[go: up one dir, main page]

US20070169857A1 - Single crystal wire and manufacturing method of the same - Google Patents

Single crystal wire and manufacturing method of the same Download PDF

Info

Publication number
US20070169857A1
US20070169857A1 US11/726,272 US72627207A US2007169857A1 US 20070169857 A1 US20070169857 A1 US 20070169857A1 US 72627207 A US72627207 A US 72627207A US 2007169857 A1 US2007169857 A1 US 2007169857A1
Authority
US
United States
Prior art keywords
single crystal
wire
metal
copper
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/726,272
Other languages
English (en)
Inventor
Se Young Jeong
Chae Ryong Cho
Sang Eon Park
Sung Kyu Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University Industry Cooperation Foundation of Pusan National University
Original Assignee
University Industry Cooperation Foundation of Pusan National University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University Industry Cooperation Foundation of Pusan National University filed Critical University Industry Cooperation Foundation of Pusan National University
Assigned to PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION reassignment PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, CHAE RYONG, JEONG, SE YOUNG, KIM, SUNG KYU, PARK, SANG EON
Publication of US20070169857A1 publication Critical patent/US20070169857A1/en
Priority to US12/436,754 priority Critical patent/US8663388B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
    • C30B11/14—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method characterised by the seed, e.g. its crystallographic orientation
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/36—Single-crystal growth by pulling from a melt, e.g. Czochralski method characterised by the seed, e.g. its crystallographic orientation
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/62—Whiskers or needles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/02—Obtaining noble metals by dry processes

Definitions

  • the present invention relates to a single-crystal wire and a manufacturing method thereof, and more particularly to a single-crystal wire manufactured by growing a single crystal through a single crystal growth method and machining the grown single crystal into a wire, as well as a manufacturing method thereof.
  • an alternating magnetic field When such wires are applied with alternating current, an alternating magnetic field will occur, which acts as resistance to the alternating current. Particularly, the higher the frequency, the higher the resistance, and this property is called “inductance”.
  • inductance In the case of cables, if coated wires are coiled in a circular form or formed with positive and negative terminals, the inductance will increase, resulting in a reduction in the purity of sound. However, if coated wires are formed with positive and negative terminals and then twisted like a rope, the inductance will decrease instead, resulting an increase in the purity of sound.
  • an increase in the purity of wires leads to an increase in the purity of sound but generally results in an increase in direct current resistance, which may also reduce the cable's energy.
  • the sound quality of cables is influenced by the material and physical properties of the wires themselves, it is also highly influenced by the covering material and crystalline structure of wires, the inductance, capacitance and skin effect caused by terminal processing, and the impedance between audio systems.
  • the sound quality of most cables is influenced by the properties of the wires themselves, it is also influenced by a covering material for the cables, the crystalline structure of the wires, etc.
  • OFC cables having a purity of 99.99% frequently have better sound quality than 6N copper wire cables having a purity of 99.9999%.
  • Metal conductors for the wires include silver, gold, copper and aluminum, in descending order from highest electrical conductivity to lowest. Among them, copper is most frequently used as a conductor, because it is inexpensive and has good electrical conductivity and processability.
  • Copper wires have a standard purity of 3N (99.9%), and during production, oxygen is blown to increase the workability thereof, while copper produced in an atmosphere having no oxygen is called “OFC”.
  • Other examples of copper wires include 6N (99.9999%), 7N (99.99999%), etc., according to the extent of removal of metals and sulfur, which are impurities other than oxygen. Prior methods for manufacturing copper wires will now be described.
  • TPC tough pitch copper
  • This method is suitable for mass production and produces a 3N-purity copper containing sulfur and cuprous oxide and having an oxygen content of 3000-4000 ppm and a purity of 99.9%.
  • OFC is copper from which the development of high-purity copper started.
  • the OFC is a 4N (99.99%) product which has an oxygen content reduced to less than 10 ppm by removing a cuprous oxide impurity, unlike the existing TPC process comprising blowing oxygen to cool the molten copper.
  • the use of the OFC allowed muddy sound to be removed and the purity of sound to be increased, thus improving sound clarity.
  • Linear crystal oxygen-free copper (hereinafter, referred to as “LC-OPC”) was developed based on the theory that every factor reducing the sound quality exists at boundaries between metal crystals. When copper is rapidly cooled in a melted state, it will have a fine crystal structure, in which case an increase in crystals will increasingly interfere with signal transmission. Based on this theory, in order for the OFC to have a unidirectional crystal structure, copper is slowly cooled to obtain large crystals, and the resulting copper crystal structure is then linearly stretched. However, during the process for linearly stretching the copper crystal structure, mechanical stress and heat are generated in the copper, so that the copper crystal structure is adversely affected, thus causing deterioration in sound quality.
  • LC-OPC Linear crystal oxygen-free copper
  • PCOCC Pure crystal ohno continuous casting
  • Typical examples of conductors having a high strength include LC-OFC and PCOCC, which have not been subjected to a thermal treatment process in order to prevent their single crystal structure from being changed.
  • the copper wires which have not been subjected to the thermal treatment process, undergo mechanical stress during their machining so that their crystal structure is influenced.
  • a myu (m) conductor was developed which has been slightly thermally treated to reduce mechanical stress.
  • the structure of a single crystal acts as an important factor in manufacturing high-quality cables.
  • technology for preventing the single crystal structure from being changed has not yet been developed.
  • silver (Ag) has excellent electrical properties, particularly low electrical resistance, compared to copper.
  • silver is clearly advantageous compared to copper, particularly when in an oxidized state. Namely, copper is easily oxidized to form a coating film such as a semiconductor film, whereas oxidized silver has an advantage in that it is chemically stable, so that it can sufficiently function as a conductor.
  • Aluminum is a conductor having highly specific properties, like silver. It is known that aluminum is slightly higher in electrical resistance than copper but also that it produces a highly specific sound in a wide sound range. Thus, an aluminum wire containing silver or aluminum produces a unique and elegant sound.
  • the present invention has been made to solve the above-described problems occurring in the prior art, and it is an object of the present invention to provide a method for manufacturing a single crystal wire, comprising growing a metal single crystal using a seed crystal and then forming the grown metal single crystal into a disc-shaped piece which is then formed into a wire.
  • the present invention provides a method for manufacturing a single crystal wire, comprising the steps of: placing into a growth crucible at least one metal selected from the group consisting of gold, copper, silver, aluminum and nickel; heating and melting the metal placed in the growth crucible; growing a single crystal using the metal crystal as a seed by the Czochralski or Bridgman method; cutting the grown single crystal by electric discharge machining; and forming the cut single crystal into a wire.
  • the growth crucible is preferably selected from the group consisting of a graphite crucible, a boron nitride (BN) crucible, an alumina crucible, and a quartz crucible.
  • the heating of the metal placed in the growth crucible is preferably performed using an RF induction coil or a carbon heater.
  • the single crystal is preferably formed into a disc shape.
  • the cut single crystal is preferably formed into a wire by wire-cut electric discharge machining or press machining using a mold having a pattern.
  • the single crystal formed into the disc shape is preferably used as a metal single crystal substrate or a metal deposition target.
  • the wire formed by the pressing machining has a ring shape.
  • the single crystal is preferably formed into a cylindrical shape.
  • the cylindrical shape formed in the cutting step is preferably cut into a ring shape.
  • the single crystal is preferably subjected to a polishing or wet etching process.
  • the wire is preferably covered with synthetic resin on the outer surface thereof, and both ends of the wire are provided with terminals.
  • the present invention provides a single crystal wire manufactured by: heating and melting at least one metal selected from the group consisting of gold, copper, silver, aluminum and nickel; growing a single crystal using the metal crystal as a seed by the Czochralski or Bridgman method; and cutting the grown single crystal.
  • the cut single crystal is preferably formed into a ring shape or a wire shape for use as a connection cable.
  • connection cable formed into the wire shape is preferably covered with synthetic resin on the outer surface thereof, and both ends of the connection cable are preferably provided with terminals.
  • the metal single crystal is grown using the seed crystal and then formed into a disc-shaped piece by electrical discharge machining, and the piece is subjected to wire-cut discharge machining. Accordingly, various single-crystal wires and wire products having a unidirectional crystal structure can be formed.
  • the single-crystal wire can be used as products, such as a ring, a pendant or a wire in a high-quality cable making a connection in audio and video systems.
  • the single crystal formed into the disc shape can be used as a single crystal substrate for the fabrication of thin films or a target for metal deposition.
  • FIG. 1 is a photograph showing a copper-single crystal formed according to an embodiment of the present invention.
  • FIG. 2 is a photograph showing a wire formed according to an embodiment of the present invention.
  • FIG. 3 is shows a disc-shaped single crystal piece and mold according to an embodiment of the present invention.
  • FIG. 4 shows the step of machining a single crystal into a ring shape, according to an embodiment of the present invention.
  • FIG. 5 shows XRD results for a copper single-crystal wire and a polycrystal copper wire.
  • FIG. 6 shows GDS results for a copper single-crystal wire and a polycrystal copper wire.
  • FIG. 7 shows surface image photographs of a copper single crystal wire (a) and a polycrystal copper wire (b).
  • FIG. 8 shows the comparison of resistivity between a copper single crystal wire and a polycrystal copper wire.
  • FIG. 9 shows sound cables produced by covering the outer surface of copper single crystal wires with insulation leather.
  • FIG. 10 shows the comparison of impedance as a function of frequency between a single crystal cable and a polycrystal cable.
  • a metal mass to be grown which is at least one selected from the group consisting of gold, copper, silver, aluminum and nickel, is placed into a growth crucible (BN crucible, quartz crucible, graphite crucible, alumina crucible, etc.) in which the metal mass is then melted either by induction heating using an induction coil or by a carbon heater.
  • the growth crucible used in the present invention is either the graphite crucible or a double crucible structure in which the outer crucible is the graphite crucible and the inner crucible is one selected from among the BN crucible, the quartz crucible and alumina crucible.
  • the graphite crucible or the double crucible structure having the graphite crucible as an outer crucible is used as the growth crucible.
  • the reason why the growth crucible is used as a heating element is that the temperature of induction heating will be difficult to control when the amount of melted mass remaining in the crucible during the growth of a metal single crystal is reduced. Thus, it is easy in the growth of a metal single crystal to use the growth crucible as a heating element to control the temperature of the crucible itself.
  • the growth crucible, copper and silver are induction-heated to the melting points of the metals. Since the melting points of copper and silver are 1083° C. and 962° C., respectively, they are heated to temperatures higher than the melting points by about 30° C. so as to dissolve them completely.
  • a seed crystal having the desired crystal structure is prepared and grown into a single crystal by the Czochralski method.
  • the seed crystal is prepared in the form of a rod in each of the ( 100 ), ( 110 ) and ( 111 ) directions.
  • the growth of the copper single crystal is performed at a temperature of 1100-1000° C.
  • the growth of the silver crystal is performed at a temperature of 1000-900° C.
  • the growth of each of copper and silver is performed according to the Czochralski method, in which the temperature of a liquid phase is lowered at a rate of about 1° C./min.
  • the Bridgman method may also be used for the growth of single crystals, and the use of the Bridgman method is also within the scope of the present invention.
  • the formed single crystal is used to produce a wire.
  • the grown high-purity single crystal is cut into a disc-shaped piece having the desired thickness by electric discharge machining.
  • the electric discharge machining is adopted in order to minimize deformation caused by stress generated in machining copper and silver into the disc-shaped piece.
  • the thickness of the disc-shaped piece is determined depending on the diameter of a wire to be produced, and in the present invention, the disc-shaped disc has a small thickness of about 1 mm.
  • the produced disc-shaped piece should be formed into a 1-mm-diameter wire by wire-cut electric discharge machining, it is polished with alumina powder having a particle size of 0.3 ⁇ m in order to completely remove stress remaining on the surface of the disc-shaped piece.
  • the disc-shaped disc is fixed using an outer mold and then formed into a wire by wire-cut electric discharge machining.
  • the disc-shaped piece is cut from the outside to the inside of a cross-section thereof so as to form a wire having the desired thickness, and a separate winding process is performed to prevent twisting of the wire during the electric discharge machining.
  • the wire may also be formed by forming a small hole in the central portion of the disc using a wire drill and then cutting the disc from the inside to the outside of a cross section thereof so as to form a wire having the desired diameter.
  • optical polishing of the wire is required. This optical polishing is performed using alumina powder in the same manner as in the polishing of the disc-shaped piece so as to remove the effect of stress remaining on the surface of the wire.
  • the effect of stress formed on the surface of the wire may also be removed using a hydrofluoric acid dilution.
  • the effects of stress on the metal surface during the electric discharge machining mostly consist of oxide films.
  • the wire produced through this process is shown in FIG. 2 .
  • the surface-polished or wet-etched wire can be used as a connection cable making connections in audio systems, etc.
  • the wire is covered with any material on the outer surface thereof.
  • the process for covering the wire is performed by a known method or a manual process to make a cable.
  • the single crystal wire product required for the transmission of commercial sounds and image data is produced.
  • the wire is covered with, for example, an insulating shrinkable tube having a diameter larger than that of the wire.
  • an insulating shrinkable tube having a diameter larger than that of the wire.
  • the wire is covered with a polyurethane or insulating shrinkable tube to the required diameter so as to produce a single crystal wire product in which the wire is protected from oxidation or external stress.
  • the wire is covered sequentially with a synthetic resin coating and a natural leather coating so as to produce a single-crystal product which is protected from the noise of external current.
  • both ends of the cable are terminated with RCA terminals or terminals made of metal single crystals so that the cable is protected from noise during use as a connection in audio and video systems, thus increasing the quality of sound.
  • the disc-shaped piece may also be used as a unidirectional substrate or target for deposition, in which case it can be used a target having a size of 2, 3 or 4 inches.
  • the disc-shaped piece formed by electric discharge machining is re-machined to the desired diameter, or the copper single crystal is subjected to electric discharge machining to have the desired outer diameter, so that it can be used as a target or substrate for deposition. This process is also within the scope of the present invention.
  • the wire may also be formed using a mold as shown in FIG. 3 .
  • a disc-shaped piece 100 formed by electric discharge machining is placed on a mold 100 having the desired pattern 111 formed thereon and then subjected to press machining, so as to form a wire having the same shape as the pattern 111 of the mold 110 .
  • a ring-shaped wire will be obtained, and when a mold having patterns continuously connected with each other is used, a continuous wire will be obtained.
  • the ring-shaped wire can be used as a ring or pendant, and the continuous wire is subjected to post-machining, such as optical polishing, in the same manner as when forming the wire by milling operations, including electric discharge machining, so as to produce a single-crystal cable.
  • the continuous wire is subjected to wet etching to remove an oxide film from the surface thereof so as to produce a single-crystal cable.
  • the single crystal grown according to the Czochralski or Bridgman method as described above can be used to produce a highly pure ring.
  • the upper surface of the single crystal grown as shown in FIG. 1 is cut with a wire-cut electric discharge machine.
  • the resulting crystal is cut into a column shape using a wire electric discharge drill having a diameter of less than 0.5 mm and a wire-cut electric discharge machine.
  • the column-shaped material is subjected to electric discharge machining to form a cylindrical body 120 , which is then cut in the horizontal direction to produce a highly pure ring.
  • the machining of the metal using the electric discharge machine is performed using known technology. However, to prevent the oxidation of the product and to give high-added value to the product by fine machining, it is also possible to use spearhead machines, such as non-electric discharge machines.
  • the ring products manufactured according to the above method may be used as an aid for promoting human health.
  • a change in the magnetic field induced by an electric current in the ring or an eddy current induced by this change in the magnetic field will be increased compared to that in a general metal ring.
  • factors interfering with electric current will be reduced owing to its structural stability so that the amount of electric current induced in the ring will be larger than that in a general metal ring.
  • the amount of eddy current produced in the single crystal ring will stimulate the blood flow of the human body to make it smooth, and when biomagnetic changes caused by this change in the blood flow are accumulated over time, the change of the blood flow becomes active compared to that in a general person.
  • the fact that smooth and active blood flow is favorable to the health of the human body is well supported by modern medical science.
  • the single-crystal wire produced by the above method had a unidirectional crystal structure similar to that of the seed crystal.
  • the polycrystal copper and the single crystal were analyzed by glow discharge spectroscopy, and the results are shown in FIG. 6 .
  • the produced single crystal had a purity of 5N, indicating that it can be used as a wire.
  • the produced single crystal wire is a single crystal, which is highly pure and has a unidirectional crystal structure.
  • This single crystal wire was measured for resistivity with a change in temperature, and the results are shown in FIG. 8 .
  • the resistivity of the polycrystal copper wire is known to be 1.7 ⁇ 10 ⁇ 6 ⁇ cm for highly pure copper. As can be seen in FIG. 8 , however, the resistivity of the single crystal wire prepared according to the invention was 1.2 ⁇ 10 ⁇ 7 ⁇ cm and was much lower with a decrease in temperature than that of the polycrystal copper wire.
  • the single crystal wire was finally covered with natural leather on the outer surface thereof.
  • the inventive cable was markedly superior in sound signal transmission to the existing polycrystal product. This is demonstrated from results shown in FIG. 10 .
  • the inventive single crystal cable was completely protected from external sound and magnetic waves owing to the characteristics of the natural leather.
  • the impedance as a function of frequency was constantly lower over the entire frequency region than that of the existing polycrystal cable.
  • the single crystal wire manufactured by the present invention and the manufacturing method thereof is applicable in various fields.
  • the present invention can be applicable for commercial image and sound cables, precious metal rings and various medical accessories, and thus, is an excellent technology from an industrial point of view.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Conductive Materials (AREA)
US11/726,272 2004-09-21 2007-03-21 Single crystal wire and manufacturing method of the same Abandoned US20070169857A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/436,754 US8663388B2 (en) 2004-09-21 2009-05-06 Method of manufacturing single crystal wire and other single crystal metallic articles

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020040075550A KR20040088448A (ko) 2004-09-21 2004-09-21 단결정 와이어 제조방법
KR10-2004-0075550 2004-09-21
PCT/KR2005/003050 WO2006033534A1 (fr) 2004-09-21 2005-09-15 Fil monocristallin et procede de fabrication de celui-ci

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2005/003050 Continuation WO2006033534A1 (fr) 2004-09-21 2005-09-15 Fil monocristallin et procede de fabrication de celui-ci

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/436,754 Division US8663388B2 (en) 2004-09-21 2009-05-06 Method of manufacturing single crystal wire and other single crystal metallic articles

Publications (1)

Publication Number Publication Date
US20070169857A1 true US20070169857A1 (en) 2007-07-26

Family

ID=36090260

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/726,272 Abandoned US20070169857A1 (en) 2004-09-21 2007-03-21 Single crystal wire and manufacturing method of the same
US12/436,754 Active 2028-09-14 US8663388B2 (en) 2004-09-21 2009-05-06 Method of manufacturing single crystal wire and other single crystal metallic articles

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/436,754 Active 2028-09-14 US8663388B2 (en) 2004-09-21 2009-05-06 Method of manufacturing single crystal wire and other single crystal metallic articles

Country Status (6)

Country Link
US (2) US20070169857A1 (fr)
EP (1) EP1794353B1 (fr)
JP (1) JP4971165B2 (fr)
KR (2) KR20040088448A (fr)
CN (1) CN101048539B (fr)
WO (1) WO2006033534A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150292113A1 (en) * 2012-09-21 2015-10-15 Busan National University Industrial University Cooperation Foundation Metal single crystal in which metal element is substituted
US20170121843A1 (en) * 2015-10-30 2017-05-04 The Board Of Trustees Of The Leland Stanford Junior University Single metal crystals
US20190390366A1 (en) * 2017-02-02 2019-12-26 Soitec Process for manufacturing a two-dimensional film of hexagonal crystalline structure
KR20220137813A (ko) * 2016-04-01 2022-10-12 게바우어 앤 그릴러 메탈벨크 게엠베하 절연 전도체
DE102021102753B4 (de) 2021-02-05 2023-05-25 Ford Global Technologies Llc Elektrische Maschine
CN116324010A (zh) * 2020-10-14 2023-06-23 釜山大学产学合作团 用于控制薄膜的原子层的射频溅射装置
EP4242706A4 (fr) * 2020-11-05 2024-10-02 Pusan National University Industry-University Cooperation Foundation Structure de film mince d'argent monocristallin ayant une grande surface utilisant une couche tampon de film mince de cuivre monocristallin et son procédé de fabrication

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791048B1 (ko) * 2007-01-02 2008-01-04 부산대학교 산학협력단 단결정 용기의 제조방법 및 그 단결정 용기
KR100825831B1 (ko) * 2007-01-02 2008-04-28 부산대학교 산학협력단 단결정 장신구의 제조방법 및 그 단결정 장신구
KR100825836B1 (ko) * 2007-01-02 2008-04-28 부산대학교 산학협력단 단결정 케이블 제조방법 및 그 단결정 케이블
KR100861478B1 (ko) * 2007-02-26 2008-10-02 부산대학교 산학협력단 단결정 기판의 제조방법 및 그 단결정 기판
KR101104395B1 (ko) * 2009-06-11 2012-01-16 주식회사 엠씨랩 단결정 전원케이블의 제조방법 및 그 단결정 전원케이블
KR102048045B1 (ko) * 2014-01-22 2019-11-25 부산대학교 산학협력단 단결정 구리 타깃을 이용한 구리 박막 제조방법 및 이를 이용한 구리 박막 구조체
KR101771611B1 (ko) 2014-04-03 2017-08-25 부산대학교 산학협력단 단결정 금속 극세선 제조방법
JP6606638B2 (ja) * 2014-07-14 2019-11-20 株式会社福田結晶技術研究所 Ｆｅ−Ｇａ基合金単結晶の育成方法及び育成装置
CN111733449B (zh) * 2020-07-07 2021-04-27 上海新昇半导体科技有限公司 晶棒生长设备及生长方法
CN113802176A (zh) * 2021-08-02 2021-12-17 江苏布里其曼科技股份有限公司 单晶铜生长工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792369A (en) * 1987-02-19 1988-12-20 Nippon Mining Co., Ltd. Copper wires used for transmitting sounds or images
US4976792A (en) * 1985-01-14 1990-12-11 Sumitomo Electric Industries, Ltd. Electric conductor and method of manufacturing same
US5629236A (en) * 1994-07-26 1997-05-13 Kabushiki Kaisha Toshiba Method of manufacture of semiconductor device
US5733389A (en) * 1993-07-07 1998-03-31 Sumitomo Chemical Co., Ltd. Method of manufacturing a micro-alloy high purity aluminum conductor for use at ultra low temperature
US6683256B2 (en) * 2002-03-27 2004-01-27 Ta-San Kao Structure of signal transmission line

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1793672A (en) * 1926-02-16 1931-02-24 Percy W Bridgman Crystals and their manufacture
US3529227A (en) * 1967-03-03 1970-09-15 Robert W Kearns Windshield wiper control
JPS6092011A (ja) 1983-10-21 1985-05-23 Sumitomo Electric Ind Ltd 超極細線導体の製造方法
JPS61146796A (ja) 1984-12-14 1986-07-04 Shin Etsu Chem Co Ltd タンタル酸リチウム単結晶の単一分域化方法
JPS61163194A (ja) 1985-01-09 1986-07-23 Toshiba Corp 半導体素子用ボンデイング線
JPS61163504A (ja) * 1985-01-14 1986-07-24 住友電気工業株式会社 画像表示機器、音響機器用導体
JPS62285311A (ja) * 1986-06-04 1987-12-11 日本鉱業株式会社 オ−デイオ用銅線およびオ−デイオ用銅線の製造方法
JPS644444A (en) * 1987-06-26 1989-01-09 Nippon Mining Co Copper wire for sound and its production
JPH0820351B2 (ja) * 1987-02-27 1996-03-04 株式会社ジャパンエナジー 超精密硬度標準片
US4951380A (en) * 1988-06-30 1990-08-28 Raytheon Company Waveguide structures and methods of manufacture for traveling wave tubes
JPH07118225B2 (ja) * 1988-12-16 1995-12-18 北川工業株式会社 フラットケーブル
JPH0336225A (ja) * 1989-06-30 1991-02-15 Aichi Steel Works Ltd 単結晶連鎖組織金属細線およびその製造方法
US5171938A (en) * 1990-04-20 1992-12-15 Yazaki Corporation Electromagnetic wave fault prevention cable
GB9104235D0 (en) * 1991-02-28 1991-04-17 Powersafe Cables Ltd Electrical conductors
US5161602A (en) * 1991-07-22 1992-11-10 National Science Council Graphite mold for single crystal growth of active materials and a process for manufacturing the same
US5491321A (en) * 1992-02-26 1996-02-13 Tweco Products, Inc. Welding gun assembly
JPH08106819A (ja) 1994-10-05 1996-04-23 Hitachi Ltd シールド多芯ケーブル
EP0724028A3 (fr) * 1994-12-27 1997-04-16 Shinetsu Chemical Co Procédé de préparation d'un monocristal de silicium sous forme de fil
JPH08239298A (ja) * 1994-12-27 1996-09-17 Shin Etsu Chem Co Ltd 細線状シリコンの製造方法および細線状シリコン
JPH08298028A (ja) 1995-04-25 1996-11-12 Nec Corp 多対平衡形ケーブル
JP2716023B2 (ja) * 1995-11-22 1998-02-18 日本電気株式会社 シリコン単結晶育成装置
DE19653458A1 (de) * 1996-12-20 1998-06-25 Karlsruhe Forschzent Verfahren zur Herstellung von Verformungsproben aus festen Einkristallen
US6453536B1 (en) * 1997-10-31 2002-09-24 G. Rau Gmbh & Co. Method for producing hollow nickel titanium profiles
US6315827B1 (en) * 1998-10-02 2001-11-13 Komatsu Electronics Metals Co., Ltd. Apparatus for producing single crystal
US6461680B2 (en) * 1999-12-23 2002-10-08 Nikon Corporation Simplified fabrication method of toroidal charged particle deflector vanes
JP3464442B2 (ja) * 2000-10-26 2003-11-10 三菱電機株式会社 電磁機器
WO2003015968A1 (fr) * 2001-08-10 2003-02-27 Sumitomo Electric Industries, Ltd. Lame jetable de tranchet frittee sous haute pression presentant un evidement ou une rainure, son mecanisme de fixation et son procede de fabrication
US6887441B2 (en) * 2002-09-30 2005-05-03 The Regents Of The University Of California High resistivity aluminum antimonide radiation detector
CA2440573C (fr) * 2002-12-16 2013-06-18 Howmet Research Corporation Superalliage a base de nickel
JP3870909B2 (ja) * 2003-01-31 2007-01-24 株式会社島津製作所 プラズマ処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4976792A (en) * 1985-01-14 1990-12-11 Sumitomo Electric Industries, Ltd. Electric conductor and method of manufacturing same
US4792369A (en) * 1987-02-19 1988-12-20 Nippon Mining Co., Ltd. Copper wires used for transmitting sounds or images
US5733389A (en) * 1993-07-07 1998-03-31 Sumitomo Chemical Co., Ltd. Method of manufacturing a micro-alloy high purity aluminum conductor for use at ultra low temperature
US5629236A (en) * 1994-07-26 1997-05-13 Kabushiki Kaisha Toshiba Method of manufacture of semiconductor device
US6683256B2 (en) * 2002-03-27 2004-01-27 Ta-San Kao Structure of signal transmission line

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150292113A1 (en) * 2012-09-21 2015-10-15 Busan National University Industrial University Cooperation Foundation Metal single crystal in which metal element is substituted
US20170121843A1 (en) * 2015-10-30 2017-05-04 The Board Of Trustees Of The Leland Stanford Junior University Single metal crystals
US10435814B2 (en) * 2015-10-30 2019-10-08 The Board Of Trustees Of The Leland Stanford Junior University Single metal crystals
KR102587257B1 (ko) 2016-04-01 2023-10-10 게바우어 앤 그릴러 메탈벨크 게엠베하 절연 전도체
US12087468B2 (en) 2016-04-01 2024-09-10 Hpw Metallwerk Gmbh Insulated electric conductor
KR20220137813A (ko) * 2016-04-01 2022-10-12 게바우어 앤 그릴러 메탈벨크 게엠베하 절연 전도체
US11913134B2 (en) * 2017-02-02 2024-02-27 Soitec Process for manufacturing a two-dimensional film of hexagonal crystalline structure using epitaxial growth on a transferred thin metal film
US20190390366A1 (en) * 2017-02-02 2019-12-26 Soitec Process for manufacturing a two-dimensional film of hexagonal crystalline structure
CN116324010A (zh) * 2020-10-14 2023-06-23 釜山大学产学合作团 用于控制薄膜的原子层的射频溅射装置
US20230374652A1 (en) * 2020-10-14 2023-11-23 Pusan National University Industry-University Cooperation Foundation Rf sputtering apparatus for controlling atomic layer of thin film
US12180578B2 (en) * 2020-10-14 2024-12-31 Pusan National University Industry-University Cooperation Foundation RF sputtering apparatus for controlling atomic layer of thin film
EP4242706A4 (fr) * 2020-11-05 2024-10-02 Pusan National University Industry-University Cooperation Foundation Structure de film mince d'argent monocristallin ayant une grande surface utilisant une couche tampon de film mince de cuivre monocristallin et son procédé de fabrication
DE102021102753B4 (de) 2021-02-05 2023-05-25 Ford Global Technologies Llc Elektrische Maschine

Also Published As

Publication number Publication date
CN101048539A (zh) 2007-10-03
CN101048539B (zh) 2011-04-06
KR20050096893A (ko) 2005-10-06
EP1794353A4 (fr) 2010-04-14
KR20040088448A (ko) 2004-10-16
US8663388B2 (en) 2014-03-04
JP4971165B2 (ja) 2012-07-11
EP1794353A1 (fr) 2007-06-13
EP1794353B1 (fr) 2015-08-12
WO2006033534A1 (fr) 2006-03-30
KR100749833B1 (ko) 2007-08-16
JP2008513332A (ja) 2008-05-01
US20090211516A1 (en) 2009-08-27

Similar Documents

Publication Publication Date Title
US8663388B2 (en) Method of manufacturing single crystal wire and other single crystal metallic articles
JP5345341B2 (ja) 帯域引き上げ用の多結晶シリコンロッド及びその製造方法
EP1288972B1 (fr) Fils magnétiques nanocristallins recouverts de verre et leur procédé de fabrication
US10626483B2 (en) Copper alloy wire rod
KR20180109394A (ko) 단결정 구리 와이어 도체, 이를 포함하는 케이블 및 이의 제조방법
EP1375705B1 (fr) Appareil et procede de production de monocristal semi-conducteur de silicium
JPH0249169B2 (fr)
JPH0788269B2 (ja) シリコン単結晶引上げ用ルツボ
JPS61163504A (ja) 画像表示機器、音響機器用導体
KR102157414B1 (ko) 고성능 차폐 케이블
CN118950735B (zh) 一种单晶金属丝材及其制备方法
CN115198356B (zh) 一种特定取向的大规格金属单晶及其制备方法
WO2010119982A1 (fr) Matériau à base d'argent ayant une structure hautement conductrice de l'électricité
CN111155172B (zh) 螺旋选晶器在制备电偶丝材料中的用途和电偶丝及其应用
JP3858861B2 (ja) 架空配電線用銅線及びその製造方法
JPH03134142A (ja) 粗大結晶粒からなる高純度銅線の製造法
JPS60125359A (ja) 画像表示機器、音響機器用導体の製造法
JPH05101725A (ja) 酸化物超電導線材の製造方法
JPH0628796B2 (ja) 超極細線導体の製造方法
JP3117521B2 (ja) 酸化物超電導線材の製造方法
JPH03134143A (ja) 粗大結晶粒からなる高純度銅線の製造法
JP2007077505A (ja) Ｃｕ−Ａｇ合金線および同軸ケーブル用Ｃｕ−Ａｇ合金線
JPH07141937A (ja) ＮｂＴｉ超電導線の製造方法
JPS62265194A (ja) 単結晶の製造装置
JPS6214631B2 (fr)

Legal Events

Date Code Title Description
AS Assignment

Owner name: PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOP

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JEONG, SE YOUNG;CHO, CHAE RYONG;PARK, SANG EON;AND OTHERS;REEL/FRAME:019158/0941

Effective date: 20070307

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION