as indicated by the arrows.
  • FIGS. 5A and 5B illustrate two different electrode configurations of the embodiment of FIG. 4 .
  • FIG. 5A illustrates a wire pattern embodiment.
  • FIG. 5B illustrates a mesh pattern embodiment.
  • FIGS. 6A-6E illustrates a method of fabricating a microstructured hydrophobic surface according to one embodiment.
  • FIG. 7 illustrates a perspective view of a microstructured hydrophobic device according to one embodiment.
  • the microstructured surface includes a series of trenches and electrodes are configured to have a pattern of wires.
  • FIGS. 8A-8D illustrate a panel of photographs of a microstructured hydrophobic device illustrating operation of one embodiment.
  • the vertical black lines are the electrodes.
  • Horizontal black lines are the gas that is formed in the spaces between microfeatures (which appear clear, i.e., the black lines disappear where they are wetted).
  • FIG. 8A illustrates the microstructured hydrophobic device with the surface in a dewetted state.
  • FIG. 8B illustrates the microstructured hydrophobic device with the surface in a partially wetted state.
  • FIG. 8C illustrates the microstructured hydrophobic device with the surface in a de-wetting state where gas is actively created and pushing out the electrolyte.
  • FIG. 8D illustrates the microstructured hydrophobic device with the surface in a de-wetted state resembling that of FIG. 8A .
  • FIG. 2 illustrates a microstructured hydrophobic surface 2 according to one embodiment.
  • the microstructured surface 2 includes a substrate 4 having a plurality of microstructures or microfeatures 6 disposed thereon.
  • the microfeatures 6 are generally oriented substantially orthogonal to the substrate 4 .
  • the use of the term “microfeatures 6 ” means, when used herein, microscopic physical features; they are commonly in micrometer scale but can be in smaller or larger scale.
  • the microfeatures 6 may be arranged in an array or random configuration. Microfeatures 6 can include gratings, trenches, ridges, posts, pillars, holes, random structures, or porous materials.
  • the substrate 4 may be formed from any number of materials but, as explained in the method, may include a polymer if molding techniques are used to form the microstructured surface 2 .
  • the microfeatures 6 have a height in which they project relative to a surface of the substrate 4 .
  • the microfeatures 6 are separated from one another by a distance.
  • the pitch is center-center distance between the nearest neighboring microfeature 6 .
  • a liquid solution containing electrolyte 8 is disposed on the microstructured surface 2 . When the space between neighboring microfeatures 4 is filled with a gas 10 , a meniscus is formed that may sag or bulge depending on the pressure difference between the liquid and the gas.
  • a microstructured surface 2 includes a surface that contains microfeatures 6 made of or whose surface is made of a material that water or liquid of interest does not wet, i.e., forms a contact angle larger than 90° on its surface. This means the liquid is not restricted to water and may be of any kind, including water, oil, or solvent, despite the use of “hydrophobic” as described herein.
  • the microfeatures 6 may be formed from the same or different material from the substrate 4 .
  • the microfeatures 6 may be formed from a polytetrafluoroethylene (PTFE) or the like.
  • the microfeatures 6 may be made mostly from a material that is particularly hydrophobic.
  • at least some portions of the microfeatures 6 may be coated with a hydrophobic material such as PTFE or the like.
  • the top surfaces of the microfeatures 6 may not be hydrophobic so that only the inner surfaces between the microfeatures 6 are hydrophobic.
  • a fluid of electrolyte 8 that is electrically conductive is disposed on the microstructured surface 2 .
  • a typical electrolyte 8 may include seawater or water having dissolved ionic species therein.
  • the microstructured surface 2 includes a first electrode 12 and a second electrode 14 that are in electrical communication with one another, for example, connected to one another via a conductor 16 .
  • Conductor 16 may be a wire, electrical line, trace, tracks, vias, or the like.
  • the first electrode 12 and the second electrode 14 together makes a “built-in” or “self-powered” gas generator that is configured to generate a gas 10 in between the microfeatures 6 .
  • the gas 10 is generated on the electrode 12 without the aid of any applied power source.
  • the first electrode 12 , the second electrode 14 , and the electrolyte 8 are made from materials having distinctly different standard electrode potentials (SEP) (or standard reduction potentials) so that when electrolyte 8 fills the space between microfeatures 6 the two electrodes 12 , 14 and the electrolyte 8 form an electrochemical cell (or more specifically a galvanic cell) that spontaneously generates a gas 10 on electrode 12 .
  • SEP standard electrode potential
  • the overall potential of the galvanic cell should overcome the overpotential needed for gas generation on the first electrode 12 .
  • the overpotential is the potential difference (i.e., voltage) between a half-reaction's thermodynamically determined reduction potential and the potential at which the redox (reduction/oxidation) event is observed experimentally.
  • bubble formation of gas 10 causes overpotential.
  • the magnitude of overpotential needed for gas generation on the first electrode 12 should be smaller than that on the second electrode 14 , so that gas is generated on electrode 12 rather than on electrode 14 .
  • Any electrolytes 8 that would generate gas in half-reaction could be used here.
  • Equation 1 This condition (Equation 1) is required to ensure that there is a reaction between the second electrode 14 and the electrolyte 8 .
  • the second condition is that the half-reaction of electrolyte 8 should produce gas 10 under standard pressure and temperature. This condition is to ensure that the reaction will generate gas.
  • the third condition is that the difference in the theoretical standard cell potentials between the second electrode 14 and electrolyte 8 (SEP 2 ⁇ SEP 3 ) should be, in magnitude, larger than the overpotential of half-reaction of electrolyte 8 on the first electrode 12 , denoted OP 3/1 as seen in Equation 2 below:
  • Equation 2 This condition (Equation 2) is to ensure that gas 10 can be generated on the first electrode 12 .
  • the overpotential of half-reaction of electrolyte 8 on the first electrode 12 should be, in magnitude, smaller than the overpotential of half-reaction of electrolyte 8 on the second electrode 14 , denoted OP 3/2 as seen in Equation 3 below:
  • Equation 3 This condition (Equation 3) is to ensure the gas 10 is generated mainly on the first electrode 12 rather than on the second electrode 14 . All four conditions should be satisfied for the gas generation to operate properly.
  • the above conditions can be divided into two scenarios, depending on whether the gas generation is by reduction or oxidation reaction. If the gas generation on the first electrode 12 is by reduction reaction (e.g., 2H + +2e ⁇ ⁇ H 2 ), then the SEP of the second electrode 14 , SEP 2 , should be smaller than the SEP of the electrolyte, SEP 3 as seen by Equation 4 below.
  • the half-reaction of the electrolyte 8 should produce the gas under standard pressure and temperature.
  • the theoretical standard electrode potential between the second electrode 14 and the electrolyte 8 (SEP 2 ⁇ SEP 3 ) should be smaller (i.e., more negative) than the overpotential of half-reaction of the electrolyte 8 on the first electrode 12 , OP 3/1 as seen by Equation 5 below.
  • the overpotential of half-reaction of the electrolyte 8 on the first electrode 12 , OP 3/1 , should be larger (i.e., less negative) than the overpotential of half-reaction of the electrolyte 8 on the second electrode 14 OP 3/2 as seen by Equation 6 below.
  • the SEP of the second electrode 14 SEP 2 should be larger than the SEP of the electrolyte 8 SEP 3 as seen by Equation 7 below.
  • the half-reaction of the electrolyte 8 should produce a gas under standard pressure and temperature.
  • the theoretical standard electrode potential electrode potential between the second electrode 14 and the electrolyte 8 (SEP 2 ⁇ SEP 3 ) should be larger (i.e., more positive) than the overpotential of half-reaction of the electrolyte 8 on the first electrode 12 , OP 3/1 as seen by Equation 8 below.
  • the overpotential of half-reaction of the electrolyte 8 on the first electrode 12 , OP 3/1 , should be smaller (i.e., less positive) than the overpotential of half-reaction of the electrolyte 8 on the second electrode 14 OP 3/2 as seen by Equation 9 below.
  • the standard electrode potential is about ⁇ 0.83 V from 2H 2 O+2e ⁇ ⁇ H 2 (g)+2OH ⁇ . If the electrolyte 8 is an acid water solution, the standard electrode potential is 0 V from 2H + +2e ⁇ ⁇ H 2 (g).
  • the first electrode 12 may be made from a metal or metal alloy containing nickel
  • the second electrode 14 may be made from a metal or metal alloy containing magnesium
  • the electrolyte 8 may be seawater (although other electrolytes may also be used such as fresh water, acid solutions, basic solutions, and the like).
  • the gas 10 that is produced is hydrogen at the first electrode 12 .
  • Table 1 below lists various materials and SEP and overpotential values that have been tested with successful results.
  • gas 10 e.g., hydrogen
  • spontaneous electrochemical reaction i.e., galvanic reaction
  • the microfeatures 6 are designed and spaced such that the gas 10 that is generated on the electrode 12 is trapped and grows within the localized space, gap, or well 13 formed between adjacent microfeatures 6 .
  • the volume of generated gas 10 has grown in size to the top (e.g., upper surface) of the microfeatures 6 the gas 10 proceeds to extend laterally in between the microfeatures 6 across the microstructured surface 2 .
  • the microstructured surface 2 can be restored from a partially or fully wetted state back into a non-wetted state.
  • the first electrode 12 is disposed on or embedded in the substrate 4 .
  • FIGS. 2A-2C illustrates the first electrode 12 located on the substrate 4 within the space 13 formed between adjacent microfeatures 6 .
  • the first electrode 12 is located on a bottom surface of space or gap 13 located between the microfeatures 6 .
  • the first electrode 12 may be located on the sidewall surface of the microfeatures 6 .
  • the first electrode 12 can be located in any location between the microfeatures 6 , wherein between microfeatures 6 refers to the spaces 13 and inner surfaces between microfeatures 6 (excluding the top or exposed surfaces of the microfeatures 6 ). Note that in the embodiment of FIGS. 2A-2C , the second electrode 14 is not located between the microfeatures 6 . Instead, the second electrode 14 is located outside of the internal space 13 created by the microfeatures 6 .
  • the gas 10 that is generated by the first electrode 12 is trapped and grows in the localized space or well 13 formed between adjacent microfeatures 6 .
  • gas generation is self-regulated in this embodiment.
  • the electrochemical circuit is “closed” and gas generation occurs only if the microstructured surface 2 becomes partially or fully wetted. Once the electrolyte 8 invades the space 13 between adjacent microfeatures 6 the circuit is closed between the first electrode 12 and the second electrode 14 and the electrochemical reaction proceeds, thereby liberating gas 10 within the spaces 13 located between the microfeatures 6 . After sufficient gas generation, the electrochemical circuit then becomes “open” and the electrochemical reaction stops.
  • This feature is particularly advantageous because there is no need for any sensing and controlling circuitry to switch the gas generator (i.e., electrode) on or off; in other words, the gas generation is self-regulated to respond to presence of electrolyte 8 in between the microfeatures 6 .
  • the gas generation occurs spontaneously without connecting the microstructured surface 2 to any external power source (e.g., battery); in other words, the gas generation is self-sufficient.
  • the gas generation is the product of an electrochemical reaction (i.e., powered electrically albeit using internal energy) rather than pure chemical reaction (i.e., no electric power involved)
  • the gas generator i.e., electrode
  • the microstructured surface 2 has the built-in ability to maintain the gas 10 trapped in between its microfeatures 6 .
  • FIG. 3A illustrates a top view of one configuration of a microstructured surface 2 .
  • the view of FIGS. 2A, 2B, and 2C is taken along the cross-sectional line A-A in FIG. 3A .
  • the first electrodes 12 are formed as a pattern of substantially parallel wires located between and under the microfeatures 6 .
  • the microfeatures 6 are formed as a grating or the like that extend across the surface of the substrate 4 .
  • the first electrode wires 12 run along or across the spaces 13 formed between adjacent microfeatures 6 .
  • FIG. 3B illustrates a top view of another configuration of a microstructured surface 2 .
  • the first electrodes 12 are formed as a mesh pattern that is located between and under the microfeatures 6 .
  • FIGS. 4A-4C illustrates another embodiment of a microstructured surface 2 .
  • both the first electrode 12 and the second electrode 14 are placed in the space 13 formed between the microfeatures 6 .
  • the first electrode 12 and the second electrode 14 are electrically connected directly or via a conductor 16 .
  • the first electrode 12 , the second electrode 14 , and the electrolyte 8 are made from materials having distinctly different standard electrode potentials so that when electrolyte 8 fills the spaces 13 of the microfeatures 6 the two electrodes 12 , 14 and the electrolyte 8 form an electrochemical cell (more specifically, a galvanic cell) that spontaneously generates a gas 10 on the first electrode 12 .
  • the overall potential of the galvanic cell should overcome the overpotential needed for gas generation on the first electrode 12 . Also, the magnitude of overpotential needed for gas generation on the first electrode 12 should be lower than that on the second electrode 14 so that gas is generated on electrode 12 rather than on electrode 14 . Any electrolytes 8 that would generate gas in half-reaction could be used here. The same criteria of four conditions described above apply to this embodiment as well.
  • FIG. 5A illustrates a top view of one configuration of a microstructured surface 2 of the embodiment of FIG. 4 .
  • the view of FIGS. 2A, 2B, and 2C is taken along the cross-sectional line A-A in FIG. 3A .
  • one or both of the first electrodes 12 and the second electrodes 14 are formed as a pattern of substantially parallel wires between and under the microfeatures 6 .
  • FIG. 5B illustrates a top view of another configuration of a microstructured surface 2 .
  • one or both of the first electrodes 12 and the second electrodes 14 are formed as a mesh pattern between and under the microfeatures 6 .
  • FIG. 4 illustrates the first electrode 12 and the second electrode 14 being located at the bottom surface of the substrate 4 between the microfeatures 6
  • one or both of the electrodes 12 , 14 may be located on the sidewall surfaces of the microfeatures 6 .
  • FIG. 6A-6E illustrates a process of fabricating a microstructured surface 2 according to one embodiment. This process relies on a molding technique such as embossing or imprinting.
  • the first electrode 12 or first and second electrodes 12 , 14 are placed between substrate 4 and mold 7 as seen in FIGS. 6A, 6B .
  • the electrodes 12 , 14 may be a porous layer, a mesh, or a collection of wires, among others.
  • the feature size (e.g., width of the wires) of the electrodes 12 , 14 should be smaller than the openings (e.g., cavity diameter, trench width) on the mold 7 so that the electrodes 12 , 14 do not substantially block the recesses.
  • the substantial coverage of the recess openings would hinder the filling of the recesses during the molding step shown in FIG. 6C .
  • the material or its top portion of substrate 4 flows around (or through the openings of) the electrodes 12 , 14 and fill into the recesses on mold 7 .
  • mold 7 is separated from substrate 4 , as shown in FIG. 6E .
  • the electrodes 12 , 14 may be completely exposed or covered with a thin residual layer of the material from substrate 4 .
  • This thin residual material may be removed by one of many etching methods known to those skilled in the art, such as plasma etching, chemical etching, or the like if necessary.
  • the device may function as intended even with the electrodes 12 , 14 not fully exposed, as electrochemical gas generation can still occur if the residual layer is thin enough.
  • the substrate 4 may be thick, thin, rigid, or flexible, and may be made of one material or multiple layers of different materials.
  • the material of microfeatures 6 maybe the same as or different from the material of substrate 4 , although FIGS. 6A-6E illustrates the same material being used for the substrate 4 and microfeatures 6 .
  • Electrodes e.g., electrodes 12 , 14
  • the electrodes are in a tight contact with mold 7 during the molding step. This tight contact can prevent the substrate 4 material from seeping onto the electrode surfaces, while flowing into the recesses or cavities of mold 7 .
  • the electrode surfaces that were in tight contact with mold 7 are exposed in between microfeatures 6 with no or little residual material on top, as shown in FIG. 6E .
  • embossing/imprinting microfeatures 6 with functional materials in between the microfeatures 6 would require separate fabrication steps of molding the microfeatures 6 and placing the functional materials in between the molded microfeatures 6 .
  • the current invention completes the process with only a single or nearly single molding step and still does not leave much residual material on the functional materials, keeping the simplicity of traditional embossing/imprinting techniques while obtaining the functional materials exposed in between the microfeatures 6 .
  • this processing method is useful for other purposes as well, such as microfluidic devices for biochemical applications.
  • FIG. 7 illustrates a perspective view of the microstructured surface 2 in one exemplary embodiment.
  • the microfeatures 6 are gratings and the spaces 13 are formed as trenches located between adjacent microfeatures 6 .
  • the electrodes 12 , 14 are illustrated as wires that extend generally transverse with respect to the microfeatures 6 . Alternatively, the electrodes 12 , 14 may be aligned parallel with the microfeatures 6 .
  • FIGS. 8A-8D illustrate photographs of experimental results of a microstructured surface 2 operating in the configuration of FIG. 2 .
  • the FIG. 8A image show the spaces 13 between microfeatures 6 filled with gas (shown as black or dark lines perpendicular to the microfeatures 6 .
  • the microstructured surface 2 is in a dewetted state.
  • FIG. 8B shows a substantial portion of the spaces 13 between microfeatures 6 filled with water (i.e., much of the microstructured surface 2 in a wetted state).
  • the microstructured surface 2 is in a partially wetted state.
  • FIG. 8C illustrates the water in the spaces being replaced by the gas 10 generated within the spaces 13 (i.e., the microstructured surface 2 being dewetted).
  • FIG. 8C thus illustrates the de-wetting state whereby gas 10 is used to push our or expel the water contained in the spaces 13 .
  • FIG. 8D shows that nearly all the water in the spaces 13 is replaced by the gas 10 , i.e., the microstructured surface 2 has returned to a dewetted state.
  • the surface was not connected to any power source during the experiment.
  • the gas in the microfeatures was maintained in a self-regulated and self-powered fashion.
  • the microstructured surfaces 2 described herein may be used on an exterior surface of a water-borne vehicle or watercraft (e.g., boat, ship, or the like) that comes into contact with the water.
  • a water-borne vehicle or watercraft e.g., boat, ship, or the like
  • the choice of materials for electrodes 12 , 14 is selected for particularly suitability for use in salt-water contact applications (e.g., for water-borne vehicles or watercraft that travel in seawater).
  • the microstructured surfaces 2 may also be used in other applications.
  • the microstructured surfaces 2 may be located on the inner surface of a pipe or conduit.

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KR102378963B1 (ko) 2022-03-24

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