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US20090278875A1 - Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus - Google Patents

Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus Download PDF

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Publication number
US20090278875A1
US20090278875A1 US12/084,958 US8495806A US2009278875A1 US 20090278875 A1 US20090278875 A1 US 20090278875A1 US 8495806 A US8495806 A US 8495806A US 2009278875 A1 US2009278875 A1 US 2009278875A1
Authority
US
United States
Prior art keywords
viscous medium
medium container
container
signal
jetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/084,958
Other languages
English (en)
Inventor
William Holm
Håkan Sandell
Johan Kronstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mycronic AB
Original Assignee
MyData Automation AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MyData Automation AB filed Critical MyData Automation AB
Priority to US12/084,958 priority Critical patent/US20090278875A1/en
Publication of US20090278875A1 publication Critical patent/US20090278875A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0623—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers coupled with a vibrating horn
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0408—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing two or more liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0483—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with gas and liquid jets intersecting in the mixing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B05C5/022—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path the outlet being fixed during operation

Definitions

  • a further object of the present invention is to provide improved and more reliable methods and devices for measuring and/or monitoring the solder paste consumption during a jet printing process.
  • a viscous medium container for holding a viscous medium adapted to attached in a jetting device for jetting droplets of the viscous medium onto a substrate, the jetting device comprising an ejector element for performing the jetting process and a jetting outlet through which the droplets are jetted.
  • the viscous medium container comprises: at least one first conducting element arranged at an inner wall of the container; at least one second conducting element arranged at an inner wall; the first conducting element and the second conducting element being connectable to a measuring device in accordance with the second aspect of the present invention.
  • an array of hall effect sensor is arranged in proximity to the container.
  • the sensors detect the magnetic field generated by the magnetic plunger in the viscous medium and deliver a current at detection of a field.
  • the plunger moves within the container, indicative of a viscous medium volume and filling degree, only the sensors that detect a magnet field within the viscous medium will deliver the current.
  • the position of the plunger can be determined and thereby the level of the viscous medium in the container.
  • Each sensor element 94 is connected to the signal processing circuit 86 including a combining circuit (not shown) adapted to combine currents from respective sensor element 94 to determine a position of the magnetic element 93 in solder paste container 81 and adapted to determine a level of solder paste in the container 81 using the position determination of the magnetic element. Consequently, this embodiment provide the possibility to monitor both the volume, or level, of the solder paste in the solder paste container 81 by means of the detection of the magnetic field in the container 81 and characteristics of the solder paste such as the electrical properties, e.g. permittivity and dielectric constant, of the solder paste by means of the complex impedance measurements in the passage 83 between the container and the ejection chamber of the ejector element, for example, between the container and the feed screw.
  • a combining circuit not shown
  • a jetting apparatus in accordance with the present invention for example a jetting apparatus as shown in FIG. 1 , including any one of the embodiments for measuring the level of solder paste and/or electrical properties of the solder paste in order to determine characteristics of the solder paste described above and an external work station connectable to the jetting apparatus is shown.
  • the work station 102 is comprises a display screen or monitor 104 for presenting information for a user by means of a graphical user interface (GUI) such as a level or volume of viscous medium in the viscous medium container and characteristics of the viscous medium, and input devices 106 , for example, a keyboard and a mouse, which enable a user to, for example, input information and commands.
  • GUI graphical user interface
  • the external work station 102 may communicate with the jetting apparatus 1 via a physical connection such as, for example, an USB connection or wirelessly by means of a number of different technologies including short range communication links including BLUETOOTH, or other types of short-range wireless connections such as Infrared.
  • a physical connection such as, for example, an USB connection or wirelessly by means of a number of different technologies including short range communication links including BLUETOOTH, or other types of short-range wireless connections such as Infrared.
  • a plunger 113 arranged in a solder paste container 111 is provided with first conductive elements 112 a and the container 111 is provided with a second conductive element 112 b at an inner wall of the container 111 , which conductive elements 112 a , 112 b are connectable to signal generator 114 of the signal generating circuit 22 , see FIG. 2 , and a signal measuring circuit 115 and a signal processing circuit 116 .
  • the solder paste container 111 is provided with the conductive element, e.g. conductive strips, per se.
  • the signal measuring circuit 115 comprises resistive elements 117 connected to an amplifier 118 and an analog-to-digital converter 119 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
US12/084,958 2005-11-14 2006-11-14 Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus Abandoned US20090278875A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/084,958 US20090278875A1 (en) 2005-11-14 2006-11-14 Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US73589805P 2005-11-14 2005-11-14
PCT/EP2006/010922 WO2007054372A1 (fr) 2005-11-14 2006-11-14 Appareil de projection et procede permettant d'ameliorer les performances d'un appareil de projection
US12/084,958 US20090278875A1 (en) 2005-11-14 2006-11-14 Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus

Publications (1)

Publication Number Publication Date
US20090278875A1 true US20090278875A1 (en) 2009-11-12

Family

ID=37709751

Family Applications (3)

Application Number Title Priority Date Filing Date
US12/084,958 Abandoned US20090278875A1 (en) 2005-11-14 2006-11-14 Jetting Apparatus and Method of Improving the Performance of a Jetting Apparatus
US12/084,964 Active 2029-10-05 US8453595B2 (en) 2005-11-14 2006-11-14 Jetting apparatus and method of improving the performance of a jetting apparatus
US11/598,752 Abandoned US20070146442A1 (en) 2005-11-14 2006-11-14 System, assembly and method for jetting viscous medium onto a substrate

Family Applications After (2)

Application Number Title Priority Date Filing Date
US12/084,964 Active 2029-10-05 US8453595B2 (en) 2005-11-14 2006-11-14 Jetting apparatus and method of improving the performance of a jetting apparatus
US11/598,752 Abandoned US20070146442A1 (en) 2005-11-14 2006-11-14 System, assembly and method for jetting viscous medium onto a substrate

Country Status (5)

Country Link
US (3) US20090278875A1 (fr)
EP (2) EP1963042A1 (fr)
JP (2) JP5199107B2 (fr)
CN (2) CN101356037A (fr)
WO (2) WO2007054372A1 (fr)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105792971A (zh) * 2013-12-05 2016-07-20 富士机械制造株式会社 焊料供给装置
EP3730169A1 (fr) * 2016-08-14 2020-10-28 Insulet Corporation Dispositif d'administration de medicaments avec detection de position du piston
US10874803B2 (en) 2018-05-31 2020-12-29 Insulet Corporation Drug cartridge with drive system
US10973978B2 (en) 2017-08-03 2021-04-13 Insulet Corporation Fluid flow regulation arrangements for drug delivery devices
US11229741B2 (en) 2012-03-30 2022-01-25 Insulet Corporation Fluid delivery device, transcutaneous access tool and fluid drive mechanism for use therewith
US11229736B2 (en) 2018-06-06 2022-01-25 Insulet Corporation Linear shuttle pump for drug delivery
US11229740B2 (en) 2017-03-07 2022-01-25 Insulet Corporation Very high volume user filled drug delivery device
US11267063B2 (en) * 2017-07-05 2022-03-08 Ersa Gmbh Method for operating a soldering device, soldering device
US11280327B2 (en) 2017-08-03 2022-03-22 Insulet Corporation Micro piston pump
US11369735B2 (en) 2019-11-05 2022-06-28 Insulet Corporation Component positioning of a linear shuttle pump
US11446435B2 (en) 2018-11-28 2022-09-20 Insulet Corporation Drug delivery shuttle pump system and valve assembly
US11633541B2 (en) 2017-01-19 2023-04-25 Insulet Corporation Cartridge hold-up volume reduction
US11786668B2 (en) 2017-09-25 2023-10-17 Insulet Corporation Drug delivery devices, systems, and methods with force transfer elements
US12318594B2 (en) 2016-05-26 2025-06-03 Insulet Corporation On-body interlock for drug delivery device
US12359903B2 (en) 2021-05-28 2025-07-15 Insulet Corporation Spring-based status sensors
US12377208B2 (en) 2021-01-08 2025-08-05 Insulet Corporation Single actuated precision dose intermediate pumping chamber
US12440617B2 (en) 2021-01-11 2025-10-14 Insulet Corporation Linear activated drug dosing pump system

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2138308A1 (fr) * 2008-06-12 2009-12-30 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Génération de gouttelettes indépendante de la pression
EP2547527B1 (fr) * 2010-03-18 2014-11-26 OCE-Technologies B.V. Procédé de surveillance d'une performance d'injection d'une tête d'impression
JP5553795B2 (ja) * 2010-05-21 2014-07-16 Ｔｄｋ株式会社 液体滴下装置
WO2013158184A1 (fr) 2012-04-20 2013-10-24 Nordson Corporation Dispositif, système et procédé pour suivre la configuration ou l'historique de fonctionnement d'une buse dans un système d'injection de fluides
WO2014139569A1 (fr) * 2013-03-13 2014-09-18 Micronic Mydata AB Procédés pour effectuer des jets de milieu visqueux sur une pièce à travailler
KR102273617B1 (ko) * 2013-03-15 2021-07-05 마이크로닉 아베 워크피스 상에 점성 매체를 분사하기 위한 장치 및 방법
CN105327835B (zh) * 2015-12-07 2017-12-01 常州高凯精密机械有限公司 一种压电串联式柱塞喷射点胶装置
JP6811570B2 (ja) * 2016-09-07 2021-01-13 Ykk株式会社 材料吐出制御装置
JP6851796B2 (ja) * 2016-12-05 2021-03-31 株式会社Ｆｕｊｉ 粘性流体供給装置、粘性流体供給方法
CN108738246B (zh) * 2017-04-14 2023-08-04 伊利诺斯工具制品有限公司 用于自动清除残留锡膏的装置
WO2019011675A1 (fr) * 2017-07-12 2019-01-17 Mycronic AB Dispositifs de projection à flux d'air variable et procédés de régulation de flux d'air
IT201900017288A1 (it) * 2019-09-26 2021-03-26 Cefla Deutschland Gmbh Processo per preparare bordi di pannelli a prova di acqua, rinforzati e/o a fiamma ritardata
IT201900017324A1 (it) * 2019-09-26 2021-03-26 Cefla Deutschland Gmbh Processo per preparare un pannello rinforzato e/o a ritardo di fiamma
WO2021151973A1 (fr) * 2020-01-28 2021-08-05 Mycronic AB Dispositifs d'éjection dotés d'un actionneur de conduit d'alimentation
KR102766798B1 (ko) * 2020-01-28 2025-02-14 마이크로닉 아베 가요성 토출 노즐을 갖는 토출 장치들
US20210301943A1 (en) * 2020-03-27 2021-09-30 Illinois Tool Works Inc. Dispensing unit having fixed flexible diaphragm seal
CN111299083A (zh) * 2020-03-31 2020-06-19 江苏立讯机器人有限公司 一种点胶机
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
CN113304958B (zh) * 2021-08-02 2021-10-22 江苏高凯精密流体技术股份有限公司 双液点胶自动校准系统的控制方法
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491143A (en) * 1922-10-17 1924-04-22 William Theis Jr Battery liquid-level indicator
US4061988A (en) * 1976-02-09 1977-12-06 Oak Industries Inc. Hall effect linear motion switch
US4373389A (en) * 1979-10-15 1983-02-15 Precitronic Gesellschaft Fur Feinmechanik Und Electronic M.B.H. Device for capacitive level measurement
US4737710A (en) * 1983-01-27 1988-04-12 Trw Inc. Hall-effect array for sensing second spatial derivative of magnetic field
US4884052A (en) * 1987-05-29 1989-11-28 Aisan Kogyo Kabushiki Contact structure for slider position sensor
US5273187A (en) * 1991-07-01 1993-12-28 Tenryu Technics Co., Ltd. Dispenser
US5366896A (en) * 1991-07-30 1994-11-22 University Of Virginia Alumni Patents Foundation Robotically operated laboratory system
US5553494A (en) * 1993-05-29 1996-09-10 Solartron Group Limited Fluid level sensing systems
US5682184A (en) * 1995-12-18 1997-10-28 Xerox Corporation System for sensing ink level and type of ink for an ink jet printer
US6164132A (en) * 1997-06-12 2000-12-26 G.D.M, Inc. Capacitive liquid level indicator
US6173573B1 (en) * 1996-02-28 2001-01-16 Komatsu Ltd. Control device for hydraulic drive machine
US20010008310A1 (en) * 1999-12-27 2001-07-19 Fujitsu Limited Method for forming bumps, semiconductor device, and solder paste
US20020015780A1 (en) * 2000-07-11 2002-02-07 William Holm Method and apparatus for applying viscous medium onto a substrate
US20020014602A1 (en) * 2000-07-11 2002-02-07 William Holm Method and apparatus for providing a substrate with viscous medium
US20020043570A1 (en) * 1999-04-08 2002-04-18 William Holm Dispensing assembly
US6450416B1 (en) * 1998-06-11 2002-09-17 Mydata Automation Ab Device and method for jetting droplets
US20030177842A1 (en) * 1997-10-07 2003-09-25 Swartzel Kenneth R. Method and system for residence time measurement of simulated food particles in continuous thermal food processing and simulated particles for use in same
US20040118935A1 (en) * 2000-10-09 2004-06-24 William Holm Method of jetting viscous medium
US20040209396A1 (en) * 2002-12-18 2004-10-21 The Regents Of The University Of California Electronic unit integrated into a flexible polymer body
US20040217193A1 (en) * 2001-04-27 2004-11-04 William Holm Jetting device and a method of jetting device
US6823731B1 (en) * 2003-10-10 2004-11-30 Delphi Technologies, Inc. Liquid level sensing assembly and method for measuring using same
US20040262824A1 (en) * 2001-11-12 2004-12-30 Tommy Andersson Device for jetting droplets of a particle filled viscous medium
US20050024396A1 (en) * 2003-07-30 2005-02-03 Isaac Farr Printing device having a printing fluid detector
US20050092774A1 (en) * 2001-12-14 2005-05-05 William Holm Viscous medium feeder
US20050167519A1 (en) * 2002-07-18 2005-08-04 Mydata Automation Ab Jetting device and method at a jetting device
US6941822B2 (en) * 2003-06-10 2005-09-13 Visteon Global Technologies, Inc. Angular displacement sensing system and method using brushless DC motor commutation hall effect sensors
US20080231290A1 (en) * 2004-05-14 2008-09-25 Scientific Generics Ltd. Capacitive Position Sensor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184462A (en) 1981-05-09 1982-11-13 Yasushi Suzuki Detection of clogging of nozzle
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
JPH06258189A (ja) 1992-08-05 1994-09-16 Nippon Steel Corp 吹き込みノズルの詰り検知方法
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
CN2246285Y (zh) * 1995-06-06 1997-01-29 河南省安阳钢铁公司 差压力电接点料位监测装置
CN1089298C (zh) * 1996-01-22 2002-08-21 佳能株式会社 确定图象形成装置墨水容器中存在的墨水量的方法和装置
US6654697B1 (en) * 1996-03-28 2003-11-25 Rosemount Inc. Flow measurement with diagnostics
IE76714B1 (en) * 1996-04-19 1997-10-22 Auro Environmental Ltd Apparatus for measuring the velocity of a fluid flowing in a conduit
US6042219A (en) * 1996-08-07 2000-03-28 Minolta Co., Ltd. Ink-jet recording head
FR2759164A1 (fr) * 1997-01-31 1998-08-07 Canon Kk Procede et dispositif de determination de la quantite de produit present dans un reservoir, reservoir de produit et dispositif de traitement de signaux electriques destines a un tel dispositif de determination
US6378971B1 (en) * 1999-11-05 2002-04-30 Seiko Epson Corporation Ink-jet recording apparatus
FI20002251L (fi) 2000-10-12 2002-04-13 Metso Paper Inc Menetelmä ja laite spraysuuttimen puhdistamiseksi
JP3849867B2 (ja) * 2002-07-24 2006-11-22 ソニー株式会社 液体検出装置及び液体量検出装置
US6938984B2 (en) * 2003-01-15 2005-09-06 Xerox Corporation Custom color inkjet printing system
TWI625762B (zh) * 2003-08-29 2018-06-01 Nikon Corp Liquid recovery device, exposure device, exposure method, and component manufacturing method
SE0302985D0 (sv) 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP4354786B2 (ja) * 2003-11-28 2009-10-28 富士フイルム株式会社 インク濃度検出方法およびインクジェット記録装置
JP4415865B2 (ja) * 2005-02-02 2010-02-17 パナソニック株式会社 ペースト吐出装置

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1491143A (en) * 1922-10-17 1924-04-22 William Theis Jr Battery liquid-level indicator
US4061988A (en) * 1976-02-09 1977-12-06 Oak Industries Inc. Hall effect linear motion switch
US4373389A (en) * 1979-10-15 1983-02-15 Precitronic Gesellschaft Fur Feinmechanik Und Electronic M.B.H. Device for capacitive level measurement
US4737710A (en) * 1983-01-27 1988-04-12 Trw Inc. Hall-effect array for sensing second spatial derivative of magnetic field
US4884052A (en) * 1987-05-29 1989-11-28 Aisan Kogyo Kabushiki Contact structure for slider position sensor
US5273187A (en) * 1991-07-01 1993-12-28 Tenryu Technics Co., Ltd. Dispenser
US5366896A (en) * 1991-07-30 1994-11-22 University Of Virginia Alumni Patents Foundation Robotically operated laboratory system
US5553494A (en) * 1993-05-29 1996-09-10 Solartron Group Limited Fluid level sensing systems
US5682184A (en) * 1995-12-18 1997-10-28 Xerox Corporation System for sensing ink level and type of ink for an ink jet printer
US6173573B1 (en) * 1996-02-28 2001-01-16 Komatsu Ltd. Control device for hydraulic drive machine
US6164132A (en) * 1997-06-12 2000-12-26 G.D.M, Inc. Capacitive liquid level indicator
US20030177842A1 (en) * 1997-10-07 2003-09-25 Swartzel Kenneth R. Method and system for residence time measurement of simulated food particles in continuous thermal food processing and simulated particles for use in same
US6450416B1 (en) * 1998-06-11 2002-09-17 Mydata Automation Ab Device and method for jetting droplets
US20020043570A1 (en) * 1999-04-08 2002-04-18 William Holm Dispensing assembly
US20020047052A1 (en) * 1999-04-08 2002-04-25 William Holm Dispensing assembly
US20010008310A1 (en) * 1999-12-27 2001-07-19 Fujitsu Limited Method for forming bumps, semiconductor device, and solder paste
US20020014602A1 (en) * 2000-07-11 2002-02-07 William Holm Method and apparatus for providing a substrate with viscous medium
US20020015780A1 (en) * 2000-07-11 2002-02-07 William Holm Method and apparatus for applying viscous medium onto a substrate
US20040118935A1 (en) * 2000-10-09 2004-06-24 William Holm Method of jetting viscous medium
US20040217193A1 (en) * 2001-04-27 2004-11-04 William Holm Jetting device and a method of jetting device
US20040262824A1 (en) * 2001-11-12 2004-12-30 Tommy Andersson Device for jetting droplets of a particle filled viscous medium
US20050092774A1 (en) * 2001-12-14 2005-05-05 William Holm Viscous medium feeder
US20050167519A1 (en) * 2002-07-18 2005-08-04 Mydata Automation Ab Jetting device and method at a jetting device
US20040209396A1 (en) * 2002-12-18 2004-10-21 The Regents Of The University Of California Electronic unit integrated into a flexible polymer body
US6941822B2 (en) * 2003-06-10 2005-09-13 Visteon Global Technologies, Inc. Angular displacement sensing system and method using brushless DC motor commutation hall effect sensors
US20050024396A1 (en) * 2003-07-30 2005-02-03 Isaac Farr Printing device having a printing fluid detector
US6823731B1 (en) * 2003-10-10 2004-11-30 Delphi Technologies, Inc. Liquid level sensing assembly and method for measuring using same
US20080231290A1 (en) * 2004-05-14 2008-09-25 Scientific Generics Ltd. Capacitive Position Sensor

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11229741B2 (en) 2012-03-30 2022-01-25 Insulet Corporation Fluid delivery device, transcutaneous access tool and fluid drive mechanism for use therewith
US12329928B2 (en) 2012-03-30 2025-06-17 Insulet Corporation Fluid delivery device, transcutaneous access tool and fluid drive mechanism for use therewith
US20160297021A1 (en) * 2013-12-05 2016-10-13 Fuji Machine Mfg. Co., Ltd. Solder supply device
US9878390B2 (en) * 2013-12-05 2018-01-30 Fuji Machine Mfg. Co. Ltd. Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable
CN105792971A (zh) * 2013-12-05 2016-07-20 富士机械制造株式会社 焊料供给装置
US12318594B2 (en) 2016-05-26 2025-06-03 Insulet Corporation On-body interlock for drug delivery device
US11497856B2 (en) * 2016-08-14 2022-11-15 Insulet Corporation Drug delivery device with indicator
US12420022B2 (en) * 2016-08-14 2025-09-23 Insulet Corporation Drug delivery device with indicator
EP3730169A1 (fr) * 2016-08-14 2020-10-28 Insulet Corporation Dispositif d'administration de medicaments avec detection de position du piston
US11439765B2 (en) 2016-08-14 2022-09-13 Insulet Corporation Variable fill drug delivery device
US20230063696A1 (en) * 2016-08-14 2023-03-02 Insulet Corporation Drug delivery device with indicator
US11633541B2 (en) 2017-01-19 2023-04-25 Insulet Corporation Cartridge hold-up volume reduction
US11229740B2 (en) 2017-03-07 2022-01-25 Insulet Corporation Very high volume user filled drug delivery device
US11267063B2 (en) * 2017-07-05 2022-03-08 Ersa Gmbh Method for operating a soldering device, soldering device
US11280327B2 (en) 2017-08-03 2022-03-22 Insulet Corporation Micro piston pump
US10973978B2 (en) 2017-08-03 2021-04-13 Insulet Corporation Fluid flow regulation arrangements for drug delivery devices
US11786668B2 (en) 2017-09-25 2023-10-17 Insulet Corporation Drug delivery devices, systems, and methods with force transfer elements
US10874803B2 (en) 2018-05-31 2020-12-29 Insulet Corporation Drug cartridge with drive system
US11229736B2 (en) 2018-06-06 2022-01-25 Insulet Corporation Linear shuttle pump for drug delivery
US11446435B2 (en) 2018-11-28 2022-09-20 Insulet Corporation Drug delivery shuttle pump system and valve assembly
US11369735B2 (en) 2019-11-05 2022-06-28 Insulet Corporation Component positioning of a linear shuttle pump
US12377208B2 (en) 2021-01-08 2025-08-05 Insulet Corporation Single actuated precision dose intermediate pumping chamber
US12440617B2 (en) 2021-01-11 2025-10-14 Insulet Corporation Linear activated drug dosing pump system
US12359903B2 (en) 2021-05-28 2025-07-15 Insulet Corporation Spring-based status sensors

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US8453595B2 (en) 2013-06-04
US20090266906A1 (en) 2009-10-29
CN101356425B (zh) 2011-01-26
CN101356037A (zh) 2009-01-28
JP5199107B2 (ja) 2013-05-15
WO2007054371A1 (fr) 2007-05-18
US20070146442A1 (en) 2007-06-28
EP1952099A1 (fr) 2008-08-06
WO2007054372A1 (fr) 2007-05-18

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